JP2019021904A - Electron module and method for manufacturing the same - Google Patents

Abstract

To incorporate a first electronic component having a hollow part and a second electronic component with no hollow part in an electron module in a good state.SOLUTION: An electron module comprises: a substrate 1; at least one first electronic component 4 having a hollow part 5; at least one second electronic component 11 having no hollow part; a first sealing resin 13; and a second sealing resin 14. The first electronic component 4 is sealed by the first sealing resin 13. As to the second electronic component 11 smallest in the pitch between electrodes formed on a mount face, of the at least one second electronic component 11, the mount face including at least the electrodes 12 is sealed by the second sealing resin 14. A percent by volume of a filler included in the first sealing resin 13 is higher than a percent by volume of the filler included in the second sealing resin 14.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic module in which an electronic component is mounted on a substrate and sealed with a sealing resin. The present invention also relates to an electronic module manufacturing method suitable for manufacturing the electronic module of the present invention.

  Electronic modules in which electronic components are mounted on a substrate and sealed with a sealing resin are widely used in various electronic devices. As an example, FIG. 9 shows an electronic module 1100 disclosed in WO2014-0117159A1 (Patent Document 1).

  In an electronic module 1100, chip-like electronic components (chip components) 102, 103, and 104 having electrodes formed on both ends of capacitors, inductors, resistors, and the like are mounted on one main surface of a substrate (wiring substrate) 101. . A semiconductor device (semiconductor substrate) 105 having a plurality of electrodes formed on the mounting surface is mounted on the other main surface of the substrate 101.

  The electronic components 102, 103, and 104 are sealed with a sealing resin (resin layer) 108. Further, the semiconductor device 105 is sealed with a sealing resin 109.

  In the electronic module 1100, the sealing resin 108 and the sealing resin 109 that are the same kind of resin are used on one main surface and the other main surface of the substrate (wiring substrate) 101. However, when the warpage of the electronic module 1100 is large, the linear expansion coefficients of the sealing resin 108 and the sealing resin 109 may be different in order to suppress the warpage.

  In addition, elastic wave devices using SAW (Surface Acoustic Wave) and BAW (Bulk Acoustic Wave) are widely used as resonators and filters in electronic devices such as mobile communication devices. ing. As an example, FIG. 10 shows an acoustic wave device 1200 disclosed in WO2015-098678A1 (Patent Document 2).

  The acoustic wave device 1200 includes a hollow portion 204 surrounded by a substrate (support substrate) 201, a support member 202, a lid member 203, and the like.

  In the acoustic wave device 1200, an IDT electrode 206 is formed on a piezoelectric thin film 205 formed in the hollow portion 204. The hollow portion 204 is provided so that the vibration of the IDT electrode 206 is not hindered.

WO2014-0117159A1 WO2015-098678A1

  The electronic module 1100 includes chip-shaped electronic components 102, 103, 104 such as capacitors, inductors, resistors, etc., and a semiconductor device 105. In order to further increase the functionality of the electronic module 1100, there are cases where it is desired to add an electronic component having a hollow portion such as the elastic wave device 1200 to be incorporated.

  However, when an attempt is made to seal a semiconductor device in which a plurality of electrodes are formed on the mounting surface at an extremely small pitch and an electronic component having a hollow portion with a sealing resin having the same fluidity, the following is performed. Problems occur.

  That is, the semiconductor device has a plurality of electrodes formed on the mounting surface, but generally, the pitch between the electrodes is extremely small, and therefore, when sealing the semiconductor device, it is necessary to use a resin with high fluidity. is there. If a sealing resin with low fluidity is used, the sealing resin is not sufficiently filled between the electrodes on the mounting surface of the semiconductor device, and a gap may be formed. And if a gap is formed in the sealing resin between the electrodes of the semiconductor device, it is used to mount the semiconductor device on the substrate by heat when mounting the electronic module on the substrate of the electronic device by reflow soldering etc. The solder that has been melted again expands and expands into the gap. As a result, there is a possibility that a phenomenon called solder flash that short-circuits the electrodes of the semiconductor device may occur.

  On the other hand, when sealing an electronic component having a hollow portion, such as the acoustic wave device 1200, it is necessary to use one having low fluidity. If a sealing resin with high fluidity is used, the hollow part may be crushed by the pressure of the sealing resin in the step of forming the sealing resin around the electronic component having the hollow part.

  In many cases, an inorganic filler such as silica is added to the sealing resin for the purpose of adjusting the linear expansion coefficient. Addition of the filler generally lowers the fluidity of the sealing resin. In addition, since the filler blocks the moisture permeation path in the sealing resin, generally, the more filler is added, the higher the moisture resistance of the sealing resin. When the same amount (same volume) of filler is added to the sealing resin, the fluidity increases as the average particle size of the filler decreases, and the fluidity tends to decrease as the average particle size increases.

  As described above, since the fluidity required for the sealing resin differs for each built-in electronic component, a semiconductor device having a small inter-electrode pitch and an electronic component having a hollow portion are mounted on the substrate of the electronic module. However, when trying to seal with a sealing resin having the same fluidity, the following problems occur.

  First, in order to sufficiently fill the sealing resin between the electrodes of the electronic component (semiconductor device) having a small inter-electrode pitch, and to prevent a gap from being formed in the sealing resin between the electrodes, When a high one is used, there is a possibility that the hollow part of the electronic component (elastic wave device) having the hollow part may be crushed by the pressure when the sealing resin is filled.

