CN208460724U - Chip heating device and heating tool - Google Patents
Chip heating device and heating tool Download PDFInfo
- Publication number
- CN208460724U CN208460724U CN201821397931.XU CN201821397931U CN208460724U CN 208460724 U CN208460724 U CN 208460724U CN 201821397931 U CN201821397931 U CN 201821397931U CN 208460724 U CN208460724 U CN 208460724U
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- chip
- heating
- supporting plate
- slot
- heating device
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Abstract
A kind of chip heating device and heating tool, including support platform, load bearing unit and heating unit, opening is provided in support platform, load bearing unit includes supporting plate and cover board, targeting port and the card slot for being embedded chip to be heated are provided on supporting plate, targeting port is connected to card slot, cover plate lid is located on supporting plate, cover board and supporting plate wrap up chip to be heated, supporting plate is mounted in support platform, targeting port and open communication, heating unit includes elevating mechanism and heating mechanism, elevating mechanism is mounted on the lower section of support platform, heating mechanism is mounted on the lift side of elevating mechanism, in elevating mechanism lifting process, the fire end of heating mechanism can stretch in targeting port from opening, and it is bonded with chip to be heated.Before carrying out chip heating, the placement location of chip determines that its position is solid and reliable after chip is placed, and not easily shifted, the contact with heating member is close, and heating location is accurate, and heating effect is good, improves the accuracy of detection.
Description
Technical field
The utility model relates to chip detecting equipment fields, in particular to a kind of chip heating device and heating
Jig.
Background technique
Chip, also known as microcircuit (microcircuit), microchip (microchip), integrated circuit, refer to include it is integrated
The silicon wafer of circuit, volume very little, often a part of computer or other electronic equipments.Chip generally refers to integrated circuit
Support plate and integrated circuit after design, manufacture, encapsulation, test as a result, the usually independence that can be used immediately
Entirety.
Heat can be generated during chip operation, the temperature that heat will lead to chip increases, temperature, atmospheric pressure etc. it is external because
Element is the important factor for influencing chip operation.
Be influenced by temperature when in order to study chip operation, there is device for heating chip on the market, by chip plus
It observes the variation of the working performance of chip during heat to set temperature in real time by detection device, and then adjusts chip
Working environment provides good environment for the work of chip.
Inventor has found that equipment used in traditional chip heating process at least has the following disadvantages: under study for action
In chip heating, directly chip is heated using heating member, the position of chip easily changes, and heats uneven
It is even.
Utility model content
The purpose of this utility model is to provide a kind of chip heating devices, to improve position in traditional chip heating process
Set not secured enough, heating effect difference problem.
The purpose of this utility model is to provide a kind of heating tool, to improve in traditional chip heating process position not
Enough secured, heating effect difference problems.
The embodiments of the present invention are achieved in that
Based on above-mentioned first purpose, the utility model provides a kind of chip heating device comprising has:
Support platform is provided with opening in the support platform,
Load bearing unit, the load bearing unit include supporting plate and cover board, be provided on the supporting plate targeting port and
For being embedded the card slot of chip to be heated, the targeting port is connected to the card slot, and the cover plate lid is located on the supporting plate,
The cover board and the supporting plate wrap up the chip to be heated, and the supporting plate is mounted in the support platform, described
Targeting port and the open communication,
Heating unit, the heating unit include elevating mechanism and heating mechanism, and the elevating mechanism is mounted on described
The lower section of support platform, the heating mechanism are mounted on the lift side of the elevating mechanism, in the elevating mechanism lifting process,
The fire end of the heating mechanism can stretch in the targeting port from the opening, and be bonded with the chip to be heated.
In the utility model preferred embodiment, the support platform includes support plate and supporting leg, the support
Leg is supported in the support plate, and the opening is set in the support plate, and the supporting plate is mounted in the support plate.
In the utility model preferred embodiment, it is provided with the first locating piece in the support plate, on the supporting plate
It is provided with the second locating piece, first locating piece and second locating piece are engaged by clamping.
In the utility model preferred embodiment, first locating piece includes positioning column, the positioning column perpendicular to
The support plate setting, second locating piece includes locating slot, and the locating slot is located at the side of the supporting plate, described fixed
Position column is connected in the locating slot.
