JP2006117761A - Epoxy resin composition, its cured product, novel epoxy resin and its production method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in curability and its cured product, and to provide a novel epoxy resin used in the epoxy resin composition and a method for producing the same. <P>SOLUTION: The epoxy resin composition contains the epoxy resin represented by formula (1) (wherein Ar<SB>1</SB>-Ar<SB>4</SB>are each an aromatic skeleton; R<SB>1</SB>-R<SB>4</SB>are each an alkyl group, an alkoxy group, a phenyl group, an amino group or a halogen atom; R<SB>5</SB>-R<SB>12</SB>are each a hydrogen atom, an alkyl group, an alkoxy group or a phenyl group; X is a direct bond, an alkylene chain, an oxyalkylene chain, a carbonyl group, an ether bond, a thioether bond, a sulfenyl group or a sulfonyl group; R<SB>13</SB>-R<SB>14</SB>are each a hydrogen atom or an alkyl group; and n<SB>1</SB>-n<SB>4</SB>are each an integer of 0-10 and satisfy the relation: n<SB>1</SB>+n<SB>2</SB>+n<SB>3</SB>+n<SB>4</SB>≥1) and a hardener. The cured product, the novel epoxy resin and its production method are also provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention is excellent in curability, and the cured product obtained has good flame retardancy, moisture resistance, dielectric properties, etc., and can be suitably used as a resin composition for semiconductor devices, circuit board devices, etc. , A cured product thereof, a novel epoxy resin used therefor, and a method for producing the same.

  Epoxy resins can be cured with various curing agents, resulting in cured products that are generally excellent in low shrinkage (dimensional stability), electrical insulation, and chemical resistance during curing. In order to respond to technological innovations in the field of high-performance paints and environmental problems such as the dioxin problem, characteristics such as flame retardancy, moisture resistance, and dielectric properties that are superior to conventional ones are strongly required. Tetramethylbiphenol type epoxy resins are widely used in the field of semiconductor encapsulation materials as epoxy resin compositions that give cured products with excellent crack resistance at a high rate. Since the resin has crystallinity and low viscosity, it is possible to increase the filling rate of about 90% of the filler. In order to develop characteristics such as flame retardancy and moisture resistance, it is necessary to increase the filling rate of the filler. Great contribution. However, the cured epoxy resin using the composition does not have sufficient performance to be able to be applied to the current strict requirements, and further improved various properties such as flame retardancy, moisture resistance and dielectric properties. It has been demanded.

  In response to these requirements, for example, a compound in which an arylalkyl group is introduced into a 4,4′-hydroxybiphenyl skeleton has been proposed as a curing agent that provides an epoxy resin composition that provides low water absorption, low elastic modulus, and low melt viscosity. (For example, refer to Patent Document 1). It is described that by introducing an arylalkyl group into the biphenyl skeleton, the compound is excellent in compatibility with an epoxy resin, and can impart properties such as low melt viscosity, low hygroscopicity, and low elastic modulus. However, since an arylalkyl group having a large steric hindrance is introduced in the vicinity of the hydroxyl group serving as a crosslinking point, the curability is inferior and not at a practical level.

JP 2003-096011 A (pages 3 to 6)

  In view of the above situation, the present invention has an excellent curability far surpassing conventional products, and the cured product obtained has excellent flame retardancy, dielectric properties, and the like, its cured product, and It aims at providing the novel epoxy resin which can be used suitably for this, and its manufacturing method.

  In order to solve the above problems, the present inventors have eagerly studied for an epoxy resin excellent in the above characteristics, and as a result, the curability of the epoxy resin composition using the epoxy resin having the following specific structure is excellent, The cured product obtained using the epoxy resin composition has good flame retardancy, dielectric properties, moisture resistance and the like, and 4-substituted 4 having a substituent at the 3,3 ′, 5,5′-position. , 4'-dihydroxybiphenyl has been found that it is possible to introduce an aralkyl group even though it is vacant only in the meta position, which is normally considered to be inactive with respect to the hydroxy group. The invention has been completed.

  That is, the present invention provides the following general formula (1)

〔式中、Ａｒ_１、Ａｒ_２、Ａｒ_３、Ａｒ_４は各々独立に、置換基を有していてもよい芳香族骨格（但し、置換基は、置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、置換基を有していてもよいフェニル基、置換基を有していてもよいアミノ基、カルボキシル基、ニトロ基又はハロゲン原子である。）であり、Ｒ_１、Ｒ_２、Ｒ_３、Ｒ_４は各々独立に、置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、置換基を有していてもよいフェニル基、置換基を有していてもよいアミノ基、又はハロゲン原子であり、Ｒ_５、Ｒ_６、Ｒ_７、Ｒ_８、Ｒ_９、Ｒ_１０、Ｒ_１１、Ｒ_１２は各々独立に、水素原子或いは、置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、又は置換基を有していてもよいフェニル基であり、Ｘは直接結合、置換基を有していてもよいアルキレン鎖、置換基を有していてもよいオキシアルキレン鎖、カルボニル基、エーテル結合、チオエーテル結合、スルフェニル基又はスルホニル基であり、Ｒ_１３、Ｒ_１４は各々独立に、水素原子或いは、置換基を有していてもよいアルキル基、又は置換基を有していてもよいフェニル基であり、ｎ_１、ｎ_２、ｎ_３、ｎ_４は繰り返し数を示し、各々独立に０〜１０の整数であって、且つｎ_１＋ｎ_２＋ｎ_３＋ｎ_４≧１である。〕
で表されるエポキシ樹脂と硬化剤とを含有することを特徴とするエポキシ樹脂組成物及びその硬化物を提供するものである。

[Wherein, Ar ₁ , Ar ₂ , Ar ₃ , Ar ₄ are each independently an aromatic skeleton optionally having a substituent (provided that the substituent is an alkyl group optionally having a substituent] An alkoxy group which may have a substituent, a phenyl group which may have a substituent, an amino group which may have a substituent, a carboxyl group, a nitro group or a halogen atom. Each of R ₁ , R ₂ , R ₃ and R ₄ may independently have an alkyl group which may have a substituent, an alkoxy group which may have a substituent, or a substituent. R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , R ₁₂ are each independently a good phenyl group, an optionally substituted amino group, or a halogen atom, It has a hydrogen atom or an alkyl group which may have a substituent, and a substituent. A good alkoxy group or a phenyl group which may have a substituent, and X is a direct bond, an alkylene chain which may have a substituent, an oxyalkylene chain which may have a substituent, a carbonyl A group, an ether bond, a thioether bond, a sulfenyl group or a sulfonyl group, and each of R ₁₃ and R ₁₄ independently has a hydrogen atom, an alkyl group which may have a substituent, or a substituent. N ₁ , n ₂ , n ₃ , and n ₄ are each an integer of 0 to 10 and n ₁ + n ₂ + n ₃ + n ₄ ≧ 1 . ]
The epoxy resin composition characterized by containing and the hardening | curing agent are contained, and the hardened | cured material is provided.

  Furthermore, the present invention provides the following general formula (1)

〔式中、Ａｒ_１、Ａｒ_２、Ａｒ_３、Ａｒ_４は各々独立に、置換基を有していてもよい芳香族骨格（但し、置換基は、置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、置換基を有していてもよいフェニル基、置換基を有していてもよいアミノ基、カルボキシル基、ニトロ基、又はハロゲン原子である。）であり、Ｒ_１、Ｒ_２、Ｒ_３、Ｒ_４は各々独立に、置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、置換基を有していてもよいフェニル基、置換基を有していてもよいアミノ基、又はハロゲン原子であり、Ｒ_５、Ｒ_６、Ｒ_７、Ｒ_８、Ｒ_９、Ｒ_１０、Ｒ_１１、Ｒ_１２は各々独立に、水素原子或いは、置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、又は置換基を有していてもよいフェニル基であり、Ｘは直接結合、置換基を有していてもよいアルキレン鎖、置換基を有していてもよいオキシアルキレン鎖、カルボニル基、エーテル結合、チオエーテル結合、スルフェニル基又はスルホニル基であり、Ｒ_１３、Ｒ_１４は各々独立に、水素原子或いは、置換基を有していてもよいアルキル基、又は置換基を有していてもよいフェニル基であり、ｎ_１、ｎ_２、ｎ_３、ｎ_４は繰り返し数を示し、各々独立に０〜１０の整数であって、且つｎ_１＋ｎ_２＋ｎ_３＋ｎ_４≧１である。〕
で表される新規エポキシ樹脂を提供するものである。

[Wherein, Ar ₁ , Ar ₂ , Ar ₃ , Ar ₄ are each independently an aromatic skeleton optionally having a substituent (provided that the substituent is an alkyl group optionally having a substituent] An alkoxy group which may have a substituent, a phenyl group which may have a substituent, an amino group which may have a substituent, a carboxyl group, a nitro group, or a halogen atom.) R ₁ , R ₂ , R ₃ , and R ₄ each independently have an alkyl group that may have a substituent, an alkoxy group that may have a substituent, or a substituent. R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , R ₁₂ are each independently a phenyl group that may be substituted, an amino group that may have a substituent, or a halogen atom. A hydrogen atom or an alkyl group which may have a substituent, or a substituent. An alkoxy group which may have a substituent, or a phenyl group which may have a substituent, and X is a direct bond, an alkylene chain which may have a substituent, an oxyalkylene chain which may have a substituent, A carbonyl group, an ether bond, a thioether bond, a sulfenyl group or a sulfonyl group, and each of R ₁₃ and R ₁₄ independently has a hydrogen atom, an alkyl group which may have a substituent, or a substituent. N ₁ , n ₂ , n ₃ , and n ₄ are each an integer of 0 to 10 and n ₁ + n ₂ + n ₃ + n ₄ ≧ 1 is there. ]
The novel epoxy resin represented by these is provided.