  On the contrary, in order to prevent the hollow part of the electronic component having a hollow part from being crushed by the pressure when filling the sealing resin, the pitch between the electrodes is reduced by using a sealing resin with low fluidity. There is a possibility that the sealing resin is not sufficiently filled between the electrodes of the small electronic component, and a gap is formed in the sealing resin between the electrodes, which may cause a solder flash.

  The present invention has been made to solve the above-described conventional problems. As a means for the electronic module according to one aspect of the present invention, a substrate and a plurality of electrodes are formed on a mounting surface of the substrate. And at least one first electronic component having a hollow portion, a plurality of electrodes formed on the mounting surface on the substrate, and at least one second electronic component having no hollow portion, A sealing resin and a second sealing resin, wherein the first electronic component is sealed with the first sealing resin, and the pitch between the electrodes formed on the mounting surface of the second electronic component is The smallest second electronic component is such that at least the mounting surface including the electrode is sealed with the second sealing resin, and the volume percentage of the filler contained in the first sealing resin is the filler contained in the second sealing resin. Higher than the volume%. In addition, even when a filler is not contained in 2nd sealing resin, it corresponds when the volume% of the filler contained in 1st sealing resin is higher than the volume% of the filler contained in 2nd sealing resin. Shall.

  In addition, an electronic module according to another aspect of the present invention includes a substrate, a plurality of electrodes formed on a mounting surface of the substrate, and at least one first electronic component having a hollow portion; A plurality of electrodes are formed on the mounting surface, and includes at least one second electronic component that does not have a hollow portion, a first sealing resin, and a second sealing resin. The second electronic component that is sealed with the first sealing resin and has the smallest inter-electrode pitch of the electrodes formed on the mounting surface among the second electronic components has a mounting surface that includes at least the electrode at the second sealing resin. The average particle size of the filler contained in the first sealing resin is larger than the average particle size of the filler contained in the second sealing resin. Even when the second sealing resin contains no filler, the average particle size of the filler contained in the first sealing resin is larger than the average particle size of the filler contained in the second sealing resin. Applicable.

  In addition, the average particle diameter of the filler contained in resin is measured with the following method. First, the cross section of the resin containing the filler is exposed. Next, from the exposed cross section, an arbitrary square cross section including 100 or more and less than 110 fillers is determined as a “measurement region”, and a first SEM (scanning electron microscope) image (reflection) is determined. Take an electronic image. Next, a cross section of a part 3 μm deeper is exposed in the measurement region, and a second SEM image is taken. This process is repeated, and a plurality of SEM images are taken for the measurement region for the third time, the fourth time, the nth time. Next, 10 fillers are arbitrarily selected from among the fillers included in the measurement region, and are specified as measurement target fillers. Next, for each measurement target filler, the one having the largest filler cross-section is selected from a plurality of photographed SEM images, and the area is defined as the maximum cross-sectional area without only the measurement target filler (10 measurement targets). For each filler, determine the maximum cross-sectional area). The diameter when it is assumed that the measurement target filler is a true sphere is obtained from the maximum cross-sectional area of each measurement target filler alone, and the obtained diameter is defined as the measurement target filler only particle size. An average value of the particle diameters of only 10 fillers to be measured is obtained and set as the average particle diameter of the filler contained in the resin.

  It is also preferable to make the moisture resistance of the first sealing resin higher than the moisture resistance of the second sealing resin. In this case, the penetration of moisture into the hollow portion of the first electronic component can be suppressed by the first sealing resin having high moisture resistance.

  In the electronic module of the present invention, for example, a first sealing resin may be formed on one main surface of the substrate, and a second sealing resin may be formed on the other main surface of the substrate. Alternatively, the electronic module of the present invention can be formed by laminating the first sealing resin and the second sealing resin on one main surface of the substrate.

  The first electronic component is an elastic wave device using, for example, SAW or BAW. In addition, among the second electronic components, the second electronic component having the smallest inter-electrode pitch between the electrodes formed on the mounting surface is, for example, a semiconductor device.

  Further, it is preferable that an external electrode for mounting is provided, and the external electrode is formed on the outer surface of the second sealing resin. In the electronic module, moisture easily enters from the portion where the external electrode of the sealing resin is formed, but the first electronic component is sealed with the first sealing resin and the external electrode is used as the second sealing resin. Even if moisture penetrates into the inside from the portion where the external electrode of the second sealing resin is formed, the moisture that has entered the first electronic component is hollowed by the first sealing resin and the module substrate. It is because it can suppress reaching.

  It is also preferable that a shield electrode is formed on at least a part of the outer surface of the first sealing resin and the outer surface of the second sealing resin. In this case, the shield electrode can suppress noise entering the inside of the electronic module from outside and noise emitted from the inside of the electronic module to the outside. Moreover, since the penetration | invasion of the water | moisture content to an inside can be suppressed also by a shield electrode, it is because the moisture resistance of an electronic module can further be improved.

  An electronic module manufacturing method according to one aspect of the present invention includes a substrate, a plurality of electrodes formed on a mounting surface on the substrate, and at least one first electronic component having a hollow portion, and mounting on the substrate. A plurality of electrodes are formed on the surface, and at least one second electronic component having no hollow portion, an uncured first sealing resin, and more fluid than the uncured first sealing resin Preparing a high uncured second sealing resin, mounting the first electronic component directly or indirectly on the substrate, and mounting the second electronic component directly or indirectly on the substrate A step of filling an uncured first sealing resin around the mounted first electronic component and then curing the uncured first sealing resin; and mounting the second electronic component Of these, the second electronic component having the smallest pitch between the electrodes formed on the mounting surface , The mounting surface including at least the electrode, after filling the second sealing resin uncured, and so comprises curing the second sealing resin uncured, the.

