CN208507723U - A kind of four color light source wiring boards for LED encapsulation - Google Patents
A kind of four color light source wiring boards for LED encapsulation Download PDFInfo
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- CN208507723U CN208507723U CN201820737755.3U CN201820737755U CN208507723U CN 208507723 U CN208507723 U CN 208507723U CN 201820737755 U CN201820737755 U CN 201820737755U CN 208507723 U CN208507723 U CN 208507723U
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Abstract
The utility model discloses a kind of four color light source wiring boards for LED encapsulation, PCB substrate including insulated type and route thereon, PCB substrate is made of the unit substrate of multiple square structures, there are four areas for the front even symmetrical setting of each unit substrate, four areas are provided centrally with public pole bonding region, not common pole die bond bonding region is respectively arranged in four areas, the back side of each unit substrate is provided with public pole bonding welding pad and not common pole bonding welding pad；Public pole bonding region is connected by public pole via hole with public pole bonding welding pad, and not common pole die bond bonding region covers copper via hole by surface and is connected with not common pole bonding welding pad one-to-one correspondence；The utility model realizes the encapsulation of the light-emitting diode chip for backlight unit of four kinds of different colours by the structure limited, while so that connection line is obtained optimization and meeting the thermally conductive demand of LED；It can be applied to LED display encapsulation, and greatly promote the color fidelity of LED display.
Description
Technical field
The utility model relates to wiring board art technologies, refer in particular to a kind of four color light source wiring boards for LED encapsulation.
Background technique
Semiconductor lighting has the remarkable advantages such as service life length, energy-saving and environmental protection, safety as new and effective solid light source, will
Leaping again after incandescent lamp, fluorescent lamp in history is illuminated as the mankind, application field is expanding rapidly, positive to drive
The liter pole of the industries such as traditional lighting, display is regenerated, and economic benefit and social benefit are huge.Just because of this, semiconductor lighting quilt
Generally regard one of 21st century new industry most with prospects and the most important system of coming years optoelectronic areas as
One of high point.Due to various advantages such as its energy conservation and environmental protection, safety, light emitting diode is widely used in the neck such as illumination, electronic device
Domain, wherein in display screen using especially prominent.
Light emitting diode (LED) display screen is that Chinese light emitting diode market development is more early also larger light emitting diode
Application field, the light emitting diode (LED) display screen market sales volume and sales volume expand year by year.Chinese light emitting diode (LED) display screen according to
Market structure is divided into single primary colours display screen, dual base color display screen and full color display.Single primary colours market share is minimum, full-color display
It is maximum to shield the market share.What full color display was generallyd use is traditional RGB three primary colours technology, is sealed on a display unit
Red primaries, green primary color, blue primary Tricolor LED chip have been filled, by being limited by the colour gamut of RGB three primary colours, tradition
The diode displaying lamp bead based on RGB technology be difficult to true reappearance original color, exist and lack color fidelity
Defect.
It is continued to increase now with the intensity of illumination of LED light, lighting color requires increasingly to enrich, it is necessary to will be different
The LED chip of luminescent color (red, green, blue, white) is integrated into the region of very little, and the red LED chip of single electrode is because of its light efficiency height
It is widely applied in required field, the chip of single double two kinds of Different electrodes, common line plate is just integrated in this way in the region of very little
The demand for the route that the thermally conductive and single bipolar electrode chip of LED coexists cannot be met simultaneously.
Utility model content
The utility model overcomes the deficiencies in the prior art, provides a kind of four color light source wiring boards for LED encapsulation, will
The wiring board is applied to LED display encapsulation, will can greatly promote the color fidelity of LED display.
In order to achieve the above object, the utility model is achieved by the following technical solution.
A kind of four color light source wiring boards for LED encapsulation, PCB substrate including insulated type and are arranged in the PCB base
Route on plate, the PCB substrate are made of the unit substrate of multiple square structures, and each unit substrate is just
There are four areas for the setting of face even symmetrical, and four areas are provided centrally with public pole bonding region, divide in four areas
It is not provided with not common pole die bond bonding region, public pole via hole, the non-public affairs are provided on the public pole bonding region
Surface, which is provided with, on copolar die bond bonding region covers copper via hole；The back side of each unit substrate with public pole bonding region
Be provided with public pole bonding welding pad on corresponding position, the back side of each unit substrate with not common pole die bond key
It closes and is provided with not common pole bonding welding pad on the corresponding position in area；The public pole bonding region by public pole via hole with
Public pole bonding welding pad is connected, and the not common pole die bond bonding region covers copper via hole by surface and is bonded with not common pole
Pad one-to-one correspondence is connected.
Further, the PCB substrate is BT plate or resin plate or ceramic wafer material.
Wherein, not common pole die bond bonding region plays the role of die bond and bonding simultaneously.
The utility model has following column beneficial effect compared with prior art.
Not common pole bonding region is arranged by the way that public pole bonding region to be arranged in the centre of unit substrate for the utility model
In the quadrangle of unit substrate, the positional relationship of the not common pole bonding region in public pole bond area is optimized, makes it in the mistake of connection
Distance is shorter and more effective in journey, while substrate front side being connected with the pad at the back side by the route of most shortcut, only leads to
The route that the mono- bipolar electrode of LED coexists can be realized by crossing one layer of PCB substrate, and fully meet the thermally conductive demand of LED.The utility model
Wiring board can be applied to using four kinds of different colours light-emitting diode chip for backlight unit encapsulation, i.e., in traditional tri- base of RGB
The light emitting diode that joined another color in color LED technology replaces traditional three primary colors, the color that four primaries include
Domain is significantly greater than traditional RGB three primary colours, it can be achieved that accurate light modulation to white light, can more accurately show 500-600nm's
Colour gamut, therefore display color saturation can be improved, keep display more bright and bright-coloured.