  Furthermore, the present invention provides the following general formula (2)

（式中、Ｒ_１、Ｒ_２、Ｒ_３、Ｒ_４は各々独立に、置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、置換基を有していてもよいフェニル基、置換基を有していてもよいアミノ基、又はハロゲン原子であり、Ｘは直接結合或いは、置換基を有していてもよいアルキレン鎖、置換基を有していてもよいオキシアルキレン鎖、カルボニル基、エーテル結合、チオエーテル結合、スルフェニル基又はスルホニル基である。）
で表される３，３’，５，５’位に置換基を有する２価フェノール化合物（ａ１）と、下記一般式（３）

(In the formula, each of R ₁ , R ₂ , R ₃ and R ₄ independently has an alkyl group which may have a substituent, an alkoxy group which may have a substituent, or a substituent. An optionally substituted phenyl group, an optionally substituted amino group, or a halogen atom, and X may be a direct bond or an optionally substituted alkylene chain or a substituted group. A good oxyalkylene chain, carbonyl group, ether bond, thioether bond, sulfenyl group or sulfonyl group.)
A dihydric phenol compound (a1) having a substituent at the 3,3 ′, 5,5 ′ position represented by the following general formula (3)

（式中、Ｒ_１３、Ｒ_１４、Ｒ_１５、Ｒ_１６、Ｒ_１７は各々独立して、置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、置換基を有していてもよいフェニル基、置換基を有していてもよいアミノ基、カルボキシル基、ニトロ基、ハロゲン原子又は水素原子であり、Ｒ_１８、Ｒ_１９は各々独立して、水素原子或いは置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、又は置換基を有していてもよいフェニル基であり、Ｙはハロゲン原子、アルコキシ基、又は水酸基である。）
で表される化合物、又は下記一般式（４）

(In the formula, R ₁₃ , R ₁₄ , R ₁₅ , R ₁₆ and R ₁₇ are each independently an alkyl group which may have a substituent, an alkoxy group which may have a substituent, and a substituent. A phenyl group which may have a substituent, an amino group which may have a substituent, a carboxyl group, a nitro group, a halogen atom or a hydrogen atom, and R ₁₈ and R ₁₉ are each independently a hydrogen atom or An alkyl group which may have a substituent, an alkoxy group which may have a substituent, or a phenyl group which may have a substituent; Y is a halogen atom, an alkoxy group or a hydroxyl group; is there.)
Or a compound represented by the following general formula (4)

（式中、Ｒ_１３、Ｒ_１４、Ｒ_１５、Ｒ_１６、Ｒ_１７は前記と同じであり、Ｒ_２０、Ｒ_２１、Ｒ_２２は各々独立して、水素原子或いは置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、又は置換基を有していてもよいフェニル基を示す。）
で表される化合物である芳香族系変性剤（ａ２）とを反応させて変性２価フェノール化合物を得た後、エピハロヒドリン類（ａ３）とを反応させることを特徴とするエポキシ樹脂の製造方法をも提供するものである。

(In the formula, R ₁₃ , R ₁₄ , R ₁₅ , R ₁₆ and R ₁₇ are the same as described above, and R ₂₀ , R ₂₁ and R ₂₂ may each independently have a hydrogen atom or a substituent. A good alkyl group, an alkoxy group which may have a substituent, or a phenyl group which may have a substituent.
A method for producing an epoxy resin comprising: reacting an aromatic modifier (a2), which is a compound represented by formula (2), to obtain a modified dihydric phenol compound, and then reacting with an epihalohydrin (a3). Is also provided.

  ADVANTAGE OF THE INVENTION According to this invention, the epoxy resin composition excellent in sclerosis | hardenability, and the flame retardance of the obtained hardened | cured material, moisture resistance, a dielectric characteristic etc. is favorable, and its hardened | cured material can be provided. Furthermore, the novel epoxy resin which can be used suitably for this epoxy resin composition, and its manufacturing method can be provided. The cured epoxy resin obtained therefrom can meet the high level required by high-frequency devices such as advanced semiconductor package substrates.

Hereinafter, the present invention will be described in detail.
The epoxy resin composition of the present invention is a novel epoxy resin of the present invention represented by the following general formula (1)

〔式中、Ａｒ_１、Ａｒ_２、Ａｒ_３、Ａｒ_４は各々独立に、置換基を有していてもよい芳香族骨格（但し、置換基は、置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、置換基を有していてもよいフェニル基、置換基を有していてもよいアミノ基、カルボキシル基、ニトロ基又はハロゲン原子である。）であり、Ｒ_１、Ｒ_２、Ｒ_３、Ｒ_４は各々独立に、置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、置換基を有していてもよいフェニル基、置換基を有していてもよいアミノ基、又はハロゲン原子であり、Ｒ_５、Ｒ_６、Ｒ_７、Ｒ_８、Ｒ_９、Ｒ_１０、Ｒ_１１、Ｒ_１２は各々独立に、水素原子或いは、置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基又は置換基を有していてもよいフェニル基であり、Ｘは直接結合、置換基を有していてもよいアルキレン鎖、置換基を有していてもよいオキシアルキレン鎖、カルボニル基、エーテル結合、チオエーテル結合、スルフェニル基又はスルホニル基であり、Ｒ_１３、Ｒ_１４は各々独立に、水素原子或いは、置換基を有していてもよいアルキル基又は置換基を有していてもよいフェニル基であり、ｎ_１、ｎ_２、ｎ_３、ｎ_４は繰り返し数を示し、各々独立に０〜１０の整数であって、且つｎ_１＋ｎ_２＋ｎ_３＋ｎ_４≧１である。〕
で表されるエポキシ樹脂（Ａ）を用いることを必須とする。

[Wherein, Ar ₁ , Ar ₂ , Ar ₃ , Ar ₄ are each independently an aromatic skeleton optionally having a substituent (provided that the substituent is an alkyl group optionally having a substituent] An alkoxy group which may have a substituent, a phenyl group which may have a substituent, an amino group which may have a substituent, a carboxyl group, a nitro group or a halogen atom. Each of R ₁ , R ₂ , R ₃ and R ₄ may independently have an alkyl group which may have a substituent, an alkoxy group which may have a substituent, or a substituent. R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , R ₁₂ are each independently a good phenyl group, an optionally substituted amino group, or a halogen atom, It has a hydrogen atom or an alkyl group which may have a substituent, and a substituent. A good alkoxy group or a phenyl group which may have a substituent, and X is a direct bond, an alkylene chain which may have a substituent, an oxyalkylene chain which may have a substituent, a carbonyl group , An ether bond, a thioether bond, a sulfenyl group or a sulfonyl group, and each of R ₁₃ and R ₁₄ may independently have a hydrogen atom or an alkyl group or a substituent which may have a substituent. It is a good phenyl group, n ₁ , n ₂ , n ₃ , and n ₄ each represent a repeating number, each independently an integer of 0 to 10, and n ₁ + n ₂ + n ₃ + n ₄ ≧ 1. ]
It is essential to use an epoxy resin (A) represented by:

Among these, R ₁ , R ₂ , R ₃ , and R _{4 in the} general formula (1) may be the same or different from each other because they can be synthesized from raw materials that are easily industrially available. 4 is preferable, and R ₁ , R ₂ , R ₃ and R _{4 in the} general formula (1) are preferably methyl groups from the viewpoint of excellent flame retardancy of the resulting cured product. .

Further, Ar ₁ , Ar ₂ , Ar ₃ , Ar _{4 in the} general formula (1) is a benzene skeleton optionally having an alkyl group as a substituent, particularly an alkyl group having 1 to 6 carbon atoms. A benzene skeleton that may be present as a substituent is preferable because it can be synthesized from a raw material that is easily available industrially and becomes a lower viscosity epoxy resin. Ar ₁ , Ar ₂ , Ar ₃ , Ar _{4 in the} general formula (1) may be the same or different, and further, the number of repetitions n ₁ , n ₂ , n including each aromatic ring ₃ and n ₄ need not all have the same structure, and for example, a structure in which aromatic rings having different structures are linked by a methylene group which may have a substituent may be used. Among these, those having an average addition number of 1 to 3 are particularly preferable because the crosslinking density is appropriate and the balance of physical properties of the obtained cured product is excellent.

Furthermore, it is easy to obtain industrially that R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ and R _{12 in the} general formula (1) are hydrogen atoms. It is preferable from the viewpoint of being able to synthesize from the above and the excellent balance of physical properties of the resulting cured product.

  The epoxy equivalent of the epoxy resin (A) is not particularly limited, but is 200 to 1,000 g / eq. It is preferable from the point that the epoxy resin composition which is more excellent in curability is obtained. The melt viscosity is preferably 5 dPa · s or less by an ICI corn / plate viscometer method at 150 ° C. in order to increase the blending amount of the inorganic filler described later.

  Although it does not specifically limit as a manufacturing method of the said epoxy resin (A), From the point which can be industrially produced, the method of synthesize | combining with the manufacturing method of this invention is preferable.

Hereinafter, the production method of the present invention will be described.
The method for producing an epoxy resin of the present invention comprises the following general formula (3)

（式中、Ｒ_１、Ｒ_２、Ｒ_３、Ｒ_４は各々独立に、置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、置換基を有していてもよいフェニル基、置換基を有していてもよいアミノ基、又はハロゲン原子であり、Ｘは直接結合、置換基を有していてもよいアルキレン鎖、置換基を有していてもよいオキシアルキレン鎖、カルボニル基、エーテル結合、チオエーテル結合、スルフェニル基又はスルホニル基である。）
で表される３，３’，５，５’位に置換基を有する２価フェノール化合物（ａ１）と、下記一般式（４）

(In the formula, each of R ₁ , R ₂ , R ₃ and R ₄ independently has an alkyl group which may have a substituent, an alkoxy group which may have a substituent, or a substituent. An optionally substituted phenyl group, an optionally substituted amino group, or a halogen atom, and X is a direct bond, an optionally substituted alkylene chain, or optionally substituted. An oxyalkylene chain, a carbonyl group, an ether bond, a thioether bond, a sulfenyl group or a sulfonyl group.)
A dihydric phenol compound (a1) having a substituent at the 3,3 ′, 5,5′-position represented by the following general formula (4)

（式中、Ｒ_１５、Ｒ_１６、Ｒ_１７、Ｒ_１８、Ｒ_１９は各々独立して、置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、置換基を有していてもよいフェニル基、置換基を有していてもよいアミノ基、カルボキシル基、ニトロ基、ハロゲン原子又は水素原子であり、Ｒ_２０、Ｒ_２１は各々独立して、水素原子或いは置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、又は置換基を有していてもよいフェニル基であり、Ｙはハロゲン原子、アルコキシ基、又は水酸基である。）
で表される化合物、又は下記一般式（５）

(In the formula, R ₁₅ , R ₁₆ , R ₁₇ , R ₁₈ , and R ₁₉ are each independently an alkyl group that may have a substituent, an alkoxy group that may have a substituent, and a substituent. A phenyl group which may have a substituent, an amino group which may have a substituent, a carboxyl group, a nitro group, a halogen atom or a hydrogen atom, and R ₂₀ and R ₂₁ each independently represent a hydrogen atom or An alkyl group which may have a substituent, an alkoxy group which may have a substituent, or a phenyl group which may have a substituent; Y is a halogen atom, an alkoxy group or a hydroxyl group; is there.)
Or a compound represented by the following general formula (5)

（式中、Ｒ_１５、Ｒ_１６、Ｒ_１７、Ｒ_１８、Ｒ_１９は前記と同じであり、Ｒ_２２、Ｒ_２３、Ｒ_２４は各々独立して、水素原子或いは置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、又は置換基を有していてもよいフェニル基を示す。）
で表される化合物である芳香族系変性剤（ａ２）とを反応させて変性２価フェノール化合物を得た後、エピハロヒドリン類（ａ３）とを反応させることを特徴とする。

(In the formula, R ₁₅ , R ₁₆ , R ₁₇ , R ₁₈ and R ₁₉ are the same as described above, and R ₂₂ , R ₂₃ and R ₂₄ may each independently have a hydrogen atom or a substituent. A good alkyl group, an alkoxy group which may have a substituent, or a phenyl group which may have a substituent.
A modified dihydric phenol compound is obtained by reacting with an aromatic modifier (a2) which is a compound represented by the following formula, and then reacted with an epihalohydrin (a3).