  According to another aspect of the present invention, there is provided a method for manufacturing an electronic module, comprising: a substrate; a plurality of electrodes formed on a mounting surface of the substrate; and at least one first electronic component having a hollow portion; A plurality of electrodes are formed on the mounting surface on the substrate, and have at least one second electronic component, an uncured first sealing resin, and an uncured first sealing resin that do not have a hollow portion. A step of preparing an uncured second sealing resin having a low moisture resistance in a cured state, a step of preparing the first electronic component directly or indirectly on the substrate, a second step The step of mounting the electronic component directly or indirectly on the substrate, and the periphery of the mounted first electronic component is filled with the uncured first sealing resin, and then the uncured first sealing resin is Step of curing and electrode formed on mounting surface among mounted second electronic components A step of filling the mounting surface including at least the electrode of the second electronic component having the smallest inter-electrode pitch with the uncured second sealing resin and curing the uncured second sealing resin. I did it.

  The first electronic component is sealed with the first sealing resin, and the mounting surface including at least the electrode of the second electronic component having the smallest inter-electrode pitch of the electrodes formed on the mounting surface among the second electronic components is The electronic module of the present invention is sealed with two sealing resins, and the volume% of the filler contained in the first sealing resin is higher than the volume% of the filler contained in the second sealing resin. Since the fluidity of the second sealing resin in the uncured state is high, the second sealing resin is sufficiently filled in the mounting surface including at least the electrodes of the second electronic component, and the sealing between the electrodes of the second electronic component is performed. It is difficult to form voids in the stop resin. Moreover, since the fluidity | liquidity in the uncured state of 1st sealing resin is low, the hollow part of a 1st electronic component is hard to be crushed by the pressure when filling 1st sealing resin.

  In addition, the first electronic component is sealed with the first sealing resin, and the mounting surface including at least the electrodes of the second electronic component having the smallest inter-electrode pitch formed on the mounting surface among the second electronic components. Of the present invention in which the average particle size of the filler contained in the first sealing resin is larger than the average particle size of the filler contained in the second sealing resin. Since the electronic module has high fluidity in the uncured state of the second sealing resin, the mounting surface including at least the electrode of the second electronic component is sufficiently filled with the second sealing resin. It is difficult to form voids in the sealing resin between the electrodes. Moreover, since the fluidity | liquidity in the uncured state of 1st sealing resin is low, the hollow part of a 1st electronic component is hard to be crushed by the pressure when filling 1st sealing resin.

  According to the electronic module manufacturing method of the present invention, the electronic module of the present invention can be easily manufactured.

It is sectional drawing which shows the electronic module 100 concerning 1st Embodiment. 2A to 2C are cross-sectional views illustrating steps performed in an example of a method for manufacturing the electronic module 100. 3D to 3F are continuations of FIG. 2C, and are cross-sectional views illustrating steps performed in an example of the method for manufacturing the electronic module 100. FIGS. 4G and 4H are continuations of FIG. 3F and are cross-sectional views illustrating steps performed in an example of a method for manufacturing the electronic module 100. FIG. It is sectional drawing which shows the electronic module 200 concerning 2nd Embodiment. It is sectional drawing which shows the electronic module 300 concerning 3rd Embodiment. It is sectional drawing which shows the electronic module 400 concerning 4th Embodiment. It is sectional drawing which shows the electronic module 500 concerning 5th Embodiment. 1 is a cross-sectional view showing an electronic module 1100 disclosed in Patent Document 1. FIG. 10 is a cross-sectional view showing an acoustic wave device 1200 disclosed in Patent Document 2. FIG.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. Each embodiment shows an embodiment of the present invention exemplarily, and the present invention is not limited to the content of the embodiment. Moreover, it is also possible to implement combining the content described in different embodiment, and the implementation content in that case is also included in this invention. Further, the drawings are for helping the understanding of the specification, and may be schematically drawn, and the drawn components or the ratio of dimensions between the components are described in the specification. There are cases where the ratio of these dimensions does not match. In addition, the constituent elements described in the specification may be omitted in the drawings or may be drawn with the number omitted.

[First Embodiment]
FIG. 1 shows an electronic module 100 according to the first embodiment. However, FIG. 1 is a cross-sectional view of the electronic module 100.

  The electronic module 100 includes a substrate 1. The material of the substrate 1 is arbitrary, for example, a resin substrate using PCB (Poly Chlorinated Biphenyl) or a ceramic substrate using LTCC (Low Temperature Co-fired Ceramics) or the like. Can be used. Also, the structure of the substrate 1 is arbitrary, and may be a multilayer substrate or a single layer substrate.

  The substrate 1 has a first main surface 1A on the upper side in FIG. 1 and a second main surface 1B on the lower side in FIG. An electrode 2 is formed on the first main surface 1A, and an electrode 3 is formed on the second main surface 1B. The material of the electrodes 2 and 3 is arbitrary, but, for example, copper, silver or the like can be used. In addition, the surface of the electrodes 2 and 3 may be plated with tin or solder.

  Although illustration is omitted inside the substrate 1, for example, via electrodes or via electrodes and wiring electrodes are formed of copper or the like to form internal wiring. The electrode 2 formed on the first main surface 1A of the substrate 1 and the electrode 3 formed on the second main surface 1B are connected by internal wiring.

  Two first electronic components 4 having a hollow portion 5 are mounted on the first main surface 1 </ b> A of the substrate 1. In the present embodiment, the elastic wave device using SAW is the first electronic component 4. However, the type of the first electronic component 4 is arbitrary, and instead of the elastic wave device using SAW, an elastic wave device using BAW may be used. Further, the first electronic component 4 may be an electronic component other than the elastic wave device. May be.