In the utility model preferred embodiment, the side of the supporting plate is provided with lug boss, the lug boss with
The support platform interval setting.
In the utility model preferred embodiment, limiting slot, the cover board are provided in a plate face of the supporting plate
On be provided with retention bead, the retention bead is plugged in the limiting slot.
In the utility model preferred embodiment, it is provided with clamping groove on the supporting plate, the clamping groove includes the
One slot section and the second slot section, one end of the first slot section extend in the limiting slot, described in the second slot section connection
First slot section, and the groove width of the second slot section is greater than the groove width of the first slot section；The first card is provided on the supporting plate
Block is connect, the second clamping block is provided on the cover board, first clamping block and second clamping block are engaged by clamping.
In the utility model preferred embodiment, it is provided with sliding channel on the supporting plate and leads to the sliding
The card hole of road connection, one end of the sliding channel extend on the side of the supporting plate, and peace is slided in the sliding channel
Equipped with snap-gauge, second clamping block is mounted on the snap-gauge, and limit corresponding with the card hole is provided on the snap-gauge
Bolt is plugged in position hole, the card hole and the limit hole.
In the utility model preferred embodiment, the heating mechanism includes ceramic heating flake and heat transfer head, described
Ceramic heating flake is mounted in the heat transfer head, and the heat transfer head is mounted on the lift side of the elevating mechanism, the heat transfer head
It can extend into the targeting port and be fitted on the chip to be heated.
Based on above-mentioned second purpose, the utility model provides a kind of heating tool, including upper die unit and described
Chip heating device, the upper die unit are slidably connected with the support platform, and the upper die unit is flat relative to the support
Platform has the position on the surface for being fitted in the cover board during declining.
The beneficial effect of the utility model embodiment is:
In conclusion the utility model embodiment provides a kind of chip heating device, and it is simple and reasonable, convenient for system
Make processing, installation with it is easy to use, meanwhile, before carrying out chip heating, the placement location determination of chip, its position after chip placement
Set solid and reliable, not easily shifted, the contact with heating member is close, and heating location is accurate, and heating effect is good, improves the accurate of detection
Property.It is specific as follows:
Chip heating device provided in this embodiment is first opened cover board and supporting plate, support when needing to heat chip
Card slot on plate is exposed, and chip is installed according to the cloth set direction of card slot, and chip realizes accurate positionin by card slot,
And the position of chip and supporting plate is compact, chip is hardly damaged.After chip is installed, cover plate lid is located on supporting plate, is covered
Plate and supporting plate collective effect clamp chip therebetween.Then supporting plate is placed in support platform, on supporting plate
Targeting port and support platform on register.After the position of chip and support platform determines, start elevating mechanism, lifting
The lift side of mechanism is moved towards support platform, until heating mechanism is delivered to the position being bonded with chip, in the process,
Fire end in heating mechanism enters from opening, and enters targeting port after passing through opening, under the guiding role of targeting port
It is fitted at the position to be heated of chip to be heated, realizes the heating for treating heating chip.It is grasped in the heating process of entire chip
To make convenient reliable, the position of chip is fixed, and it is not easily shifted, good condition is provided for chip heating, chip, which heats, more pacifies
Entirely, and heating location is accurate, and subsequent testing result is more accurate.
Heating tool provided in this embodiment includes above-mentioned chip heating device, all excellent with chip heating device
Point.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by
Regard the restriction to range as, for those of ordinary skill in the art, without creative efforts, may be used also
To obtain other relevant attached drawings according to these attached drawings.
Fig. 1 is the schematic diagram of the chip heating device of the utility model embodiment；
Fig. 2 is the schematic diagram of the support platform of the chip heating device of the utility model embodiment；
Fig. 3 is the schematic diagram of the load bearing unit of the chip heating device of the utility model embodiment；
Fig. 4 is the schematic top plan view of the load bearing unit of the chip heating device of the utility model embodiment；
Fig. 5 be Fig. 4 in A-A to schematic diagram；
Fig. 6 is that the chip of the chip heating device of the utility model embodiment is mounted on the schematic diagram on supporting plate；
Fig. 7 is the schematic diagram of the supporting plate of the chip heating device of the utility model embodiment；
Fig. 8 is the first clamping block of the chip heating device of the utility model embodiment and the schematic diagram of the second clamping block；
Fig. 9 is the schematic diagram of the heating mechanism of the chip heating device of the utility model embodiment.
