CN208478300U - A kind of cooling stations - Google Patents
A kind of cooling stations Download PDFInfo
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- CN208478300U CN208478300U CN201821040534.7U CN201821040534U CN208478300U CN 208478300 U CN208478300 U CN 208478300U CN 201821040534 U CN201821040534 U CN 201821040534U CN 208478300 U CN208478300 U CN 208478300U
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- cooling
- cooled
- wall
- cooling cavities
- wafer
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Abstract
The utility model provides a kind of cooling stations, comprising: cooling cavities；For placing the bracket of object to be cooled, the bracket is set in the cooling cavities；And for detect the object to be cooled whether the detecing element within the scope of predeterminated position, the detecing element is set in the cooling cavities.The utility model is used to detect object to be cooled whether within the scope of predeterminated position, causes wafer breakage to reduce wafer position offset, and reduce board delay machine rate, improve wafer production efficiency by the way that detecing element is arranged in cooling cavities.
Description
Technical field
The utility model relates to IC manufacturing fields, more particularly to a kind of cooling stations.
Background technique
With science and technology fast development, high-tech electronic product be used in daily life be it is fairly common, such as mobile phone,
The electronic products such as mainboard, digital camera, all install and are covered with many semiconductor devices inside the electronic product, and semiconductor device
The material source of part is exactly wafer, in order to meet the wilderness demand of various high-tech electronic product, therefore Foundry industry
All how more fast and accurately to produce wafer as target, constantly carries out research and development and improve breakthrough.
In the process of wafer, wafer generally between 80 DEG C to 170 DEG C, is needed from temperature when coming out in working cavity
Subsequent operation can just be carried out by temperature being cooled to a certain range (e.g.≤50 DEG C) by cooling stations.And when cooling stations are whole
Body run-off the straight not by timely correction, and, wafer by transmit arm be put into cooling stations or from cold-zone station take out when position send out
Raw offset can all cause that friction, collision mutually occur between wafer or collide with the cavity inner wall of cooling stations, to cause
Wafer breakage even causes board delay machine when serious, influences wafer production efficiency.
Utility model content
The purpose of this utility model is to provide a kind of cooling stations, wafer breakage caused by being deviated with reduction because of wafer position,
And board delay machine rate is reduced, improve wafer production efficiency.
To solve the above-mentioned problems, the utility model proposes a kind of cooling stations, comprising: cooling cavities；For place to
The bracket of cooled material, the bracket are set in the cooling cavities；And for whether detecting the object to be cooled default
Detecing element in position range, the detecing element are set in the cooling cavities.
Optionally, the cooling cavities includes: the upper inner wall being oppositely arranged and lower inner wall；And the connection upper inner wall and
The lower multiple side inner walls of inner wall.
Optionally, the bracket includes: multiple convex portions, and the multiple convex portion is respectively arranged at the cooling chamber
On multiple side inner walls of body, the multiple convex portion collectively forms a loading end, and the loading end is described to cold for placing
But object.
Optionally, the detecing element includes: multipair photoelectric sensor, and each pair of photoelectric sensor is separately positioned on described cold
But the upper inner wall of cavity and lower inner wall, the line of each pair of photoelectric sensor are each perpendicular to the loading end, and object to be cooled is beyond pre-
If the signal of at least a pair of of photoelectric sensor is blocked when position range.
Optionally, the object to be cooled is wafer, and every three convex portions collectively form a loading end.
Optionally, the detecing element includes being at least 3 pairs of photoelectric sensors.
Optionally, the cooling cavities is rectangular parallelepiped structure.
Optionally, the cooling cavities is provided with the opening entered and left for object to be cooled.
Optionally, further includes: for showing that the display element of the detecing element state, the display element are set to institute
It states in cooling cavities.
Optionally, the material of the cooling cavities is stainless steel.
Due to using above technical scheme, the utility model has the following beneficial effects:
A kind of cooling stations provided by the utility model, by the way that detecing element is arranged in cooling cavities, be used to detect to
Cooled material (e.g. wafer) causes wafer breakage whether within the scope of predeterminated position, to reduce wafer position offset, and reduces
Board delay machine rate improves wafer production efficiency.
Detailed description of the invention
Fig. 1 is the schematic diagram for the cooling stations that an embodiment of the present invention provides；
Fig. 2 is the position view of the photoelectric sensor of an embodiment of the present invention.
Description of symbols:
100- cooling cavities；The upper inner wall of 101-；Inner wall under 102-；Inner wall on rear side of 104-；105- inner left wall；On the right side of 106-
Inner wall；
200- detecing element；210- photoelectric sensor；
300- bracket；310- convex portion；
400- object to be cooled；
500- display element.