  Preferred as the dihydric phenol compound (a1) is, for example, when X is a direct bond, 4,4′-dihydroxy-3,3 ′, 5,5′-tetramethylbiphenol, 3,3′-ditertiary. Butyl-5,5′-dimethylbiphenyl-4,4′-diol, 3,3 ′, 5,5′-tetratertiary butylbiphenyl-4,4′-diol, 3,3 ′, 5,5′- And tetramethoxybiphenyl-4,4′-diol, 3,3 ′, 5,5′-tetrabutoxybiphenyl-4,4′-diol, etc., and X is an alkylene group which may have a substituent. In this case, 3,3 ′, 5,5′-tetramethylbisphenol A, 3,3 ′, 5,5′-tetramethylbisphenol F, etc. are mentioned, and X may be a phenyl group which may have a substituent. In case of group 3,5,3 ″, 5 ″ -tetramethyl- [1,1 ′; 4 ′, 1 ″] terphenyl-4,4 ″ -diol and the like, and even when X has a substituent In the case of a good amino group, 4-[(4-hydroxy-3,5-dimethylphenyl) methylamino] -2,6-dimethylphenol and the like are mentioned, and when X is a carboxyl group, 4,4′-dihydroxy -3,3 ', 5,5'-tetramethylbenzophenone and the like, and when X is an ether bond, 4,4'-dihydroxy-3,3', 5,5'-tetramethyldibenzoether and the like In addition, when X is a thio group, 4,4′-dihydroxy-3,3 ′, 5,5′-tetramethyldibenzothioether and the like are mentioned, and when X is a sulfenyl group, 4,4 ′ -Dihydroxy-3,3 ', 5 5'-tetramethyl bisphenol sulfide, and the like, and if X is a sulfonyl group, 4,4'-dihydroxy-3,3 ', 5,5'-tetramethyl bisphenol sulfone, and the like.

  The aromatic modifier (a2) is represented by the general formula (4) or the general formula (5). For example, the compound represented by the general formula (4) is preferable. , Y is a halogen atom, benzyl chloride, benzyl bromide, benzyl iodide, o-methylbenzyl chloride, m-methylbenzyl chloride, p-methylbenzyl chloride, p-ethylbenzyl chloride, p-isopropylbenzyl chloride, p- tert-Butylbenzyl chloride, p-cyclohexylbenzyl chloride, p-phenylbenzyl chloride, 2-naphthylmethyl chloride, 7-methyl-2-naphthylmethyl chloride and their nuclear substitution isomers, α-methylbenzyl chloride, α, α -Dimethylbenzyl chloride, etc. And when Y is an alkoxy group, it is preferably an alkoxy group having 1 to 4 carbon atoms, such as benzyl methyl ether, o-methylbenzyl methyl ether, m-methylbenzyl methyl ether, p-methylbenzyl methyl ether, p -Ethyl benzyl methyl ether and nucleosubstituted isomers thereof, such as benzyl ethyl ether, benzyl isopropyl ether, benzyl n-propyl ether, benzyl isobutyl ether, benzyl n-butyl ether, p-methylbenzyl methyl ether and nucleosubstituted isomers thereof And when Y is a hydroxyl group, benzyl alcohol, o-methylbenzyl alcohol, m-methylbenzyl alcohol, p-methylbenzyl alcohol, p-ethylbenzyl alcohol, p-isopropylbenzyl alcohol p-tert-butylbenzyl alcohol, p-cyclohexylbenzyl alcohol, p-phenylbenzyl alcohol, 2-naphthylcarbinol, 7-methyl-2-naphthylcarbinol and their nuclear substitution isomers, α-methylbenzyl alcohol, α , Α-dimethylbenzyl alcohol and the like.

  Examples of preferable compounds represented by the general formula (5) include styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, α-methylstyrene, and β-methylstyrene. .

  As a ratio of the dihydric phenol compound (a1) and the aromatic modifier (a2), the dihydric phenol compound (a1) and the aromatic modifier are preferable from the viewpoint of excellent physical property balance of the obtained cured product. The reaction ratio (a1) / (a2) with (a2) is preferably 1 / 0.1 to 1/10 (molar ratio), and in particular, the ratio is 1 / 0.1 to 1/5. Is preferred.

  The reaction between the dihydric phenol compound (a1) and the aromatic modifier (a2) is preferably performed in the presence of an acid catalyst. The acid catalyst that can be used varies depending on the type of the aromatic modifier (a2). However, inorganic acids such as phosphoric acid, sulfuric acid, and hydrochloric acid, oxalic acid, benzenesulfonic acid, toluenesulfonic acid, methanesulfonic acid, An organic acid such as fluoromethanesulfonic acid, a Friedel-Crafts catalyst such as aluminum chloride, zinc chloride, stannic chloride, ferric chloride, and diethyl sulfate can be used alone or in combination.

  The type and amount of the acid catalyst may be selected depending on the target modification rate and the like, and are not particularly limited. For example, in the case of an inorganic acid or an organic acid, the divalent phenol compound (a1) 100 is used. The amount is 0.001 to 5.0 parts by weight, preferably 0.01 to 3.0 parts by weight, based on parts by weight. In the case of a Friedel-Crafts catalyst, 0.1 parts by weight per 1 mol of the dihydric phenol compound (a1). It is preferable to use 2-3.0 mol, preferably 0.5-2.0 mol.

  The reaction with the aromatic modifier (a1) can be carried out in the absence of a solvent or in a soluble solvent that forms a homogeneous solution, depending on the dihydric phenol compound (a1) used. Examples of the soluble solvent include ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dipropyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl. Aprotic electrodes such as ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, ethylene glycol or diethylene glycol mono or diether, dimethylformamide and dimethyl sulfoxide It may be mentioned solvent, chlorobenzene, nitrobenzene and the like. These organic solvents can be used alone or in combination of several kinds. By using such a soluble solvent, it is possible to obtain a modified dihydric phenol compound that has been stably modified with the aromatic modifier (a2).

  In the reaction, the dihydric phenol compound (a1), the aromatic modifier (a2), and the acid catalyst are dissolved in the absence of solvent or in the soluble solvent, and the acid catalyst is dissolved at 60 to 180 ° C., preferably 80 to It can be carried out by maintaining at a temperature of about 160 ° C. for about 1 to 10 hours. In addition, it is preferable to distill off hydrogen halide, water, alcohols, or the like generated during the reaction out of the system using a fractionating tube or the like in order to perform the reaction quickly.

  Moreover, when the coloring of the modified | denatured dihydric phenol compound obtained is large, in order to suppress it, you may add antioxidant and a reducing agent. Although it does not specifically limit as antioxidant, For example, a hindered phenol type compound, such as a 2, 6- dialkylphenol derivative, a bivalent sulfur type compound, a phosphite type compound containing a trivalent phosphorus atom, etc. are mentioned. Can do. The reducing agent is not particularly limited, and examples thereof include hypophosphorous acid, phosphorous acid, thiosulfuric acid, sulfurous acid, hydrosulfite, and salts thereof.

  After completion of the reaction, the acid catalyst can be removed by neutralization treatment, water washing treatment or decomposition, and the desired modified dihydric phenol compound can be separated by general operations such as extraction and distillation. The neutralization treatment and the water washing treatment may be carried out according to conventional methods and are not limited in any way. For example, a basic substance such as sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, triethylenetetramine, aniline, etc. It can be used as a neutralizing agent.

  The modified dihydric phenol compound obtained by the above method is a mixture of two or more kinds of arylalkyl groups and / or different bonding positions thereof, and can be used as it is for the reaction with epihalohydrins (a3) described later. However, if necessary, a fractionation operation such as distillation can be further performed to separate each component or a mixture having a smaller number of components.

  An epoxy resin can be obtained by reacting the modified dihydric phenol compound obtained above and the epihalohydrin (a3).

  The epihalohydrins (a3) that can be used here are not particularly limited and include, for example, epichlorohydrin, epibromohydrin, β-methylepichlorohydrin, β-methylepibromohydrin, and the like. Epichlorohydrin is preferably used because it is easily available.

  The conditions for performing the reaction between the modified dihydric phenol compound and the epihalohydrins (a3) are not particularly limited, and can be performed according to various methods. For example, 2 to 10 mol of epihalohydrins (a3) are added to 1 mol of the phenolic hydroxyl group in the modified dihydric phenol compound obtained above, and 0.9 to 2 to 1 mol of the hydroxyl group is added to this mixture. A method of reacting at a temperature of 20 to 120 ° C. for 0.5 to 10 hours while adding or gradually adding 0.0 mol of a basic catalyst. As the basic catalyst, a solid or an aqueous solution thereof may be used. When an aqueous solution is used, it is continuously added, and water and epihalohydrins are continuously added from the reaction mixture under reduced pressure or normal pressure. A method may be employed in which (a3) is distilled, further separated to remove water, and the epihalohydrins (a3) are continuously returned to the reaction mixture.

  In addition, when industrial production is performed, new epihalohydrins (a3) used in the first batch of epoxy resin production are used, but the epihalohydrins (a3) recovered from the crude reaction product are used after the next batch. And a new epihalohydrin (a3) corresponding to the amount consumed and lost in the reaction is preferably used in combination.

