CN208589429U - Electronic module - Google Patents
Electronic module Download PDFInfo
- Publication number
- CN208589429U CN208589429U CN201821121137.2U CN201821121137U CN208589429U CN 208589429 U CN208589429 U CN 208589429U CN 201821121137 U CN201821121137 U CN 201821121137U CN 208589429 U CN208589429 U CN 208589429U
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- sealing resin
- electrode
- electronic component
- substrate
- electronic module
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
Abstract
The utility model provides a kind of electronic module, and the 1st electronic component with hollow portion and the 2nd electronic component without hollow portion is made to be built in electronic module with good state.Has substrate (1), at least one the 1st electronic component (4) with hollow portion (5), at least one the 2nd electronic component (11) without hollow portion, 1st sealing resin (13) and the 2nd sealing resin (14), 1st electronic component (4) is sealed by the 1st sealing resin (13), the smallest 2nd electronic component (11) of spacing between the electrode for the electrode for being formed in mounting surface among 2nd electronic component (11), it is sealed including at least the mounting surface of electrode (12) by the 2nd sealing resin (14), the volume % of the filler contained in 1st sealing resin (13) is than the volume % high of the filler contained in the 2nd sealing resin (14).
Description
Technical field
The electronic module for being installed on substrate the utility model relates to electronic component and being sealed by sealing resin.
Background technique
Electronic component is installed on substrate and is widely used in various electronic equipments by the electronic module that sealing resin seals.Make
For example, electronic module 1100 disclosed in WO2014-017159A1 (patent document 1) is shown in FIG. 9.
Electronic module 1100 is equipped with capacitor, inductor, resistance etc. in an interarea of substrate (circuit board) 101 and exists
Both ends form the electronic component (chip part) 102,103,104 of the shaped like chips of electrode.In addition, substrate 101 another
Interarea, which is equipped with, forms the semiconductor device (semiconductor substrate) 105 of multiple electrodes in mounting surface.
Moreover, electronic component 102,103,104 is sealed by sealing resin (resin layer) 108.In addition, semiconductor device 105
It is sealed by sealing resin 109.
In electronic module 1100, substrate (circuit board) 101 an interarea and another interarea used as
The sealing resin 108 and sealing resin 109 of homogenous resins.But in the case where the warpage of electronic module 1100 is big, in order to press down
Warpage processed can make sealing resin 108 different with the linear expansion coefficient of sealing resin 109.
In addition, SAW (Surface Acoustic Wave is utilized；Surface acoustic wave), BAW (Bulk Acoustic
Wave；Bulk acoustic wave) acoustic wave device be widely used in the electronics such as mobile communicating equipment as resonator, filter etc. and set
It is standby.As an example, acoustic wave device 1200 disclosed in WO2015-098678A1 (patent document 2) is shown in FIG. 10.
Acoustic wave device 1200 has by the hollow of the encirclements such as substrate (supporting substrates) 201, supporting member 202, lid 203
Portion 204.
Acoustic wave device 1200 is formed with IDT electrode 206 on the piezoelectric membrane 205 being formed in hollow portion 204.It is hollow
Portion 204 is arranged in order not to interfere the vibration of IDT electrode 206.
Citation
Patent document
Patent document 1:WO2014-017159A1
Patent document 2:WO2015-098678A1
Utility model content
The utility model project to be solved
The electronic component 102,103,104, half of the shaped like chips such as electronic module 1100 built-in capacitor, inductor, resistance
Conductor device 105.In electronic module 1100, in order to further seek multifunction, occasionally want to add built-in such as elastic wave
The such electronic component with hollow portion of device 1200.
However, multiple electrodes are formed in minimum spacing being sealed with the sealing resin with identical mobility
In the case where the semiconductor device of mounting surface and electronic component with hollow portion, it can lead to the problem of following.
That is, although semiconductor device is formed with multiple electrodes in mounting surface, normally due to spacing is minimum between the electrode, because
This needs the resin high using mobility in the case where being sealed to semiconductor device.If using the low sealing of mobility
Resin, then not sufficiently filled sealing resin is to form the anxiety in gap between there is the electrode of the mounting surface of semiconductor device.Moreover,
If the interelectrode sealing resin in semiconductor device forms gap, since electronic module being installed on by Reflow Soldering etc.
The heat whens substrate etc. of electronic equipment, the solder for semiconductor device to be installed on to substrate melts again, and expands, from
And enter gap.As a result, in the presence of make the inter-electrode short-circuit of semiconductor device, referred to as solder flash of light (solder is generated
Flash the anxiety of) the phenomenon that.
On the other hand, to as acoustic wave device 1200 there is the electronic component of hollow portion to be sealed the case where
Under, need the material low using mobility.If using the high sealing resin of mobility, in the electronic component with hollow portion
Around formed in the process of sealing resin, there is the pressure due to sealing resin and anxiety that hollow portion is subject to crushing.
In addition, adding filling out for the inorganic matters such as silica in sealing resin for the purpose of adjustment of linear expansion coefficient etc.
The case where material, is more.The addition of filler generally makes the mobility of sealing resin be lower.Further, since filler blocks in sealing resin
Moisture penetrate path, therefore generally by filler add more more then sealing resins moisture-proof it is higher.In addition, being set in sealing
In the case where the filler for being added to same amount (same volume) in rouge, it is higher, average that there are the smaller then mobility of the average grain diameter of filler
The lower trend of the more big then mobility of partial size.
As above, due to according to each electronic component being built and to the mobility of sealing resin requirement difference
Closely spaced semiconductor device and electronic component with hollow portion are installed between electrode in the substrate of electronic module and with phase
In the case where being sealed with the sealing resin of mobility, it can lead to the problem of following.
Firstly, if in order to be sufficient filling with sealing tree between the electrode of electronic component (semiconductor device) closely spaced between electrode
Rouge simultaneously not form gap in interelectrode sealing resin, and to the resin that sealing resin uses mobility high, then there is tool
The anxiety that pressure when having the hollow portion of the electronic component (acoustic wave device) of hollow portion to be filled sealing resin is damaged by pressure.
