CN108470815A - The four color light source wiring boards for LED encapsulation - Google Patents
The four color light source wiring boards for LED encapsulation Download PDFInfo
- Publication number
- CN108470815A CN108470815A CN201810476076.XA CN201810476076A CN108470815A CN 108470815 A CN108470815 A CN 108470815A CN 201810476076 A CN201810476076 A CN 201810476076A CN 108470815 A CN108470815 A CN 108470815A
- Authority
- CN
- China
- Prior art keywords
- common
- bonding region
- welding pad
- common level
- via hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000003466 welding Methods 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000003086 colorant Substances 0.000 abstract description 9
- 238000005457 optimization Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- YZYBNQLOSZEZMO-UHFFFAOYSA-N N1=NN=CC=C1.C1(C=CC(N1)=O)=O.C1(C=CC(N1)=O)=O.N1=NN=CC=C1 Chemical compound N1=NN=CC=C1.C1(C=CC(N1)=O)=O.C1(C=CC(N1)=O)=O.N1=NN=CC=C1 YZYBNQLOSZEZMO-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses the four color light source wiring boards encapsulated for LED, PCB substrate including insulated type and circuit thereon, PCB substrate is made of the unit substrate of multiple square structures, there are four areas for the front even symmetrical setting of each unit substrate, four areas are provided centrally with common level bonding region, not common grade die bond bonding region is respectively arranged in four areas, the back side of each unit substrate is provided with common level bonding welding pad and not common pole bonding welding pad；Common level bonding region is connected by public pole via hole with common level bonding welding pad, and not common grade die bond bonding region covers copper via hole by surface and is connected with not common pole bonding welding pad one-to-one correspondence；The present invention realizes the encapsulation of the light-emitting diode chip for backlight unit of four kinds of different colours by the structure of restriction, while so that connection line is obtained optimization and meeting LED heat conduction demands；LED display encapsulation is can be applied to, and greatly promotes the color fidelity of LED display.
Description
Technical field
The present invention relates to wiring board art technologies, refer in particular to a kind of four color light source wiring boards for LED encapsulation.
Background technology
Semiconductor lighting has the remarkable advantages such as long lifespan, energy-saving and environmental protection, safety as new and effective solid light source, will
Leaping again after incandescent lamp, fluorescent lamp in history is illuminated as the mankind, application field is expanding rapidly, positive to drive
The upgrading of the industries such as traditional lighting, display, economic benefit and social benefit are huge.Just because of this, semiconductor lighting quilt
Generally regard one of 21st century new industry most with prospects and the most important system of coming years optoelectronic areas as
One of high point.Due to various advantages such as its energy conservation and environmental protection, safety, light emitting diode is widely used in the necks such as illumination, electronic device
Domain, wherein the application in display screen is especially prominent.
Light emitting diode (LED) display screen is that Chinese light emitting diode market development is also more early larger light emitting diode
Application field, the light emitting diode (LED) display screen market sales volume and sales volume expand year by year.Chinese light emitting diode (LED) display screen according to
Market structure is divided into single primary colours display screen, dual base color display screen and full color display.Single primary colours market share is minimum, full-color display
It is maximum to shield the market share.For full color display generally using traditional RGB three primary colours technology, sealed on a display unit
Red primaries, green primary color, blue primary Tricolor LED chip have been filled, by being limited by the colour gamut of RGB three primary colours, tradition
The diode displaying lamp bead based on RGB technologies be difficult to true reappearance original color, exist and lack color fidelity
Defect.
It is continued to increase now with the intensity of illumination of LED light, lighting color requires increasingly to enrich, it is necessary to will be different
Luminescent color（It is red, green, blue, white）LED chip be integrated into the region of very little, the red LED chip of single electrode is because of its light efficiency height
In required field extensive use, the chip of single double two kinds of Different electrodes, common line plate are just integrated in this way in the region of very little
The demand for the circuit that LED heat conduction coexists with single bipolar electrode chip cannot be met simultaneously.
Invention content
The present invention overcomes the deficiencies in the prior art, provide a kind of four color light source wiring boards for LED encapsulation, will be described
Wiring board be applied to LED display encapsulation, will can greatly promote the color fidelity of LED display.
In order to achieve the above object, the present invention is achieved through the following technical solutions.
A kind of four color light source wiring boards for LED encapsulation, the ontology include the PCB substrate of insulated type and are arranged in described
Circuit in PCB substrate, the PCB substrate are made of the unit substrate of multiple square structures, each unit base
The front even symmetrical setting of plate is there are four area, and described four areas are provided centrally with common level bonding region, described four
It is respectively arranged with not common grade die bond bonding region in area, public pole via hole is provided on the common level bonding region, it is described
Not common grade die bond bonding region on be provided with surface and cover copper via hole；The back side of each unit substrate with common level
Be provided with common level bonding welding pad on the corresponding position of bonding region, the back side of each unit substrate with not common grade
Not common pole bonding welding pad is provided on the corresponding position of die bond bonding region；The common level bonding region is led by public pole
Through-hole is connected with common level bonding welding pad, the not common grade die bond bonding region by surface cover copper via hole with it is not common
Pole bonding welding pad one-to-one correspondence is connected.