  The basic catalyst is not particularly limited, and examples thereof include alkaline earth metal hydroxides, alkali metal carbonates, and alkali metal hydroxides. In particular, alkali metal hydroxides are preferable from the viewpoint of excellent catalytic activity of the epoxy resin synthesis reaction, and examples thereof include sodium hydroxide and potassium hydroxide. In use, as described above, these alkali metal hydroxides may be used in the form of an aqueous solution of about 10 to 55% by weight, or may be used in a solid form.

  Moreover, the reaction rate in the synthesis | combination of an epoxy resin can be raised by using an organic solvent together. The organic solvent is not particularly limited, for example, ketones such as acetone and methyl ethyl ketone, alcohols such as methanol, ethanol, 1-propyl alcohol, isopropyl alcohol, 1-butanol, secondary butanol, and tertiary butanol, methyl cellosolve, Examples include cellosolves such as ethyl cellosolve, ethers such as tetrahydrofuran, 1,4-dioxane, 1,3-dioxane and diethoxyethane, and aprotic polar solvents such as acetonitrile, dimethyl sulfoxide and dimethylformamide. These organic solvents may be used alone or in combination of two or more as appropriate in order to adjust the polarity.

  The reaction product obtained by this reaction can be subsequently purified by distilling off the unreacted epihalohydrins (a3) and the organic solvent used in combination by distillation under heating and reduced pressure after washing with water. Further, in order to obtain an epoxy resin with less hydrolyzable halogen, the obtained reaction product is again dissolved in an organic solvent such as toluene, methyl isobutyl ketone, methyl ethyl ketone, and alkali metal hydroxide such as sodium hydroxide or potassium hydroxide. Further reaction can be carried out by adding an aqueous solution of the product. At this time, a phase transfer catalyst such as a quaternary ammonium salt or crown ether may be present for the purpose of improving the reaction rate. When the phase transfer catalyst is used, the amount used is preferably in the range of 0.1 to 3.0% by weight based on the reaction product (crude epoxy resin) used. After completion of the reaction, the generated salt is removed by filtration, washing with water, and a high-purity epoxy resin can be obtained by distilling off a solvent such as toluene and methyl isobutyl ketone under heating and reduced pressure.

As the curing agent (B) used in the present invention, various curing agents for epoxy resins can be used and are not particularly limited. For example, amine-based compounds, amide-based compounds, acid anhydride-based compounds are used. Various curing agents such as compounds and phenolic compounds can be used. Specifically, examples of the amine compound include diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, imidazole, BF ₃ -amine complex, and guanidine derivative. Examples of the amide compound include dicyandiamide. And polyamide resins synthesized from dimer of linolenic acid and ethylenediamine. Examples of acid anhydride compounds include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, and tetrahydrophthalic anhydride. Acid, methyltetrahydrophthalic anhydride, methyl nadic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, etc., and phenolic compounds include phenol novolac resin, cresol novolac resin Aromatic hydrocarbon formaldehyde resin modified phenolic resin, dicyclopentadiene phenol addition type resin, phenol aralkyl resin (commonly known as xyloc resin), naphthol aralkyl resin, trimethylol methane resin, tetraphenylol ethane resin, naphthol novolac resin, naphthol-phenol Co-condensed novolak resin, naphthol-cresol co-condensed novolak resin, biphenyl-modified phenol resin (polyhydric phenol compound in which phenol nucleus is linked by bismethylene group), biphenyl-modified naphthol resin (polyvalent naphthol in which phenol nucleus is linked by bismethylene group) Compound), polyhydric phenol compounds such as aminotriazine-modified phenolic resins (polyhydric phenol compounds in which phenol nuclei are linked with melamine, benzoguanamine, etc.), And modified products thereof, but are not limited thereto. These may be used alone or in combination of two or more.

  Among these, phenol novolak resin, cresol novolak resin, aromatic hydrocarbon formaldehyde resin modified phenol resin, phenol aralkyl resin, naphthol aralkyl resin, naphthol novolak resin, naphthol-phenol co-condensed novolak resin, naphthol-cresol co-condensed novolak resin, Biphenyl-modified phenolic resin, biphenyl-modified naphthol resin, and aminotriazine-modified phenolic resin are preferable because they are excellent in flame retardancy, especially aromatic hydrocarbon formaldehyde resin-modified phenolic resin, phenol aralkyl resin, naphthol aralkyl resin, biphenyl-modified phenolic resin, biphenyl. Hydroxyl by a linking group containing an aromatic ring not having a hydroxyl group such as a modified naphthol resin or an aminotriazine-modified phenol resin It is preferred particularly from the viewpoint of excellent flame retardancy polyvalent aromatic compound containing an aromatic ring are linked structure with.

  Further, the above-mentioned modified dihydric phenol compound, that is, the following general formula (2)

〔式中、Ａｒ_１、Ａｒ_２、Ａｒ_３、Ａｒ_４は各々独立に、置換基を有していてもよい芳香族骨格（但し、置換基は、置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、置換基を有していてもよいフェニル基、置換基を有していてもよいアミノ基、カルボキシル基、ニトロ基又はハロゲン原子である。）であり、Ｒ_１、Ｒ_２、Ｒ_３、Ｒ_４は各々独立に、置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基、置換基を有していてもよいフェニル基、置換基を有していてもよいアミノ基又はハロゲン原子であり、Ｒ_５、Ｒ_６、Ｒ_７、Ｒ_８、Ｒ_９、Ｒ_１０、Ｒ_１１、Ｒ_１２は各々独立に、水素原子或いは、置換基を有していてもよいアルキル基、置換基を有していてもよいアルコキシ基又は置換基を有していてもよいフェニル基であり、Ｘは直接結合、置換基を有していてもよいアルキレン鎖、置換基を有していてもよいオキシアルキレン鎖、カルボニル基、エーテル結合、チオエーテル結合、スルフェニル基又はスルホニル基であり、ｎ_１、ｎ_２、ｎ_３、ｎ_４は繰り返し数を示し、各々独立に０〜１０の整数であって、且つｎ_１＋ｎ_２＋ｎ_３＋ｎ_４≧１である。〕
で表される変性２価フェノール化合物を硬化剤として用いることも出来、硬化性に優れ、且つ、難燃性、低誘電特性等に優れる硬化物が得られる。

[Wherein, Ar ₁ , Ar ₂ , Ar ₃ , Ar ₄ are each independently an aromatic skeleton optionally having a substituent (provided that the substituent is an alkyl group optionally having a substituent] An alkoxy group which may have a substituent, a phenyl group which may have a substituent, an amino group which may have a substituent, a carboxyl group, a nitro group or a halogen atom. Each of R ₁ , R ₂ , R ₃ and R ₄ may independently have an alkyl group which may have a substituent, an alkoxy group which may have a substituent, or a substituent. A good phenyl group, an optionally substituted amino group or a halogen atom, and R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , R ₁₂ are each independently hydrogen Atom or alkyl group which may have a substituent, Or a phenyl group which may have a substituent, X is a direct bond, an alkylene chain which may have a substituent, an oxyalkylene chain which may have a substituent, a carbonyl group , An ether bond, a thioether bond, a sulfenyl group, or a sulfonyl group, n ₁ , n ₂ , n ₃ , and n ₄ each represent a repeating number, each independently an integer of 0 to 10, and n ₁ + n ₂ + N ₃ + n ₄ ≧ 1. ]
Can be used as a curing agent, and a cured product having excellent curability and excellent flame retardancy, low dielectric properties, and the like can be obtained.

  The epoxy resin composition of the present invention is not limited in any way other than using the epoxy resin (A) and the curing agent (B), and the epoxy resin (A) is within the range not impairing the effects of the present invention. Various epoxy resins other than can be used in combination. When other epoxy resins are used in combination, the proportion of the epoxy resin (A) in the entire epoxy resin is preferably 30% by weight or more, particularly preferably 40% by weight or more.

  Other epoxy resins that can be used in combination are not particularly limited. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, tetramethylbiphenyl type epoxy resin, phenol novolac type epoxy resin, cresol Novolac type epoxy resin, triphenylmethane type epoxy resin, tetraphenylethane type epoxy resin, dicyclopentadiene-phenol addition reaction type epoxy resin, phenol aralkyl type epoxy resin, naphthol novolak type epoxy resin, naphthol aralkyl type epoxy resin, naphthol- Phenol co-condensed novolac type epoxy resin, naphthol-cresol co-condensed novolac type epoxy resin, aromatic hydrocarbon formaldehyde resin modified phenolic resin Epoxy resin, biphenyl-modified novolak type epoxy resins are not limited thereto. Moreover, these other epoxy resins may be used independently and may mix 2 or more types. Among these epoxy resins, bisphenol F-type epoxy resins, biphenyl-type epoxy resins, and tetramethylbiphenyl-type epoxy resins are preferable in terms of particularly low viscosity, and phenol aralkyl-type epoxy resins and biphenyls are preferable in terms of excellent flame retardancy. A modified novolac type epoxy resin is preferred.

  The blending amount of the epoxy resin (A) and the curing agent (B) in the epoxy resin composition of the present invention is not particularly limited, but the mechanical properties of the resulting cured product are good. From the viewpoint, the amount of the active group in the curing agent (B) is preferably 0.7 to 1.5 equivalents with respect to 1 equivalent in total of the epoxy groups in the epoxy resin containing the epoxy resin (A).

  Moreover, a hardening accelerator can also be suitably used together with the epoxy resin composition of this invention as needed. Various curing accelerators can be used, and examples thereof include phosphorus compounds, tertiary amines, imidazoles, organic acid metal salts, Lewis acids, and amine complex salts. In particular, when used as a semiconductor encapsulating material, it is excellent in curability, heat resistance, electrical characteristics, moisture resistance reliability, etc., so that triphenylphosphine is used for phosphorus compounds and 1,8-diazabicyclo is used for tertiary amines. -[5.4.0] -undecene (DBU) is preferred.

  In the epoxy resin composition of the present invention, since the epoxy resin (A) itself has flame retardancy, it does not contain a conventionally used flame retardant to impart flame retardancy of a cured product. However, the cured product obtained has good flame retardancy, but in order not to lower the moldability in the sealing process and the reliability of the semiconductor device in order to exhibit higher flame retardancy, it is non-halogen. It is preferable to add a flame retardant (C), and at this time, a non-halogen flame retardant epoxy resin composition containing substantially no halogen atom is obtained.