Conversely, if in order to enable pressure pressure when the hollow portion of the electronic component with hollow portion is not filled sealing resin
It is bad, and to sealing resin using the low resin of mobility, then exist between electrode between the electrode of closely spaced electronic component not sufficiently
The anxiety for the reason of filling sealing resin, forming gap in interelectrode sealing resin, become solder flash of light.
Means for solving the problems
The utility model is precisely in order to solve above-mentioned existing issue and complete, as its means, the utility model
The electronic module related in one aspect to has: substrate；At least one the 1st electronic component is formed more in the mounting surface installed to substrate
A electrode, and there is hollow portion；At least one the 2nd electronic component forms multiple electrodes in the mounting surface installed to substrate, and
And do not have hollow portion；1st sealing resin；With the 2nd sealing resin, the 1st electronic component is sealed by the 1st sealing resin, the 2nd electronics
The mounting surface including at least electrode of the smallest 2nd electronic component of spacing between the electrode of the electrode of mounting surface is formed among component
It is sealed by the 2nd sealing resin, the volume % of the filler contained in the 1st sealing resin is than the filler that contains in the 2nd sealing resin
Volume % high.In addition, the case where not containing filler in the 2nd sealing resin also belongs to the body of the filler contained in the 1st sealing resin
Product situation of the % than the volume % high of the filler contained in the 2nd sealing resin.
In addition, the electronic module that the another aspect of the utility model is related to has: substrate；At least one the 1st electronic component,
Multiple electrodes are formed in the mounting surface installed to substrate, and there is hollow portion；At least one the 2nd electronic component, to substrate
The mounting surface of installation forms multiple electrodes, and does not have hollow portion；1st sealing resin；With the 2nd sealing resin, the 1st ministry of electronics industry
Part is sealed by the 1st sealing resin, the smallest 2nd electricity of spacing between the electrode for the electrode for being formed in mounting surface among the 2nd electronic component
The mounting surface including at least electrode of subassembly is sealed by the 2nd sealing resin, the average grain of the filler contained in the 1st sealing resin
The average grain diameter of filler of the diameter than containing in the 2nd sealing resin is big.In addition, the case where not containing filler in the 2nd sealing resin
It is than the average grain diameter of the filler contained in the 2nd sealing resin bigger to belong to the average grain diameter of the filler contained in the 1st sealing resin
Situation.
In addition, the average grain diameter of the filler contained in resin is measured by following method.Firstly, making containing filler
Expose in the section of resin.Secondly, determining to include 100 pros more than and less than 110 fillers among the section being exposed
The arbitrary section of shape is as " measurement region ", SEM (scanning electron microscope) image (reflective electron that shooting is the 1st time
Picture).Next, further expose the section of the part of 3 μm of depths for measurement region, the SEM image that shooting is the 2nd time.Repeatedly
The process is executed, for measurement region, shooting the 3rd time, multiple SEM images as the 4th ... n-th.Then, from measurement region
Among the filler for including in domain, 10 fillers are dispersedly arbitrarily selected as far as possible, are determined as measure object filler.Secondly, for each
Measure object filler selects filler section for the filler of maximum area among captured multiple SEM images, which is made
It (for 10 measure object fillers, finds out be regarded as maximum cross-section respectively for the maximum cross-section area that is regarded as of the measure object filler
Area).It is regarded as maximum cross-section area according to each measure object filler to assume that the measure object filler is positive spherical to find out
In the case of diameter, be regarded as partial size using the diameter found out as the measure object filler.Find out 10 measure object fillers
It is regarded as the average value of partial size, the average grain diameter as the filler contained in resin.
It is also preferred that keeping the moisture-proof of the 1st sealing resin higher than the moisture-proof of the 2nd sealing resin.In this case, energy
It is enough to inhibit moisture to the intrusion of the hollow portion of the 1st electronic component by the 1st high sealing resin of moisture-proof.
The electronic module of the utility model can for example be set as being formed with the 1st sealing resin in an interarea of substrate,
Another interarea of substrate is formed with the 2nd sealing resin.Alternatively, the electronic module of the utility model can be set as the one of substrate
A interarea stacking is formed with the 1st sealing resin and the 2nd sealing resin.
1st electronic component is, for example, the acoustic wave device that SAW, BAW etc. is utilized.In addition, being formed among the 2nd electronic component
The smallest 2nd electronic component of spacing is, for example, semiconductor device between the electrode of the electrode of mounting surface.
It is also preferred that being also equipped with the external electrode of installation, external electrode is formed in the outer surface of the 2nd sealing resin.
Although thering is the part of external electrode internally to invade moisture from the formation of sealing resin the reason is that electronic module is easy,
By sealing the 1st electronic component by the 1st sealing resin, and external electrode is formed in the 2nd sealing resin, even if thus from the
The formation of 2 sealing resins has the part of external electrode internally to immerse moisture, can also pass through the 1st sealing resin and module base
Plate inhibits the hollow portion of invaded moisture the 1st electronic component of arrival.
It is also preferred that at least part shape of the outer surface in the outer surface and the 2nd sealing resin of the 1st sealing resin
At bucking electrode.The reason is that in this case, the inside externally to electronic module can be inhibited by bucking electrode
The noise of immersion and the noise released from the interior of electronic module.Furthermore, which is because, passing through bucking electrode
Also it is able to suppress the intrusion of moisture internally, therefore the moisture-proof of electronic module can be further increased.
The manufacturing method of the electronic module related in one aspect to of the utility model, comprising: prepared substrate is installed to substrate
Mounting surface formed multiple electrodes and with hollow portion at least one the 1st electronic component, in the mounting surface installed to substrate
It forms multiple electrodes and does not have at least one the 2nd electronic component, uncured 1st sealing resin and flowing of hollow portion
The process of property uncured 2nd sealing resin higher than uncured 1st sealing resin；By the 1st electronic component directly or
It is grounded the process for being installed on substrate；The process that 2nd electronic component is directly or indirectly installed on substrate；In the be mounted
It is filled with around 1 electronic component on the basis of uncured 1st sealing resin, keeps uncured 1st sealing resin cured
Process；The smallest 2nd ministry of electronics industry of spacing between the electrode for the electrode among the 2nd mounted electronic component being formed in mounting surface
The mounting surface including at least electrode of part is filled on the basis of uncured 2nd sealing resin, makes uncured 2nd sealing tree
The cured process of rouge.
