CN101616545B - Leveling device for circuit board and method for leveling and welding - Google Patents
Leveling device for circuit board and method for leveling and welding Download PDFInfo
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- CN101616545B CN101616545B CN2008101157071A CN200810115707A CN101616545B CN 101616545 B CN101616545 B CN 101616545B CN 2008101157071 A CN2008101157071 A CN 2008101157071A CN 200810115707 A CN200810115707 A CN 200810115707A CN 101616545 B CN101616545 B CN 101616545B
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- screed
- circuit board
- rotating shaft
- leveling plate
- hinge
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Abstract
The invention relates to a leveling device for a circuit board and a method for leveling and welding. The device comprises a bracket, a lower leveling plate and an upper leveling plate, wherein the bracket is provided with a rotating shaft; the lower leveling plate is provided with a hollow part, one side of the lower leveling plate is connected with the rotating shaft, the circumferential side of the hollow part is provided with an inwards sunken terrace, the upper edge of the terrace is matched with the outline of the circuit board, the lower edge of the terrace is provided with a fixed table extending towards the hollow part, the fixed table is provided with a column, and the position of the column corresponds to the position of a fixed hole on the circuit board; the upper leveling plate is connected with the lower leveling plate through a hinge; one surface of the upper leveling plate which is contacted with the circuit board is provided with a lug; and the lug is used for supporting the lower leveling plate when the upper leveling plate is attached to the lower leveling plate through the hinge so that the upper leveling plate is in parallel with the lower leveling plate. The method presses each power device when the upper leveling plate is attached to the lower leveling plate. In the method and the leveling device, power modules can be on the same plane, have good radiating effect when contacting radiating fins, and have high safety.
Description
Technical field
The present invention relates to tooling device, be specifically related to a kind of circuit board leveling apparatus and flatten the method for welding.
Background technology
In decades recently, the fast development of power model and encapsulation technology thereof has caused the great variety of electric and electronic technical field.Current market demands power electronic equipment will have broad range of application, the solution of cutting the garment according to the figure, chip that integrated, intelligent, littler volume and weight, efficient is higher, high-quality low-cost, longer life-span and shorter product development cycle more.Existing numerous research and development achievement constantly provides solution new, economic security in several years in the past, thereby power model is incorporated in a series of industry and the consumer field in large quantities.
The general power model of saying is exactly the module that one or several electron electric power combination of devices are packaged into again.Generally be to comprise 1～6 power electronic device, such as IBGT device, booster diode, rectifier bridge or IPM module etc.But because the big ting model of each device is different; Making each power device in the power module circuit plate is not to be in same horizontal plane, and a lot of devices are the power consumption device in the power device, when being installed to other equipment, is the reinforcement heat radiation; Can contact with fin; And, make the heat dispersion of each power device can not reach best, if the big power device of power consumption does not touch fin because each power device is not in same horizontal plane; Be stored in and fin between can the raise temperature of power module circuit plate of heat, have circuit safety hidden danger.
Summary of the invention
The purpose of this invention is to provide a kind of circuit board leveling apparatus and flatten the method for welding; When this circuit board is the power module circuit plate; Utilize these apparatus and method each device to be in the same plane, the good heat dispersion of ability when the guaranteed output module contacts with fin to the leveling welding of each device on the power module circuit plate; Reduce the circuit board temperature, improve fail safe.
For realizing above-mentioned purpose, the present invention adopts following technical scheme:
A kind of circuit board leveling apparatus, this device comprises: the support that rotating shaft is installed; Following screed with cut-out; The one of which side is connected with said rotating shaft; The periphery of said cut-out is provided with the step that caves inward, and the top edge of said step and the outline of circuit board match, and the lower limb of said step is provided with the fixed station that extends to cut-out; Said fixed station is provided with cylinder, and the position of fixing hole is corresponding on the position of said cylinder and the circuit board; Last screed is connected with said screed down in the side near said rotating shaft through hinge, and the one side that said upward screed contacts with said circuit board is provided with projection; When said go up screed through hinge to said down when screed is fitted, said projection is supported on the said screed down, make said go up screed with said under screed parallel.
