CN208538077U - Computer heat radiation rack - Google Patents
Computer heat radiation rack Download PDFInfo
- Publication number
- CN208538077U CN208538077U CN201821226690.2U CN201821226690U CN208538077U CN 208538077 U CN208538077 U CN 208538077U CN 201821226690 U CN201821226690 U CN 201821226690U CN 208538077 U CN208538077 U CN 208538077U
- Authority
- CN
- China
- Prior art keywords
- conducting wire
- fan
- shape memory
- memory alloy
- alloy components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of computer heat radiation racks, it includes shape memory alloy components, bottom plate and the inclined plate connecting with bottom plate, it is provided with the first fan and the second fan of series connection on inclined plate, battery or USB port power supply line are provided between the first fan and the second fan；It is connected with the first conducting wire on first fan, the second conducting wire is connected on the second fan；Inclined plate upper surface is provided with the groove for accommodating the first conducting wire, the second conducting wire and shape memory alloy components；Shape memory alloy components are connect by vertically disposed first spring in groove with inclined plate, and the end of the first conducting wire and shape memory alloy components connects to form the first contact, is provided with insulating layer between the first conducting wire and shape memory alloy components；Being horizontally disposed in groove has second spring, and one end of the second conducting wire and second spring connects the second contact to be formed with the cooperation of the first contact, is provided with insulating layer between second spring and the second conducting wire.
Description
Technical field
The utility model relates to computer heat radiation apparatus fields, and in particular to a kind of computer heat radiation rack.
Background technique
Nowadays laptop has been very common electronic product, and heat radiation rack also becomes settlement computer heat dissipation problem
Important helper.The on-off of heat radiating rack of notebook computer power supply must be artificially controlled when current most of radiating frame for notebook computer uses,
And the judgment criteria whether everyone needs to radiate to computer is not quite similar, so that the weight such as CPU and video card of certain computers
Hardware excessive heating is wanted, this not only influences the smooth operation of computer, it is also possible to influence the service life or notebook electricity of computer
Brain heat radiation rack works always, waste of resource.
Utility model content
For above-mentioned deficiency in the prior art, the utility model, which is intended to provide, can automatically control heat radiation rack on/off
Radiating frame for notebook computer.
In order to achieve the purpose that foregoing invention is created, the technical solution adopted in the utility model are as follows:
A kind of computer heat radiation rack is provided comprising shape memory alloy components, bottom plate and the inclined plate being connect with bottom plate, on inclined plate
It is provided with the first fan and the second fan of series connection, battery or USB port electricity are provided between the first fan and the second fan
Source line；It is connected with the first conducting wire on first fan, the second conducting wire is connected on the second fan；Inclined plate upper surface is provided with for holding
Receive the groove of the first conducting wire, the second conducting wire and shape memory alloy components；
Shape memory alloy components are connect by vertically disposed first spring in groove with inclined plate, and the first conducting wire and shape are remembered
The end for recalling alloy components connects to form the first contact, is provided with insulating layer between the first conducting wire and shape memory alloy components；
Being horizontally disposed in groove has second spring, and one end of the second conducting wire and second spring connects to be formed matches with the first contact
The second contact closed, is provided with insulating layer between second spring and the second conducting wire.
Preferably, second spring is U-shaped flat spring.
Preferably, inclined plate is flexibly connected with bottom plate.
It is closed the utility model has the following beneficial effects: the temperature of its bottom surface is transmitted to the shape memory on heat radiation rack by computer
On golden part.When the temperature of shape memory alloy components is more than default deformation values, shape memory alloy components are deformed, and drive first
Contact is contacted with the second contact, so that circuit loop conducting, fan work accelerate the heat dissipation of computer where fan；When shape is remembered
When recalling the temperature of alloy components lower than default recovery value, Shape memory alloy strip moves the first contact far from the second contact, so that fan
Place circuit loop disconnects, and fan stops working；So complete the automatic in due course heat dissipation of computer.