In addition, the manufacturing method for the electronic module that the another aspect of the utility model is related to, comprising: prepared substrate, to
The mounting surface of substrate installation forms multiple electrodes and has at least one the 1st electronic component of hollow portion, installs to substrate
Mounting surface formed multiple electrodes and do not have hollow portion at least one the 2nd electronic component, it is uncured 1st sealing tree
The process of moisture-proof uncured 2nd sealing resin lower than the 1st sealing resin under solid state under rouge and solid state；
The process that 1st electronic component is directly or indirectly installed on substrate；2nd electronic component is directly or indirectly installed on
The process of substrate；On the basis of being filled with uncured 1 sealing resin around the 1st mounted electronic component, make not
The cured process of cured 1st sealing resin；With the electricity for the electrode for being formed in mounting surface among the 2nd mounted electronic component
The mounting surface including at least electrode of the smallest 2nd electronic component of interpolar spacing is filled with the base of uncured 2nd sealing resin
On plinth, make the cured process of uncured 2nd sealing resin.
The effect of utility model
1st electronic component is sealed by the 1st sealing resin, is sealed among the 2nd electronic component and is formed by the 2nd sealing resin
The mounting surface including at least electrode of the smallest 2nd electronic component of spacing between the electrode of the electrode of mounting surface makes the 1st sealing tree
Electronic die of the volume % of the filler contained in rouge than the utility model of the volume % high of the filler contained in the 2nd sealing resin
Block, since the mobility under the uncured state of the 2nd sealing resin is high, in the electrode that includes at least of the 2nd electronic component
Mounting surface has been sufficient filling with the 2nd sealing resin, is not easy to form gap in the interelectrode sealing resin of the 2nd electronic component.In addition,
Since the mobility under the uncured state of the 1st sealing resin is low, the hollow portion of the 1st electronic component is not easy because of filling the 1st
Pressure when sealing resin and be subject to crushing.
In addition, seal the 1st electronic component by the 1st sealing resin, sealed by the 2nd sealing resin the 2nd electronic component it
In be formed in mounting surface electrode electrode between the smallest 2nd electronic component of spacing the mounting surface including at least electrode, make the 1st
The big sheet of the average grain diameter of filler of the average grain diameter of the filler contained in sealing resin than containing in the 2nd sealing resin is practical new
The electronic module of type, since the mobility under the uncured state of the 2nd sealing resin is high, the 2nd electronic component at least
Mounting surface including electrode has been sufficient filling with the 2nd sealing resin, is not easy to be formed in the interelectrode sealing resin of the 2nd electronic component
Gap.Further, since the mobility under the uncured state of the 1st sealing resin is low, therefore the hollow portion of the 1st electronic component is not easy
It is subject to crushing due to pressure when filling 1 sealing resin.
The electronic die of the utility model can be easily manufactured in the manufacturing method of electronic module according to the present utility model
Block.
Detailed description of the invention
Fig. 1 is the sectional view for indicating electronic module 100 of the first embodiment.
Fig. 2 (A)~Fig. 2 (C) is cutting for the process for indicating to implement in an example of the manufacturing method of electronic module 100 respectively
Face figure.
Fig. 3 (D)~Fig. 3 (F) is the connecting of Fig. 2 (C), is an example indicated in the manufacturing method of electronic module 100 respectively
The sectional view of the process of middle implementation.
Fig. 4 (G), Fig. 4 (H) are the connectings of Fig. 3 (F), are indicated in an example of the manufacturing method of electronic module 100 respectively
The sectional view of the process of implementation.
Fig. 5 is the sectional view for indicating electronic module 200 of the second embodiment.
Fig. 6 is the sectional view for indicating electronic module 300 of the third embodiment.
Fig. 7 is the sectional view for indicating electronic module 400 of the fourth embodiment.
Fig. 8 is the sectional view for indicating electronic module 500 of the fifth embodiment.
Fig. 9 is the sectional view for indicating electronic module 1100 disclosed in patent document 1.
Figure 10 is the sectional view for indicating acoustic wave device 1200 disclosed Patent Document 2.
Symbol description
1,51 ... substrates；
The 1st interarea of 1A, 51A ...；
The 2nd interarea of 1B, 51B ...；
2,52 ... electrodes；
3 ... electrodes；
4 ... the 1st electronic components (have hollow portion；Acoustic wave device etc.)；
5 ... hollow portions；
6 ... IDT electrodes；
7 ... electrodes；
8 ... solders；
9,21 ... the 2nd electronic components (do not have hollow portion；Semiconductor device, capacitor, inductor, resistance etc.)；
10a, 10b ... electrode；
11, the smallest 2nd electronic component of spacing between the electrode for the electrode for being formed in mounting surface among 31 ... the 2nd electronic components
(semiconductor device etc.)；
12, the electrode for being formed in mounting surface of 22 ... the 2nd electronic components；
13 ... the 1st sealing resins；
14 ... the 2nd sealing resins；
15,55 ... cross pore electrod；
16,56 ... external electrodes；
41 ... bucking electrodes；
100,200,300,400,500 ... electronic module.
Specific embodiment
Hereinafter, coming together with attached drawing illustrates the mode for implementing the utility model.In addition, each embodiment is illustratively
The embodiments of the present invention is shown, the utility model is not limited to the content of embodiment.It is further possible to combine not
With embodiment in the content recorded implement, implementation content in this case is also contained in the utility model.In addition, attached drawing
It is used to help understand specification, schematically draw sometimes, the ratio of the size between the constituent element or constituent element drawn out
Rate is sometimes inconsistent with the ratio for these sizes recorded in specification.In addition, the constituent element recorded in specification has attached
The case where being omitted in figure omits number come the case where drafting etc..
[the 1st embodiment]
Electronic module 100 of the first embodiment is shown in FIG. 1.Wherein, Fig. 1 is the section of electronic module 100
Figure.