Specific embodiment
It is described in more detail below in conjunction with a kind of cooling stations of the schematic diagram to the utility model, which show this
The preferred embodiment of utility model, it should be appreciated that those skilled in the art can modify the utility model described herein, and still
So realize the advantageous effects of the utility model.Therefore, following description should be understood as the extensive of those skilled in the art
Know, and is not intended as limitations of the present invention.
For clarity, not describing whole features of practical embodiments.In the following description, it is not described in detail well known function
And structure, because they can make the utility model chaotic due to unnecessary details.It will be understood that in any practical embodiments
Exploitation in, it is necessary to make a large amount of implementation details to realize the specific objective of developer, such as according to related system or related quotient
The limitation of industry changes into another embodiment by one embodiment.Additionally, it should think this development may be it is complicated and
It is time-consuming, but to those skilled in the art it is only routine work.
The utility model is more specifically described by way of example referring to attached drawing in the following passage.According to following explanation, originally
The advantages of utility model and feature will become apparent from.It should be noted that attached drawing is all made of very simplified form and uses non-essence
Quasi- ratio, only to convenient, lucidly aid illustration the utility model embodiment purpose.
It is exemplified below the preferred embodiment of cooling stations, clearly to illustrate the content of the utility model, it is understood that, this
The content of utility model is not restricted to following embodiment, other pass through the conventional technical means of those of ordinary skill in the art
It improves also within the thought range of the utility model.
The core concept of the utility model is, by the way that detecing element is arranged in cooling cavities, is used to detect to cold
But whether object (e.g. wafer) is within the scope of predeterminated position, wafer breakage caused by being deviated with reduction because of wafer position, and reduces
Board delay machine rate improves wafer production efficiency.
Fig. 1 is the schematic diagram of cooling stations provided in this embodiment, as shown in Figure 1, the cooling stations include at least: cooling cavities
100；For placing the bracket 300 of object to be cooled；For detect the object to be cooled whether the detecting within the scope of predeterminated position
Element 200.
The cooling cavities 100 includes: the upper inner wall 101 being oppositely arranged and lower inner wall 102；And the connection upper inner wall
101 and lower inner wall 102 multiple side inner walls, e.g. rear side inner wall 104, inner left wall 105 and right side inner wall 106.It is described
Cooling cavities 100 is provided with the opening entered and left for object to be cooled.
In the present embodiment, the cooling cavities 100 is, for example, rectangular parallelepiped structure, and the opening is arranged in the cooling chamber
In the one side wall of body 100, e.g. it is arranged on the front side wall of the cooling cavities 100.The material example of the cooling cavities 100
Stainless steel in this way.
The quantity of the bracket can be to be multiple, so that a cooling stations can cool down multiple objects to be cooled, phase simultaneously
The distance between two adjacent described brackets are preferably 7mm~8mm.
In other embodiments, the bracket can also support object to be cooled, such as frame structure by other structures.
The bracket 300 is set in the cooling cavities 100, and the bracket 300 includes: multiple convex portions 310, institute
Stating multiple convex portions 310 and being respectively arranged on multiple side inner walls of the cooling cavities 100 is, for example, rear side inner wall 104, a left side
Side inner wall 105 and right side inner wall 106, the multiple convex portion 310 collectively form a loading end, and the loading end is for putting
The object to be cooled is set, every three convex portions 310 collectively form a loading end.
In the present embodiment, the object to be cooled is, for example, wafer to be cooled, and the multiple convex portion 310 is, for example,
Three convex portions 310, and three convex portions 310 collectively form a loading end.
Fig. 2 is the position view of the photoelectric sensor of the present embodiment.As shown in Fig. 2, simultaneously referring to Fig. 1, described detect
It surveys element 200 to be set in the cooling cavities 100, the detecing element 200 includes: multipair photoelectric sensor 210, Mei Duiguang
Electric transducer 210 is separately positioned on the upper inner wall 101 and lower inner wall 102 of the cooling cavities 100, each pair of photoelectric sensor 210
Line be each perpendicular to the loading end, object 400 to be cooled exceeds at least a pair of of photoelectric sensor 210 when predeterminated position range
Signal is blocked.It, can be with from the foregoing, it will be observed that the multipair photoelectric sensor 210 is arranged by increasing in the cooling cavities 100
Object 400 to be cooled e.g. wafer is detected when cooling stations are placed or whether the position for the when of taking is within the scope of predeterminated position, with
It reduces wafer position offset and causes wafer breakage, and reduce board delay machine rate, improve wafer production efficiency.