Icon: 001- chip to be heated；100- support platform；110- support plate；120- supporting leg；130- opening；
140- plummer；200- load bearing unit；210- supporting plate；211- card slot；212- limiting slot；213- clamping groove；214-
Sliding channel；215- card hole；216- lug boss；217- targeting port；220- snap-gauge；221- limit hole；230- second blocks
Connect block；231- mounting portion；The clamping portion 232-；233- guiding surface；240- cover board；The first clamping block of 250-；260-
Positioning piece；The second locating piece of 270-；300- heating mechanism；310- ceramic heating flake；320- heat transfer head；400- lifting
Mechanism.
Specific embodiment
In chip heating, directly chip is heated using heating member, the position of chip easily changes, and heats uneven
It is even.
In consideration of it, inventor devises a kind of chip heating device and heating tool, before carrying out chip heating, chip
Placement location determine, chip place after its position it is solid and reliable, not easily shifted, the contact with heating member is close, heating location
Accurately, heating effect is good, improves the accuracy of detection.
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Usually here in attached drawing description and
The component of the utility model embodiment shown can be arranged and be designed with a variety of different configurations.
Therefore, requirement is not intended to limit to the detailed description of the embodiments of the present invention provided in the accompanying drawings below
The scope of the utility model of protection, but it is merely representative of the selected embodiment of the utility model.Based in the utility model
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the range of the utility model protection.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the present invention, it should be noted that the orientation of the instructions such as term " on ", "lower", "inner", "outside"
Or positional relationship be based on the orientation or positional relationship shown in the drawings or the utility model product using when usually put
Orientation or positional relationship is merely for convenience of describing the present invention and simplifying the description, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to the utility model
Limitation.In addition, term " first ", " second " are only used for distinguishing description, it is not understood to indicate or imply relative importance.
In the description of the present invention, it should also be noted that, unless otherwise clearly defined and limited, term " is set
Set ", " installation ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
The concrete meaning of language in the present invention.
It should be noted that in the absence of conflict, the feature in the embodiments of the present invention and embodiment can
To be combined with each other.
Embodiment
Fig. 1-Fig. 9 is please referred to, chip heating device provided in this embodiment comprising have:
Support platform 100 is provided with opening 130 in the support platform 100,
Load bearing unit 200, the load bearing unit 200 include supporting plate 210 and cover board 240, are set on the supporting plate 210
It is equipped with targeting port 217 and the card slot 211 for being embedded chip 001 to be heated, the targeting port 217 connects with the card slot 211
Logical, the lid of cover board 240 is located on the supporting plate 210, and the cover board 240 and the supporting plate 210 are by the core to be heated
Piece 001 wraps up, and the supporting plate 210 is mounted in the support platform 100, and the targeting port 217 connects with the opening 130
It is logical,
Heating unit, the heating unit include elevating mechanism 400 and heating mechanism 300, and the elevating mechanism 400 is pacified
Mounted in the lower section of the support platform 100, the heating mechanism 300 is mounted on the lift side of the elevating mechanism 400, the liter
In 400 lifting process of descending mechanism, the fire end of the heating mechanism 300 can stretch to the targeting port from the opening 130
In 217, and it is bonded with the chip 001 to be heated.
Chip heating device provided in this embodiment first plays cover board 240 and supporting plate 210 when needing to heat chip
It opens, the card slot 211 on supporting plate 210 is exposed, and chip is installed according to the cloth set direction of card slot 211, and chip is by card
Slot 211 realizes accurate positionin, and the position of chip and supporting plate 210 is compact, and chip is hardly damaged.After chip is installed,
The lid of cover board 240 is located on supporting plate 210, cover board 240 and 210 collective effect of supporting plate clamp chip therebetween.So
Supporting plate 210 is placed in support platform 100 afterwards, the targeting port 217 on supporting plate 210 and the opening in support platform 100
130 alignment.After the position of chip and support platform 100 determines, start elevating mechanism 400, the lift side court of elevating mechanism 400
It is moved to support platform 100, until heating mechanism 300 is delivered to the position being bonded with chip, in the process, heating mechanism
Fire end on 300 enters from opening 130, and enters targeting port 217 after passing through opening 130, in the guiding of targeting port 217
It is fitted under effect at the position to be heated of chip 001 to be heated, realizes the heating for treating heating chip 001.Entire chip
Operate convenient reliable in heating process, the position of chip is fixed, and it is not easily shifted, it is heated for chip and provides good condition, core
Piece heating is safer, and heating location is accurate, and subsequent testing result is more accurate.