Electronic module 100 has substrate 1.The material of substrate 1 is arbitrary, such as is able to use and PCB (Poly is utilized
Chlorinated Biphenyl；Polychlorinated biphenyls) etc. resin substrate, LTCC (Low TemperatureCo-fired is utilized
Ceramics；Low temperature simultaneously Low fire ceramic) etc. ceramic substrate.In addition, the construction of substrate 1 is also arbitrary, it can be multilayer
Substrate, or single layer substrate.
Upside of the substrate 1 in Fig. 1 has the 1st interarea 1A, and the downside in Fig. 1 has the 2nd interarea 1B.Moreover, the 1st
Interarea 1A is formed with electrode 2, is formed with electrode 3 in the 2nd interarea 1B.The material of electrode 2,3 is arbitrary, but is for example able to use
Copper, silver etc..In addition, implementing the plating of tin, solder etc. on the surface of electrode 2,3 sometimes.
In the inside of substrate 1, although illustration omitted, such as by being formed with pore electrod copper or crossing pore electrod
And cloth line electrode, to constitute internal wiring.By internal wiring, in 2 He of electrode that the 1st interarea 1A of substrate 1 is formed
It is connected in the electrode 3 that the 2nd interarea 1B is formed.
In the 1st interarea 1A of substrate 1, two the 1st electronic components 4 with hollow portion 5 are installed.In present embodiment
In, the acoustic wave device of SAW will be utilized as the 1st electronic component 4.But, the type of the 1st electronic component 4 is arbitrary,
The acoustic wave device that SAW is utilized can be replaced, but the acoustic wave device of BAW is utilized, in turn, be also possible to elastic wave dress
Electronic component other than setting.
1st electronic component 4 has the hollow portion 5 being made of piezoelectric substrate 5a, supporting member 5b, lid 5c.Moreover, in
IDT electrode 6 is formed on the piezoelectric substrate 5a of the inside in empty portion 5.The hollow portion 5 of 1st electronic component 4 is in order not to interfere IDT
The vibration of electrode 6 and be arranged.In addition, in the present specification, hollow portion refers to the closed space intentionally formed, such as not
It include that enter resin medium to the gap etc. that is unintentionally formed for air in manufacturing process.The hollow portion 5 of 1st electronic component 4
Although having fluid tight but not having perfect air-tightness sometimes, need to improve moisture-proof by sealing resin so that humidity
High gas will not invade hollow portion.
1st electronic component 4 is formed with multiple electrodes 7 in mounting surface.The material of electrode 7 is arbitrary, but can for example be made
With Cu, Ni.Spacing is sufficiently big between the electrode of electrode 7, and spacing is, for example, 0.3mm between the mutual electrode of immediate electrode 7.Separately
Outside, electrode 7 may not be the electrode being made of metal film, but the salient pole of golden convex block etc..
The electrode 7 for being formed in mounting surface of 1st electronic component 4 is formed by solder 8 and the 1st interarea 1A in substrate 1
Electrode 2 engage.In addition, the engagement for electrode 7 and electrode 2, solder 8 can also be replaced and use conductive adhesive etc..
In the present embodiment, in the 1st interarea 1A installation of substrate 1, there are two the 1st electronic components 4.In addition, the 1st electronic component 4 can be with
Directly or indirectly it is installed on substrate 1.Being installed on substrate indirectly means to form sealing resin and close at this on substrate
It seals and the 1st electronic component is installed on resin.
In addition, being equipped with the 2nd electronic component 9 of the shaped like chips without hollow portion in the 1st interarea 1A of substrate 1.2nd
Electronic component 9 is, for example, capacitor, inductor, resistance etc..Electrode 10a, 10b are formed at the both ends of the 2nd electronic component 9.Electricity
Spacing is sufficiently big between the electrode of pole 10a, 10b, for example, 0.3mm.
2nd electronic component 9 connects electrode 10a, 10b by solder 8 and the electrode 2 of the 1st interarea 1A formation in substrate 1
It closes.In addition, the engagement for electrode 10a, 10b and electrode 2, solder 8 can also be replaced and use conductive adhesive etc..Separately
Outside, the 2nd electronic component 9 is not formed with the component of electrode in mounting surface, therefore does not have the electricity for the electrode for being formed in mounting surface
Interpolar spacing (is not belonging to " being formed in the smallest 2nd electronic component of spacing between the electrode of the electrode of mounting surface ").
In the 2nd interarea 1B of substrate 1, the 2nd electronic component 11 without hollow portion is installed.In the present embodiment,
Using semiconductor device as the 2nd electronic component 11.
2nd electronic component 11 is formed with multiple electrodes 12 in mounting surface.The material of electrode 12 is arbitrary, but for example can
Use Cu.Formation of the spacing than other the 2nd electronic components between the electrode of the electrode 12 for being formed in mounting surface of 2nd electronic component 11
Spacing is small between the electrode of the electrode of mounting surface, and spacing is, for example, 150 μm between the mutual electrode of immediate electrode 12.In addition,
Electrode 12 may not be the electrode being made of metal film, but the salient pole of golden convex block etc..
The electrode 12 for being formed in mounting surface of 2nd electronic component 11 by solder 8 in the 2nd interarea 1B shape of substrate 1
At electrode 3 engage.In addition, the engagement for electrode 12 and electrode 3, can also replace solder 8 and use conductive adhesive
Deng.In addition, the 2nd electronic component 11 can directly or indirectly be installed on substrate 1.Being installed on substrate indirectly means in base
Sealing resin is formed on plate and the 2nd electronic component is installed on the sealing resin.
The 2nd electronic components 9 that be installed on the 1st interarea 1A of substrate 1, the 1st electronic component 4 and shaped like chips are by the 1st sealing
Resin 13 seals.
For the 1st sealing resin 13, the moisture-proof under and solid state low using the mobility under uncured state is high
Resin.1st sealing resin 13 is using the reason of low resin of mobility in the uncured state, it is close forming the 1st
It seals in the process of resin 13, so that the hollow portion 5 of the 1st electronic component 4 will not be subject to crushing because of the pressure of the 1st sealing resin 13.
In addition, be for the 1st sealing resin 13 using the reason of high resin of the moisture-proof under solid state, inhibit moisture intrusion by
The hollow portion 5 of 1st electronic component 4 of the 1st sealing resin 13 sealing.