  The first electronic component 4 has a hollow portion 5 composed of a piezoelectric substrate 5a, a support member 5b, and a lid material 5c. An IDT electrode 6 is formed on the piezoelectric substrate 5 a inside the hollow portion 5. The hollow portion 5 of the first electronic component 4 is provided so that the vibration of the IDT electrode 6 is not hindered. In this specification, the hollow portion refers to a closed space that is intentionally formed, and includes, for example, voids that are unintentionally formed due to air entering the resin during the manufacturing process. Absent. The hollow part 5 of the first electronic component 4 has liquid tightness, but may not have perfect airtightness. In order to prevent a gas with high humidity from entering the hollow part, the hollow part 5 is resistant to moisture by a sealing resin. It is necessary to improve the performance.

  The first electronic component 4 has a plurality of electrodes 7 formed on the mounting surface. Although the material of the electrode 7 is arbitrary, for example, Cu or Ni can be used. The interelectrode pitch of the electrodes 7 is sufficiently large, and the interelectrode pitch between the closest electrodes 7 is, for example, 0.3 mm. The electrode 7 may be a bump electrode such as a gold bump instead of an electrode made of a metal film.

  In the first electronic component 4, the electrode 7 formed on the mounting surface is joined to the electrode 2 formed on the first main surface 1 </ b> A of the substrate 1 by solder 8. In addition, instead of the solder 8, a conductive adhesive or the like may be used for joining the electrode 7 and the electrode 2. In the present embodiment, two first electronic components 4 are mounted on the first main surface 1A of the substrate 1. The first electronic component 4 may be mounted directly or indirectly on the substrate 1. Indirect mounting on the substrate means forming a sealing resin on the substrate and mounting the first electronic component on the sealing resin.

  Further, a chip-like second electronic component 9 that does not have a hollow portion is mounted on the first main surface 1A of the substrate 1. The second electronic component 9 is, for example, a capacitor, an inductor, a resistor, or the like. Electrodes 10 a and 10 b are formed on both ends of the second electronic component 9. The pitch between the electrodes 10a and 10b is sufficiently large, for example, 0.3 mm.

  In the second electronic component 9, electrodes 10 a and 10 b are joined to the electrode 2 formed on the first main surface 1 </ b> A of the substrate 1 by solder 8. In addition, instead of the solder 8, a conductive adhesive or the like may be used for joining the electrodes 10 a and 10 b and the electrode 2. The second electronic component 9 does not have electrodes between the electrodes formed on the mounting surface because the electrodes are not formed on the mounting surface (“between the electrodes between the electrodes formed on the mounting surface”). This does not correspond to the “second electronic component having the smallest pitch”).

  A second electronic component 11 that does not have a hollow portion is mounted on the second main surface 1B of the substrate 1. In the present embodiment, the semiconductor device is the second electronic component 11.

  The second electronic component 11 has a plurality of electrodes 12 formed on the mounting surface. The material of the electrode 12 is arbitrary, but, for example, Cu can be used. The inter-electrode pitch of the electrodes 12 formed on the mounting surface of the second electronic component 11 is smaller than the inter-electrode pitch of the electrodes formed on the mounting surface of the other second electronic component, and is between the electrodes of the electrodes 12 closest to each other. The pitch is 150 μm, for example. The electrode 12 may be a bump electrode such as a gold bump instead of an electrode made of a metal film.

  In the second electronic component 11, the electrode 12 formed on the mounting surface is joined to the electrode 3 formed on the second main surface 1 </ b> B of the substrate 1 by solder 8. In addition, instead of the solder 8, a conductive adhesive or the like may be used for joining the electrode 12 and the electrode 3. The second electronic component 11 may be mounted directly or indirectly on the substrate 1. To be indirectly mounted on the substrate means that a sealing resin is formed on the substrate and the second electronic component is mounted on the sealing resin.

  The first electronic component 4 and the chip-like second electronic component 9 mounted on the first main surface 1A of the substrate 1 are sealed with a first sealing resin 13.

  For the first sealing resin 13, a resin having low fluidity in an uncured state and high moisture resistance in a cured state is used. A resin having low fluidity in an uncured state is used for the first sealing resin 13 because the first electronic component 4 is pressed by the pressure of the first sealing resin 13 in the step of forming the first sealing resin 13. This is to prevent the hollow portion 5 from being crushed. In addition, the use of a highly moisture-resistant resin in a cured state for the first sealing resin 13 is that moisture penetrates into the hollow portion 5 of the first electronic component 4 sealed with the first sealing resin 13. This is to suppress this.

  In the present embodiment, the first sealing resin 13 is obtained by adding 80% by volume of silica powder having an average particle diameter of 30 μm as a filler to an epoxy resin as a base material. Note that the epoxy resin of the base material has at least one property of thermosetting and photocuring. Since the first sealing resin 13 has a large amount of filler added, the fluidity is low in the uncured state and the moisture resistance is high in the cured state. In addition, the kind of base material of the 1st sealing resin 13 is arbitrary, and it may replace with an epoxy resin and may use a silicone resin, an acrylic resin, etc. The material of the filler is also arbitrary, and instead of silica, alumina, boron nitride, or a composite material thereof may be used.

  The second electronic component 11 mounted on the second main surface 1B of the substrate 1 is sealed with the second sealing resin 14.