Further, the PCB substrate is BT plates or resin plate or ceramic wafer material.
Wherein, not common grade die bond bonding region plays the role of die bond and bonding simultaneously.
The present invention has following row advantageous effect compared with prior art.
Not common grade bonding region is arranged in list by being arranged common level bonding region in the centre of unit substrate by the present invention
The quadrangle of first substrate optimizes the position relationship of the not common grade bonding region in common level bond area, makes it during connection
Distance is shorter and more effective, while substrate front side being connected with the pad at the back side by the circuit of most shortcut, only passes through one
Layer PCB substrate can realize the circuit that the mono- bipolar electrodes of LED coexist, and fully meet LED heat conduction demands.The wiring board of the present invention
The encapsulation that can be applied to the light-emitting diode chip for backlight unit using four kinds of different colours, i.e., in traditional RGB three-color light-emittings two
The light emitting diode that pole pipe technically adds another color replaces traditional three primary colors, the colour gamut that four primaries include obviously big
In traditional RGB three primary colours, it can be achieved that accurate light modulation to white light, can more accurately show the colour gamut of 500-600nm, therefore
Display color saturation can be improved, keeps display more bright and bright-coloured.
Description of the drawings
Fig. 1 is wiring board front schematic view of the present invention.
Fig. 2 is wiring board schematic rear view of the present invention.
Fig. 3 is unit substrate front schematic view.
Fig. 4 is unit substrate schematic rear view.
Wherein, 1 is common level bonding region, and 2 be not common grade die bond bonding region, and 3 be common level bonding welding pad, and 4 be non-public affairs
Copolar bonding welding pad, 5 be public pole via hole, and 6 cover copper via hole for surface, and 7 be Mark points, and 8 be row cutting line, and 9 cut for row
Secant.
Specific implementation mode
In order to make technical problems, technical solutions and advantages to be solved be more clearly understood, tie below
Embodiment is closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used to solve
The present invention is released, is not intended to limit the present invention.With reference to embodiment and the attached drawing technical solution that the present invention will be described in detail, but protect
Shield range is not limited by this.
As shown in Figs 1-4, four color light source wiring boards of LED encapsulation are used for, which to include PCB substrate and be arranged in described
Circuit in PCB substrate, PCB substrate use BT（Bismaleimide Triazine bismaleimide-triazine resins）Plate
For base material, each unit substrate that PCB substrate is formed afterwards after cutting is square structure, average pair of the front of each unit substrate
Claim setting there are four area, four areas are provided centrally with common level bonding region 1, and not common grade die bond is respectively arranged in four areas
Bonding region 2 is provided with public pole via hole 5 on common level bonding region 1, and being provided with surface on not common grade die bond bonding region 2 covers
Copper via hole 6；The back side of each unit substrate be provided with common level on 1 corresponding position of common level bonding region and be bonded weldering
Disk 3, the back side of each unit substrate be provided with not common pole on not common 2 corresponding position of grade die bond bonding region and be bonded
Pad 4；Common level bonding region 1 is connected by public pole via hole 5 with common level bonding welding pad 3, not common grade die bond bonding
Copper via hole 6 is covered by surface and is connected with not common pole bonding welding pad 4 one-to-one correspondence in area 2.
The specific preparation method of this wiring board is：BT plates are drilled out into public pole via hole according to actual demand size and hole position
5 and surface cover copper via hole 6, public pole via hole 5 and surface, which are covered copper via hole 6, carries out copper facing, clogged using resin described in
Two kinds of through-holes；Make the positive not common grade die bond bonding regions 2 of PCB and common level bonding region 1；Make the not common pole at the back side
Bonding welding pad 4 and common level bonding welding pad 3；Mark points 7 are done using white or other conspicuous colors paint, are prepared above-mentioned
Surface of semi-finished is electroplated or chemical nickel plating, gold or silver；It is molded using the size of CNC digital control processings or mold as requested,
PCB surface mark row cutting line 8 and row cutting line 9；Then wiring board can be cut according to practical application size, has been cut
Finished product wiring board is obtained after.
The above content is combine specific preferred embodiment to the further description done of the present invention, and it cannot be said that
The specific implementation mode of the present invention is only limitted to this, for those of ordinary skill in the art to which the present invention belongs, is not taking off
Under the premise of from the present invention, several simple deduction or replace can also be made, all shall be regarded as belonging to the present invention by being submitted
Claims determine scope of patent protection.