In the present embodiment, it as the 1st sealing resin 13, has used in the epoxy resin as substrate as filler
Resin made of the powder for the silica that the average grain diameter for being added to 80 volume % is 30 μm.In addition, the epoxy resin of substrate
The property for having at least one party of Thermocurable and photo-curable.1st sealing resin 13 since the additive amount of filler is more,
Mobility is low in the uncured state, and moisture-proof is high in the solid state.In addition, the type of the substrate of the 1st sealing resin 13
It is arbitrary, silicone resin, acrylic resin etc. can also be used with substituted epoxy resin.In addition, the material of filler is also to appoint
Meaning, silica can also be replaced and use aluminium oxide, boron nitride or their composite material etc..
The 2nd electronic component 11 for being installed on the 2nd interarea 1B of substrate 1 is sealed by the 2nd sealing resin 14.
For the 2nd sealing resin 14, the high resin of the mobility under uncured state is used.For the 2nd sealing resin 14
It is using the reason of high resin of mobility in the uncured state, in the small electrode of the electrode spacing of the 2nd electronic component 11
The 2nd sealing resin 14 is sufficient filling between 12, so that the 2nd sealing resin 14 between electrode 12 does not form gap.
In the present embodiment, it as the 2nd sealing resin 14, has used in the epoxy resin as substrate as filler
Resin made of the powder for the silica that the average grain diameter for being added to 50 volume % is 30 μm.In addition, the epoxy resin of substrate
The property for having at least one party of Thermocurable and photo-curable.2nd sealing resin 14 since the additive amount of filler is few,
Mobility is high in the uncured state.In addition, the 2nd sealing resin 14 is since the additive amount of filler is few, moisture-proof is closeer than the 1st
It is low to seal resin 13.In addition, the type of the substrate of the 2nd sealing resin 14 is arbitrary, silicon can also be used with substituted epoxy resin
Ketone resin, acrylic resin etc..In addition, the material of filler is also arbitrary, can also replace silica and use aluminium oxide,
Boron nitride or their composite material etc..In addition, in the present embodiment, being filled out although being added in the 2nd sealing resin 14
Material, however, you can also not add filler in the 2nd sealing resin 14, is set as so-called virgin resin.
It penetrates through the 2nd sealing resin 14 and is formed with multiple pore electrods 15 excessively.The material for crossing pore electrod 15 is arbitrary, but example
Such as use copper.The one end for crossing pore electrod 15 is connect with the electrode 3 of the 2nd interarea 1B formation in substrate 1.In addition, crossing pore electrod
15 other end exposes in the outer surface of the 2nd sealing resin 14.Moreover, to the mistake exposed in the outer surface of the 2nd sealing resin 14
The other end of pore electrod 15 is for example implemented gold-plated, forms the external electrode 16 used when installing electronic module 100.
By the electronic module 100 constructed above constituted since the mobility under the uncured state of the 1st sealing resin 13 is low,
Therefore it inhibits pressure of the hollow portion 5 of the 1st electronic component 4 when filling 1 sealing resin 13 due to is subject to crushing.In addition, electronics
Module 100 inhibits moisture to the intrusion of the hollow portion 5 of the 1st electronic component 4 by the 1st high sealing resin 13 of moisture-proof.This
Outside, electronic module 100 is due to the mobility height under the uncured state of the 2nd sealing resin 14, in the 2nd electronic component 11
The 2nd sealing resin 14 has been sufficient filling between the small electrode 12 of electrode spacing, it is suppressed that the formation in gap.
It for example can be by system described below by the electronic module of the first embodiment 100 constructed above constituted
Method is made to make.In addition, using mother substrate, carrying out singualtion in actual manufacturing process in midway, thus making together
Multiple electronic modules 100, but below for convenience's sake, illustrate the case where making electronic module 100.
(an example of the manufacturing method of electronic module 100)
Firstly, preparation is formed with electrode 2 in the 1st interarea 1A in advance as shown in Fig. 2 (A), electricity is formed in the 2nd interarea 1B
Pole 3 is formed with the substrate 1 for the internal wiring (not shown) that electrode 2 is connected with electrode 3 in inside.
Secondly, the 1st electronic component 4 and the 2nd electronic component 9 to be installed on to the 1st interarea 1A of substrate 1 as shown in Fig. 2 (B)
Electrode 2.Specifically, firstly, applying cream solder on the electrodes 2.Next, on the electrode 2 coated with cream solder
Configure the electrode 7 of the 1st electronic component 4, electrode 10a, 10b of the 2nd electronic component 9.Secondly, being heated and keeping cream solder molten
Melt, be then cooled off and form solder 8, by the electrode 7 of the 1st electronic component 4 and electrode 10a, 10b of the 2nd electronic component 9
It is engaged in the electrode 2 in the 1st interarea 1A formation of substrate 1.
Next, as shown in Fig. 2 (C), by the 1st sealing resin 13 to the 1st electronics of the 1st interarea 1A installation in substrate 1
Component 4 and the 2nd electronic component 9 are sealed.Specifically, firstly, in the 1st electronic component 4 and the 2nd electronic component 9
Surrounding fills uncured 1st sealing resin 13.Secondly, implementing at least one party of heating and light irradiation, make the 1st sealing resin
13 solidifications.In addition, since mobility is low in the uncured state for the 1st sealing resin 13, the hollow portion 5 of the 1st electronic component 4
It will not be subject to crushing due to pressure when filling 1 sealing resin 13.
Then, as shown in Fig. 3 (D), the 2nd electronic component 11 is installed on to the electrode 3 of the 2nd interarea 1B of substrate 1.It is specific and
Speech, firstly, inverting the up and down direction of substrate 1.Secondly, applying cream solder on the electrode 3 for installing the 2nd electronic component 11.
Next, configuring the electrode 12 of the 2nd electronic component 11 on the electrode 3 coated with cream solder.Secondly, being heated and making cream
Shape melt solder is then cooled off and forms solder 8, and the electrode 12 of the 2nd electronic component 11 is engaged in the 2nd of substrate 1
The electrode 3 that interarea 1B is formed.