In addition, shape memory alloy components are connect by vertically disposed first spring in groove with inclined plate, heat radiation rack is not
In use, shape memory alloy components extend the plane of inclined plate, so that when using heat radiation rack, shape memory alloy components and computer
The contact of bottom surface is even closer, enhances the transmission efficiency of shape memory alloy components Yu computer bottom surface temperature.
Being horizontally disposed in groove has second spring, and one end of the second conducting wire and second spring connects to be formed matches with the first contact
The second contact closed, when so that the first contact and the second contact contacting, second spring is in compressive state and applies to the second conducting wire
Add the power to the first contact direction, so that the first contact and the contact of the second contact are more stable.
Detailed description of the invention
Fig. 1 is the positive structure schematic of specific embodiment.
Fig. 2 is the side structure schematic diagram of Fig. 1.
Wherein, 1, inclined plate；2, the first conducting wire；3, the first fan；4, battery；5, bottom plate；6, the second fan；7, it second leads
Line；8, second spring；9, shape memory alloy components；10, groove.
Specific embodiment
With reference to the accompanying drawing, it elaborates to specific embodiment of the present utility model, in order to the art
Technical staff understands the utility model.It should be apparent that embodiment described below is only a part of the utility model
Embodiment, rather than whole embodiments.Do not depart from the attached claims limit and determine the utility model spirit and
In range, those of ordinary skill in the art are not making any creative work every other embodiment obtained, all belong to
In the protection scope of the utility model.
As depicted in figs. 1 and 2, which includes shape memory alloy components 9, bottom plate 5 and connect with bottom plate 5 oblique
Plate 1 is provided with the first fan 3 and the second fan 6 of series connection on inclined plate 1, is arranged between the first fan 3 and the second fan 6
There are battery 4 or USB port power supply line；It is connected with the first conducting wire 2 on first fan 3, the second conducting wire 7 is connected on the second fan 6；Tiltedly
1 upper surface of plate is provided with the groove 10 for accommodating the first conducting wire 2, the second conducting wire 7 and shape memory alloy components 9.
Shape memory alloy components 9 are connect by vertically disposed first spring in groove 10 with inclined plate 1, and heat radiation rack does not make
Used time, shape memory alloy components 9 extend the plane of inclined plate 1, so that when using heat radiation rack, shape memory alloy components 9 and electricity
The contact of brain bottom surface is even closer, enhances the transmission efficiency of shape memory alloy components 9 Yu computer bottom surface temperature.
In addition, the first conducting wire 2 connect to form the first contact with the end of shape memory alloy components 9, the first conducting wire 2 and shape
It is provided with insulating layer between memory alloy part 9, prevents electric current from conducting to computer surface.
Being horizontally disposed in groove 10 has second spring 8, and the second conducting wire 7 connect to be formed and first with one end of second spring 8
Second contact of contact cooperation is provided with insulating layer between the second conducting wire 7 the and two springs, prevents electric current from conducting to computer table
Face.
When using the utility model, in the case where the use of the new type power supply, the temperature of its bottom surface is transmitted to by computer
On shape memory alloy components 9 on heat radiation rack.When the temperature of shape memory alloy components 9 is more than default deformation values, shape memory
Alloy components 9 are deformed, and the first contact is driven to contact with the second contact, so that circuit loop conducting where fan, fan work,
Accelerate the heat dissipation of computer；When the temperature of shape memory alloy components 9 is lower than default recovery value, marmem 9 drives first
Contact is far from the second contact, so that circuit loop disconnects where fan, fan stops working；So complete the automatic in due course of computer
Heat dissipation.
When implementing, the preferred second spring 8 of this programme is U-shaped flat spring；Inclined plate 1 is flexibly connected with bottom plate 5, so that inclined plate
1 gradient is adjustable, enhances the applicability of the utility model.