In the present embodiment, the detecing element 200 includes 3 pairs of photoelectric sensors 210, is separately positioned on the cooling
On upper inner wall 101 that cavity is oppositely arranged, lower inner wall 102, be e.g. embedded the cooling cavities 100 upper inner wall 101, under
On inner wall 102, and each pair of photoelectric sensor 210 is arranged along the 100 short transverse face of cooling cavities.Each pair of light
One of photoelectric sensor 210 of electric transducer 210 is, for example, to issue signal, another photoelectric sensor 210 is, for example, to connect
The collection of letters number.
Each pair of photoelectric sensor 210 is located at outside the predeterminated position of the object to be cooled, and apart from the predeterminated position example
The place of 0~1cm in this way, multipair 210 scattering device of photoelectric sensor outside the predeterminated position be, for example, 0~
On the ring of 1cm.When the object to be cooled is, for example, wafer, the ring is annulus.Preferably, adjacent two pairs of photoelectric sensings
Angle two pairs of light adjacent with other of the predeterminated position central point line of the object to be cooled is arrived in 210 position of device respectively
The angle that the predeterminated position central point line of the object to be cooled is arrived in 210 position of electric transducer respectively is identical.
In the present embodiment, 3 pairs of photoelectric sensors 210 are arranged on the circumference apart from predeterminated position 1cm, institute
It states arbitrary neighborhood two in 3 pairs of photoelectric sensors 210 and the object to be cooled is arrived respectively to 210 position of photoelectric sensor
The angle of predeterminated position central point line is identical, and is 120 °.
Please continue to refer to Fig. 2, when each pair of photoelectric sensor 210 works normally, (object 400 to be cooled is placed described
On loading end, and be located within the scope of the predeterminated position of object to be cooled), the access for sending and receiving signal be it is unimpeded, can also be with
Saying is, the photoelectric sensor 210 for receiving signal can receive from the issued signal of another photoelectric sensor 210；When each pair of
(object 400 to be cooled is placed on the loading end, and is located at the pre- of object to be cooled when 210 abnormal work of photoelectric sensor
If outside position range), which is hindered by the external world so that sending and receiving the access of signal not
It is unimpeded, that is, the signal to photoelectric sensor is blocked.
In the present embodiment, when wafer is placed in the range of the wafer predeterminated position, 3 pairs of photoelectric sensors
210 work normally, that is, the access that each pair of photoelectric sensor 210 sends and receives signal is unimpeded.When the position that wafer is placed
It is, for example, to be deviated along the loading end to 104 direction of rear side inner wall when setting the predeterminated position range beyond the wafer, so that one
Pair or two pairs of 210 abnormal works of photoelectric sensor, a pair or two pairs of photoelectric sensors send and receive signal
Access hindered by the external world so that the access for sending and receiving signal is not smooth.
In addition, in other embodiments, the quantity of the multipair photoelectric sensor 210 can be more to e.g. 4 pairs,
5 equities, specific quantity can be set according to actual process demand.
Referring to Fig. 1, preferred, the cooling stations are, for example, further include: for showing the aobvious of the detecing element state
Show that element 500, the display element 500 are, for example, display lamp or display screen, the display element 500 is set to described cold
But on cavity 100.
In the present embodiment, the display element 500 is preferably display lamp, and the display element 500 is, for example, to be arranged
In the lower sidewalls of the opening of the cooling stations, convenient for users to observation.When the photoelectric sensor 210 at work,
The display lamp lights, and indicates that the access for sending and receiving signal between the photoelectric sensor 210 is smooth；This is aobvious
Show lamp extinguish then indicate the access for sending and receiving signal between the photoelectric sensor 210 be it is not smooth, with reflection
The normal or abnormal working condition of the photoelectric sensor 210.