  The non-halogen flame retardant epoxy resin composition substantially containing no halogen atom as used herein means a resin composition that exhibits sufficient flame retardancy without blending a halogen compound for the purpose of imparting flame retardancy. For example, the halogen atom by the trace amount impurity of about 5000 ppm or less derived from the epihalohydrin contained in an epoxy resin may be contained.

  The non-halogen flame retardant (C) is a compound that does not substantially contain a halogen atom such as chlorine or bromine and has a function as a flame retardant or a flame retardant aid. For example, phosphorus-based flame retardants, nitrogen-based flame retardants, silicone-based flame retardants, inorganic flame retardants, organometallic salt-based flame retardants, and the like are not limited in any way. Even if it is used alone, a plurality of flame retardants of the same type may be used, or different types of flame retardants may be used in combination.

  As the phosphorus flame retardant, both inorganic and organic compounds can be used as long as they are compounds containing phosphorus atoms. Examples of inorganic compounds include phosphoric acids such as red phosphorus, monoammonium phosphate, diammonium phosphate, triammonium phosphate, and ammonium polyphosphate, which may be subjected to surface treatment for the purpose of preventing hydrolysis and the like. Examples thereof include inorganic nitrogen-containing phosphorus compounds such as ammonium and phosphoric acid amide.

  Examples of the surface treatment method of red phosphorus include (i) coating with an inorganic compound such as magnesium hydroxide, aluminum hydroxide, zinc hydroxide, titanium hydroxide, bismuth oxide, bismuth hydroxide, bismuth nitrate, or a mixture thereof. A method of treating, (ii) a method of coating with a mixture of an inorganic compound such as magnesium hydroxide, aluminum hydroxide, zinc hydroxide and titanium hydroxide, and a thermosetting resin such as a phenol resin, (iii) magnesium hydroxide And a method of double coating with a thermosetting resin such as phenol resin on a coating of an inorganic compound such as aluminum hydroxide, zinc hydroxide or titanium hydroxide, and any of (i) to (iii) What was processed by the method of can also be used.

  Examples of the organic phosphorus compounds include phosphate ester compounds, phosphonic acid compounds, phosphinic acid compounds, phosphine oxide compounds, phospholane compounds, and organic nitrogen-containing phosphorus compounds.

  Specific examples of the phosphoric ester compound include triphenyl phosphate, resorcinol bis (diphenyl phosphate), resorcinol bis (di-2,6-xylenol phosphate), bisphenol A bis (diphenyl phosphate), bisphenol A bis (dicresyl phosphate). ), Resorcinyl diphenyl phosphate and the like.

  Specific examples of the phosphonic acid compound include phenylphosphonic acid, methylphosphonic acid, ethylphosphonic acid, and phosphonic acid metal salts described in JP-A No. 2000-226499.

  Specific examples of the phosphinic acid compound include diphenylphosphinic acid, methylethylphosphinic acid, a compound described in JP-A No. 2001-55484, 9,10-dihydro-9-oxa-10-phosphaphenanthrene = 10-oxide. 10- (2,5-dihydrooxyphenyl) -10H-9-oxa-10-phosphaphenanthrene = 10-oxide, 10- (2,7-dihydrooxynaphthyl) -10H-9-oxa-10-phos Examples thereof include cyclic organophosphorus compounds such as faphenanthrene = 10-oxide, and derivatives obtained by reacting them with compounds such as epoxy resins and phenol resins.

  Specific examples of the phosphine oxide compound include triphenylphosphine oxide, tris (3-hydroxypropyl) phosphine oxide, diphenylphosphinyl hydroquinone, JP-A No. 2000-186186, JP-A No. 2002-080484, JP-A No. 2002. -097248 gazette etc. are mentioned.

  Specific examples of the phosphorane compound include compounds described in JP-A No. 2000-281871.

  Examples of organic nitrogen-containing phosphorus compounds include JP 2002-60720, JP 2001-354686, JP 2001-261792, JP 2001-335703, JP 2000-103939, and the like. And the phosphazene compounds described.

  The blending amount thereof is appropriately selected depending on the type of the phosphorus-based flame retardant, the other components of the epoxy resin composition, and the desired degree of flame retardancy. For example, epoxy resin, curing agent, non-halogen In 100 parts by weight of the epoxy resin composition containing all of the flame retardant and other fillers and additives, when using red phosphorus as a non-halogen flame retardant, in the range of 0.1 to 2.0 parts by weight It is preferable to mix, and when using an organophosphorus compound, it is also preferable to mix in the range of 0.1 to 10.0 parts by weight, particularly in the range of 0.5 to 6.0 parts by weight. Is preferred.

  Further, the method of using the phosphorus-based flame retardant is not particularly limited. For example, JP 2002-080566 A, JP 2002-053734 A, JP 2000-248156 A, and JP 9-9 A. No. 235449, etc., hydrotalcite used together, Japanese Patent Application Laid-Open No. 2001-329147, etc., magnesium hydroxide used together, Japanese Patent Application Laid-Open No. 2002-23989, Japanese Patent Application Laid-Open No. 2001-323134, etc. Compound combination, zirconium oxide combination described in JP-A No. 2002-069271, etc., black dye combination described in JP-A No. 2001-123047, etc., calcium carbonate described in JP-A No. 2000-281873, etc. Combined use, combined use of zeolite described in JP-A-2000-281873, etc., JP-A-200 Used in combination with zinc molybdate described in JP-A No. -248155, etc., used in combination with activated carbon described in JP-A No. 2000-212392, JP-A No. 2002-348440, JP-A No. 2002-265758, and JP-A No. 2002-180053. Conventional methods such as surface treatment methods described in JP-A No. 2001-329147, JP-A No. 2001-226564, JP-A No. 11-269345, and the like can be applied.

  The nitrogen-based flame retardant is not particularly limited as long as it is a compound containing a nitrogen atom, and examples thereof include triazine compounds, cyanuric acid compounds, isocyanuric acid compounds, phenothiazines, and the like. Triazine compounds, cyanuric acid compounds An isocyanuric acid compound is preferred.

  Specific examples of the triazine compound include, for example, melamine, acetoguanamine, benzoguanamine, melon, melam, succinoguanamine, ethylene dimelamine, melamine polyphosphate, triguanamine, and derivatives thereof. For example, (i) aminotriazine sulfate compounds such as guanylmelamine sulfate, melem sulfate, melam sulfate, (ii) phenols such as phenol, cresol, xylenol, butylphenol, nonylphenol, melamine, benzoguanamine, acetoguanamine, formguanamine, etc. A co-condensate of melamines and formaldehyde, (iii) a mixture of the co-condensate of (ii) and a phenol resin such as a phenol formaldehyde condensate, (iv) the above (ii), (iii) Furthermore tung, such as those modified with isomerized linseed oil, and the like.

  Specific examples of the cyanuric acid compound include cyanuric acid and cyanuric acid melamine.

  Specific examples of the isocyanuric acid compound include tris (β-cyanoethyl) isocyanurate, diallyl monoglycidyl isocyanuric acid, monoallyl diglycidyl isocyanuric acid, and the like.

In addition, the compound containing a nitrogen atom has a functional group such as —OH, —NH ₂ , —NCO, —COOH, —CHO, —SH, methylol, acrylate, methacrylate, silyl, glycidyl group or epoxy group. May be.

  The amount of the nitrogen-based flame retardant is appropriately selected depending on the type of the nitrogen-based flame retardant, the other components of the epoxy resin composition, and the desired degree of flame retardancy. It is preferable to mix in the range of 0.05 to 10 parts by weight in 100 parts by weight of the epoxy resin composition containing all of the agent, non-halogen flame retardant and other fillers and additives. It is preferable to mix in the range of 5 parts by weight.

  Further, the method of using the nitrogen-based flame retardant is not particularly limited. For example, the metal hydroxide described in JP-A-2001-234036 and the like, JP-A-2002-003577, JP-A Conventional methods such as combined use of molybdenum compounds described in JP 2001-098144 A can be applied.

  The silicone flame retardant is not particularly limited as long as it is an organic compound containing a silicon atom, and examples thereof include silicone oil, silicone rubber, and silicone resin.

  Specific examples of the silicone oil include dimethyl silicone oil, methylphenyl silicone oil, methyl hydrogen silicone oil, polyether-modified silicone oil, and the like.

  Specific examples of the silicone rubber include methyl silicone rubber and methylphenyl silicone rubber.

  Specific examples of the silicone resin include methyl silicone, methyl phenyl silicone, and phenyl silicone.

The organic compound containing a silicon atom has a functional group such as —OH, —NH ₂ , —NCO, —COOH, —CHO, —SH, methylol, acrylate, methacrylate, silyl, glycidyl group or epoxy group. You may do it.

  The amount of the silicone flame retardant is appropriately selected according to the type of the silicone flame retardant, the other components of the epoxy resin composition, and the desired degree of flame retardancy. It is preferable to mix in the range of 0.05 to 20 parts by weight in 100 parts by weight of the epoxy resin composition containing all of the agent, non-halogen flame retardant and other fillers and additives.

  Further, the method of using the silicone-based flame retardant is not particularly limited. For example, a combination of molybdenum compounds described in JP 2001-011288 A, alumina described in JP 10-182941 A, and the like. A conventional method such as a combination of these can be applied.

  Examples of the inorganic flame retardant include metal hydroxide, metal oxide, metal carbonate compound, metal powder, boron compound, and low melting point glass.

  Specific examples of the metal hydroxide include, for example, aluminum hydroxide, magnesium hydroxide, dolomite, hydrotalcite, calcium hydroxide, barium hydroxide, zirconium hydroxide, JP 2002-212391 A, and JP 2001. Examples thereof include composite metal hydroxides described in JP-A No. 335681 and JP-A No. 2001-32050.

  Specific examples of the metal oxide include, for example, zinc molybdate, molybdenum trioxide, zinc stannate, tin oxide, aluminum oxide, iron oxide, titanium oxide, manganese oxide, zirconium oxide, zinc oxide, molybdenum oxide, and cobalt oxide. Bismuth oxide, chromium oxide, nickel oxide, copper oxide, tungsten oxide and the like.

  Specific examples of the metal carbonate compound include zinc carbonate, magnesium carbonate, calcium carbonate, barium carbonate, basic magnesium carbonate, aluminum carbonate, iron carbonate, cobalt carbonate, and titanium carbonate.