It should be noted that support platform 100 may include support plate 110 and supporting leg 120, support in the present embodiment
Plate 110 is rectangular slab, and supporting leg 120 can be set four, and four supporting legs 120 are separately mounted to four angles of support plate 110
Place, every supporting leg 120 are provided with frustum cone structure far from the end of support plate 110, increase contact area, support more steady.
Obviously, in other embodiments, supporting leg 120 can be set three, five etc., alternatively, supporting leg 120 can be set to it is adjustable
Height structure is saved, adaptation range is wider.
Further, the top plate face of support plate 110 is equipped with plummer 140, and plummer 140 is screwed onto support plate 110
On, it is provided on plummer 140 and 130 corresponding through-holes of opening.
Plummer 140 can be rectangular plate-like, and the circumferentially-spaced of plummer 140 is placed with the first locating piece 260, and first is fixed
Position part 260 can be cylindrical positioning column, and the first locating piece 260 is arranged perpendicular to plummer 140.It is corresponding, in supporting plate
It is provided with the second locating piece 270 on 210, the second locating piece 270 is locating slot, and the quantity of the quantity of locating slot and positioning column is one by one
It is corresponding, multiple locating slots along supporting plate 210 circumferentially-spaced arrangement, it is clear that the position of locating slot and the position one of positioning column
One is corresponding, in this way, positioning column and locating slot cooperation, play the setting position that supporting plate 210 is limited to plummer 140, support
Plate 210 is not easily shifted.
Further, positioning column is set as spherical surface far from the end face of plummer 140, has guiding role, is convenient for positioning column
It is plugged in corresponding locating slot.
In the present embodiment, the restriction of supporting plate 210 and 240 collective effect of cover board realization chip position.Supporting plate 210 can be with
For rectangular slab, setting is respectively arranged with a lug boss 216, lug boss 216 on two sides of the length direction of supporting plate 210
Can be rectangular strip, after supporting plate 210 is mounted on plummer 140, lug boss 216 and the interval of plummer 140 are arranged, in this way,
Supporting plate 210 is picked and placed convenient for operating projection portion 216, is operated convenient reliable.There are two fixed for installation in 210 1 plate face of supporting plate
Position block, two locating pieces are spirally connected with supporting plate 210, and two locating pieces are intervally arranged along 210 width direction of supporting plate, two positioning
Block and supporting plate 210 form limiting slot 212, the generally rectangular shaped slot of limiting slot 212.Clamping groove is provided on each locating piece
213, clamping groove 213 includes the first slot section and the second slot section, and one end of the first slot section extends in limiting slot 212, the second slot
Duan Liantong the first slot section, and the groove width of the second slot section is greater than the groove width of the first slot section.
Further, sliding channel 214 is provided on supporting plate 210, sliding channel 214 is that rectangle is poroid, and sliding is logical
Length direction of the road 214 with limiting slot 212 along supporting plate 210 is intervally arranged, and is provided with and slides in a plate face of supporting plate 210
The card hole 215 that dynamic channel 214 is connected to, the plate face and 211 place plate face of card slot for being provided with card hole 215 are same plate face, and sliding is logical
The length direction in road 214 is parallel with the length direction of supporting plate 210, and one end along its length of sliding channel 214 extends
To the side of supporting plate 210, sliding is provided with snap-gauge 220 in sliding channel 214, and snap-gauge 220 is rectangular slab, on snap-gauge 220
It is provided with limit hole 221, the second clamping block 230 is installed on snap-gauge 220, snap-gauge 220 is slidably arranged in sliding channel 214,
Meanwhile card hole 215 can be connected to limit hole 221 in 220 sliding process of snap-gauge, at this point, being plugged on 215 He of card hole using bolt
The relatively fixed of snap-gauge 220 and supporting plate 210, and then the fixation of the second clamping block 230 of realization are realized in location hole.