Wherein, Said support comprises base plate, side plate and supporting bracket; Said side plate is positioned at the both sides of base plate and vertical with said base plate; The two ends of said rotating shaft are installed in respectively on the said side plate, and said supporting bracket is positioned at the other both sides of base plate and vertical with said base plate, are respectively applied for to support screed and last screed down.
Wherein, This device also comprises the plurality of support columns that is positioned on the screed; Said support column is distributed in the edge on the screed, on said screed through hinge to said down when screed is fitted, relative with the cut-out edge of said screed down; When being used on said screed down, placing circuit board, be supported on the edge of said circuit board.
Wherein, said support column is four, lays respectively at said four angular zones of going up screed.
Wherein, this device also comprises and is positioned at the said kayser of going up on the screed and the draw-in groove that is positioned on the said screed down, and to said down when screed is fitted, said kayser gets into said draw-in groove to screed through hinge on said.
Wherein, said kayser, draw-in groove are two pairs, respectively through being bolted to said two ends of going up on screed and the following screed away from said rotating shaft one side.
Wherein, said projection is two, lays respectively at the said mid portion that connects the both sides of axis perpendicular to hinge of going up on the screed.
Wherein, this device also comprises the groove that is positioned on the following screed, and said groove is lower than or is parallel to said step, and is connected with said step.
Wherein, said groove is two, lays respectively at the mid portion that is parallel to the both sides of rotating shaft on the said screed down.
The present invention also provides a kind of method of using said apparatus to flatten welding, and this method may further comprise the steps: will descend screed to center on rotating shaft and rotate, and turn to said screed down and be in level; The circuit board that does not insert power device is placed on the step of said down screed cut-out, make cylinder on the fixed station pass the fixing hole of circuit board; On said circuit board, insert power device; To go up screed and fit, push said power device, be supported on the said screed down up to the said projection of going up on the screed to said screed down; Last screed after pushing and following screed are overturn, and the back side that makes said time screed up; Weld the power device on the said circuit board; Welded, the said screed of going up has been opened, taken out said circuit board.
Utilize apparatus for leveling provided by the invention and flatten the method for welding; Have following beneficial effect: when circuit board is the power module circuit plate, make the power module circuit plate in whole process of preparation, each device remains on same horizontal plane; Flatten effective; Make the power module circuit plate with can fully dispel the heat after fin contacts, greatly reduce the temperature of power module circuit plate, security performance is high.
Description of drawings
Fig. 1 is the not vertical view of device, circuit board of circuit board leveling apparatus of the present invention;
Fig. 2 is the vertical view behind the circuit board leveling apparatus fixing circuit board of the present invention;
Fig. 3 is the vertical view after the downward screed of screed is fitted in the present invention;
Fig. 4 rotates the back vertical view at the screed back side down to the left for the present invention.
Fig. 5 flattens the method flow diagram of welding for the embodiment of the invention.
Among the figure: 101, base plate; 102, side plate; 103, left side supporting bracket; 103 ' right side supporting bracket; 2, following screed; 201, step; 202, cut-out; 203, fixed station; 204, bolt; 205, draw-in groove; 206, groove; 3, go up screed; 301, projection; 302, kayser; 303, support column; 4, hinge; 5, rotating shaft; 6, power module circuit plate.
Embodiment
The power model apparatus for leveling that the present invention proposes and flatten the method for welding specifies as follows in conjunction with accompanying drawing and embodiment.
Circuit board in the present embodiment is a power module circuit plate 6.
Be depicted as the vertical view of power model apparatus for leveling of the present invention like Fig. 1,3, this device comprises: the support that rotating shaft 5 is installed; Following screed 2 with cut-out 202; Following screed 2 one sides are connected with rotating shaft 5 and rotate around said rotating shaft 5; The periphery of cut-out 202 is provided with the step 201 that caves inward; The outline of the top edge of step 201 and power module circuit plate 6 matches, and the lower limb of step 201 is provided with the fixed station 203 that extends to cut-out 202, and fixed station 203 is provided with cylinder; Cylinder is a bolt 204 in the present embodiment, and the position of fixing hole is corresponding on the position of bolt 204 and the power module circuit plate 6; Last screed 3; Be connected with following screed 2 in a side through hinge 4 near rotating shaft 5; The one side that last screed 3 contacts with circuit board has projection 301; Projection 301 is used for, being supported on down on the screed 2 during through downward screeds 2 applyings of hinge 4 at last screed 3, makes screed 3 parallel with following screed 4.