  As the second sealing resin 14, a resin having high fluidity in an uncured state is used. For the second sealing resin 14, a resin having high fluidity in an uncured state is used because the second sealing resin 14 is sufficiently filled between the electrodes 12 having a small electrode pitch of the second electronic component 11. This is to prevent a gap from being formed in the second sealing resin 14 between the electrodes 12.

  In the present embodiment, as the second sealing resin 14, an epoxy resin as a base material added with 50% by volume of silica powder having an average particle size of 30 μm as a filler is used. Note that the epoxy resin of the base material has at least one property of thermosetting and photocuring. The second sealing resin 14 has high fluidity in an uncured state because the amount of filler added is small. Further, the second sealing resin 14 has lower moisture resistance than the first sealing resin 13 because the amount of filler added is small. In addition, the kind of base material of the 2nd sealing resin 14 is arbitrary, and it may replace with an epoxy resin and may use a silicone resin, an acrylic resin, etc. The material of the filler is also arbitrary, and instead of silica, alumina, boron nitride, or a composite material thereof may be used. Moreover, in this embodiment, although the filler is added to the 2nd sealing resin 14, you may make a so-called filler-less without adding a filler to the 2nd sealing resin 14. FIG.

  A plurality of via electrodes 15 are formed through the second sealing resin 14. The material of the via electrode 15 is arbitrary, but, for example, copper or the like is used. One end of the via electrode 15 is connected to the electrode 3 formed on the second main surface 1 </ b> B of the substrate 1. The other end of the via electrode 15 is exposed on the outer surface of the second sealing resin 14. Then, the other end of the via electrode 15 exposed on the outer surface of the second sealing resin 14 is subjected to, for example, gold plating, and an external electrode 16 used for mounting the electronic module 100 is formed.

  Since the electronic module 100 having the above structure has low fluidity in the uncured state of the first sealing resin 13, the hollow portion 5 of the first electronic component 4 is caused by the pressure when filling the first sealing resin 13. Is suppressed from being crushed. Further, in the electronic module 100, the intrusion of moisture into the hollow portion 5 of the first electronic component 4 is suppressed by the first sealing resin 13 having high moisture resistance. Moreover, since the electronic module 100 has high fluidity in the uncured state of the second sealing resin 14, the second sealing resin 14 is sufficiently provided between the electrodes 12 having a small electrode pitch of the second electronic component 11. Filled and the formation of voids is suppressed.

  The electronic module 100 according to the first embodiment having the above structure can be manufactured, for example, by a manufacturing method described below. In the actual manufacturing process, a large number of electronic modules 100 are manufactured at once by using a mother substrate and dividing into pieces on the way. In the following, for convenience, one electronic module 100 is manufactured. The case where it does is demonstrated.

(Example of manufacturing method of electronic module 100)
First, as shown in FIG. 2A, the electrode 2 is formed on the first main surface 1A in advance, the electrode 3 is formed on the second main surface 1B, and the internal wiring (not shown) connecting the electrode 2 and the electrode 3 is not formed. A substrate 1 is prepared on the inside of which is shown.

  Next, as shown in FIG. 2B, the first electronic component 4 and the second electronic component 9 are mounted on the electrode 2 on the first main surface 1 </ b> A of the substrate 1. Specifically, first, cream solder is applied on the electrode 2. Next, the electrode 7 of the first electronic component 4 and the electrodes 10a and 10b of the second electronic component 9 are disposed on the electrode 2 to which the cream solder is applied. Next, heating is performed to melt the cream solder, followed by cooling to form the solder 8, and the electrode 7 of the first electronic component 4 and the electrodes 10 a and 10 b of the second electronic component 9 are connected to the first main component of the substrate 1. Bonded to the electrode 2 formed on the surface 1A.

  Next, as shown in FIG. 2C, the first electronic component 4 and the second electronic component 9 mounted on the first main surface 1 </ b> A of the substrate 1 are sealed with a first sealing resin 13. Specifically, first, the uncured first sealing resin 13 is filled around the first electronic component 4 and the second electronic component 9. Next, at least one of heating and light irradiation is applied to cure the first sealing resin 13. Since the first sealing resin 13 has low fluidity in an uncured state, the hollow portion 5 of the first electronic component 4 is not crushed by the pressure when filling the first sealing resin 13.

  Next, as shown in FIG. 3D, the second electronic component 11 is mounted on the electrode 3 on the second main surface 1 </ b> B of the substrate 1. Specifically, first, the vertical direction of the substrate 1 is reversed. Next, cream solder is applied on the electrode 3 on which the second electronic component 11 is mounted. Next, the electrode 12 of the second electronic component 11 is disposed on the electrode 3 coated with cream solder. Next, heating is performed to melt the cream solder, followed by cooling to form the solder 8, and the electrode 12 of the second electronic component 11 is joined to the electrode 3 formed on the second main surface 1 </ b> B of the substrate 1. .

  Next, as shown in FIG. 3E, the second electronic component 11 mounted on the second main surface 1 </ b> B of the substrate 1 is sealed with a second sealing resin 14. Specifically, first, an uncured second sealing resin 14 is filled around the second electronic component 11. Next, at least one of heating and light irradiation is performed to cure the second sealing resin 14. Since the second sealing resin 14 has high fluidity in an uncured state, the second sealing resin 14 is sufficiently filled between the electrodes 12 having a small electrode pitch of the second electronic component 11 and no gap is formed.

  Next, as shown in FIG. 3F, a hole 15 ′ for forming the via electrode 15 is formed in the second sealing resin 14 by, for example, laser light irradiation. The hole 15 ′ is formed so that the bottom reaches the electrode 3 on the second main surface 1 </ b> B of the substrate 1. However, the hole 15 ′ may be formed by cutting with a drill or the like instead of the laser light irradiation.

