CN2085565U - 全集光超高光效发光二极管 - Google Patents

全集光超高光效发光二极管 Download PDF

Info

Publication number
CN2085565U
CN2085565U CN90215418U CN90215418U CN2085565U CN 2085565 U CN2085565 U CN 2085565U CN 90215418 U CN90215418 U CN 90215418U CN 90215418 U CN90215418 U CN 90215418U CN 2085565 U CN2085565 U CN 2085565U
Authority
CN
China
Prior art keywords
light
tube core
utility
model
potting material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN90215418U
Other languages
English (en)
Inventor
张龙宝
薛明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHANGHAI NAVIGATION MARK FACTORY MINISTRY OF COMMUNICATIONS
Original Assignee
SHANGHAI NAVIGATION MARK FACTORY MINISTRY OF COMMUNICATIONS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHANGHAI NAVIGATION MARK FACTORY MINISTRY OF COMMUNICATIONS filed Critical SHANGHAI NAVIGATION MARK FACTORY MINISTRY OF COMMUNICATIONS
Priority to CN90215418U priority Critical patent/CN2085565U/zh
Publication of CN2085565U publication Critical patent/CN2085565U/zh
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Road Signs Or Road Markings (AREA)

Abstract

一种全集光超高光效发光二极管，由管脚(1)、封 装材料(2)、管芯(3)、引线(4)及集光膜(5)组成，透明 的封装材料的外表面是半球面或抛物面状的，在这外 表面上镀有一层具有光的反射性能的金属材料制成 的集光膜(5)，使管芯发出的光线透过封装材料达到 集光膜，集光膜将全部光线集中会聚成一束光线再向 前发射出去，光效很高，比普通二极管提高20～30 倍，适宜在航道导标、高速公路上高亮显示牌中作光 源用。

Description

本实用新型涉及一种全集光超高光效的发光二极管，适用于作为航道导标、桥函标及其它定向光亮显示牌的光源。
目前社会上使用的发光二极管都是由管芯发出的光线直接经透明的封装材料后散射出去，这种发光二极管由于发射角大，（±15°～50°），集光后的定向光强较小（小於0.9烛光），因此这种二极管不适宜在导航标中作光源用。
本实用新型的目的是设计一种全发射角集光、定向光效高的能在各种导航标示中作高亮光源的全集光超高光效发光二极管。
本实用新型的目的是这样实现的，将普通发光二极管的透明的封装材料的外表面制成半球面或抛物面状的，在这外表面上镀上一层集光膜，使管芯发出的光线经透明的封装材料后在集光膜上聚成一束光线，再向前发射，达到全发射角集光的效果。
下面结合附图对本实用新型的结构叙述如下：
图：全集光超高光效发光二极管结构图
（1）管脚    （2）封装材料    （3）管芯    （4）引线    （5）集光膜
全集光超高光效发光二极管由管脚（1）、封装材料（2）、管芯（3）、引线（4）及集光膜（5）组成。管脚（1）的二个引出头外露，管脚的其余部分及管芯（3）、引线（4）都封装在透明的封装材料（2）内，封装材料（2）的外表面制成半球面或抛物面状的，在这外表面上镀有一层具有光的反射性能的金属材料制成的集光膜（5），集光膜的口径为5－50mm。管芯（3）发出的光线透过透明的封装材料（2）达到集光膜（5）时，集光膜将全部光线集中会聚成一束光线再向前发射出去，集光角为2л－2.5л立体角，发散角仅为±1°－15°。
本实用新型的发光二极管由于采用集光后再发射，因此，光效很高，光强是普通二极管的20～30倍，而本实用新型本身的制作很方便，成本也不高，因此可以推广使用到航道导标、桥函标及高速公路上用的高亮显示牌及其它光源等领域。
举一个实施例：
管脚的一部分及管芯、引线封装在透明的封装材料内，封装材料用聚碳酸脂，封装材料的外表面制成半球面状的，在外表面上镀有一层银或汞制成的集光膜，集光膜口径为25mm。

Claims (2)

1、一种全集光超高光效发光二极管，由管脚(1)、封装材料(2)、管芯(3)、引线(4)组成，其特征在于透明的封装材料(2)的外表面是半球面或抛物面状的，在这外表面上镀有一层具有光的反射性能的金属材料制成的集光膜(5)。
2、如权利要求1所述的全集光超高光效发光二极管，其特征在于集光膜的口径为5－50mm。
CN90215418U 1990-10-31 1990-10-31 全集光超高光效发光二极管 Expired - Lifetime CN2085565U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN90215418U CN2085565U (zh) 1990-10-31 1990-10-31 全集光超高光效发光二极管

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN90215418U CN2085565U (zh) 1990-10-31 1990-10-31 全集光超高光效发光二极管

Publications (1)

Publication Number Publication Date
CN2085565U true CN2085565U (zh) 1991-09-25

Family

ID=4894708

Family Applications (1)

Application Number Title Priority Date Filing Date
CN90215418U Expired - Lifetime CN2085565U (zh) 1990-10-31 1990-10-31 全集光超高光效发光二极管

Country Status (1)

Country Link
CN (1) CN2085565U (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100435365C (zh) * 2004-12-21 2008-11-19 夏普株式会社 发光二极管、背光器件以及制造发光二极管的方法
CN100481535C (zh) * 2004-03-24 2009-04-22 日立电线精密株式会社 发光器件的制造方法和发光器件

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100481535C (zh) * 2004-03-24 2009-04-22 日立电线精密株式会社 发光器件的制造方法和发光器件
CN100435365C (zh) * 2004-12-21 2008-11-19 夏普株式会社 发光二极管、背光器件以及制造发光二极管的方法

Similar Documents

Publication Publication Date Title
TWI435468B (zh) 照明裝置及其製造方法
US6667582B1 (en) Light emitting diode reflector
GB1308487A (en) Light emitting assemblies
US20060071245A1 (en) Projection lens for light source arrangement
US20160223143A1 (en) Lighting device and manufacturing method
EP0805304A3 (en) Long light emitting apparatus
US20100128474A1 (en) Led lamp
CN204857783U (zh) 一种侧面发光的led
JP3172947B2 (ja) 発光体を用いた照明装置
CN207455309U (zh) 一种led灯具
US8921880B2 (en) Light emitting diode light source device
CN2085565U (zh) 全集光超高光效发光二极管
CN102856475A (zh) 全角度发光led芯片封装结构
US7233106B2 (en) LED chip capping construction
CN202274328U (zh) 光源模块及具有该光源模块的发光装置
JPS59226401A (ja) 発光表示装置
WO2002090825A1 (fr) Dispositif d'eclairage faisant intervenir l'utilisation d'une diode electroluminescente
CN205141017U (zh) 消除蓝光的led封装结构及led光源
JPS63280467A (ja) 光半導体素子
CN210805821U (zh) 一种可见光通讯发射光芯片封装结构
CN213636025U (zh) 一种全方位出光的白光lamp led的封装结构
US7025484B2 (en) Light source
JPS6218070Y2 (zh)
CN212485354U (zh) 倒装高反光率led
CN220041897U (zh) 一种led芯片

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
C15 Extension of patent right duration from 15 to 20 years for appl. with date before 31.12.1992 and still valid on 11.12.2001 (patent law change 1993)
RN01 Renewal of patent term
C17 Cessation of patent right
CX01 Expiry of patent term