It should be noted that the second clamping block 230 includes mounting portion 231 and clamping portion 232, mounting portion 231 is mounted on
On snap-gauge 220, clamping portion 232 is mounted on side of the mounting portion 231 far from snap-gauge 220, and clamping portion 232 has protrusion mounting portion
231 part, one side of the clamping portion 232 far from snap-gauge 220 is guiding surface 233.
Optionally, cover board 240 is rectangular slab, and the side of cover board 240 is provided with clamping bar, for being connected to clamping groove 213
Interior, cover board 240 is provided with the first clamping block 250, the first clamping block 250 and the second clamping block 230 adjacent to the plate face of supporting plate 210
Structure it is identical, when cover board 240 is fitted on supporting plate 210, the first clamping block 250 squeezes the second clamping block 230 and with second
Clamping is realized in the clamping portion 232 of clamping block 230, and then completes the installation of supporting plate 210 and cover board 240.It needs to open supporting plate
210 and when cover board 240, bolt is extracted, then sliding jaw 220, separates the first clamping block 250 and the second clamping block 230.
For example, as shown in Figure 8, snap-gauge 220 can be pushed inwardly, 230 slid inward of the second clamping block is driven, and then make the first clamping
Block 250 and the separation of the second clamping block 230.Obviously, the installation position of the first clamping block 250 and the second clamping block 230 can also be into
Row exchanges, herein without illustrating.
Optional in the present embodiment, heating mechanism 300 includes ceramic heating flake 310 and heat transfer head 320, ceramic heating flake
310 are mounted in heat transfer head 320, and heat transfer head 320 is mounted on the lift side of elevating mechanism 400, and heat transfer head 320 can extend into guiding
Mouth 217 is simultaneously fitted on chip 001 to be heated.Ceramic heating flake 310 converts electrical energy into thermal energy, first carries out to heat transfer head 320
Heat transfer head 320 is heated to after set temperature being again extremely bonded the jacking of heat transfer head 320 with chip by elevating mechanism 400 by heating,
Realize the heating to chip.
Optional in this example, elevating mechanism 400 can be cylinder assembly or hydraulic pressure cylinder assembly.
Embodiment
Present embodiments provide a kind of heating tool, including upper die unit and chip provided by the above embodiment heating dress
It sets, upper die unit is slidably connected with support platform 100, and upper die unit has patch during declining relative to support platform 100
It closes in the position on the surface of cover board 240.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this
For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model
Within, any modification, equivalent replacement, improvement and so on should be included within the scope of protection of this utility model.
Claims (10)
1. a kind of chip heating device, which is characterized in that it includes:
Support platform is provided with opening in the support platform,
Load bearing unit, the load bearing unit include supporting plate and cover board, and targeting port is provided on the supporting plate and is used for
It is embedded the card slot of chip to be heated, the targeting port is connected to the card slot, and the cover plate lid is located on the supporting plate, described
Cover board and the supporting plate wrap up the chip to be heated, and the supporting plate is mounted in the support platform, the guiding
Mouth and the open communication,
Heating unit, the heating unit include elevating mechanism and heating mechanism, and the elevating mechanism is mounted on the support
The lower section of platform, the heating mechanism are mounted on the lift side of the elevating mechanism, described in the elevating mechanism lifting process
The fire end of heating mechanism can stretch in the targeting port from the opening, and be bonded with the chip to be heated.
2. chip heating device according to claim 1, which is characterized in that the support platform includes support plate and branch
Support leg, the supporting leg are supported in the support plate, and the opening is set in the support plate, and the supporting plate is mounted on
In the support plate.
3. chip heating device according to claim 2, which is characterized in that be provided with the first positioning in the support plate
Part, the second locating piece is provided on the supporting plate, and first locating piece and second locating piece are engaged by clamping.
