CN209055633U - Chip heating tool - Google Patents

Abstract

A kind of chip heating tool, including lower mold assemblies and upper die component, lower mold assemblies include pedestal, support platform, load bearing unit, heating unit and cooling unit, opening is provided in support platform, load bearing unit includes supporting plate and flip lid, targeting port and card slot are provided on supporting plate, targeting port is connected to card slot, flip lid lid is located on supporting plate, supporting plate is mounted in support platform, targeting port and open communication, heating unit includes elevating mechanism and heating mechanism, elevating mechanism is mounted on the lower section of support platform, heating mechanism is mounted on the lift side of elevating mechanism, the fire end of heating mechanism can stretch in targeting port from opening, cooling unit is used for cooled wafer and supporting plate.Upper die component is mounted on lower mold assemblies.Before carrying out chip heating, the placement location of chip determines that its position is solid and reliable after chip is placed, and not easily shifted, the contact with heating member is close, and heating location is accurate, and heating effect is good, improves the accuracy of detection.

Description

Chip heating tool

Technical field

The utility model relates to chip detecting equipment fields, in particular to a kind of chip heating tool.

Background technique

Chip, also known as microcircuit (microcircuit), microchip (microchip), integrated circuit, refer to include it is integrated The silicon wafer of circuit, volume very little, often a part of computer or other electronic equipments.Chip generally refers to integrated circuit Support plate and integrated circuit after design, manufacture, encapsulation, test as a result, the usually independence that can be used immediately Entirety.

Heat can be generated during chip operation, the temperature that heat will lead to chip increases, temperature, atmospheric pressure etc. it is external because Element is the important factor for influencing chip operation.

Be influenced by temperature when in order to study chip operation, there is device for heating chip on the market, by chip plus It observes the variation of the working performance of chip during heat to set temperature in real time by detection device, and then adjusts chip Working environment provides good environment for the work of chip.

Inventor has found that equipment used in traditional chip heating process at least has the following disadvantages: under study for action

In chip heating, directly chip is heated using heating member, the position of chip easily changes, and heats uneven It is even.

Utility model content

The purpose of this utility model is to provide a kind of chip heating tools, to improve position in traditional chip heating process Set not secured enough, heating effect difference problem.

The embodiments of the present invention are achieved in that

Based on above-mentioned purpose, the utility model provides a kind of chip heating tool comprising has:

Lower mold assemblies, the lower mold assemblies include pedestal, support platform, load bearing unit, heating unit and cooling unit, The chassis interior is provided with chamber, and the chamber is provided with switch gate, and opening, the support are provided in the support platform On the base, the load bearing unit includes supporting plate and flip lid to stage+module, is provided with targeting port on the supporting plate And the card slot for being embedded chip to be heated, the targeting port are connected to the card slot, the flip lid lid is located at the support On plate, the flip lid wraps up the chip to be heated with the supporting plate, and the supporting plate is mounted in the support platform, The targeting port and the open communication；The heating unit includes elevating mechanism and heating mechanism, the elevating mechanism peace Mounted in the lower section of the support platform, the heating mechanism is mounted on the lift side of the elevating mechanism, the elevating mechanism liter During drop, the fire end of the heating mechanism can stretch in the targeting port from the opening, and with it is described to be heated Chip fitting；The cooling unit is placed in the chamber, and the cooling unit includes placing frame, limit plate, partition and wind Fan, the placing frame have recessed portion, and the limit plate is mounted in the recessed portion, and the limit plate is by the depressed section Every forming the first placing groove and the second placing groove for placing the support plate, the notch of first placing groove and described the The notch of two placing grooves is located at the same side, and ventilation opening is provided on the limit plate, and the partition is mounted on described second and places In slot, second placing groove is separated to form two side-by-side placement region, the ventilation opening connection described two by the partition A placement region, the fan are mounted in first placing groove, and the air outlet of the fan is connected to the ventilation opening；

Upper die component, the upper die component include top mold holder, pressing plate and lifting assembly, and the top mold holder is mounted on described In support platform, the lifting assembly is mounted in the top mold holder, and the lifting assembly is drivingly connected the pressing plate, drives institute State pressing plate along the direction perpendicular to the support platform close to or far from the flipping motion.

In the utility model preferred embodiment, the support platform includes support plate and supporting leg, the support Leg is supported in the support plate, and the opening is set in the support plate, and the supporting plate is mounted in the support plate, The top mold holder is mounted in the support plate.

In the utility model preferred embodiment, it is provided with the first locating piece in the support plate, on the supporting plate It is provided with the second locating piece, first locating piece and second locating piece are engaged by clamping.

In the utility model preferred embodiment, first locating piece includes positioning column, the positioning column perpendicular to The support plate setting, second locating piece includes locating slot, and the locating slot is located at the side of the supporting plate, described fixed Position column is connected in the locating slot.