  Next, as shown in FIG. 4G, metal is deposited by plating on the electrode 3 formed on the second main surface 1B of the substrate 1 exposed at the bottom of the hole 15 ′, and the via electrode 15 is formed. Form.

  Finally, as shown in FIG. 4H, plating is performed on the via electrode 15 exposed from the outer surface of the second sealing resin 14 to form the external electrode 16 to complete the electronic module 100.

  Next, a modified example of the electronic module 100 will be described.

(First Modification of Electronic Module 100)
In the electronic module 100 described above, the second sealing resin 14 was used by adding 50% by volume of silica powder having an average particle diameter of 30 μm as a filler to the epoxy resin as the base material.

  In the electronic module according to the first modification, the type of the base material of the second sealing resin 14, the material of the filler, and the volume% of the filler were not changed, and only the average particle diameter of the filler was changed from 30 μm to 10 μm.

  In addition, the 1st sealing resin 13 was not changed, but as above-mentioned, what added 80 volume% of silica powder with an average particle diameter of 30 micrometers was used for the epoxy resin which is a base material as a filler.

  In the electronic module according to the first modification, the fluidity in the uncured state of the second sealing resin 14 is reduced by reducing the average particle size of the filler added to the second sealing resin 14 from 30 μm to 10 μm. Higher. In the electronic module according to the first modified example, the fluidity in the uncured state of the second sealing resin 14 is higher, so that the second sealing is provided between the electrodes 12 having a small electrode pitch of the second electronic component 11. The stop resin 14 is reliably filled, and the gap is less likely to be formed.

(Second Modification of Electronic Module 100)
In the electronic module according to the first modification, the average particle size of the filler added to the second sealing resin 14 is reduced from 30 μm to 10 μm.

  In the electronic module according to the second modification, the addition of the filler to the second sealing resin 14 is stopped, and the so-called filler-less operation is performed.

  In the electronic module according to the second modification, the fluidity of the second sealing resin 14 in the uncured state is further increased by making the second sealing resin 14 filler-free. For this reason, the second sealing resin 14 is more reliably filled between the electrodes 12 having a small electrode pitch of the second electronic component 11, and a void is hardly formed.

[Second Embodiment]
FIG. 5 shows an electronic module 200 according to the second embodiment. However, FIG. 5 is a cross-sectional view of the electronic module 200.

  The electronic module 200 is modified from the electronic module 100 according to the first embodiment. Specifically, in the electronic module 100, two first electronic components 4 having a hollow portion 5 and one second electronic component 9 having no hollow portion are mounted on the first main surface 1A of the substrate 1. However, in the electronic module 200, one of the first electronic components 4 is replaced with the second electronic component 21. The second electronic component 21 is sealed with the first sealing resin 13 together with the first electronic component 4 and the second electronic component 9.

  The second electronic component 21 is also a semiconductor device, like the second electronic component 11, and has a plurality of electrodes 22 formed on the mounting surface. However, the second electronic component 21 has a larger inter-electrode pitch of the electrodes 22 formed on the mounting surface than the second electronic component 11, for example, 0.3 mm.

  Even if the second electronic component 21 is sealed with the first sealing resin 13 having low fluidity in an uncured state, the pitch between the electrodes 22 formed on the mounting surface is large. 1 The sealing resin 13 is sufficiently filled, and no gap is formed.

  Even if it is a 2nd electronic component, if the inter-electrode pitch of the electrode 22 formed in the mounting surface is large enough like the 2nd electronic component 21, it will mount in the 1st main surface 1A of the board | substrate 1, and will be in an unhardened state The first sealing resin 13 having low fluidity can be sealed.

[Third Embodiment]
FIG. 6 shows an electronic module 300 according to the third embodiment. However, FIG. 6 is a cross-sectional view of the electronic module 300.

  The electronic module 300 is also modified from the electronic module 100 according to the first embodiment. Specifically, in the electronic module 100, the second electronic component 11 having the smallest inter-electrode pitch of the electrodes formed on the mounting surface among the second electronic components that do not have a hollow portion is formed by the second sealing resin 14. Was completely sealed. That is, the second electronic component 11 was covered with the second sealing resin 14 on all surfaces including the mounting surface, the top surface opposite to the mounting surface, and the side surface. The electronic module 300 modifies this so that the top surface of the second electronic component 31 having the smallest inter-electrode pitch of the electrodes formed on the mounting surface of the second electronic components is the outer surface of the second sealing resin 14. Exposed to the outside. Note that the second electronic component 31 of the electronic module 300 is smaller in thickness than the second electronic component 11 of the electronic module 100.

  In the electronic module 300, the top surface of the second electronic component 31 is exposed to the outside from the outer surface of the second sealing resin 14, so that the thickness of the second sealing resin 14 is reduced and the height is reduced. ing. In addition, the use of the second electronic component 31 having a small thickness also contributes to a reduction in height.

[Fourth Embodiment]
FIG. 7 shows an electronic module 400 according to the fourth embodiment. However, FIG. 7 is a cross-sectional view of the electronic module 400.

  The electronic module 400 has a configuration added to the electronic module 100 according to the first embodiment. Specifically, in the electronic module 400, the shield electrode 41 is formed on the top surface and four side surfaces of the electronic module 100. More specifically, the shield electrode 41 was formed on all the outer surfaces of the first sealing resin 13, the four end surfaces of the substrate 1, and a part of the outer surface of the second sealing resin 14. The material and configuration of the shield electrode 41 are arbitrary. For example, an adhesion layer made of Ti, Ni, Cr, SUS, or an alloy thereof, a conductive layer made of Cu, Al, Ag, or an alloy thereof, Ti, Ni , Cr, or an alloy thereof can be formed into a three-layer structure of a corrosion-resistant layer.