4. chip heating device according to claim 3, which is characterized in that first locating piece includes positioning column, institute
It states positioning column to be arranged perpendicular to the support plate, second locating piece includes locating slot, and the locating slot is located at the support
The side of plate, the positioning column are connected in the locating slot.
5. chip heating device according to claim 1, which is characterized in that the side of the supporting plate is provided with protrusion
Portion, the lug boss and the support platform interval are arranged.
6. chip heating device according to claim 1, which is characterized in that be arranged in a plate face of the supporting plate limited
Position slot, is provided with retention bead on the cover board, the retention bead is plugged in the limiting slot.
7. chip heating device according to claim 6, which is characterized in that be provided with clamping groove, institute on the supporting plate
Stating clamping groove includes the first slot section and the second slot section, and one end of the first slot section extends in the limiting slot, and described the
Two slot sections are connected to the first slot section, and the groove width of the second slot section is greater than the groove width of the first slot section；The supporting plate
On be provided with the first clamping block, be provided with the second clamping block on the cover board, first clamping block and second clamping block
It is engaged by clamping.
8. chip heating device according to claim 7, which is characterized in that be provided on the supporting plate sliding channel with
And the card hole being connected to the sliding channel, one end of the sliding channel extend on the side of the supporting plate, the cunning
Be slidably fitted with snap-gauge in dynamic channel, second clamping block is mounted on the snap-gauge, be provided on the snap-gauge with it is described
Bolt is plugged in the corresponding limit hole of card hole, the card hole and the limit hole.
9. chip heating device according to claim 1, which is characterized in that the heating mechanism include ceramic heating flake with
And heat transfer head, the ceramic heating flake are mounted in the heat transfer head, the heat transfer head is mounted on the lifting of the elevating mechanism
End, the heat transfer head can extend into the targeting port and be fitted on the chip to be heated.
10. a kind of heating tool, which is characterized in that including upper die unit and according to claim 1 to 9
Chip heating device, the upper die unit are slidably connected with the support platform, and the upper die unit is flat relative to the support
Platform has the position on the surface for being fitted in the cover board during declining.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821397931.XU CN208460724U (en) | 2018-08-28 | 2018-08-28 | Chip heating device and heating tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821397931.XU CN208460724U (en) | 2018-08-28 | 2018-08-28 | Chip heating device and heating tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208460724U true CN208460724U (en) | 2019-02-01 |
Family
ID=65179336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821397931.XU Active CN208460724U (en) | 2018-08-28 | 2018-08-28 | Chip heating device and heating tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208460724U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110517979A (en) * | 2019-09-18 | 2019-11-29 | 扬州虹扬科技发展有限公司 | A kind of preheating apparatus and production method of matrix form switching electronic product |
| CN111987018A (en) * | 2020-08-27 | 2020-11-24 | 智瑞半导体有限公司 | IGBT module heating tool |
| CN112670209A (en) * | 2020-12-23 | 2021-04-16 | 杰华特微电子（杭州）有限公司 | Heating jig and chip-on-lead packaging method |
| CN113125934A (en) * | 2019-12-31 | 2021-07-16 | 深圳市江波龙电子股份有限公司 | Chip test circuit and chip test equipment |
-
2018
- 2018-08-28 CN CN201821397931.XU patent/CN208460724U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110517979A (en) * | 2019-09-18 | 2019-11-29 | 扬州虹扬科技发展有限公司 | A kind of preheating apparatus and production method of matrix form switching electronic product |
| CN110517979B (en) * | 2019-09-18 | 2024-03-19 | 扬州虹扬科技发展有限公司 | Preheating device and production method of matrix rectifying electronic product |
| CN113125934A (en) * | 2019-12-31 | 2021-07-16 | 深圳市江波龙电子股份有限公司 | Chip test circuit and chip test equipment |
| CN111987018A (en) * | 2020-08-27 | 2020-11-24 | 智瑞半导体有限公司 | IGBT module heating tool |
| CN112670209A (en) * | 2020-12-23 | 2021-04-16 | 杰华特微电子（杭州）有限公司 | Heating jig and chip-on-lead packaging method |
| CN112670209B (en) * | 2020-12-23 | 2023-08-29 | 杰华特微电子股份有限公司 | Heating jig and lead chip packaging method |
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