Claims (3)
1. computer heat radiation rack, it is characterised in that: connect including shape memory alloy components (9), bottom plate (5) and with the bottom plate (5)
Inclined plate (1), the first fan (3) and the second fan (6) of series connection, first fan are provided on the inclined plate (1)
(3) battery (4) or USB port power supply line are provided between the second fan (6)；First is connected on first fan (3) to lead
Line (2) is connected with the second conducting wire (7) on second fan (6)；Inclined plate (1) upper surface is provided with for accommodating first
The groove (10) of conducting wire (2), the second conducting wire (7) and shape memory alloy components (9)；
The shape memory alloy components (9) are connect by vertically disposed first spring in groove (10) with the inclined plate (1), institute
The first conducting wire (2) is stated to connect to form the first contact with the end of the shape memory alloy components (9), first conducting wire (2) with
Insulating layer is provided between the shape memory alloy components (9)；
Being horizontally disposed in the groove (10) has second spring (8), and the one of second conducting wire (7) and the second spring (8)
End connection forms the second contact with first contact cooperation, is provided between the second spring (8) and the second conducting wire (7)
Insulating layer.
2. computer heat radiation rack according to claim 1, it is characterised in that: the second spring (8) is U-shaped flat spring.
3. computer heat radiation rack according to claim 1 or 2, it is characterised in that: the inclined plate (1) and the bottom plate (5) are living
Dynamic connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821226690.2U CN208538077U (en) | 2018-07-31 | 2018-07-31 | Computer heat radiation rack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821226690.2U CN208538077U (en) | 2018-07-31 | 2018-07-31 | Computer heat radiation rack |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208538077U true CN208538077U (en) | 2019-02-22 |
Family
ID=65386339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821226690.2U Expired - Fee Related CN208538077U (en) | 2018-07-31 | 2018-07-31 | Computer heat radiation rack |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208538077U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112735813A (en) * | 2020-12-18 | 2021-04-30 | 扬州日精电子有限公司 | Film capacitor heat radiation structure applied to water-cooled inverter |
-
2018
- 2018-07-31 CN CN201821226690.2U patent/CN208538077U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112735813A (en) * | 2020-12-18 | 2021-04-30 | 扬州日精电子有限公司 | Film capacitor heat radiation structure applied to water-cooled inverter |
| CN112735813B (en) * | 2020-12-18 | 2022-04-05 | 扬州日精电子有限公司 | Film capacitor heat radiation structure applied to water-cooled inverter |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208538077U (en) | Computer heat radiation rack | |
| CN219123939U (en) | Direct-plug-in type power adapter | |
| CN110494015A (en) | Charge radiator, electronic equipment, charging cooling system | |
| CN217064199U (en) | Heat radiation structure of motor controller | |
| CN203040009U (en) | High heat conducting circuit board | |
| CN206348702U (en) | A kind of computer motherboard structure | |
| CN210627123U (en) | Computer cooling device | |
| CN210244274U (en) | Heat sink device | |
| CN205229954U (en) | Computer temperature control device | |
| CN211792236U (en) | Heat dissipation type PCB circuit board | |
| CN211453706U (en) | Power processing clamp for sheet resistor | |
| CN203722987U (en) | Simple heat radiation structure of multiple power devices | |
| CN208637314U (en) | Support Capacitor radiator structure and drive motor controller | |
| CN207836056U (en) | A kind of multiple layer combination cooling fin | |
| CN208919592U (en) | A kind of laptop radiator support | |
| CN206610387U (en) | The independent air guiding heat dissipation device of all-in-one | |
| CN206708822U (en) | A kind of rapid thermal conduction LED light bar backing structure | |
| CN207780710U (en) | A kind of computer heat radiation rack | |
| CN104460909A (en) | Gap self-adaptation adjusting cold plate radiating method | |
| CN206115368U (en) | Industrial control main board | |
| CN217879335U (en) | Aging test fixture for high-power TO packaging laser | |
| CN209895279U (en) | Computer chip card board with temperature compensation function | |
| CN205353547U (en) | Intelligence heat dissipation projecting apparatus mount pad | |
| CN205071581U (en) | Power electronic device natural cooling structure of generating heat | |
| CN212484302U (en) | Computer heat sink |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190222 Termination date: 20200731 |