  The electronic module 400 can suppress noise entering from the outside to the inside and noise emitted from the inside to the outside by the shield electrode 41. In addition, the electronic module 400 has improved moisture resistance since the penetration of moisture into the inside is suppressed by the shield electrode 41.

[Fifth Embodiment]
FIG. 8 shows an electronic module 500 according to the fifth embodiment. However, FIG. 8 is a cross-sectional view of the electronic module 500.

  In the electronic modules 100, 200, 300, and 400 according to the first embodiment to the fourth embodiment, the first sealing resin 13 is formed on the first main surface 1A of the substrate 1, and the second main surface 1B of the substrate 1 is formed. The second sealing resin 14 was formed. In the electronic module 500, this is changed, the second sealing resin 14 is formed on the first main surface 51 </ b> A of the substrate 51, and the first sealing resin 13 is formed on the second sealing resin 14. The following is a brief description.

  The electronic module 500 includes a substrate 51. The electrode 3 is formed on the first main surface 51 </ b> A of the substrate 51. External electrodes 56 used when mounting the electronic module 500 are formed on the second main surface 51 </ b> B of the substrate 51.

  A second electronic component (semiconductor device) 11 having the smallest inter-electrode pitch of the electrodes formed on the mounting surface among the second electronic components that does not have a hollow portion is mounted on the first main surface 51A of the substrate 51. Has been.

  The second electronic component 11 is sealed with the second sealing resin 14. Also in the electronic module 500, as in the electronic module 100, 50 vol% silica powder having an average particle size of 30 μm as a filler is added to the epoxy resin as the base material as the second sealing resin 14. Is used. The second sealing resin 14 has high fluidity in an uncured state because the amount of filler added is small.

  A plurality of via electrodes 55 are formed through the second sealing resin 14. One end of the via electrode 55 is connected to the electrode 3 formed on the first main surface 51 </ b> A of the substrate 51. The other end of the via electrode 55 is exposed on the outer surface of the second sealing resin 14.

  An electrode 52 is formed on the second sealing resin 14. The predetermined electrode 52 is connected to the via electrode 55 exposed on the outer surface of the second sealing resin 14.

  Two first electronic components (elastic wave devices) 4 having a hollow portion 5 and one chip-shaped second electronic component 9 are mounted on the electrode 52 formed on the second sealing resin 14. Yes.

  The first electronic component 4 and the second electronic component 9 are sealed with the first sealing resin 13. Similarly to the electronic module 100, the electronic module 500 is obtained by adding 80% by volume of silica powder having an average particle size of 30 μm as a filler to the first sealing resin 13 and the epoxy resin as the base material. Is used. Since the first sealing resin 13 has a large amount of filler added, it has high moisture resistance and low fluidity in an uncured state.

  The electronic module 500 can be manufactured by applying an example of the method for manufacturing the electronic module 100 described above. Specifically, first, the second electronic component 11 is mounted on the substrate 51. Next, the second electronic component 11 is sealed with the second sealing resin 14. Next, the via electrode 55 is formed in the second sealing resin 14. Next, the electrode 52 is formed on the second sealing resin 14. Next, the first electronic component 4 and the second electronic component 9 are mounted on the electrode 52. Finally, the first electronic component 4 and the second electronic component 9 are sealed with the first sealing resin 13 to complete the electronic module 500.

  Since the electronic module 500 has high fluidity in the uncured state of the second sealing resin 14, the second sealing resin 14 is sufficiently filled between the electrodes 12 having a small electrode pitch of the second electronic component 11, The formation of voids is suppressed. Moreover, since the electronic module 500 has low fluidity in the uncured state of the first sealing resin 13, the hollow portion 5 of the first electronic component 4 is crushed by the pressure when filling the first sealing resin 13. Is suppressed. Further, in the electronic module 500, moisture intrusion into the hollow portion 5 of the first electronic component 4 is suppressed by the first sealing resin 13 having high moisture resistance.

  The electronic modules 100, 200, 300, 400, and 500 according to the first to third embodiments have been described above. However, the present invention is not limited to the contents described above, and various modifications can be made in accordance with the spirit of the invention.

  For example, in the electronic modules 100, 200, 300, 400, and 500, the epoxy resin is used as the base material for the first sealing resin 13 and the second sealing resin 14, but the type of the resin base material is arbitrary. In place of the epoxy resin, for example, a silicone resin or the like may be used. Further, the first sealing resin 13 and the second sealing resin 14 may have different types of base materials.

  Further, in the electronic modules 100, 200, 300, 400, and 500, silica powder is used as the filler of the first sealing resin 13 and the second sealing resin 14, but the material of the filler is arbitrary. Instead of silica, for example, alumina, boron nitride, or a composite material thereof may be used. Further, the filler material may be different between the first sealing resin 13 and the second sealing resin 14.

  In the electronic modules 100, 200, 300, 400, and 500, the elastic wave device is used as the first electronic component 4 having the hollow portion 5. However, the type of the first electronic component 4 is arbitrary, and the elastic wave device is used. Instead, other types of first electronic components may be used.

  In the electronic modules 100, 200, 300, 400, and 500, a semiconductor device is used as the second electronic component 11 that does not have a hollow portion. However, the type of the second electronic component 11 is arbitrary, and the semiconductor device is replaced with the semiconductor device. Other types of second electronic components may be used.