Secondly, as shown in Fig. 3 (E), by the 2nd sealing resin 14 to the 2nd ministry of electronics industry of the 2nd interarea 1B installation in substrate 1
Part 11 is sealed.Specifically, firstly, filling uncured 2nd sealing resin 14 around the 2nd electronic component 11.It connects
Get off, implements at least one party of heating and light irradiation, solidify the 2nd sealing resin 14.In addition, due to the 2nd sealing resin 14
Mobility is high in the uncured state, therefore between the small electrode 12 of the electrode spacing for being sufficiently filled to the 2nd electronic component 11, non-shape
At gap.
Next, as shown in Fig. 3 (F), such as by the irradiation of laser, be used to form in the formation of the 2nd sealing resin 14
The hole 15 ' of pore electrod 15.In addition, hole 15 ' is formed as the electrode 3 that bottom reaches the 2nd interarea 1B of substrate 1.But, hole 15 '
It forms the irradiation that can also replace laser and is carried out by cutting using drill bit etc. etc..
Then, as shown in Fig. 4 (G), the electrode 3 of the 2nd interarea 1B exposing in the bottom in hole 15 ', being formed in substrate 1
On, metal is precipitated by plating, formed pore electrod 15.
Finally, crossing implementation plating on pore electrod 15 what is exposed from the outer surface of the 2nd sealing resin 14 as shown in Fig. 4 (H)
It covers, external electrode 16 is formed, to complete electronic module 100.
Next, being illustrated to the variation of electronic module 100.
(the 1st variation of electronic module 100)
In above-mentioned electronic module 100, for the 2nd sealing resin 14, use in the epoxy resin as substrate
Resin made of the powder for the silica that the average grain diameter of 50 volume % is 30 μm is added to as filler.
The electronic module that 1st variation is related to does not change the type of the substrate of the 2nd sealing resin 14, the material of filler, fills out
The volume % of material, and the average grain diameter of filler is only changed to 10 μm from 30 μm.
In addition, not changing the 1st sealing resin 13, filled out as described above, having used and being used as in the epoxy resin as substrate
Material is added to resin made of the powder for the silica that the average grain diameter of 80 volume % is 30 μm.
The electronic module that 1st variation is related to is by the average grain diameter of the filler that will be added in the 2nd sealing resin 14 from 30 μ
M is reduced to 10 μm, so that the mobility under the uncured state of the 2nd sealing resin 14 becomes higher.The electricity that 1st variation is related to
Submodule is since the mobility under the uncured state of the 2nd sealing resin 14 becomes higher, in the electricity of the 2nd electronic component 11
It is reliably filled with the 2nd sealing resin 14 between extremely closely spaced electrode 12, becomes to be less susceptible to form gap.
(the 2nd variation of electronic module 100)
In the electronic module that the 1st variation is related to, by the average grain diameter of the filler added in the 2nd sealing resin 14 from 30
μm it is reduced to 10 μm.
The electronic module that 2nd variation is related to does not add filler in the 2nd sealing resin 14, is set as so-called non-filling tree
Rouge.
The electronic module that 2nd variation is related to is by being set as virgin resin for the 2nd sealing resin 14, thus the 2nd sealing
Mobility under the uncured state of resin 14 is further got higher.Thus, in the small electrode of the electrode spacing of the 2nd electronic component 11
It is more reliably filled with the 2nd sealing resin 14 between 12, becomes more to be not easy to form gap.
[the 2nd embodiment]
Electronic module 200 of the second embodiment is shown in FIG. 5.Wherein, Fig. 5 is the section of electronic module 200
Figure.
Electronic module 200 is applied with change to electronic module 100 of the first embodiment.Specifically, in electronic die
In block 100, two the 1st electronic components 4 with hollow portion 5 are mounted in the 1st interarea 1A of substrate 1 and without hollow portion
One the 2nd electronic component 9, but in electronic module 200, one among the 1st electronic component 4 is replaced into the 2nd electronic component
21.2nd electronic component 21 is sealed by the 1st sealing resin 13 together with the 1st electronic component 4 and the 2nd electronic component 9.
2nd electronic component 21 is also semiconductor device in the same manner as the 2nd electronic component 11, is formed with multiple electricity in mounting surface
Pole 22.However, the 2nd electronic component 21 compared with the 2nd electronic component 11, is formed in spacing between the electrode of the electrode 22 of mounting surface
Greatly, for example, 0.3mm.
Even if the 2nd electronic component 21 is sealed by the 1st low sealing resin 13 of mobility in the uncured state, due to being formed
Spacing is big between the electrode of the electrode 22 of mounting surface, therefore the 1st sealing resin 13 has also been sufficient filling between electrode 22, not formed
Gap.
Even the 2nd electronic component, as long as being formed in as the 2nd electronic component 21 between the electrode of electrode 22 of mounting surface
Spacing is sufficiently big, then can also be installed on the 1st interarea 1A of substrate 1, and 1st sealing low by mobility in the uncured state
Resin 13 seals.
[the 3rd embodiment]
Electronic module 300 of the third embodiment is shown in FIG. 6.Wherein, Fig. 6 is the section of electronic module 300
Figure.
Electronic module 300 is also applied with change to electronic module 100 of the first embodiment.Specifically, in electronics
In module 100, spacing is the smallest by between the electrode for the electrode for being formed in mounting surface among the 2nd electronic component without hollow portion
2 electronic components 11 are fully sealed by the 2nd sealing resin 14.That is, the 2nd electronic component 11 includes mounting surface, opposite with mounting surface one
Including the top surface and side of side, all faces are all covered by the 2nd sealing resin 14.Electronic module 300 applies change to it,
Make the top surface of the smallest 2nd electronic component 31 of spacing between the electrode for the electrode for being formed in mounting surface among the 2nd electronic component from the 2nd
The outer surface of sealing resin 14 is exposed to outside.In addition, having used thickness ratio for the 2nd electronic component 31 of electronic module 300
The small electronic component of 2nd electronic component 11 of electronic module 100.
Electronic module 300 is by being exposed to the top surface of the 2nd electronic component 31 outside from the outer surface of the 2nd sealing resin 14
Portion, so that the thickness of the 2nd sealing resin 14 becomes smaller, by shortization.In addition, the electricity small using thickness for the 2nd electronic component 31
Subassembly also contributes to shortization.