In the utility model preferred embodiment, the placing frame includes front side board, right side plate, left plate, right side plate And bottom plate, the front side board, the left plate, the back side panel and the right side plate are sequentially connected end to end that surround both ends spacious The structure of mouth, the bottom plate are mounted on the bottom of the front side board, the left plate, the back side panel and the right side plate, And cover an opening；The limit plate is connect with the bottom plate, left plate and right side plate, the limit plate and it is described before Second placing groove is limited between side plate, and first placing groove is limited between the limit plate and the back side panel.

In the utility model preferred embodiment, limiting slot, the flip lid are provided in a plate face of the supporting plate On be provided with retention bead, the retention bead is plugged in the limiting slot.

In the utility model preferred embodiment, set in a limit plate plate face corresponding with second placing groove It is equipped with groove, the ventilation opening is connected to the groove, the slot bottom interval setting of the partition and the groove.

In the utility model preferred embodiment, it is provided with sliding channel on the supporting plate and leads to the sliding The card hole of road connection, one end of the sliding channel extend on the side of the supporting plate, and peace is slided in the sliding channel Equipped with snap-gauge, second clamping block is mounted on the snap-gauge, and limit corresponding with the card hole is provided on the snap-gauge Bolt is plugged in position hole, the card hole and the limit hole.

In the utility model preferred embodiment, the heating mechanism includes ceramic heating flake and heat transfer head, described Ceramic heating flake is mounted in the heat transfer head, and the heat transfer head is mounted on the lift side of the elevating mechanism, the heat transfer head It can extend into the targeting port and be fitted on the chip to be heated.

In the utility model preferred embodiment, the partition is provided with multiple, and multiple partition parallel intervals are set It sets, second placing groove is separated to form three or more placement regions side by side by multiple partitions.

The beneficial effect of the utility model embodiment is:

In conclusion the utility model embodiment provides a kind of chip heating tool, and it is simple and reasonable, convenient for system Make processing, installation with it is easy to use, meanwhile, before carrying out chip heating, the placement location determination of chip, its position after chip placement Set solid and reliable, not easily shifted, the contact with heating member is close, and heating location is accurate, and heating effect is good, improves the accurate of detection Property.It is specific as follows:

Chip heating tool provided in this embodiment is first opened flip lid with supporting plate, support when needing to heat chip Card slot on plate is exposed, and chip is installed according to the cloth set direction of card slot, and chip realizes accurate positionin by card slot, And the position of chip and supporting plate is compact, chip is hardly damaged.After chip is installed, flip lid lid is located on supporting plate, is turned over Lid clamps chip therebetween with supporting plate collective effect.Then supporting plate is placed in support platform, on supporting plate Targeting port and support platform on register.After the position of chip and support platform determines, start elevating mechanism, lifting The lift side of mechanism is moved towards support platform, until heating mechanism is delivered to the position being bonded with chip, in the process, Fire end in heating mechanism enters from opening, and enters targeting port after passing through opening, under the guiding role of targeting port It is fitted at the position to be heated of chip to be heated, realizes the heating for treating heating chip.It is grasped in the heating process of entire chip To make convenient reliable, the position of chip is fixed, and it is not easily shifted, good condition is provided for chip heating, chip, which heats, more pacifies Entirely, and heating location is accurate, and subsequent testing result is more accurate.

Heating tool provided in this embodiment includes above-mentioned chip heating tool, all excellent with chip heating tool Point.

Detailed description of the invention

It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by Regard the restriction to range as, for those of ordinary skill in the art, without creative efforts, may be used also To obtain other relevant attached drawings according to these attached drawings.

Fig. 1 is the schematic diagram of the chip heating tool of the utility model embodiment；

Fig. 2 is the schematic diagram of the support platform of the chip heating tool of the utility model embodiment；

Fig. 3 is the schematic diagram of the load bearing unit of the chip heating tool of the utility model embodiment；

Fig. 4 is the schematic top plan view of the load bearing unit of the chip heating tool of the utility model embodiment；

Fig. 5 be Fig. 4 in A-A to schematic diagram；

Fig. 6 is that the chip of the chip heating tool of the utility model embodiment is mounted on the schematic diagram on supporting plate；

Fig. 7 is the schematic diagram of the supporting plate of the chip heating tool of the utility model embodiment；

Fig. 8 is the first clamping block of the chip heating tool of the utility model embodiment and the schematic diagram of the second clamping block；

Fig. 9 is the schematic diagram of the heating mechanism of the chip heating tool of the utility model embodiment；

Figure 10 is the structural schematic diagram of the chip heating tool of the utility model embodiment；

Figure 11 is the schematic diagram of the cooling unit of the utility model embodiment；

Figure 12 is the placing frame of the cooling unit of the utility model embodiment and the schematic diagram of limit plate；

Figure 13 is the schematic diagram of the placing frame of the cooling unit of the utility model embodiment, limit plate and fan；

Figure 14 is the schematic diagram of the partition of the cooling unit of the utility model embodiment；

Figure 15 is the application schematic diagram of the cooling unit of the utility model embodiment.