Claims (2)
1. the four color light source wiring boards for LED encapsulation, which is characterized in that the ontology includes the PCB substrate and arrangement of insulated type
Circuit in the PCB substrate, the PCB substrate is made of the unit substrate of multiple square structures, each of described
There are four area, described four areas are provided centrally with common level bonding region for the front even symmetrical setting of unit substrate（1）, institute
It is respectively arranged with not common grade die bond bonding region in four areas stated（2）, the common level bonding region（1）On be provided with it is public
Pole via hole（5）, the not common grade die bond bonding region（2）On be provided with surface and cover copper via hole（6）；Each list
The back side of first substrate with common level bonding region（1）Common level bonding welding pad is provided on corresponding position（3）, described is every
The back side of a unit substrate with not common grade die bond bonding region（2）Not common pole bonding welding pad is provided on corresponding position
（4）；The common level bonding region（1）Pass through public pole via hole（5）With common level bonding welding pad（3）It is connected, it is described
Not common grade die bond bonding region（2）Copper via hole is covered by surface（6）With not common pole bonding welding pad（4）It corresponds and is connected
It connects.
2. the four color light source wiring boards according to claim 1 for LED encapsulation, which is characterized in that the PCB substrate
For BT plates or resin plate or ceramic wafer material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810476076.XA CN108470815A (en) | 2018-05-17 | 2018-05-17 | The four color light source wiring boards for LED encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810476076.XA CN108470815A (en) | 2018-05-17 | 2018-05-17 | The four color light source wiring boards for LED encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108470815A true CN108470815A (en) | 2018-08-31 |
Family
ID=63260421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810476076.XA Pending CN108470815A (en) | 2018-05-17 | 2018-05-17 | The four color light source wiring boards for LED encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108470815A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1614659A (en) * | 2003-11-07 | 2005-05-11 | 熊小梅 | Three-light arranging method for three basic color LEDs |
| CN1756460A (en) * | 2004-09-30 | 2006-04-05 | 华为技术有限公司 | High-density BGA printed circuit board wiring method |
| CN101236947A (en) * | 2008-01-25 | 2008-08-06 | 苏州固锝电子股份有限公司 | Semiconductor device with novel package structure |
| CN101350318A (en) * | 2007-07-18 | 2009-01-21 | 联发科技股份有限公司 | Electronic package an electronic device |
| CN201425185Y (en) * | 2009-05-08 | 2010-03-17 | 弘凯光电(深圳)有限公司 | LED lighting structure |
| CN101707234A (en) * | 2009-11-18 | 2010-05-12 | 珠海晟源同泰电子有限公司 | LED luminescence module and manufacture method thereof |
| US20110266579A1 (en) * | 2009-06-15 | 2011-11-03 | Hideo Nagai | Semiconductor light-emitting device, light-emitting module, and illumination device |
| CN206422064U (en) * | 2017-01-18 | 2017-08-18 | 苏州晶台光电有限公司 | A kind of light emitting diode (LED) chip with vertical structure encapsulating structure for realizing the close display of superelevation |
| CN208507723U (en) * | 2018-05-17 | 2019-02-15 | 山西高科华兴电子科技有限公司 | A kind of four color light source wiring boards for LED encapsulation |
-
2018
- 2018-05-17 CN CN201810476076.XA patent/CN108470815A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1614659A (en) * | 2003-11-07 | 2005-05-11 | 熊小梅 | Three-light arranging method for three basic color LEDs |
| CN1756460A (en) * | 2004-09-30 | 2006-04-05 | 华为技术有限公司 | High-density BGA printed circuit board wiring method |
| CN101350318A (en) * | 2007-07-18 | 2009-01-21 | 联发科技股份有限公司 | Electronic package an electronic device |
| CN101236947A (en) * | 2008-01-25 | 2008-08-06 | 苏州固锝电子股份有限公司 | Semiconductor device with novel package structure |
| CN201425185Y (en) * | 2009-05-08 | 2010-03-17 | 弘凯光电(深圳)有限公司 | LED lighting structure |
| US20110266579A1 (en) * | 2009-06-15 | 2011-11-03 | Hideo Nagai | Semiconductor light-emitting device, light-emitting module, and illumination device |
| CN101707234A (en) * | 2009-11-18 | 2010-05-12 | 珠海晟源同泰电子有限公司 | LED luminescence module and manufacture method thereof |
| CN206422064U (en) * | 2017-01-18 | 2017-08-18 | 苏州晶台光电有限公司 | A kind of light emitting diode (LED) chip with vertical structure encapsulating structure for realizing the close display of superelevation |
| CN208507723U (en) * | 2018-05-17 | 2019-02-15 | 山西高科华兴电子科技有限公司 | A kind of four color light source wiring boards for LED encapsulation |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180831 |