[the 4th embodiment]
Electronic module 400 of the fourth embodiment is shown in FIG. 7.Wherein, Fig. 7 is the section of electronic module 400
Figure.
Electronic module 400 has added structure to electronic module 100 of the first embodiment.Specifically, electronic module
400 form bucking electrode 41 in the top surface of electronic module 100 and four sides.More specifically, in the 1st sealing resin 13
A part of the outer surface of four end faces and the 2nd sealing resin 14 of all outer surface, substrate 1, forms bucking electrode
41.The material and structure of bucking electrode 41 are arbitrary, but be for example capable of forming for comprising Ti, Ni, Cr, SUS or they
Alloy adhesion layer, the conductive layer comprising Cu, Al, Ag or their alloy, include Ti, Ni, Cr or their conjunction
3 layers of construction of the anticorrosion layer of gold.
Electronic module 400 can be inhibited the noise immersed externally to inside by bucking electrode 41 and from inside
The noise released to outside.In addition, electronic module 400 is due to inhibiting the intrusion of moisture internally by bucking electrode 41, because
This moisture-proof improves.
[the 5th embodiment]
Electronic module 500 of the fifth embodiment is shown in FIG. 8.Wherein, Fig. 8 is the section of electronic module 500
Figure.
In the 1st embodiment~electronic module of the fourth embodiment 100,200,300,400, the of substrate 1
1 interarea 1A forms the 1st sealing resin 13, forms the 2nd sealing resin 14 in the 2nd interarea 1B of substrate 1.In electronic module
In 500, it is changed, the 2nd sealing resin 14 is formd on the 1st interarea 51A of substrate 51, in the 2nd sealing resin 14
On form the 1st sealing resin 13.Hereinafter, being simply illustrated.
Electronic module 500 has substrate 51.Electrode 3 is formed in the 1st interarea 51A of substrate 51.The 2nd in substrate 51 is main
Face 51B is formed with the external electrode 56 used when installing electronic module 500.
In the 1st interarea 51A of substrate 51, it is equipped among the 2nd electronic component without hollow portion and is formed in mounting surface
Electrode electrode between the smallest 2nd electronic component (semiconductor device) 11 of spacing.
2nd electronic component 11 is sealed by the 2nd sealing resin 14.It is also same as electronic module 100 in electronic module 500
Ground has used as the 2nd sealing resin 14 and has been added to being averaged for 50 volume % as filler in the epoxy resin as substrate
Resin made of the powder for the silica that partial size is 30 μm.2nd sealing resin 14 is since the additive amount of filler is few, not
Mobility is high under solid state.
It penetrates through the 2nd sealing resin 14 and is formed with multiple pore electrods 55 excessively.Cross one end of pore electrod 55 and in substrate 51
The electrode 3 that 1st interarea 51A is formed connects.In addition, the other end for crossing pore electrod 55 exposes in the outer surface of the 2nd sealing resin 14.
Electrode 52 is formed on the 2nd sealing resin 14.Given electrode 52 is showed with the appearance in the 2nd sealing resin 14
Pore electrod 55 of crossing out connects.
In the electrode 52 being formed on the 2nd sealing resin 14, two the 1st electronic component (bullets with hollow portion 5 are installed
Property wave apparatus) 4 and shaped like chips the 2nd electronic component 9.
1st electronic component 4 and the 2nd electronic component 9 are sealed by the 1st sealing resin 13.In electronic module 500, also with electricity
Submodule 100 has used similarly, for the 1st sealing resin 13 and has been added to 80 as filler in the epoxy resin as substrate
Resin made of the powder for the silica that the average grain diameter of volume % is 30 μm.Addition of 1st sealing resin 13 due to filler
Amount is more, therefore moisture-proof is high, and mobility is low in the uncured state.
Electronic module 500 can make using an example of the manufacturing method of above-mentioned electronic module 100.Specifically,
Firstly, installing the 2nd electronic component 11 in substrate 51.Secondly, being sealed by the 2nd sealing resin 14 to the 2nd electronic component 11.It connects
Get off, formed pore electrod 55 in the 2nd sealing resin 14.Then, electrode 52 is formed on the 2nd sealing resin 14.Secondly, in electricity
Pole 52 is installed by the 1st electronic component 4 and the 2nd electronic component 9.Finally, by the 1st sealing resin 13 to the 1st electronic component 4 and the 2nd
Electronic component 9 is sealed, and completes electronic module 500.
Electronic module 500 is since the mobility under the uncured state of the 2nd sealing resin 14 is high, in the 2nd ministry of electronics industry
The 2nd sealing resin 14 has been sufficient filling between the small electrode 12 of the electrode spacing of part 11, it is suppressed that the formation in gap.In addition, electronics
Module 500 inhibits the hollow of the 1st electronic component 4 since the mobility under the uncured state of the 1st sealing resin 13 is low
It is subject to crushing due to pressure of the portion 5 when filling 1 sealing resin 13.In addition, the 1st sealing that electronic module 500 is high by moisture-proof
Resin 13 inhibits moisture to the intrusion of the hollow portion 5 of the 1st electronic component 4.
More than, the 1st embodiment~electronic module of the fifth embodiment 100,200,300,400,500 is carried out
Explanation.However, the utility model is not limited to above-mentioned content, various changes can be carried out according to the purport of utility model
More.
For example, in electronic module 100,200,300,400,500, for the 1st sealing resin 13 and the 2nd sealing resin
14 substrate has used epoxy resin, but the type of the substrate of resin is arbitrary, and can also be used with substituted epoxy resin
Such as silicone resin etc..In addition, the type of substrate can also be different in the 1st sealing resin 13 and the 2nd sealing resin 14.
In addition, in electronic module 100,200,300,400,500, for the 1st sealing resin 13 and the 2nd sealing resin
14 filler has used the powder of silica, but the material of filler is arbitrary, and can also replace silica and use
Such as aluminium oxide, boron nitride or their composite material etc..In addition, in the 1st sealing resin 13 and the 2nd sealing resin 14,
The material of filler can also be different.
