CN110517979B - Preheating device and production method of matrix rectifying electronic product - Google Patents
Preheating device and production method of matrix rectifying electronic product Download PDFInfo
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- CN110517979B CN110517979B CN201910886022.5A CN201910886022A CN110517979B CN 110517979 B CN110517979 B CN 110517979B CN 201910886022 A CN201910886022 A CN 201910886022A CN 110517979 B CN110517979 B CN 110517979B
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- 239000011159 matrix material Substances 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 102
- 238000000034 method Methods 0.000 claims description 13
- 238000004806 packaging method and process Methods 0.000 claims description 10
- 238000001746 injection moulding Methods 0.000 claims description 3
- 238000012858 packaging process Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Abstract
The invention discloses a preheating device of a matrix type rectifying electronic product, which comprises a bottom bracket, a lower heating platform and an upper heating platform, wherein the lower heating platform is arranged on the bottom bracket through bolts, a heating rod is arranged on the lower heating platform, guide posts are fixedly arranged at four corners of the lower heating platform, the upper heating platform is slidably arranged on the guide posts, a lifting cylinder is vertically arranged below the bottom bracket, and a piston rod of the lifting cylinder passes through the lower heating platform and is connected with the bottom of the upper heating platform.
Description
Technical Field
The invention relates to the technical field of electronic product packaging, in particular to a preheating device and a production method of a matrix rectifying electronic product.
Background
In the field of electronic product packaging, the matrix rectifier bridge products are divided into a preheating stage and a non-preheating stage before packaging, and the preheating method in the industry is mainly to set the temperature of a preheating stage by referring to the temperature of a plastic packaging die, then directly placing a carrying frame on the preheating stage, and then placing the products to be packaged on the carrying frame for preheating one by one, so that the frame pieces and crystal grains carried by the frame pieces can rise to a high temperature of more than 150 ℃ from room temperature in a short time, the crystal grains are subjected to thermal stress impact caused by thermal expansion of the frame pieces and the frame in an instant, the frame can be oxidized to different degrees due to inconsistent preheating time, and the preheating mode is long and difficult to control, so that the frame is generally oxidized seriously, the binding force with plastic packaging materials is poor, and hidden troubles such as poor air tightness and reliability occur. If the die is not preheated, the frame sheet is pressed due to the thermal expansion factor, namely, the die is pressed to the surface of the lead during plastic packaging, and meanwhile, the die is subjected to thermal stress impact caused by thermal expansion of the die and the frame in the same moment, so that hidden troubles such as poor air tightness and reliability can be generated.
Disclosure of Invention
The invention aims to provide a preheating device and a production method of a matrix rectifying electronic product, which solve the technical problem that the preheating mode in the prior art can influence the performance of the electronic product.
The utility model provides a preheating device of matrix rectification electronic product, includes bottom support, lower heating platform and last heating platform, lower heating platform passes through the bolt and installs on the bottom support, and is provided with the heating rod on the lower heating platform, the equal fixed mounting in four corners of lower heating platform has the guide post, go up heating platform slidable mounting on the guide post, the vertical lift cylinder of installing in bottom support below, the piston rod of lift cylinder passes behind the lower heating platform with go up the bottom of heating platform and be connected.
The preheating device is divided into two parts, wherein the upper heating platform moves up and down along the guide post under the drive of the lifting cylinder, so that the distance between the upper heating platform and the lower heating platform can be adjusted, the temperature of the upper heating platform can be ensured not to be too high, two-section heating is convenient to realize, and the preheating effect can be improved.
Based on the technical scheme, the invention can also be improved as follows:
further, the lifting cylinders are two, and the lifting cylinders are arranged at intervals along the X-axis direction, so that the lifting cylinders can be used for enabling the two sides of the upper heating platform to bear force, and the moving stability of the upper heating platform is guaranteed.
Further, the baffle is installed around the bottom support, the baffle, the bottom surface of the upper heating platform and the upper surface of the lower heating platform are surrounded and combined to form a heating zone, and the beneficial effect of the method is that a zone is formed by surrounding the baffle for heating.
Further, the inner wall of the baffle plate is contacted with the side surface of the upper heating platform, and the beneficial effect of the step is that the relatively closed space is formed for heating conveniently.
Further, every the baffle all is spaced apart and is equipped with two openings, and the beneficial effect that adopts this step is can be convenient for carry out spacingly to heating frame through the opening to when can realizing heating platform motion, heating frame can not rock by a wide margin.
Further, the temperature controller is installed to upper heating platform top, the heating rod is connected with the temperature controller electricity, the temperature controller electricity is connected with the timer, adopts the beneficial effect of this step to be can carry out time and temperature's control through temperature controller and timer.
