CN208507721U - Wavelength convert component and Wavelength changing element and the light emitting device for using them - Google Patents
Wavelength convert component and Wavelength changing element and the light emitting device for using them Download PDFInfo
- Publication number
- CN208507721U CN208507721U CN201820515641.4U CN201820515641U CN208507721U CN 208507721 U CN208507721 U CN 208507721U CN 201820515641 U CN201820515641 U CN 201820515641U CN 208507721 U CN208507721 U CN 208507721U
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- Prior art keywords
- convert component
- wavelength convert
- wavelength
- particle
- inorganic phosphor
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- 239000002245 particle Substances 0.000 claims abstract description 92
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 53
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 51
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 46
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000000919 ceramic Substances 0.000 claims description 35
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims description 6
- 238000007254 oxidation reaction Methods 0.000 claims description 6
- 239000002223 garnet Substances 0.000 claims description 4
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 4
- 229910017083 AlN Inorganic materials 0.000 claims description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000003763 carbonization Methods 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 229910000484 niobium oxide Inorganic materials 0.000 claims description 3
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 230000007423 decrease Effects 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 5
- 239000000470 constituent Substances 0.000 abstract description 4
- 238000005245 sintering Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000001513 hot isostatic pressing Methods 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010189 synthetic method Methods 0.000 description 2
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- CSSYLTMKCUORDA-UHFFFAOYSA-N barium(2+);oxygen(2-) Chemical compound [O-2].[Ba+2] CSSYLTMKCUORDA-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- RCJVRSBWZCNNQT-UHFFFAOYSA-N dichloridooxygen Chemical compound ClOCl RCJVRSBWZCNNQT-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 description 1
- 239000004137 magnesium phosphate Substances 0.000 description 1
- 229960002261 magnesium phosphate Drugs 0.000 description 1
- 229910000157 magnesium phosphate Inorganic materials 0.000 description 1
- 235000010994 magnesium phosphates Nutrition 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000379 polypropylene carbonate Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical compound S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0239—Combinations of electrical or optical elements
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/64—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing aluminium
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
- Optical Filters (AREA)
- Semiconductor Lasers (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
The utility model be able to suppress when the light of irradiation great power LED or LD are provided through when luminous intensity decline and constituent material fusing wavelength convert component and Wavelength changing element and use its light emitting device.The wavelength convert component contains inorganic phosphor particle and magnesium oxide particle, which is characterized in that: there are magnesium oxide particles between inorganic phosphor particle, and inorganic phosphor particle is bonded by magnesium oxide particle.
Description
Technical field
The utility model relates to by light emitting diode (LED:Light Emitting Diode) or laser diode (LD:
Laser Diode) etc. the light of sendings wavelength convert at other wavelength wavelength convert component and Wavelength changing element and
Use their light emitting device.
Background technique
In recent years, it as substitution fluorescent lamp or the next-generation light emitting device of incandescent lamp, from low power consumption, small-size light-weight, is easy
From the viewpoint of carrying out light quantity adjusting, the light emitting device for using LED or LD is increasingly paid close attention to.As such next-generation luminous
One example of device, such as Patent Document 1 discloses be configured with to absorb from LED's on the LED for projecting blue light
A part of light and be converted into sodium yellow wavelength convert component light emitting device.The light emitting device is issued to be projected as from LED
Blue light with from wavelength convert component project sodium yellow synthesis light white light.
As wavelength convert component, the component that inorganic phosphor particle is dispersed in resinous substrates has been used at present.So
And when using the wavelength convert component, there are problems that resinous substrates change colour or deform due to the light from LED.Therefore, it mentions
Case dispersion in the glass matrix for replacing resin is fixed with the complete wavelength convert component being made of inoganic solids of fluorophor
(for example, referring to patent document 2 and 3).There is the wavelength convert component glass matrix as base material to be not easy because from LED's
Heat or irradiation light and deteriorate, do not allow to be also easy to produce discoloration or deform the feature of such problems.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2000-208815 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2003-258308 bulletin
Patent document 3: No. 4895541 bulletins of Japanese Patent No.