Shown in Figure 5 for the flow chart of power model flatening method of the present invention, the method comprising the steps of:
S501 will descend screed 2 to rotate around rotating shaft 5, turn to down screed 2 and be in level by stent support; S502 places down the power module circuit plate 6 that does not insert power device on the step 201 of screed cut-out 202 periphery, makes bolt 204 on the fixed station 203 pass the fixing hole of power module circuit plate 6; S503 inserts power device on power module circuit plate 6; S504 rotates through hinge 4 and to go up screed 3 downward screeds 2 applyings, pushes power device, is supported on down on the screed 2 up to 3 projection 301 on the last screed; S505 overturns last screed after pushing 3 and following screed 2, and the back side that makes down screed 2 up; S506, the power device on the bonding power device circuitry plate 6; S507 will go up screed 3 through hinge 4 after having welded and open take-off output module board 6.
The structure of power model apparatus for leveling of the present invention and the process of leveling welding are detailed below.
Like Fig. 3, shown in Figure 4, the support in the present embodiment comprises base plate 101, side plate 102, left side supporting bracket 103 and right side supporting bracket 103 ', and side plate 102 is positioned at the both sides of base plate 101 and vertical with base plate 101; The two ends of rotating shaft 5 are installed in the middle part of side plate 102 respectively; Be convenient to make down screed 2 to drive to go up leveling 3 plates and rotate around rotating shaft 5, two supporting brackets are positioned at the other both sides of base plate 101 and vertical with base plate 101, shown in figure; When screed 2 turns to the right side down; Right side supporting bracket 103 ' supports down that screed 2 makes it be in level, and when last screed 3 left, left side supporting bracket 103 plays a supportive role and makes it be in level; Right side supporting bracket 103 ' can be the run-through board that is communicated with biside plate 102, also can protruding block be set and play same supporting role by each end at biside plate 102.
Power model apparatus for leveling as shown in Figure 1 is the vertical view of device, circuit board not, is connected also and can rotates around rotating shaft 5 with rotating shaft 5 on the following screed 2, connects through hinge 4 and goes up screed 3; Last screed 3 screed 2 directions is downwards fitted, and following screed 2 screed 3 directions that also can make progress are fitted, and both can rotate around rotating shaft 5 together under the drive of screed 2 down; Following screed 2 is provided with cut-out 202, and the periphery of cut-out 202 is provided with the step 201 that caves inward, and the outline of the top edge of step 201 and power module circuit plate 6 matches; Like this power module circuit plate 6 can be shelved on the step 201, the lower limb of step 201 is provided with the fixed station 203 that extends to cut-out 202, and fixed station 203 is provided with bolt 204; The position of fixing hole is corresponding on the position of bolt 204 and the power module circuit plate 6; Like this power module circuit plate 6 is placed on the step 201, through the bolt on the fixed station 203 204 that power module circuit plate 6 is fixing, can prevent that the power module circuit plate is moved when rotating along with following screed 2; According to shown in Figure 1; Be provided with 4 fixed stations 203 in the present embodiment, fixed station 203 is provided with 5 bolts 204, and the position of fixing hole is relevant on the position of fixed station 203 of the present invention and the power module circuit plate 6; Be not limited to the set-up mode in the present embodiment; Also be provided with two pairs of draw-in grooves 205 and groove 206 on the following screed 2, groove 206 is lower than or is parallel to step 201 and is connected with step 201, and groove 206 is two; Lay respectively at down the mid portion that is parallel to the both sides of rotating shaft 5 on the screed 2; Be convenient to power module circuit plate 6 is taken out in the leveling back that finishes, the position of kayser 302 is corresponding on draw-in groove 205 and the last screed 3, respectively through being bolted to down on the screed 2 two ends away from said rotating shaft one side.