Detailed description of the invention
Fig. 1 is the utility model wiring board front schematic view.
Fig. 2 is the utility model wiring board schematic rear view.
Fig. 3 is unit substrate front schematic view.
Fig. 4 is unit substrate schematic rear view.
Wherein, 1 is public pole bonding region, and 2 be not common pole die bond bonding region, and 3 be public pole bonding welding pad, and 4 be non-public affairs
Copolar bonding welding pad, 5 be public pole via hole, and 6 cover copper via hole for surface, and 7 be Mark point, and 8 be row cutting line, and 9 cut for row
Secant.
Specific embodiment
In order to which technical problem to be solved in the utility model, technical solution and beneficial effect is more clearly understood, with
Under in conjunction with the embodiments, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only
Only to explain the utility model, it is not used to limit the utility model.This reality is described in detail below with reference to examples and drawings
With novel technical solution, but the scope of protection is not limited by this.
As shown in Figs 1-4, a kind of four color light source wiring boards for LED encapsulation, including PCB substrate and be arranged in described
Route in PCB substrate, PCB substrate use BT(Bismaleimide Triazine bismaleimide-triazine resin) plate
For substrate, each unit substrate that PCB substrate is formed after cutting is square structure, average pair of the front of each unit substrate
Claim setting there are four area, four areas are provided centrally with public pole bonding region 1, and not common pole die bond is respectively arranged in four areas
Bonding region 2 is provided with public pole via hole 5 on public pole bonding region 1, is provided with surface on not common pole die bond bonding region 2 and covers
Copper via hole 6；The back side of each unit substrate be provided with public pole on the corresponding position of public pole bonding region 1 and be bonded weldering
Disk 3, the back side of each unit substrate be provided with not common pole on the corresponding position of not common pole die bond bonding region 2 and be bonded
Pad 4；Public pole bonding region 1 is connected by public pole via hole 5 with public pole bonding welding pad 3, not common pole die bond bonding
Copper via hole 6 is covered by surface and is connected with not common pole bonding welding pad 4 one-to-one correspondence in area 2.
This wiring board is specific the preparation method comprises the following steps: BT plate is drilled out public pole via hole according to actual demand size and hole location
5 and surface cover copper via hole 6, public pole via hole 5 and surface are covered into copper via hole 6 and carry out copper facing, clogged using resin described in
Two kinds of through-holes；Make the positive not common pole die bond bonding region 2 of PCB and public pole bonding region 1；Make the not common pole at the back side
Bonding welding pad 4 and public pole bonding welding pad 3；Mark point 7 is done using white or other conspicuous colors paint, is prepared above-mentioned
Surface of semi-finished plating or chemical nickel plating, gold or silver；It is formed using the size of CNC numerical control processing or mold as requested,
PCB surface mark row cutting line 8 and column cutting line 9；Then wiring board can be cut according to practical application size, has been cut
Finished product wiring board is obtained after.
The above content is the further descriptions done in conjunction with specific preferred embodiment to the utility model, cannot
Assert that specific embodiment of the present utility model is only limitted to this, for the utility model person of an ordinary skill in the technical field
For, under the premise of not departing from the utility model, several simple deduction or replace can also be made, all shall be regarded as belonging to
The utility model determines scope of patent protection by the claims submitted.
Claims (2)
1. a kind of four color light source wiring boards for LED encapsulation, which is characterized in that PCB substrate including insulated type and be arranged in
Route in the PCB substrate, the PCB substrate are made of the unit substrate of multiple square structures, each list
There are four areas for the front even symmetrical setting of first substrate, and four areas are provided centrally with public pole bonding region (1), described
Four areas on be respectively arranged with not common pole die bond bonding region (2), be provided with public pole on the public pole bonding region (1)
Via hole (5) is provided with surface on the not common pole die bond bonding region (2) and covers copper via hole (6)；Each unit
The back side of substrate is provided with public pole bonding welding pad (3) on position corresponding with public pole bonding region (1), each of described
The back side of unit substrate is provided with not common pole bonding welding pad on position corresponding with not common pole die bond bonding region (2)
(4)；The public pole bonding region (1) is connected by public pole via hole (5) with public pole bonding welding pad (3), described
Not common pole die bond bonding region (2) is covered copper via hole (6) and corresponded with not common pole bonding welding pad (4) by surface to be connected
It connects.
2. a kind of four color light source wiring boards for LED encapsulation according to claim 1, which is characterized in that the PCB
Substrate is BT plate or resin plate or ceramic wafer material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820737755.3U CN208507723U (en) | 2018-05-17 | 2018-05-17 | A kind of four color light source wiring boards for LED encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820737755.3U CN208507723U (en) | 2018-05-17 | 2018-05-17 | A kind of four color light source wiring boards for LED encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208507723U true CN208507723U (en) | 2019-02-15 |
Family
ID=65293568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820737755.3U Active CN208507723U (en) | 2018-05-17 | 2018-05-17 | A kind of four color light source wiring boards for LED encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208507723U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108470815A (en) * | 2018-05-17 | 2018-08-31 | 山西高科华兴电子科技有限公司 | The four color light source wiring boards for LED encapsulation |
-
2018
- 2018-05-17 CN CN201820737755.3U patent/CN208507723U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108470815A (en) * | 2018-05-17 | 2018-08-31 | 山西高科华兴电子科技有限公司 | The four color light source wiring boards for LED encapsulation |
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