Summary of the invention
Problems to be solved by the invention
In recent years, for the purpose of the high-power of light emitting device, the output of LED or LD as light source constantly rise.With
It, the heat as caused by the heat of light source or the fluorophor of irradiation exciting light, the temperature of wavelength convert component rises, as a result,
There are luminous intensities timely to decline (temperature quenching) such problems.In addition, according to circumstances, there are the temperature of wavelength convert component
Degree rises the danger for becoming significant constituent material (glass matrix etc.) fusing.
In view of the above circumstances, the purpose of this utility model is that: provide irradiation great power LED or LD light when be able to suppress
Through when luminous intensity decline and constituent material fusing wavelength convert component and Wavelength changing element and use they
Light emitting device.
The method used for solving the problem
The wavelength convert component of the utility model contains inorganic phosphor particle and magnesium oxide particle, the wavelength convert component
Be characterized in that: there are magnesium oxide particles between inorganic phosphor particle, and inorganic phosphor particle passes through magnesia
Particle is bonded.
In the wavelength convert component of the utility model, there are magnesium oxide particles between inorganic phosphor particle.Its
In, magnesium oxide particle is compared with glass etc., excellent thermal conductivity, therefore, can be efficient by heat caused by inorganic phosphor particle
Ground is discharged to outside.It is suppressed as a result, the temperature of wavelength convert component rises, temperature quenching is less likely to occur.In addition, oxidation
The heat resistance of magnesium granules is also excellent, therefore, it may have though irradiation great power LED or LD light when, be also not easy fusing or
The advantages of being able to suppress the generation of undesirable condition as fire check caused by rising because of temperature sharply.Furthermore,
Magnesium oxide particle also has the advantage that capable of being sintered at low temperature compared with the ceramic particles such as aluminium oxide, zirconium oxide.Cause
This, firing temperature when making wavelength convert component can also be lower, and be able to suppress inorganic phosphor powder when firing
Deterioration.
The wavelength convert component of the utility model contains inorganic phosphor particle 3~80% and oxidation preferably in terms of quality %
Magnesium granules 20~97%.
In the wavelength convert component of the utility model, preferably the average grain diameter of magnesium oxide particle is 0.01~10 μm.This
Sample, the compactness of wavelength convert component improve, thermal conducting path easy to form, therefore, can will be produced by inorganic phosphor particle
Heat further efficiently discharge to outside.
In the wavelength convert component of the utility model, preferably the purity of magnesium oxide particle is 99% or more.In such manner, it is possible to
Magnesium oxide particle is sintered at relatively low temperatures.
In the wavelength convert component of the utility model, preferably the average grain diameter of inorganic phosphor particle is 1~50 μm.
In the wavelength convert component of the utility model, preferably inorganic phosphor particle includes the oxygen with garnet structure
Compound fluorophor.Therefore the excellent heat resistance of oxide phosphor with garnet structure irradiates great power LED or LD
Light time is able to suppress the deterioration of inorganic phosphor particle itself.
In the wavelength convert component of the utility model, preferably the average grain diameter of magnesium oxide particle is relative to inorganic phosphor
The ratio of the average grain diameter of particle is 0.5 or less.In this way, the compactness of wavelength convert component improves, thermal conducting path easy to form, because
This, further can efficiently discharge heat caused by inorganic phosphor particle to outside.
The Wavelength changing element of the utility model is characterized in that, comprising above-mentioned wavelength convert component and having to be higher than
Laminated body made of the heat dissipation layer laminate of the thermal coefficient of wavelength convert component.In such manner, it is possible to by produced by wavelength convert component
Heat be transferred to heat dissipating layer, therefore, be easy inhibit wavelength convert component temperature rise.
In the Wavelength changing element of the utility model, the layer comprising light transparent ceramic can be used as heat dissipating layer.