In conclusion the cooling stations of the utility model include at least: cooling cavities；For placing the bracket of object to be cooled,
The bracket is set in the cooling cavities；And for detect the object to be cooled whether detecing within the scope of predeterminated position
Element is surveyed, the detecing element is set in the cooling cavities.The detecing element includes: multipair photoelectric sensor, each pair of
Photoelectric sensor is separately positioned on the upper inner wall of the cooling cavities and lower inner wall, the line of each pair of photoelectric sensor are each perpendicular to
The loading end, the signal of at least a pair of of photoelectric sensor is blocked when object to be cooled exceeds predeterminated position range.The cooling
Station is, for example, further include: for showing the display element of the detecing element state, e.g. display lamp or display screen, with
Reflect the normal or abnormal working condition of the photoelectric sensor.With 3 pairs of photoelectric sensors being arranged in the present embodiment with
And for object to be cooled is wafer, cooling stations are started to work, and three display lamps light, after wafer to be cooled enters cooling cavities
When placement during bracket, if wafer to be cooled does not shift, that is, the predetermined position range that wafer to be cooled is placed
Interior, 3 pairs of photoelectric sensors still keep lighting state；If wafer to be cooled shifts, 1 pair or 2 pairs of photoelectricity
Sensor extinguishes, that is, wafer to be cooled has blocked 1 pair in mobile placement process or 2 pairs of photoelectric sensors send and receive letter
Number access.Alternatively, wafer after cooling is during by mobile take out, if wafer after cooling is not after cooling
It shifts, 3 pairs of photoelectric sensors still keep lighting state；If wafer after cooling shifts, 1 pair or 2 pairs
The photoelectric sensor extinguishes.In this way, by the way that detecing element is arranged in cooling cavities, be used to detect object to be cooled (such as
It is wafer) whether within the scope of predeterminated position, wafer breakage is caused to reduce wafer position offset, and reduce board delay machine rate,
Improve wafer production efficiency.So the utility model effectively overcome in the prior art wafer cooling stations place when or take
When position the problem of shifting caused wafer breakage, even causing board delay machine when serious, influence wafer production efficiency and
Has high industrial utilization value.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (10)
1. a kind of cooling stations characterized by comprising
Cooling cavities；
For placing the bracket of object to be cooled, the bracket is set in the cooling cavities；And
For detect the object to be cooled whether the detecing element within the scope of predeterminated position, the detecing element is set to described
In cooling cavities.
2. cooling stations as described in claim 1, which is characterized in that the cooling cavities includes:
The upper inner wall and lower inner wall being oppositely arranged；And
Connect multiple side inner walls of the upper inner wall and lower inner wall.
3. cooling stations as claimed in claim 2, which is characterized in that the bracket includes:
Multiple convex portions, the multiple convex portion is respectively arranged on multiple side inner walls of the cooling cavities, described more
A convex portion collectively forms a loading end, and the loading end is for placing the object to be cooled.
4. cooling stations as claimed in claim 3, which is characterized in that the detecing element includes:
Multipair photoelectric sensor, each pair of photoelectric sensor is separately positioned on the upper inner wall and lower inner wall of the cooling cavities, each pair of
The line of photoelectric sensor is each perpendicular to the loading end, and object to be cooled exceeds at least a pair of of photoelectric sensing when predeterminated position range
The signal of device is blocked.
5. cooling stations as claimed in claim 4, which is characterized in that the object to be cooled is wafer, and every three convex portions are total
With one loading end of composition.
6. cooling stations as claimed in claim 5, which is characterized in that the detecing element includes being at least 3 pairs of photoelectric sensors.
7. cooling stations as claimed in claim 2, which is characterized in that the cooling cavities is rectangular parallelepiped structure.
8. cooling stations as claimed in claim 7, which is characterized in that the cooling cavities is provided with for object to be cooled discrepancy
Opening.
9. the cooling stations as described in any one of claim 1 to 6, which is characterized in that further include:
For showing that the display element of the detecing element state, the display element are set in the cooling cavities.
10. the cooling stations as described in any one of claim 1 to 6, which is characterized in that the material of the cooling cavities is not
Become rusty steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821040534.7U CN208478300U (en) | 2018-06-29 | 2018-06-29 | A kind of cooling stations |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821040534.7U CN208478300U (en) | 2018-06-29 | 2018-06-29 | A kind of cooling stations |
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| Publication Number | Publication Date |
|---|---|
| CN208478300U true CN208478300U (en) | 2019-02-05 |
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ID=65212574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821040534.7U Active CN208478300U (en) | 2018-06-29 | 2018-06-29 | A kind of cooling stations |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114517329A (en) * | 2022-02-14 | 2022-05-20 | 新阳硅密（上海）半导体技术有限公司 | Wafer cooling device and electroplating equipment |
-
2018
- 2018-06-29 CN CN201821040534.7U patent/CN208478300U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114517329A (en) * | 2022-02-14 | 2022-05-20 | 新阳硅密（上海）半导体技术有限公司 | Wafer cooling device and electroplating equipment |
| CN114517329B (en) * | 2022-02-14 | 2024-03-15 | 新阳硅密（上海）半导体技术有限公司 | Wafer cooling device and electroplating equipment |
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