A production method of a matrix rectifying electronic product comprises the following steps:
s1: preheating an electronic product to be treated twice by the matrix rectification electronic product preheating device according to any one of claims 1-6;
s2: after preheating, plastic packaging and baking are carried out to obtain a finished product.
Wherein, the step of preheating twice in the step S1 is as follows:
s101: placing the electronic product to be processed on a heating frame, and then placing the heating frame on an upper heating platform;
s102: switching on a power supply of the timer, setting the working time as T1, setting the on temperature of the temperature controller as T1, and switching off the temperature as T2, and preheating the electronic product to be processed for the first time;
s103: after the first preheating is finished, starting a lifting cylinder, reducing the height of the upper heating platform, changing the working time of a timer to be T2, setting the on temperature of a temperature controller to be T3 and the off temperature to be T4, and preheating the electronic product to be processed for the second time to finish the twice preheating of the electronic product to be processed.
Wherein T1 in the step S102 is 20-80S, T1 is 50 degrees, and T2 is 100 degrees; t2 in the step S103 is 5-20S, T3 is 120 degrees, and T4 is 200 degrees.
Wherein, the plastic package process parameters in the step S2 are as follows: the temperature is 150-200 ℃, the time is 60-200 seconds, and the die closing pressure is 30-150Kg/cm 2 Injection molding pressure of 20-100Kg/cm 2 ；
The baking process parameters in the step S2 are as follows: temperature: 120-220 ℃ for 2-24 hours.
The existing heating frame is oxidized to different degrees due to inconsistent preheating time, and the frame is generally oxidized seriously, so that the bonding force with plastic packaging materials is poor, namely, hidden troubles such as poor air tightness and reliability occur. If not preheated, the frame sheet is pressed due to thermal expansion factors, namely, the die is pressed to the surface of the lead during plastic packaging. At the same time, the crystal grains are instantly subjected to high temperature, so that the crystal grains and the frame are thermally bulged to bring thermal stress impact. The method adopts a sectional preheating method (low temperature is firstly followed by high temperature), and can effectively control the high temperature preheating time, so that the oxidation degree of the frame piece and the relatively slow rise of the crystal grain to high temperature are controlled, and the damage of stress to the frame piece is reduced.
The invention has the beneficial effects that:
the invention adopts a sectional preheating method (low temperature is firstly followed by high temperature), and can effectively control the high temperature preheating time, thereby controlling the oxidation degree of the frame piece and improving the quality of the produced product.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a preheating device for a matrix-type rectifying electronic product according to embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of a preheating device for a matrix-type rectifying electronic product according to embodiment 1 of the present invention;
reference numerals:
1-a bottom bracket; 2-a lower heating platform; 3-upper heating platform; 4-heating rod; 5-a guide post; 6, lifting air cylinders; 7-a baffle; 8-opening; 9, a temperature controller; 10-timer.
Detailed Description
Embodiments of the technical scheme of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical aspects of the present invention, and thus are merely examples, and are not intended to limit the scope of the present invention.
It is noted that unless otherwise indicated, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this invention pertains.
In the description of the present application, it should be understood that the terms "center," "upper," "lower," "vertical," "horizontal," "top," "bottom," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Examples
As shown in fig. 1-2, the preheating device for matrix rectifying electronic products provided by the invention comprises a bottom bracket 1, a lower heating platform 2 and an upper heating platform 3, wherein the lower heating platform 2 is arranged on the bottom bracket 1 through bolts, heating rods 4 are arranged on the lower heating platform 2, guide posts 5 are fixedly arranged at four corners of the lower heating platform 2, the upper heating platform 3 is slidably arranged on the guide posts 5, a lifting cylinder 6 is vertically arranged below the bottom bracket 1, a piston rod of the lifting cylinder 6 penetrates through the lower heating platform 2 and is connected with the bottom of the upper heating platform 3, namely, the bottom of the lifting cylinder 6 is connected with the bottom bracket 1 through bolts, and a piston rod above the upper heating platform is connected with the bottom of the upper heating platform 3; in this embodiment, a preheating device is disclosed, and the preheating device is divided into two parts, wherein the upper heating platform 3 moves up and down along the guide post 5 under the driving of the lifting cylinder 6, so that the distance between the upper heating platform 3 and the lower heating platform 2 can be adjusted, the preheating is realized mainly through the upper heating platform 3, and the lower heating platform 2 is used as a heat source, so that the temperature of the upper heating platform 3 can be ensured not to be too high, and the preheating effect can be improved.
As shown in fig. 1, the number of the lifting cylinders 6 is two, and the lifting cylinders 6 are arranged at intervals along the X-axis direction, so that the lifting cylinders 6 push the two sides of the upper heating platform 3, and the upper heating platform 3 can be stabilized when moving.