In the Wavelength changing element of the utility model, as light transparent ceramic, can be used selected from alumina series ceramics,
Aluminium nitride system ceramics, carbonization silicon systems ceramics, boron nitride system ceramics, magnesia system ceramics, titanium oxide base ceramics, niobium oxide system pottery
It is at least one kind of in porcelain, Zinc oxide ceramics and yttrium oxide system ceramics.
The light emitting device of the utility model is characterized in that, with above-mentioned wavelength convert component and to wavelength convert component
Irradiate the light source of exciting light.
The light emitting device of the utility model is characterized in that, with above-mentioned Wavelength changing element and to Wavelength changing element
Irradiate the light source of exciting light.
In the light emitting device of the utility model, preferred light source is laser diode.The wavelength conversion section of the utility model
The heat resistance and thermal diffusivity of part and Wavelength changing element are excellent, therefore, use the laser diode of bigger power as light
When source, it is easy to enjoy The effect of invention.
Invention effect
Using the utility model, be able to suppress when being capable of providing the light of irradiation great power LED or LD through when luminous intensity
Decline and constituent material fusing wavelength convert component and Wavelength changing element and use their light emitting device.
Detailed description of the invention
Fig. 1 is the schematic section for indicating an embodiment of wavelength convert component of the utility model.
Fig. 2 is the schematic section for indicating an embodiment of Wavelength changing element of the utility model.
Fig. 3 is the diagrammatic side view for indicating an embodiment of light emitting device of the utility model.
Symbol description
1 inorganic phosphor particle
2 magnesium oxide particles
3 heat dissipating layers
4 light sources
10 wavelength convert components
20 Wavelength changing elements
30 light emitting devices
Specific embodiment
Hereinafter, being illustrated using attached drawing to the embodiments of the present invention.But the following embodiments and the accompanying drawings is example
Show, the utility model is not limited to the following embodiments and the accompanying drawings.
(wavelength convert component)
Fig. 1 is the schematic section for indicating an embodiment of wavelength convert component of the utility model.Wavelength convert
Component 10 contains inorganic phosphor particle 1 and magnesium oxide particle 2.Wherein, there are magnesia between inorganic phosphor particle 1
Particle 2, inorganic phosphor particle 1 are bonded by magnesium oxide particle 2.
As long as inorganic phosphor particle 1 projects the substance of fluorescence by the incidence of exciting light, just it is not particularly limited.
As the concrete example of inorganic phosphor particle 1, such as can to enumerate oxide phosphor, nitride phosphor, nitrogen oxides glimmering
Body of light, chloride fluorophor, oxychloride fluorophor, sulphide phosphor, oxysulfide fluorophor, halide fluorophor, sulphur
Belong to compound fluorophor, chlorate MClO 3 fluorescent substance, halogen-phosphate compound fluorophor etc..These can be used alone, or by two or more
It is used in mixed way.In addition, as described below, wavelength convert component 10 passes through the mixing to inorganic phosphor particle 1 and magnesium oxide particle 2
Particle is sintered and makes, therefore, preferably heat-resisting in order to which heat deterioration does not occur in sintering as inorganic phosphor particle 1
The excellent substance of property.From the viewpoint, inorganic phosphor particle 1 be preferably oxide phosphor, particularly have stone
Oxide phosphor (the Y of garnet structure3Al5O12: Ce3+、Lu3Al5O12: Ce3+Deng).
Average grain diameter (the D of inorganic phosphor particle 150) it is preferably 1~50 μm, particularly preferably 5~25 μm.Inorganic fluorescent
When the average grain diameter of body particle 1 is too small, luminous intensity is easy decline.On the other hand, the average grain diameter mistake of inorganic phosphor particle 1
When big, there are luminescent colors to become non-uniform tendency.
Average grain diameter (the D of magnesium oxide particle 250) it is preferably 0.01~10 μm, it is particularly preferably 0.05~5 μm, especially excellent
It is selected as 0.08~1 μm.By making average grain diameter be in above range, can at relatively low temperatures to magnesium oxide particle 2 into
Row sintering.