Icon: 001- chip to be heated；10- lower mold assemblies；20- upper die component；11- pedestal；100- support is flat Platform；110- support plate；120- supporting leg；130- opening；140- plummer；200- load bearing unit；210- supporting plate； 211- card slot；212- limiting slot；213- clamping groove；214- sliding channel；215- card hole；216- lug boss；217- is led To mouth；220- snap-gauge；221- limit hole；The second clamping block of 230-；231- mounting portion；The clamping portion 232-；233- guiding Inclined-plane；240- flip lid；The first clamping block of 250-；The first locating piece of 260-；The second locating piece of 270-；300- heating mechanism； 310- ceramic heating flake；320- heat transfer head；400- elevating mechanism；002- support plate；003- placing frame；004- first is placed Slot；The second placing groove of 005-；006- front side board；007- right side plate；008- left plate；009- notch；010- back side panel； 011- bottom plate；012- flip lid；013- heat release hole；014- limit plate；015- ventilation opening；016- groove；017- partition； The first plate of 018- portion；The second plate of 019- portion；The equal air port 020-；021- fillet；022- fan；023- battery.

Specific embodiment

It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Usually here in attached drawing description and The component of the utility model embodiment shown can be arranged and be designed with a variety of different configurations.

Therefore, requirement is not intended to limit to the detailed description of the embodiments of the present invention provided in the accompanying drawings below The scope of the utility model of protection, but it is merely representative of the selected embodiment of the utility model.Based in the utility model Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all Belong to the range of the utility model protection.

It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.

In the description of the present invention, it should be noted that the orientation of the instructions such as term " on ", "lower", "inner", "outside" Or positional relationship be based on the orientation or positional relationship shown in the drawings or the utility model product using when usually put Orientation or positional relationship is merely for convenience of describing the present invention and simplifying the description, rather than the dress of indication or suggestion meaning It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to the utility model Limitation.In addition, term " first ", " second " are only used for distinguishing description, it is not understood to indicate or imply relative importance.

In the description of the present invention, it should also be noted that, unless otherwise clearly defined and limited, term " is set Set ", " installation ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally Connection；It can be mechanical connection, be also possible to be electrically connected；Can be directly connected, can also indirectly connected through an intermediary, It can be the connection inside two elements.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition The concrete meaning of language in the present invention.

It should be noted that in the absence of conflict, the feature in the embodiments of the present invention and embodiment can To be combined with each other.

Embodiment

Please refer to Fig. 1-Figure 15, chip heating tool provided in this embodiment comprising have lower mold assemblies 10 and upper mold group Part 20, lower mold assemblies 10 include pedestal, support platform 100, load bearing unit 200, heating unit and cooling unit.

Pedestal 11 is internally provided with chamber, and chamber is provided with switch gate, is provided with opening 130 in the support platform 100, Support platform 100 is mounted on the pedestal 11, and the load bearing unit 200 includes supporting plate 210 and flip lid 240, described to hold Targeting port 217 and the card slot 211 for being embedded chip 001 to be heated, the targeting port 217 and institute are provided on supporting plate 210 The connection of card slot 211 is stated, 240 lid of flip lid is located on the supporting plate 210, and the flip lid 240 is with the supporting plate 210 by institute Chip 001 to be heated is stated to wrap up, the supporting plate 210 is mounted in the support platform 100, the targeting port 217 with it is described 130 connection of opening, the heating unit includes elevating mechanism 400 and heating mechanism 300, and the elevating mechanism 400 is mounted on The lower section of the support platform 100, the heating mechanism 300 are mounted on the lift side of the elevating mechanism 400, the elevator In 400 lifting process of structure, the fire end of the heating mechanism 300 can stretch to the targeting port 217 from the opening 130 It is interior, and be bonded with the chip 001 to be heated.

Cooling unit is placed in chamber, and cooling unit includes placing frame 003, limit plate 014, partition 017, fan 022, is put Frame 003 is set with recessed portion, limit plate 014 is mounted in recessed portion, and recessed portion is separated to form the first placing groove by limit plate 014 004 and the second placing groove 005 for placing supporting plate 210, the notch of the first placing groove 004 and the second placing groove 005 Notch is located at the same side, and ventilation opening 015 is provided on limit plate 014, and partition 017 is mounted in the second placing groove 005, partition Second placing groove 005 is separated to form two side-by-side placement region by 017, and ventilation opening 015 is connected to two placement regions, fan 022 is mounted in the first placing groove 004, and the air outlet of fan 022 is connected to ventilation opening 015.