As shown in fig. 1, in order to ensure heat concentration as much as possible, in this embodiment, a baffle 7 is installed around the bottom bracket 1, the baffle 7, the bottom surface of the upper heating platform 3, and the upper surface of the lower heating platform 2 are surrounded and combined to form a heating area, in this embodiment, the baffle 7 surrounds and forms a square area, and for the upper heating platform 3 to move up and down in the square area, the heat generated by the lower heating platform 2 as a heat source can be located in the heating area, and then the heat is transferred to the upper heating platform 3, so as to realize preheating.
As shown in fig. 1, the inner wall of the baffle 7 contacts with the side surface of the upper heating platform 3, so that heat waste can be avoided as much as possible.
For the convenience of wiring and placing the heating frame, each baffle 7 is provided with two gaps 8 at intervals, and the gaps 8 correspond to the handles of the heating frame, so that the heating frame cannot shake during preheating, and the preheating effect is guaranteed.
As shown in fig. 1, a temperature controller 9 is installed above the upper heating platform 3, the heating rod 4 is electrically connected with the temperature controller 9, and the temperature controller 9 is electrically connected with a timer 10; the timer 10 in this embodiment can realize a timing operation, i.e., can control the heating rod 4 to operate for a period of time, while the temperature controller 9 can ensure a heated temperature range.
Example 2:
the embodiment 2 discloses a matrix rectifying electronic product processing technology, which comprises the following steps:
s1: preheating an electronic product to be processed twice by the matrix rectification electronic product preheating device in the embodiment 1;
s2: after preheating, plastic packaging and baking are carried out to obtain a finished product.
Wherein, the step of preheating twice in the step S1 is as follows:
s101: placing the electronic product to be processed on a heating frame, and then placing the heating frame on an upper heating platform;
s102: switching on a power supply of the timer, setting the working time as T1, setting the on temperature of the temperature controller as T1, and switching off the temperature as T2, and preheating the electronic product to be processed for the first time;
s103: after the first preheating is finished, starting a lifting cylinder, reducing the height of the upper heating platform, changing the working time of a timer to be T2, setting the on temperature of a temperature controller to be T3 and the off temperature to be T4, and preheating the electronic product to be processed for the second time to finish the twice preheating of the electronic product to be processed.
Wherein T1 in the step S102 is 20-80S, T1 is 50 degrees, and T2 is 100 degrees; t2 in the step S103 is 5-20S, T3 is 120 degrees, and T4 is 200 degrees.
Wherein, the plastic package process parameters in the step S2 are as follows: the temperature is 150-200 ℃, the time is 60-200 seconds, and the die closing pressure is 30-150Kg/cm 2 Injection molding pressure of 20-100Kg/cm 2 ；
The baking process parameters in the step S2 are as follows: temperature: 120-220 ℃ for 2-24 hours.
In this embodiment, the preheating is performed twice, and the original heating frame is oxidized to different degrees due to inconsistent preheating time, which generally causes serious oxidation of the heating frame, so that the bonding force with the plastic package material is poor, that is, hidden troubles such as poor air tightness and reliability occur. If not preheated, the frame sheet is pressed due to thermal expansion factors, namely, the die is pressed to the surface of the lead during plastic packaging. Meanwhile, the crystal grains are instantly subjected to high temperature, so that the crystal grains and the frame thermally bulge to bring thermal stress impact; in this embodiment 2, a sectional preheating method (low temperature and then high temperature) is adopted, and the high temperature preheating time can be effectively controlled, so that the oxidation degree of the frame piece and the relatively slow rise of the crystal grains to high temperature are controlled, the damage of stress to the frame piece is reduced, the appearance and the electrical quality of the product are finally improved, and the air tightness and the reliability of the product are improved.
In the description of the present invention, numerous specific details are set forth. However, it is understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention, and are intended to be included within the scope of the appended claims and description.
Claims (4)
1. The production method of the matrix rectifying electronic product is characterized by comprising the following steps of:
s1: preheating an electronic product to be processed twice through a matrix rectifying electronic product preheating device; the matrix rectifying electronic product preheating device comprises a bottom bracket, a lower heating platform and an upper heating platform, wherein the lower heating platform is arranged on the bottom bracket through bolts, heating rods are arranged on the lower heating platform, guide posts are fixedly arranged at four corners of the lower heating platform, the upper heating platform is slidably arranged on the guide posts, a lifting cylinder is vertically arranged below the bottom bracket, and a piston rod of the lifting cylinder penetrates through the lower heating platform and is connected with the bottom of the upper heating platform; the number of the lifting cylinders is two, and the lifting cylinders are arranged at intervals along the X-axis direction; baffles are arranged around the bottom support, and the baffles, the bottom surface of the upper heating platform and the upper surface of the lower heating platform are combined in a surrounding mode to form a heating zone; the inner wall of the baffle plate is contacted with the side surface of the upper heating platform; each baffle is provided with two openings at intervals; a temperature controller is arranged above the upper heating platform, the heating rod is electrically connected with the temperature controller, and the temperature controller is electrically connected with a timer;
s2: after preheating, plastic packaging and baking are carried out to obtain a finished product.