The purity of magnesium oxide particle 2 is preferably 99% or more, 99.9% or more, particularly preferably 99.98% or more.Pass through
So that the purity of magnesium oxide particle 2 is in above range, magnesium oxide particle 2 can be sintered at relatively low temperatures.
As described above, sintering temperature can be made to be lower by the average grain diameter of appropriate adjustment magnesium oxide particle 2, purity.Tool
For body, though at a temperature of 1000~1400 DEG C, 1020~1250 DEG C and 1050~relatively low less than 1100 DEG C into
Row is fired, and can also sinter densification into.
As the production method of magnesium oxide particle 2, spark in synthetic method and water using gas phase oxidation can be enumerated
Electric discharge etc..Wherein, the magnesium oxide particle of high-purity is also easy to get using the synthetic method of gas phase oxidation, therefore preferably.
In addition, the commercially available product as magnesium oxide particle, can be used 50A, 2000A etc. of UBEMATERIALS manufacture.
In addition, the average grain diameter of magnesium oxide particle 2 is preferably relative to the ratio of the average grain diameter of inorganic phosphor particle 1
0.5 or less, 0.2 or less, 0.1 hereinafter, particularly preferably 0.05 or less.In this way, the compactness of wavelength convert component 10 improves, hold
Therefore easily forming thermal conducting path further can efficiently discharge heat caused by inorganic phosphor particle 1 to outside.
The ratio of inorganic phosphor particle 1 and magnesium oxide particle 2 in wavelength convert component 10 is in terms of quality %, preferably
Inorganic phosphor particle 1 be 3~80%, magnesium oxide particle 2 be 20~97%, more preferably inorganic phosphor particle 1 be 5~
75%, magnesium oxide particle 2 is 25~95%, and further preferably inorganic phosphor particle 1 is that 8~70%, magnesium oxide particle 2 is
30~92%.When the content of inorganic phosphor particle 1 very few (content of magnesium oxide particle 2 is excessive), wavelength convert component 10
Luminous intensity is easy decline.On the other hand, when content excessive (content of magnesium oxide particle 2 is very few) of inorganic phosphor particle 1,
In wavelength convert component 10, it is not easy to form the thermal conducting path being made of magnesium oxide particle 2, therefore, inorganic phosphor particle 1
Generated heat is not easy to be released into outside.In addition, the caking property of inorganic phosphor particle 1 declines, wavelength convert component 10
Mechanical strength be easy decline.
The shape of wavelength convert component 10 is not particularly limited, usually plate (rectangular plate-like, discoid etc.).It is preferred that suitable
When the thickness of selection wavelength conversion section part 10, make it possible to obtain the light of the tone as target.Specifically, wavelength conversion section
The thickness of part 10 is preferably 2mm or less, 1mm hereinafter, particularly preferably 0.8mm or less.But the thickness of wavelength convert component 10
When too small, mechanical strength is easy decline, it is therefore preferable that being 0.03mm or more.
By will be mixed with defined ratio raw material powder made of inorganic phosphor particle 1 and magnesium oxide particle 2 in advance at
It is fired after type, wavelength convert component 10 can be manufactured.Wherein, bonding agent and solvent can also be being added into raw material powder
Equal organic principles and after forming paste, be fired.In this way, using the methods of raw cook molding, desired shape easy to form
Preform.At this point, after removing organic principle in degreasing process (600 DEG C or so) first, in the sintering of magnesium oxide particle 2
At a temperature of be fired, be thus easy to get fine and close sintered body.Alternatively, it is also possible to after primary fire with firing temperature ±
150 DEG C of implementation HIP (hot isostatic pressing) processing.Thereby, it is possible to shrink the emptying aperture in wavelength convert component 10 and disappear, and can
Inhibit the scattering of superfluous light.