Last screed 3 in the present embodiment; Be connected with following screed 2 in the side near rotating shaft 5 through hinge 4, the one side that last screed 3 contacts with power module circuit plate 6 has projection 301, and projection 301 is used for when last screed 3 is fitted through hinge 4 downward screeds 2; Be supported on down on the screed 2; Make screed 3 and following screed 2 keeping parallelisms, projection 301 is two in the present embodiment, lays respectively on the screed 3 mid portion perpendicular to the both sides of hinge connection axis; Last screed 3 is provided with two kaysers 302, respectively through being bolted on the screed 6 two ends away from rotating shaft 5 one sides, when last screed 3 is fitted through hinge 4 downward screeds 2, in the draw-in groove 205 that kayser 302 gets on the screed 2; Four support columns 303 also are set on the last screed 3; Lay respectively at four angular zones of screed 3; When last screed 3 is fitted through hinge 4 downward screeds 2, relative with cut-out 202 edges of following screed 2, be used for when cut-out 202 places power module circuit plate 6; Be supported on the edge of power module circuit plate 6, prevent 6 run-off the straights of power module circuit plate.
Going up screed 3 in the present embodiment is clear glass, can know and see inner power module circuit plate structure.
To flatten the procedure of welding following for the power model apparatus for leveling in the present embodiment:
As shown in Figure 1, will descend screed 2 to open to the right, make its formation state that is supported on the level that is on the right side supporting bracket 103 ', will go up screed 3 and open to the left, it is supported on the supporting bracket 103 of left side;
The power module circuit plate 6 that does not insert power device is placed down on the step 201 of the cut-out 202 on the screed 2; The step 201 that power module circuit plate 6 is caved inward by cut-out 202 edges reaches the fixed station 203 that is connected with step 201 and supports; The fixing hole of power module circuit plate 6 passes the bolt 204 on the fixed station 201; The entire circuit plate is in level; Bolt 204 end faces that wherein pass fixing hole are lower than the power device circuit board surface, and power device itself has pin to pass circuit board;
As shown in Figure 2, be on the power module circuit plate 6 of level and be inserted into power device, power device height at this moment is not to be in the same horizontal plane, it highly is higher than the height of screed 3 upper protruding blocks 301;
Shown in Figure 3; To go up screed 3 downward screed 2 directions through hinge 4 fits; By the power device that presses power module circuit plate 6 on the screed 3, be supported on down on the screed 2 up to projection 301, go up kayser 302 on the screed 3 simultaneously and slip into down in the draw-in groove 205 on the screed 2 and be stuck; On the last screed 3 support column 303 by be pressed in circuit board around, at this moment on the power module circuit plate 6 each power device by the leveling in same horizontal plane;
Shown in Figure 4, the last screed 3 after fitting is rotated through rotating shaft 5 with following screed 2 to the left, be supported on the supporting bracket 103 of left side up to last screed 3, make down screed 2 back sides up, see through cut-out 202 and can weld each power device;
After welding finishes; Last screed 3 after will fitting again rotates through rotating shaft 5 with following screed 2 to the right; Be supported on the right side supporting bracket 103 up to following screed 2, moment can break away from draw-in grooves 205 with the transparent kayser 302 of going up leveling face 3 a little, will go up screed 3 to open; Through following screed 2 upper grooves 206 power module circuit plate 6 is taken out, accomplish whole process.
Above execution mode only is used to explain the present invention; And be not limitation of the present invention; The those of ordinary skill in relevant technologies field under the situation that does not break away from the spirit and scope of the present invention, can also be made various variations; Therefore all technical schemes that are equal to also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.
Claims (10)
1. a circuit board leveling apparatus is characterized in that, this device comprises:
The support of rotating shaft is installed;
Following screed with cut-out; The one of which side is connected with said rotating shaft; The periphery of said cut-out is provided with the step that caves inward, and the top edge of said step and the outline of circuit board match, and the lower limb of said step is provided with the fixed station that extends to cut-out; Said fixed station is provided with cylinder, and the position of fixing hole is corresponding on the position of said cylinder and the circuit board;
Last screed is connected with said screed down in the side near said rotating shaft through hinge, and the one side that said upward screed contacts with said circuit board is provided with projection;
When said go up screed through hinge to said down when screed is fitted, said projection is supported on the said screed down, make said go up screed with said under screed parallel.