In addition, in electronic module 100,200,300,400,500, as the 1st electronic component 4 with hollow portion 5
Acoustic wave device is used, but the type of the 1st electronic component 4 is arbitrary, acoustic wave device can also be replaced and use other
1st electronic component of type.
In addition, in electronic module 100,200,300,400,500, as the 2nd electronic component 11 for not having hollow portion
And semiconductor device has been used, but the type of the 2nd electronic component 11 is arbitrary, semiconductor device can also be replaced and use it
2nd electronic component of his type.
In addition, the method in electronic module 100,200,300,400,500, by the way that metal is precipitated using electrolytic coating
Formd pore electrod 15,55 in the 2nd sealing resin 14, but can also replace, by be embedded to pin-shaped metal terminal from
And pore electrod 15,55 was formed in the 2nd sealing resin 14.
In addition, the 2nd sealing resin 14 is formd on the 1st interarea 51A of substrate 51, the 2nd in electronic module 500
The 1st sealing resin 13 is formd on sealing resin 14, but can also exchange the sequence, is formed on the 1st interarea 51A of substrate 51
1st sealing resin 13 forms the 2nd sealing resin 14 on the 1st sealing resin 13.
Claims (9)
1. a kind of electronic module, has:
Substrate；
At least one the 1st electronic component forms multiple electrodes in the mounting surface installed to the substrate, and has hollow portion；
At least one the 2nd electronic component forms multiple electrodes in the mounting surface installed to the substrate, and does not have hollow
Portion；
1st sealing resin；With
2nd sealing resin,
Wherein,
1st electronic component is sealed by the 1st sealing resin,
The smallest 2nd electricity of spacing between the electrode for the electrode for being formed in the mounting surface among 2nd electronic component
The mounting surface including at least the electrode of subassembly is sealed by the 2nd sealing resin,
The volume % of the filler contained in 1st sealing resin is than the volume % of the filler contained in the 2nd sealing resin
It is high.
2. a kind of electronic module, has:
Substrate；
At least one the 1st electronic component forms multiple electrodes in the mounting surface installed to the substrate, and has hollow portion；
At least one the 2nd electronic component forms multiple electrodes in the mounting surface installed to the substrate, and does not have hollow
Portion；
1st sealing resin；With
2nd sealing resin,
Wherein,
1st electronic component is sealed by the 1st sealing resin,
The smallest 2nd electricity of spacing between the electrode for the electrode for being formed in the mounting surface among 2nd electronic component
The mounting surface including at least the electrode of subassembly is sealed by the 2nd sealing resin,
The average grain diameter of the filler contained in 1st sealing resin is averaged than the filler that contains in the 2nd sealing resin
Partial size is big.
3. electronic module according to claim 1 or 2, wherein
The moisture-proof of 1st sealing resin is higher than the moisture-proof of the 2nd sealing resin.
4. electronic module according to claim 1 or 2, wherein
It is formed with the 1st sealing resin in an interarea of the substrate,
The 2nd sealing resin is formed in another interarea of the substrate.
5. electronic module according to claim 1 or 2, wherein
The 1st sealing resin and the 2nd sealing resin are formed in the interarea stacking of the substrate.
6. electronic module according to claim 1 or 2, wherein
1st electronic component is acoustic wave device.
7. electronic module according to claim 1 or 2, wherein
The smallest 2nd electricity of spacing between the electrode for the electrode for being formed in the mounting surface among 2nd electronic component
Subassembly is semiconductor device.
8. electronic module according to claim 1 or 2, wherein
The electronic module is also equipped with the external electrode of installation,
The external electrode is formed in the outer surface of the 2nd sealing resin.
9. electronic module according to claim 1 or 2, wherein
At least part in the outer surface of the outer surface and the 2nd sealing resin of the 1st sealing resin is formed with screen
Cover electrode.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2017139540 | 2017-07-19 | ||
| JP2017-139540 | 2017-07-19 | ||
| JP2018081929A JP6891849B2 (en) | 2017-07-19 | 2018-04-21 | Electronic module and manufacturing method of electronic module |
| JP2018-081929 | 2018-04-21 |
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| US11587881B2 (en) | 2020-03-09 | 2023-02-21 | Advanced Semiconductor Engineering, Inc. | Substrate structure including embedded semiconductor device |
| US11335646B2 (en) * | 2020-03-10 | 2022-05-17 | Advanced Semiconductor Engineering, Inc. | Substrate structure including embedded semiconductor device and method of manufacturing the same |
| WO2022163263A1 (en) * | 2021-02-01 | 2022-08-04 | 株式会社村田製作所 | Elastic wave device |
| WO2023021888A1 (en) * | 2021-08-20 | 2023-02-23 | 株式会社村田製作所 | Electronic component module |
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| JPH0873564A (en) * | 1994-09-09 | 1996-03-19 | Sumitomo Chem Co Ltd | Epoxy resin composition and semiconductor device sealed therewith |
| JP4961663B2 (en) * | 2004-10-20 | 2012-06-27 | Ｄｉｃ株式会社 | Epoxy resin composition, cured product thereof, novel epoxy resin and production method thereof |
| JP4524474B2 (en) * | 2005-11-17 | 2010-08-18 | 富士通メディアデバイス株式会社 | Elastic wave device and manufacturing method thereof |
| JP2011124366A (en) * | 2009-12-10 | 2011-06-23 | Renesas Electronics Corp | Semiconductor device and method for manufacturing the same |
| JP5201371B2 (en) * | 2010-03-19 | 2013-06-05 | Ｔｄｋ株式会社 | Electronic component module |
| WO2014017228A1 (en) * | 2012-07-26 | 2014-01-30 | 株式会社村田製作所 | Module |
| JP6393092B2 (en) * | 2013-08-07 | 2018-09-19 | 日東電工株式会社 | Hollow type electronic device sealing resin sheet and method for producing hollow type electronic device package |
| JP6213128B2 (en) * | 2013-10-09 | 2017-10-18 | 富士通株式会社 | Electronic component package and method of manufacturing electronic component package |
| JP2017028174A (en) * | 2015-07-24 | 2017-02-02 | サンケン電気株式会社 | Semiconductor device |
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