  Specific examples of the metal powder include aluminum, iron, titanium, manganese, zinc, molybdenum, cobalt, bismuth, chromium, nickel, copper, tungsten, and tin.

  Specific examples of the boron compound include zinc borate, zinc metaborate, barium metaborate, boric acid, and borax.

Specific examples of the low-melting-point glass include, for example, Ceeley (Bokusui Brown), hydrated glass SiO ₂ —MgO—H ₂ O, PbO—B ₂ O ₃ system, ZnO—P ₂ O ₅ —MgO system, P ₂ O ₅ —B ₂ O ₃ —PbO—MgO, P—Sn—O—F, PbO—V ₂ O ₅ —TeO ₂ , Al ₂ O ₃ —H ₂ O, lead borosilicate, etc. The glassy compound can be mentioned.

  The blending amount of the inorganic flame retardant is appropriately selected according to the type of the inorganic flame retardant, the other components of the epoxy resin composition, and the desired degree of flame retardancy. For example, epoxy resin, cured It is preferable to mix in an amount of 0.05 to 20 parts by weight in 100 parts by weight of the epoxy resin composition containing all of the agent, non-halogen flame retardant and other fillers and additives, and particularly 0.5 to 20 parts by weight. It is preferable to mix in the range of 15 parts by weight.

  Further, the method of using the inorganic flame retardant is not particularly limited. For example, the method for controlling the specific surface area described in JP-A-2001-226564, JP-A-2000-19595, JP-A-2000. 191886, JP-A-2000-109647, JP-A-2000-038776, etc., methods for controlling the shape, particle size, and particle size distribution, JP-A-2001-32050, JP-A-2000-095956 JP, 10-279813, JP 10-251486, a method for performing surface treatment, JP 2002-030200, JP 2001-279063, etc. Combined use, combined use of zinc borate described in JP 2001-049084 A, etc., JP 2000-195994 A A combination of inorganic powders described in JP-A-2000-156437, a butadiene rubber described in JP-A-2000-156437, a high acid value polyethylene wax described in JP-A-2000-053875 and a long-chain alkyl phosphate ester compound Conventional methods such as combined use can be applied.

  Examples of the organometallic salt-based flame retardant include ferrocene, acetylacetonate metal complex, organometallic carbonyl compound, organocobalt salt compound, organosulfonic acid metal salt, metal atom and aromatic compound or heterocyclic compound or an ionic bond or Examples thereof include a coordinated compound.

  Specific examples of the acetylacetonate metal complex include compounds described in JP-A No. 2002-265760.

  Specific examples of the organometallic carbonyl compound include compounds described in JP-A No. 2002-371169.

  Specific examples of the organic cobalt salt compound include, for example, a cobalt naphthenic acid complex, a cobalt ethylenediamine complex, a cobalt acetoacetonate complex, a cobalt piperidine complex, a cobalt cyclohexanediamine complex, a cobalt tetraazacyclotetradodecane complex, and a cobalt ethylenediaminetetraacetic acid complex. , Cobalt tetraethylene glycol complex, cobalt aminoethanol complex, cobalt cyclohexadiamine complex, cobalt glycine complex, cobalt triglycine complex, cobalt naphthidirine complex, cobalt phenanthroline complex, cobalt pentanediamine complex, cobalt pyridine complex, cobalt salicylic acid complex, cobalt Salicylaldehyde complex, cobalt salicylideneamine complex, cobalt complex porphyrin, cobalt thiourea complex And the like can be given.

  Specific examples of the organic sulfonic acid metal salt include potassium diphenylsulfone-3-sulfonate.

  Specific examples of the compound in which the metal atom and the aromatic compound or heterocyclic compound are ion-bonded or coordinate-bonded include compounds described in JP-A-2002-226678.

  The amount of the organic metal salt-based flame retardant is appropriately selected according to the type of the organic metal salt-based flame retardant, the other components of the epoxy resin composition, and the desired degree of flame retardancy. It is preferable to mix in the range of 0.005 to 10 parts by weight in 100 parts by weight of the epoxy resin composition containing all of the epoxy resin, curing agent, non-halogen flame retardant, and other fillers and additives.

  An inorganic filler can be blended in the epoxy resin composition of the present invention as necessary. Examples of the inorganic filler include fused silica, crystalline silica, alumina, silicon nitride, and aluminum hydroxide. When particularly increasing the blending amount of the inorganic filler, it is preferable to use fused silica. The fused silica can be used in either a crushed shape or a spherical shape, but in order to increase the blending amount of the fused silica and to suppress an increase in the melt viscosity of the molding material, it is preferable to mainly use a spherical shape. In order to further increase the blending amount of the spherical silica, it is preferable to appropriately adjust the particle size distribution of the spherical silica. The filling rate is preferably higher in consideration of flame retardancy, and particularly preferably 65% by weight or more with respect to the total amount of the epoxy resin composition. Moreover, when using for uses, such as an electrically conductive paste, electroconductive fillers, such as silver powder and copper powder, can be used.

  Various compounding agents, such as a silane coupling agent, a mold release agent, a pigment, an emulsifier, can be added to the epoxy resin composition of this invention as needed.

  The epoxy resin composition of this invention is obtained by mixing each component uniformly. The epoxy resin composition of the present invention, in which the epoxy resin of the present invention, a curing agent and, if necessary, a curing accelerator are blended, can be easily made into a cured product by a method similar to a conventionally known method. Examples of the cured product include molded cured products such as laminates, cast products, adhesive layers, coating films, and films.

  The epoxy resin composition of the present invention can be used for printed circuit boards, electronic component sealing materials, resist inks, conductive pastes, interlayer insulating materials, resin compositions, resin casting materials, and adhesives. In particular, a coating material such as an insulating paint can be used, and among these, it can be suitably used for a semiconductor sealing material and a printed circuit board, and it is preferable to use a cured product thereof as a semiconductor device or a circuit board device.

  In order to produce an epoxy resin composition prepared for a semiconductor encapsulant, an epoxy resin, a curing agent, a compounding agent such as a filler, and the like, if necessary, an extruder, a kneader, a roll, etc. It is sufficient to obtain a melt-mixed type epoxy resin composition by mixing well until it is uniform. At that time, silica is usually used as the filler, and the filling rate is preferably in the range of 30 to 95% by weight per 100 parts by weight of the epoxy resin composition. In order to improve moisture resistance and solder crack resistance and to reduce the linear expansion coefficient, it is particularly preferably 70 parts by weight or more, and in order to significantly increase these effects, 80 parts by weight or more further enhances the effect. be able to.

  With semiconductor package molding, the composition can be molded by casting, using a transfer molding machine, an injection molding machine or the like, and further heated at 50 to 200 ° C. for 2 to 10 hours to obtain a molded product. .

  Depending on the viscosity of the resin composition, a resin composition for a prepreg for a printed circuit board can be used without a solvent, but it is preferably a prepreg resin composition by varnishing with an organic solvent. . As the organic solvent, it is preferable to use a polar solvent having a boiling point of 160 ° C. or lower such as methyl ethyl ketone, acetone, dimethylformamide or the like which does not contain an alcoholic hydroxyl group, and it can be used alone or as a mixed solvent of two or more kinds. The obtained varnish is impregnated into various reinforcing substrates such as paper, glass cloth, glass nonwoven fabric, aramid paper, aramid cloth, glass mat, and glass roving cloth, and the heating temperature according to the solvent type used, preferably 50 By heating at ˜170 ° C., a prepreg that is a cured product can be obtained. The weight ratio of the resin composition and the reinforcing substrate used at this time is not particularly limited, but it is usually preferable that the resin content in the prepreg is adjusted to 20 to 60% by weight.

  In order to obtain the resin composition for copper-clad laminates, the method is the same as the above-mentioned resin composition for prepreg, and the obtained prepreg is laminated as described in, for example, JP-A-7-41543. A copper-clad laminate can be obtained by appropriately stacking copper foils and thermocompression bonding at 170 to 250 ° C. for 10 minutes to 3 hours under a pressure of 1 to 10 MPa.

  When used as a resist ink, for example, in accordance with the method described in JP-A-5-186567, after forming a resist ink composition, it is applied on a printed circuit board by a screen printing method, and then the resist ink is cured. The method to make a thing is mentioned.

  When used as a conductive paste, for example, a method of dispersing fine conductive particles described in JP-A-3-46707 in the resin composition to form an anisotropic conductive film composition, -40183, JP-A-62-276215, JP-A-62-176139, etc., which are liquid at room temperature, such as paste resin compositions for circuit connection and anisotropic conductive adhesives, The method of doing is mentioned.

  The method for obtaining the interlayer insulating material for the build-up substrate is not particularly limited. For example, JP-B-4-6116, JP-A-7-304931, JP-A-8-64960, JP-A-9-71762, Various methods described in JP-A-9-298369 can be employed. More specifically, the resin composition appropriately blended with rubber, filler, and the like is applied to a wiring board on which a circuit is formed using a spray coating method, a curtain coating method, or the like, and then cured. Then, after drilling a predetermined through-hole part etc. as needed, it treats with a roughening agent, forms the unevenness | corrugation by washing the surface with hot water, and metal-treats, such as copper. As the plating method, electroless plating or electrolytic plating treatment is preferable, and examples of the roughening agent include an oxidizing agent, an alkali, and an organic solvent. Such operations are sequentially repeated as desired, and a build-up base can be obtained by alternately building up and forming the resin insulating layer and the conductor layer having a predetermined circuit pattern. However, the through-hole portion is formed after the outermost resin insulating layer is formed. In addition, a resin-coated copper foil obtained by semi-curing the resin composition on the copper foil is thermocompression-bonded at 170 to 250 ° C. on a circuit board on which a circuit is formed, thereby forming a roughened surface and plating treatment. It is also possible to produce a build-up substrate by omitting the process.

  The method for obtaining the cured product of the present invention may be based on a general method for curing an epoxy resin composition. For example, the heating temperature condition may be appropriately selected depending on the type and application of the curing agent to be combined, What is necessary is just to heat the composition obtained by the said method in the temperature range of room temperature-about 250 degreeC. As a molding method, a general method of an epoxy resin composition can be used, and a condition peculiar to the epoxy resin composition of the present invention is not particularly necessary.