As bonding agent, poly (propylene carbonate), polybutyl methacrylate, polyvinyl butyral, poly- first can be used
Base methyl acrylate, polyethyl methacrylate, ethyl cellulose, nitrocellulose, polyestercarbonate etc., can be by these lists
Solely or it is used in mixed way.
As solvent, can by terpineol, isoamyl acetate, toluene, methyl ethyl ketone, butyl carbitol acetate, 2,
2,4- trimethyl -1,3- pentanediol mono isobutyrate etc. is used alone or as a mixture.
In cream, sintering aid can also be contained.As sintering aid, magnesium phosphate, basic zirconium phosphate, oxidation can be used for example
The amorphous oxide matter powder of crystalline powder, silicic acid system and the phosphate of manganese, barium monoxide, yttrium oxide, silica etc. etc..
(Wavelength changing element)
Fig. 2 is the schematic section for indicating an embodiment of Wavelength changing element of the utility model.Wavelength convert
Element 20 as by wavelength convert component 10 and be higher than wavelength convert component 10 thermal coefficient 3 lamination of heat dissipating layer made of
Laminated body is constituted.In the present embodiment, the heat generated due to irradiating exciting light to wavelength convert component 10 passes through heat dissipating layer 3
And it is efficiently discharged to outside.Therefore, the temperature for being able to suppress wavelength convert component 10 excessively rises.
Heat dissipating layer 3 has the thermal coefficient higher than wavelength convert component 10.Specifically, the thermal coefficient of heat dissipating layer 3 is excellent
It is selected as 5W/mK or more, 10W/mK or more, particularly preferably 20W/mK or more.
The thickness of heat dissipating layer 3 is preferably 0.05~1mm, 0.07~0.8mm, particularly preferably 0.1~0.5mm.Heat dissipating layer 3
Thickness it is too small when, there are mechanical strength decline tendency.On the other hand, when the thickness of heat dissipating layer 3 is excessive, there are wavelength converts
The tendency of element enlargement.
As heat dissipating layer 3, the layer comprising light transparent ceramic can be used.In such manner, it is possible to exciting light or fluorescence are penetrated, because
This, can use as the Wavelength changing element of transmission-type.Heat dissipating layer comprising light transparent ceramic in 400~800nm of wavelength
The full light transmittance at place is preferably 10% or more, 20% or more, 30% or more, 40%, particularly preferably 50% or more.
As light transparent ceramic, can be used selected from alumina series ceramics, aluminium nitride system ceramics, carbonization silicon systems ceramics, nitrogen
Change boron system ceramics, magnesia system ceramics, titanium oxide base ceramics, niobium oxide system ceramics, Zinc oxide ceramics and yttrium oxide system ceramics
In it is at least one kind of.
The Wavelength changing element 20 of present embodiment is only formed with heat dissipating layer 3 in wavelength convert component 10 interarea,
But heat dissipating layer 3 can also be formed in two interareas of wavelength convert component 10.In such manner, it is possible to by produced by wavelength convert component 10
Heat further efficiently discharge to outside.Alternatively, it is also possible to being to form wavelength convert component 10 with 3 alternative stacked of heat dissipating layer
4 layers or more of laminated body.
In addition, other than being the layer comprising light transparent ceramic, can also be comprising Cu, Al, Ag etc. as heat dissipating layer 3
The layer of metal.In such manner, it is possible to which the Wavelength changing element as reflection-type uses.
(light emitting device)
Fig. 3 is the diagrammatic side view for indicating an embodiment of light emitting device of the utility model.Present embodiment institute
The light emitting device being related to is the light emitting device using the wavelength convert component of transmission-type.As shown in figure 3, light emitting device 30 has wave
Long converting member 10 and light source 4.Using wavelength convert component 10, the exciting light L0 projected from light source 4 is wavelength-converted into glimmering
Light L1, the wavelength of fluorescence L1 are longer than exciting light L0.In addition, a part of exciting light L0 penetrates wavelength convert component 10.Therefore, from
The synthesis light L2 of the injection of wavelength convert component 10 exciting light L0 and fluorescence L1.For example, exciting light L0 is blue light and fluorescence L1 is
When sodium yellow, the synthesis light L2 of white can be obtained.Alternatively, it is also possible to use above-mentioned illustrated 20 generation of Wavelength changing element
For wavelength convert component 10.