2. The method for producing a matrix-type rectifying electronic product according to claim 1, wherein the step S1 of preheating twice comprises the steps of:
s101: placing the electronic product to be processed on a heating frame, and then placing the heating frame on an upper heating platform;
s102: switching on a power supply of the timer, setting the working time as T1, setting the on temperature of the temperature controller as T1, and switching off the temperature as T2, and preheating the electronic product to be processed for the first time;
s103: after the first preheating is finished, starting a lifting cylinder, reducing the height of the upper heating platform, changing the working time of a timer to be T2, setting the on temperature of a temperature controller to be T3 and the off temperature to be T4, and preheating the electronic product to be processed for the second time to finish the twice preheating of the electronic product to be processed.
3. The method for producing a matrix rectifying electronic product according to claim 2, wherein T1 in the step S102 is 20-80S, T1 is 50 degrees, and T2 is 100 degrees; t2 in the step S103 is 5-20S, T3 is 120 degrees, and T4 is 200 degrees.
4. A moment according to claim 3The production method of the array rectifying electronic product is characterized in that the plastic packaging process parameters in the step S2 are as follows: the temperature is 150-200 ℃, the time is 60-200 seconds, and the die closing pressure is 30-150Kg/cm 2 Injection molding pressure of 20-100Kg/cm 2 ；
The baking process parameters in the step S2 are as follows: temperature: 120-220 ℃ for 2-24 hours.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910886022.5A CN110517979B (en) | 2019-09-18 | 2019-09-18 | Preheating device and production method of matrix rectifying electronic product |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910886022.5A CN110517979B (en) | 2019-09-18 | 2019-09-18 | Preheating device and production method of matrix rectifying electronic product |
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| Publication Number | Publication Date |
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| CN110517979A CN110517979A (en) | 2019-11-29 |
| CN110517979B true CN110517979B (en) | 2024-03-19 |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5716207A (en) * | 1995-07-26 | 1998-02-10 | Hitachi Techno Engineering Co., Ltd. | Heating furnace |
| JPH1197431A (en) * | 1997-09-19 | 1999-04-09 | Dainippon Screen Mfg Co Ltd | Heat processing device for substrate |
| JP2000100683A (en) * | 1998-07-22 | 2000-04-07 | Tokyo Electron Ltd | Method and device for heat treatment |
| KR20080018455A (en) * | 2006-08-24 | 2008-02-28 | 세메스 주식회사 | Bake process apparatus and method |
| CN202888142U (en) * | 2012-11-10 | 2013-04-17 | 华中科技大学 | Lift heater |
| CN104494943A (en) * | 2014-12-16 | 2015-04-08 | 天津市亿腾顺泰建筑材料有限公司 | Heating and packaging equipment |
| CN208460724U (en) * | 2018-08-28 | 2019-02-01 | 上海金东唐科技有限公司 | Chip heating device and heating tool |
| CN210429753U (en) * | 2019-09-18 | 2020-04-28 | 扬州虹扬科技发展有限公司 | Preheating device of matrix rectification electronic product |
-
2019
- 2019-09-18 CN CN201910886022.5A patent/CN110517979B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5716207A (en) * | 1995-07-26 | 1998-02-10 | Hitachi Techno Engineering Co., Ltd. | Heating furnace |
| JPH1197431A (en) * | 1997-09-19 | 1999-04-09 | Dainippon Screen Mfg Co Ltd | Heat processing device for substrate |
| JP2000100683A (en) * | 1998-07-22 | 2000-04-07 | Tokyo Electron Ltd | Method and device for heat treatment |
| KR20080018455A (en) * | 2006-08-24 | 2008-02-28 | 세메스 주식회사 | Bake process apparatus and method |
| CN202888142U (en) * | 2012-11-10 | 2013-04-17 | 华中科技大学 | Lift heater |
| CN104494943A (en) * | 2014-12-16 | 2015-04-08 | 天津市亿腾顺泰建筑材料有限公司 | Heating and packaging equipment |
| CN208460724U (en) * | 2018-08-28 | 2019-02-01 | 上海金东唐科技有限公司 | Chip heating device and heating tool |
| CN210429753U (en) * | 2019-09-18 | 2020-04-28 | 扬州虹扬科技发展有限公司 | Preheating device of matrix rectification electronic product |
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| CN110517979A (en) | 2019-11-29 |
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