  Next, the present invention will be specifically described with reference to Examples and Comparative Examples. In the following, “parts” and “%” are based on weight unless otherwise specified. In addition, the melt viscosity and softening point measurement in 150 degreeC, GPC measurement, NMR, and MS spectrum were measured on condition of the following.

1) Melt viscosity at 150 ° C .: in accordance with ASTM D4287 2) Softening point measurement method: JIS K7234
3) GPC:
・ Device: HLC-8220 GPC manufactured by Tosoh Corporation, Column: TSK-GEL G2000HXL + G2000HXL + G3000HXL + G4000HXL manufactured by Tosoh Corporation
・ Solvent: Tetrahydrofuran ・ Flow rate: 1 ml / min
・ Detector: RI
4) NMR: NMR GSX270 manufactured by JEOL Ltd.
5) MS: Double Density Mass Spectrometer AX505H (FD505H) manufactured by JEOL Ltd.

Synthesis Example 1 [Synthesis of Modified Divalent Phenol Compound]
A flask equipped with a thermometer, dropping funnel, condenser, fractionator, and stirrer has the following structural formula

で表される４，４’−ジヒドロキシ−３，３’，５，５’−テトラメチルビフェニル２４２ｇ（１．０モル）、ベンジルアルコール４３２ｇ（４．０モル）を仕込み、室温下、窒素を吹き込みながら撹拌した。メタンスルホン酸１０ｇを発熱に注意しながら添加した。その後油浴中で１５０℃まで加熱し、分留管を用いて生成するメタノールを抜き出した後、更に５時間反応させた。反応終了後、更にメチルイソブチルケトン１４００ｇを加え、溶解後、分液ロートに移した。次いで洗浄水が中性を示すまで水洗後、有機層から溶媒を加熱減圧下に除去し、下記構造式

242 g (1.0 mol) of 4,4′-dihydroxy-3,3 ′, 5,5′-tetramethylbiphenyl represented by the formula, and 432 g (4.0 mol) of benzyl alcohol were charged, and nitrogen was blown at room temperature. While stirring. 10 g of methanesulfonic acid was added, taking care of the exotherm. Thereafter, the mixture was heated to 150 ° C. in an oil bath, and methanol produced was extracted using a fractionating tube, followed by further reaction for 5 hours. After completion of the reaction, 1400 g of methyl isobutyl ketone was further added, dissolved, and transferred to a separatory funnel. Next, after washing with water until the washing water shows neutrality, the solvent is removed from the organic layer under heating and reduced pressure,

で表される変性２価フェノール化合物５７９ｇを得た。得られたフェノール化合物は褐色固体であり、水酸基当量は３０５ｇ／ｅｑ、軟化点は７８℃、ＩＣＩ粘度は１．３ｄＰａ．ｓであった。

579 g of a modified dihydric phenol compound represented by the formula: The obtained phenol compound is a brown solid, the hydroxyl group equivalent is 305 g / eq, the softening point is 78 ° C., and the ICI viscosity is 1.3 dPa.s. s.

^From the result of ¹³ C-NMR chart, the introduction ratio of benzyl group to all meta positions with respect to the hydroxyl group of 4,4′-dihydroxy-3,3 ′, 5,5′-tetramethylbiphenyl was 61%, that is, the above structural formula It was analyzed that, on average, n ₁ + n ₂ + n ₃ + n ₄ = 2.4 had a structure in which a benzyl group was introduced.

  From the results of the FD-MS chart, the molecular weight of benzyl group (Mw: 90) is one in the molecular weight (Mw: 242) of 4,4′-dihydroxy-3,3 ′, 5,5′-tetramethylbiphenyl. (332), 2 (422), 3 (512), 4 (602), 5 (692), 6 (782),... It was also confirmed that a benzyl group was further introduced into the benzyl group.

Example 1 [Synthesis of Epoxy Resin (A-1)]
While performing nitrogen gas purging on a flask equipped with a thermometer, a dropping funnel, a condenser, and a stirrer, 305 g of the modified dihydric phenol compound obtained in Synthesis Example 1, 463 g of epichlorohydrin (5.0 mol), and 139 g of n-butanol Then, 2 g of tetraethylbenzylammonium chloride was charged and dissolved. After raising the temperature to 65 ° C., the pressure was reduced to an azeotropic pressure, and 90 g (1.1 mol) of a 49% aqueous sodium hydroxide solution was added dropwise over 5 hours. Thereafter, stirring was continued for 0.5 hours under the same conditions. During this time, the distillate distilled by azeotropic distillation was separated with a Dean-Stark trap, the water layer was removed, and the reaction was carried out while returning the oil layer to the reaction system. Thereafter, unreacted epichlorohydrin was distilled off under reduced pressure. 590 g of methyl isobutyl ketone and 177 g of n-butanol were added to the crude epoxy resin thus obtained and dissolved. Further, 10 g of a 10% aqueous sodium hydroxide solution was added to this solution and reacted at 80 ° C. for 2 hours, and then washing with water 150 g was repeated three times until the pH of the washing solution became neutral. Next, the system was dehydrated by azeotropic distillation, and after passing through microfiltration, the solvent was distilled off under reduced pressure to obtain the following structural formula.

で表される本発明のエポキシ樹脂（Ａ−１）３５６ｇを得た。得られたエポキシ樹脂の軟化点は６４℃、１５０℃の溶融粘度は１．０ｄＰａ・ｓ、エポキシ当量は４１０ｇ／ｅｑであった。

The epoxy resin (A-1) 356g of this invention represented by these was obtained. The resulting epoxy resin had a softening point of 64 ° C., a melt viscosity at 150 ° C. of 1.0 dPa · s, and an epoxy equivalent of 410 g / eq.

  From the results of the FD-MS chart, the molecular weight of 4,4′-dihydroxy-3,3 ′, 5,5′-tetramethylbiphenyl (Mw: 242) and the molecular weight of two epoxy groups (Mw: 112) In addition, the molecular weight (Mw: 90) of the benzyl group is 1 (444), 2 (534), 3 (624), 4 (714), 5 (804), 6 (894),. -The peak attached was confirmed.

Synthesis Example 2 [Synthesis of Modified Divalent Phenol Compound]
In Synthesis Example 1, 413 g of a modified dihydric phenol compound was obtained in the same manner as in Synthesis Example 1 except that 432 g (4.0 mol) of benzyl alcohol was changed to 244 g (2.0 mol) of benzyl methyl ether. The obtained phenol compound was a brown solid, the hydroxyl group equivalent was 213 g / eq, the softening point was 63 ° C., and the ICI viscosity was 0.8 dPa · s.

In the formula, the introduction rate of benzyl group into all meta positions with respect to the hydroxyl group of 4,4′-dihydroxy-3,3 ′, 5,5′-tetramethylbiphenyl is 42%, that is, on average in the above structural formula, n ₁ + n ₂ + n ₃ + n ₄ = 1.7 benzyl group introduced.

  From the results of the FD-MS chart, the molecular weight of benzyl group (Mw: 90) is one in the molecular weight (Mw: 242) of 4,4′-dihydroxy-3,3 ′, 5,5′-tetramethylbiphenyl. (332) Two peaks (422), three peaks (512), four peaks (602),.

Example 2 [Synthesis of Epoxy Resin (A-2)]
In Example 1, the epoxy resin of the present invention was used in the same manner as in Example 1 except that 305 g of the modified dihydric phenol compound obtained in Synthesis Example 1 was changed to 213 g of the modified dihydric phenol compound obtained in Synthesis Example 2. (A-2) 261 g was obtained. The resulting epoxy resin had a softening point of 52 ° C., a melt viscosity at 150 ° C. of 0.5 dPa · s, and an epoxy equivalent of 295 g / eq.

Comparative Example 1 [Synthesis of Modified Divalent Phenol Compound (B′-1)]
In Synthesis Example 1, 242 g (1.0 mol) of 4,4′-dihydroxy-3,3 ′, 5,5′-tetramethylbiphenyl is changed to 186 g (1.0 mol) of 4,4′-dihydroxybiphenyl. Otherwise, in the same manner as in Synthesis Example 1, 253 g of a modified dihydric phenol compound for comparison (B′-1) was obtained. The obtained phenol compound (B′-1) was a brown solid, had a hydroxyl group equivalent of 191 g / eq, a softening point of 66 ° C., and an ICI viscosity of 0.5 dPa · s.

Comparative Example 2 [Synthesis of Epoxy Resin (A′-1)]
In Example 1, 305 g of the modified dihydric phenol compound obtained in Synthesis Example 1 was changed to 191 g of the modified dihydric phenol compound (B′-1) obtained in Comparative Example 1, and the same procedure as in Example 1 was performed. , 240 g of comparative epoxy resin (A′-1) was obtained. The resulting epoxy resin had a softening point of 52 ° C., a melt viscosity at 150 ° C. of 0.5 dPa · s, and an epoxy equivalent of 272 g / eq.

Examples 3-4 and Comparative Examples 1-5
As the epoxy resin, the epoxy resins (A-1), (A-2), (A′-1) obtained above, YX-4000H (tetramethylbiphenol type epoxy resin, epoxy equivalent: manufactured by Japan Epoxy Resin Co., Ltd .: 188 g / eq), NC-3000 manufactured by Nippon Kayaku Co., Ltd. (biphenylaralkyl type epoxy resin, epoxy equivalent: 274 g / eq), N-665-EXP manufactured by Dainippon Ink & Chemicals, Inc. (cresol novolac type epoxy resin, epoxy) Equivalent: 203 g / eq), modified dihydric phenol compound obtained above as a curing agent ((A′-1)), and Millex XLC-LL (phenol aralkyl resin hydroxyl equivalent: 176 g / eq) manufactured by Mitsui Chemicals, Inc. Used, triphenylphosphine (TPP) as curing accelerator, spherical as inorganic filler Rica (S-COL manufactured by Micron Co., Ltd.), γ-glycidoxytriethoxyxysilane (KBM-403 manufactured by Shin-Etsu Chemical Co., Ltd.) as a silane coupling agent, Carnauba wax (PEARL WAX No. 1 manufactured by Seralica Noda Co. -P), carbon black was blended in the composition shown in Table 1, and two rolls were melt-kneaded for 5 minutes at a temperature of 85 ° C. to obtain an epoxy resin composition. Using the above composition, a sample for evaluation was prepared by the following method, flame retardancy and dielectric properties were measured by the following method, and the results are shown in Table 1.