As light source 4, LED and LD can be enumerated.From the viewpoint of the luminous intensity for improving light emitting device 30, light source 4
It is preferable to use the LD that can project high-intensitive light.
Claims (13)
1. a kind of wavelength convert component contains inorganic phosphor particle and magnesium oxide particle, the feature of the wavelength convert component
It is:
There are magnesium oxide particles between inorganic phosphor particle, and inorganic phosphor particle is glued by magnesium oxide particle
Knot.
2. wavelength convert component as described in claim 1, it is characterised in that:
Contain inorganic phosphor particle 3~80% and magnesium oxide particle 20~97% in terms of quality %.
3. wavelength convert component as claimed in claim 1 or 2, it is characterised in that:
The average grain diameter of magnesium oxide particle is 0.01~10 μm.
4. wavelength convert component as claimed in claim 1 or 2, it is characterised in that:
The purity of magnesium oxide particle is 99% or more.
5. wavelength convert component as claimed in claim 1 or 2, it is characterised in that:
The average grain diameter of inorganic phosphor particle is 1~50 μm.
6. wavelength convert component as claimed in claim 1 or 2, it is characterised in that:
Inorganic phosphor particle includes the oxide phosphor with garnet structure.
7. wavelength convert component as claimed in claim 1 or 2, it is characterised in that:
The average grain diameter of magnesium oxide particle is 0.5 or less relative to the ratio of the average grain diameter of inorganic phosphor particle.
8. a kind of Wavelength changing element, it is characterised in that:
Comprising by wavelength convert component according to any one of claims 1 to 7 and with thermally conductive higher than wavelength convert component
Laminated body made of the heat dissipation layer laminate of coefficient.
9. Wavelength changing element as claimed in claim 8, it is characterised in that:
Heat dissipating layer includes light transparent ceramic.
10. Wavelength changing element as claimed in claim 9, it is characterised in that:
Light transparent ceramic is selected from alumina series ceramics, aluminium nitride system ceramics, carbonization silicon systems ceramics, boron nitride system ceramics, oxidation
It is at least one kind of in magnesium system ceramics, titanium oxide base ceramics, niobium oxide system ceramics, Zinc oxide ceramics and yttrium oxide system ceramics.
11. a kind of light emitting device comprising:
Wavelength convert component according to any one of claims 1 to 7 and the light source that exciting light is irradiated to wavelength convert component.
12. a kind of light emitting device comprising:
Wavelength changing element described in any one of claim 8~10 and the light source to Wavelength changing element irradiation exciting light.
13. the light emitting device as described in claim 11 or 12, it is characterised in that:
Light source is laser diode.
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JP2017079488A JP6802983B2 (en) | 2017-04-13 | 2017-04-13 | Wavelength conversion member and wavelength conversion element, and light emitting device using them |
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CN201810325104.8A Pending CN108735877A (en) | 2017-04-13 | 2018-04-12 | Wavelength convert component and Wavelength changing element and use their light-emitting device |
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CN114144497A (en) | 2019-07-22 | 2022-03-04 | 地方独立行政法人神奈川县立产业技术综合研究所 | Fluorescent member, method for manufacturing same, and light-emitting device |
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KR20090004179A (en) * | 2007-07-06 | 2009-01-12 | 삼성에스디아이 주식회사 | Metallic compound hybridized nanophosphor layer, applications thereof and method for preparing metallic compound hybridized nanophosphor layer |
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JP2016204563A (en) * | 2015-04-24 | 2016-12-08 | 太平洋セメント株式会社 | Fluorescent member, manufacturing method therefor and light emitting device |
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CN108735877A (en) | 2018-11-02 |
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