  In addition, in the electronic modules 100, 200, 300, 400, and 500, the via electrodes 15 and 55 were formed on the second sealing resin 14 by a method of depositing metal by electrolytic plating. Via electrodes 15 and 55 may be formed in the second sealing resin 14 by embedding metal terminals.

  In the electronic module 500, the second sealing resin 14 is formed on the first main surface 51A of the substrate 51, and the first sealing resin 13 is formed on the second sealing resin 14, but this order is changed. Alternatively, the first sealing resin 13 may be formed on the first main surface 51 </ b> A of the substrate 51, and the second sealing resin 14 may be formed on the first sealing resin 13.

DESCRIPTION OF SYMBOLS 1, 51 ... Board | substrate 1A, 51A ... 1st main surface 1B, 51B ... 2nd main surface 2, 52 ... Electrode 3 ... Electrode 4 ... 1st electronic component (hollow part Including elastic wave devices)
5 ... hollow part 6 ... IDT electrode 7 ... electrode 8 ... solder 9, 21 ... second electronic component (no hollow part; semiconductor device, capacitor, inductor, resistor, etc.)
10a, 10b... Electrodes 11, 31... Second electronic component (semiconductor device, etc.) having the smallest inter-electrode pitch of electrodes formed on the mounting surface among the second electronic components.
12, 22 ... Electrode 13 formed on mounting surface of second electronic component ... First sealing resin 14 ... Second sealing resin 15, 55 ... Via electrodes 16, 56 ... External electrode 41 ... shield electrode 100, 200, 300, 400, 500 ... electronic module

Claims (11)

A substrate,
A plurality of electrodes are formed on the mounting surface on the substrate, and at least one first electronic component having a hollow portion;
A plurality of electrodes are formed on the mounting surface to the substrate, and at least one second electronic component that does not have a hollow portion;
A first sealing resin;
An electronic module comprising a second sealing resin,
The first electronic component is sealed with the first sealing resin;
Among the second electronic components, the second electronic component having the smallest inter-electrode pitch of the electrodes formed on the mounting surface is sealed with the second sealing resin at least the mounting surface including the electrodes. ,
The electronic module in which the volume% of the filler contained in the first sealing resin is higher than the volume% of the filler contained in the second sealing resin. A substrate,
A plurality of electrodes are formed on the mounting surface on the substrate, and at least one first electronic component having a hollow portion;
A plurality of electrodes are formed on the mounting surface to the substrate, and at least one second electronic component that does not have a hollow portion;
A first sealing resin;
An electronic module comprising a second sealing resin,
The first electronic component is sealed with the first sealing resin;
Among the second electronic components, the second electronic component having the smallest inter-electrode pitch of the electrodes formed on the mounting surface is sealed with the second sealing resin at least the mounting surface including the electrodes. ,
An electronic module in which an average particle diameter of the filler contained in the first sealing resin is larger than an average particle diameter of the filler contained in the second sealing resin.   The electronic module according to claim 1, wherein the moisture resistance of the first sealing resin is higher than the moisture resistance of the second sealing resin. The first sealing resin is formed on one main surface of the substrate,
4. The electronic module according to claim 1, wherein the second sealing resin is formed on the other main surface of the substrate. 5.   4. The electronic module according to claim 1, wherein the first sealing resin and the second sealing resin are laminated and formed on one main surface of the substrate. 5. The electronic module according to claim 1, wherein the first electronic component is an elastic wave device.   7. The second electronic component according to claim 1, wherein the second electronic component having the smallest inter-electrode pitch of the electrodes formed on the mounting surface among the second electronic components is a semiconductor device. Electronic module. In addition, it has external electrodes for mounting
The electronic module according to any one of claims 1 to 7, wherein the external electrode is formed on an outer surface of the second sealing resin.   The electronic module according to any one of claims 1 to 8, wherein a shield electrode is formed on at least a part of the outer surface of the first sealing resin and the outer surface of the second sealing resin. A substrate,
A plurality of electrodes are formed on the mounting surface on the substrate, and at least one first electronic component having a hollow portion;
A plurality of electrodes are formed on the mounting surface to the substrate, and at least one second electronic component that does not have a hollow portion;
An uncured first sealing resin;
A step of preparing an uncured second sealing resin having higher fluidity than the uncured first sealing resin;
Mounting the first electronic component directly or indirectly on the substrate;
Mounting the second electronic component directly or indirectly on the substrate;
The step of curing the uncured first sealing resin after filling the uncured first sealing resin around the mounted first electronic component;
Of the second electronic component mounted, the second electronic component having the smallest inter-electrode pitch formed on the mounting surface is uncured on the mounting surface including at least the electrode. And a step of curing the uncured second sealing resin after filling with a sealing resin. A substrate,
A plurality of electrodes are formed on the mounting surface on the substrate, and at least one first electronic component having a hollow portion;
A plurality of electrodes are formed on the mounting surface to the substrate, and at least one second electronic component that does not have a hollow portion;
An uncured first sealing resin;
A step of preparing an uncured second sealing resin having lower moisture resistance in a cured state than the uncured first sealing resin;
Mounting the first electronic component directly or indirectly on the substrate;
Mounting the second electronic component directly or indirectly on the substrate;
The step of curing the uncured first sealing resin after filling the uncured first sealing resin around the mounted first electronic component;
Of the second electronic component mounted, the second electronic component having the smallest inter-electrode pitch formed on the mounting surface is uncured on the mounting surface including at least the electrode. And a step of curing the uncured second sealing resin after filling with a sealing resin.

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