  Gel time: 0.15 g of the epoxy resin composition is placed on a cure plate heated to 175 ° C. (manufactured by THERMO ELECTRIC), and time measurement is started with a stopwatch. Stir the sample evenly with the tip of the rod and stop the stopwatch when the sample breaks into a string and remains on the plate. The time until this sample was cut and remained on the plate was defined as the gel time.

Flame Retardancy Create a sample for evaluation with a width of 12.7mm, a length of 127mm, and a thickness of 1.6mm by molding for 90 seconds at a temperature of 175 ° C using a transfer molding machine and then post-curing at a temperature of 175 ° C for 5 hours. did. A combustion test was performed using five test pieces having a thickness of 1.6 mm in accordance with the UL-94 test method using the prepared test pieces.

Measurement of dielectric properties A sample for evaluation having a width of 25 mm, a length of 75 mm, and a thickness of 2.0 mm was formed by molding for 90 seconds at a temperature of 175 ° C. using a transfer molding machine and then post-curing at a temperature of 175 ° C. for 5 hours. . Using the prepared test piece, it was stored in an indoor room at 23 ° C and 50% humidity for 24 hours using the impedance material analyzer "HP4291B" manufactured by Agilent Technologies Co., Ltd., in accordance with JIS-C-6481. Then, the dielectric constant and dielectric loss tangent of the cured product at a frequency of 100 MHz were measured.

Footnotes in Table 1:
* 1: Maximum combustion time (seconds) in one flame contact
* 2: Total burning time of 5 test pieces (seconds)
Self-extinguishing: Although flame retardancy required for V-1 (ΣF ≦ 250 seconds and F _max ≦ 30 seconds) is not satisfied, fire extinguishes without reaching combustion (flame clamp arrival).

1 is a GPC chart of an epoxy resin obtained in Example 1. 2 is a ¹³ C-NMR spectrum of the epoxy resin obtained in Example 1. FIG. 2 is a mass spectrum of the epoxy resin obtained in Example 1.

Claims (22)

The following general formula (1)

[Wherein, Ar ₁ , Ar ₂ , Ar ₃ , Ar ₄ are each independently an aromatic skeleton optionally having a substituent (provided that the substituent is an alkyl group optionally having a substituent] An alkoxy group which may have a substituent, a phenyl group which may have a substituent, an amino group which may have a substituent, a carboxyl group, a nitro group or a halogen atom. Each of R ₁ , R ₂ , R ₃ and R ₄ may independently have an alkyl group which may have a substituent, an alkoxy group which may have a substituent, or a substituent. A good phenyl group, an optionally substituted amino group or a halogen atom, and R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , R ₁₂ are each independently hydrogen Atom or alkyl group which may have a substituent, Or a phenyl group which may have a substituent, X is a direct bond, an alkylene chain which may have a substituent, an oxyalkylene chain which may have a substituent, a carbonyl group , An ether bond, a thioether bond, a sulfenyl group or a sulfonyl group, and each of R ₁₃ and R ₁₄ may independently have a hydrogen atom or an alkyl group or a substituent which may have a substituent. It is a good phenyl group, n ₁ , n ₂ , n ₃ , and n ₄ each represent a repeating number, each independently an integer of 0 to 10, and n ₁ + n ₂ + n ₃ + n ₄ ≧ 1. ]
The epoxy resin composition characterized by including the epoxy resin (A) represented by these, and a hardening | curing agent (B). _2. The epoxy resin composition according to claim ₁ , wherein R ₁ , R ₂ , R ₃ and R _{4 in the} general formula (1) are the same or different alkyl groups having 1 to 4 carbon atoms. The epoxy resin composition according to claim ₁ , wherein R ₁ , R ₂ , R ₃ and R _{4 in the} general formula (1) are methyl groups. The epoxy resin composition according to claim 1, wherein R ₁₃ and R ₁₄ in the general formula (1) are a hydrogen atom or a methyl group. Ar ₁ , Ar ₂ , Ar ₃ , Ar _{4 in the} general formula (1) is a benzene skeleton that may have the same or different alkyl group having 1 to 6 carbon atoms as a substituent. Item 2. An epoxy resin composition according to Item 1. The epoxy resin composition according to claim 1, wherein R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , and R _{12 in the} general formula (1) are hydrogen atoms. The epoxy equivalent of the epoxy resin (A) is 200 to 1,000 g / eq. The epoxy resin composition according to any one of claims 1 to 6, which is in a range of The curing agent (B) is at least one selected from the group consisting of aromatic hydrocarbon formaldehyde resin-modified phenol resins, phenol aralkyl resins, naphthol aralkyl resins, biphenyl-modified phenol resins, biphenyl-modified naphthol resins, and aminotriazine-modified phenol resins. The epoxy resin composition according to claim 7. The curing agent (B) is represented by the following general formula (2)

[Wherein, Ar ₁ , Ar ₂ , Ar ₃ , Ar ₄ are each independently an aromatic skeleton optionally having a substituent (provided that the substituent is an alkyl group optionally having a substituent] An alkoxy group which may have a substituent, a phenyl group which may have a substituent, an amino group which may have a substituent, a carboxyl group, a nitro group or a halogen atom. Each of R ₁ , R ₂ , R ₃ and R ₄ may independently have an alkyl group which may have a substituent, an alkoxy group which may have a substituent, or a substituent. A good phenyl group, an optionally substituted amino group or a halogen atom, and R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , R ₁₂ are each independently hydrogen Atom or alkyl group which may have a substituent, Or a phenyl group which may have a substituent, X is a direct bond, an alkylene chain which may have a substituent, an oxyalkylene chain which may have a substituent, a carbonyl group , An ether bond, a thioether bond, a sulfenyl group, or a sulfonyl group, n ₁ , n ₂ , n ₃ , and n ₄ each represent a repeating number, each independently an integer of 0 to 10, and n ₁ + n ₂ + N ₃ + n ₄ ≧ 1. ]
The epoxy resin composition according to claim 7, which is a modified dihydric phenol compound represented by the formula: The epoxy resin composition according to claim 8 or 9, further comprising a non-halogen flame retardant (C). The epoxy resin composition according to claim 8 or 9, which is used for a sealing material for electronic parts. The epoxy resin composition according to claim 8 or 9, which is for printed circuit boards. The epoxy resin composition according to claim 8 or 9, which is used for resist ink. The epoxy resin composition according to claim 8 or 9, which is used for a conductive paste. The epoxy resin composition according to claim 8 or 9, which is used for an interlayer insulating material. A cured product obtained by curing the epoxy resin composition according to claim 1. The cured product according to claim 16, which is a semiconductor device. The cured product according to claim 16, which is a circuit board device. The following general formula (1)

[Wherein, Ar ₁ , Ar ₂ , Ar ₃ , Ar ₄ are each independently an aromatic skeleton optionally having a substituent (provided that the substituent is an alkyl group optionally having a substituent] An alkoxy group which may have a substituent, a phenyl group which may have a substituent, an amino group which may have a substituent, a carboxyl group, a nitro group or a halogen atom. Each of R ₁ , R ₂ , R ₃ and R ₄ may independently have an alkyl group which may have a substituent, an alkoxy group which may have a substituent, or a substituent. A good phenyl group, an optionally substituted amino group or a halogen atom, and R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , R ₁₂ are each independently hydrogen Atom or alkyl group which may have a substituent, Or a phenyl group which may have a substituent, X is a direct bond, an alkylene chain which may have a substituent, an oxyalkylene chain which may have a substituent, a carbonyl group , An ether bond, a thioether bond, a sulfenyl group or a sulfonyl group, and each of R ₁₃ and R ₁₄ may independently have a hydrogen atom or an alkyl group or a substituent which may have a substituent. It is a good phenyl group, n ₁ , n ₂ , n ₃ , and n ₄ each represent a repeating number, each independently an integer of 0 to 10, and n ₁ + n ₂ + n ₃ + n ₄ ≧ 1. ]
A novel epoxy resin characterized by the following: R ₁ , R ₂ , R ₃ and R _{4 in the} general formula (1) are the same or different alkyl groups having 1 to 4 carbon atoms, and R ₁₃ and R ₁₄ are a hydrogen atom or a methyl group. Ar ₁ , Ar ₂ , Ar ₃ , Ar ₄ may be the same or different and is a benzene skeleton that may have a C 1-6 alkyl group as a substituent, R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , R ₁₁ , R ₁₂ are hydrogen atoms, and the epoxy equivalent is 200 to 1,000 g / eq. The novel epoxy resin according to claim 19, which is in the range of The following general formula (3)

(In the formula, each of R ₁ , R ₂ , R ₃ and R ₄ independently has an alkyl group which may have a substituent, an alkoxy group which may have a substituent, or a substituent. An optionally substituted phenyl group, an optionally substituted amino group or a halogen atom, X is a direct bond, an optionally substituted alkylene chain, an optionally substituted oxy An alkylene chain, a carbonyl group, an ether bond, a thioether bond, a sulfenyl group or a sulfonyl group.)
A dihydric phenol compound (a1) having a substituent at the 3,3 ′, 5,5′-position represented by the following general formula (4)

(In the formula, R ₁₅ , R ₁₆ , R ₁₇ , R ₁₈ , and R ₁₉ are each independently an alkyl group that may have a substituent, an alkoxy group that may have a substituent, and a substituent. A phenyl group which may have a substituent, an amino group which may have a substituent, a carboxyl group, a nitro group, a halogen atom or a hydrogen atom, and R ₂₀ and R ₂₁ each independently represent a hydrogen atom or An alkyl group which may have a substituent, an alkoxy group which may have a substituent, or a phenyl group which may have a substituent; Y is a halogen atom, an alkoxy group or a hydroxyl group; is there.)
Or a compound represented by the following general formula (5)

(In the formula, R ₁₅ , R ₁₆ , R ₁₇ , R ₁₈ and R ₁₉ are the same as described above, and R ₂₂ , R ₂₃ and R ₂₄ may each independently have a hydrogen atom or a substituent. A good alkyl group, an alkoxy group which may have a substituent, or a phenyl group which may have a substituent.
A method for producing an epoxy resin comprising: reacting an aromatic modifier (a2), which is a compound represented by formula (2), to obtain a modified dihydric phenol compound, and then reacting with an epihalohydrin (a3). The epoxy according to claim 21, wherein the reaction ratio (a1) / (a2) between the dihydric phenol compound (a1) and the aromatic modifier (a2) is 1 / 0.1 to 1/10 (molar ratio). Manufacturing method of resin.

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