2. circuit board leveling apparatus as claimed in claim 1; It is characterized in that; Said support comprises base plate, side plate and supporting bracket, and said side plate is positioned at the both sides of base plate and vertical with said base plate, and the two ends of said rotating shaft are installed in respectively on the said side plate; Said supporting bracket is positioned at the other both sides of base plate and vertical with said base plate, is respectively applied for to support screed and last screed down.
3. circuit board leveling apparatus as claimed in claim 1; It is characterized in that this device also comprises the plurality of support columns that is positioned on the screed, said support column is distributed in the edge on the screed; On said screed through hinge to said down when screed is fitted; Relative with the cut-out edge of said screed down, when being used on said screed down, placing circuit board, be supported on the edge of said circuit board.
4. circuit board leveling apparatus as claimed in claim 3 is characterized in that said support column is four, lays respectively at said four angular zones of going up screed.
5. circuit board leveling apparatus as claimed in claim 1; It is characterized in that; This device also comprises and is positioned at the said kayser of going up on the screed and the draw-in groove that is positioned on the said screed down, and to said down when screed is fitted, said kayser gets into said draw-in groove to screed through hinge on said.
6. circuit board leveling apparatus as claimed in claim 5 is characterized in that, said kayser, draw-in groove are two pairs, respectively through being bolted to said two ends of going up on screed and the following screed away from said rotating shaft one side.
7. circuit board leveling apparatus as claimed in claim 1 is characterized in that said projection is two, lays respectively at the said mid portion that connects the both sides of axis perpendicular to hinge of going up on the screed.
8. circuit board leveling apparatus as claimed in claim 1 is characterized in that, this device also comprises the groove that is positioned on the following screed, and said groove is lower than or is parallel to said step, and is connected with said step.
9. circuit board leveling apparatus as claimed in claim 8 is characterized in that said groove is two, lays respectively at the mid portion that is parallel to the both sides of rotating shaft on the said screed down.
10. a device that uses claim 1 flattens the method for welding, it is characterized in that this method may further comprise the steps:
To descend screed to center on rotating shaft and rotate, and turn to said screed down and be in level;
The circuit board that does not insert power device is placed on the step of said down screed cut-out, make cylinder on the fixed station pass the fixing hole of circuit board;
On said circuit board, insert power device;
To go up screed and fit, push said power device, be supported on the said screed down up to the said projection of going up on the screed to said screed down;
Last screed after pushing and following screed are overturn, and the back side that makes said time screed up;
Weld the power device on the said circuit board;
Welded, the said screed of going up has been opened, taken out said circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101157071A CN101616545B (en) | 2008-06-26 | 2008-06-26 | Leveling device for circuit board and method for leveling and welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101157071A CN101616545B (en) | 2008-06-26 | 2008-06-26 | Leveling device for circuit board and method for leveling and welding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101616545A CN101616545A (en) | 2009-12-30 |
| CN101616545B true CN101616545B (en) | 2012-01-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101157071A Active CN101616545B (en) | 2008-06-26 | 2008-06-26 | Leveling device for circuit board and method for leveling and welding |
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| Country | Link |
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| CN (1) | CN101616545B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103522359B (en) * | 2013-09-30 | 2016-04-13 | 捷星显示科技（福建）有限公司 | A kind of point plate tool and using method thereof of circuit board |
| CN109270091A (en) * | 2018-09-29 | 2019-01-25 | 中联精工（天津）有限公司 | A kind of detection device panel |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101044810A (en) * | 2004-09-23 | 2007-09-26 | 哈米尔顿森德斯特兰德公司 | Combination igbt mounting method |
| CN201226615Y (en) * | 2008-06-26 | 2009-04-22 | 海尔集团公司 | Apparatus for leveling circuit board |
-
2008
- 2008-06-26 CN CN2008101157071A patent/CN101616545B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101044810A (en) * | 2004-09-23 | 2007-09-26 | 哈米尔顿森德斯特兰德公司 | Combination igbt mounting method |
| CN201226615Y (en) * | 2008-06-26 | 2009-04-22 | 海尔集团公司 | Apparatus for leveling circuit board |
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| Publication number | Publication date |
|---|---|
| CN101616545A (en) | 2009-12-30 |
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