Chip heating tool provided in this embodiment first beats flip lid 240 and supporting plate 210 when needing to heat chip It opens, the card slot 211 on supporting plate 210 is exposed, and chip is installed according to the cloth set direction of card slot 211, and chip is by card Slot 211 realizes accurate positionin, and the position of chip and supporting plate 210 is compact, and chip is hardly damaged.After chip is installed, The lid of flip lid 240 is located on supporting plate 210, flip lid 240 clamps chip therebetween with 210 collective effect of supporting plate.So Supporting plate 210 is placed in support platform 100 afterwards, the targeting port 217 on supporting plate 210 and the opening in support platform 100 130 alignment.After the position of chip and support platform 100 determines, start elevating mechanism 400, the lift side court of elevating mechanism 400 It is moved to support platform 100, until heating mechanism 300 is delivered to the position being bonded with chip, in the process, heating mechanism Fire end on 300 enters from opening 130, and enters targeting port 217 after passing through opening 130, in the guiding of targeting port 217 It is fitted under effect at the position to be heated of chip 001 to be heated, realizes the heating for treating heating chip 001.Entire chip Operate convenient reliable in heating process, the position of chip is fixed, and it is not easily shifted, it is heated for chip and provides good condition, core Piece heating is safer, and heating location is accurate, and subsequent testing result is more accurate.

Meanwhile after the completion of chip detection, need to carry out cooling processing to supporting plate 210 and chip, by supporting plate 210 After being placed on placement region, the case where supporting plate 210 and fan 022 separate, be independent of each other, be less prone to collision.It needs to carry out When supporting plate 210 is cooling, supporting plate 210 is placed on placement region, the placement of supporting plate 210 guarantees that supporting plate 210 is substantially in Upright state, big with the contact area of air, cooling velocity faster, then starts fan 022, fan 022 is by air from ventilation Mouth 015 is delivered in the second placing groove 005, and the air of flowing is contacted with the supporting plate 210 being located in the second placing groove 005, will Temperature on supporting plate 210 is taken away, and fan 022 is constantly dried towards the second placing groove 005, accelerates 210 surrounding of supporting plate empty The cooling of supporting plate 210 is realized in the flowing of gas.In 210 cooling procedure of supporting plate, high degree of automation does not need manually to carry out Intervene, reduce labor intensity, 210 cooling velocity of supporting plate is fast, takes out from placing frame 003 after the completion of cooling and continues on for trying It tests, it is more convenient to use.

Optionally, pedestal 11 is cuboid structure, the chamber with cuboid inside pedestal 11, in the front of chamber It is provided with opening, switch gate is hinged on opening, turns on the switch door, and supporting plate 210 is placed in cooling unit and is cooled down, cold But supporting plate 210 can be taken out after and is used convenient for next time.Obviously, it can be set in the surrounding of pedestal 11 and switch gate Gas outlet is set, heat dissipation is increased.

It should be noted that support platform 100 may include support plate 110 and supporting leg 120, support in the present embodiment Plate 110 is rectangular slab, and supporting leg 120 can be set four, and four supporting legs 120 are separately mounted to four angles of support plate 110 Place, every supporting leg 120 are provided with frustum cone structure far from the end of support plate 110, increase contact area, support more steady. Obviously, in other embodiments, supporting leg 120 can be set three, five etc., alternatively, supporting leg 120 can be set to it is adjustable Height structure is saved, adaptation range is wider.

Further, the top plate face of support plate 110 is equipped with plummer 140, and plummer 140 is screwed onto support plate 110 On, it is provided on plummer 140 and 130 corresponding through-holes of opening.

Plummer 140 can be rectangular plate-like, and the circumferentially-spaced of plummer 140 is placed with the first locating piece 260, and first is fixed Position part 260 can be cylindrical positioning column, and the first locating piece 260 is arranged perpendicular to plummer 140.It is corresponding, in supporting plate It is provided with the second locating piece 270 on 210, the second locating piece 270 is locating slot, and the quantity of the quantity of locating slot and positioning column is one by one It is corresponding, multiple locating slots along supporting plate 210 circumferentially-spaced arrangement, it is clear that the position of locating slot and the position one of positioning column One is corresponding, in this way, positioning column and locating slot cooperation, play the setting position that supporting plate 210 is limited to plummer 140, support Plate 210 is not easily shifted.

Further, positioning column is set as spherical surface far from the end face of plummer 140, has guiding role, is convenient for positioning column It is plugged in corresponding locating slot.

Top mold holder is installed on the supporting plate.

In the present embodiment, the restriction of supporting plate 210 and flip lid 240 collective effects realization chip position.Supporting plate 210 can be with For rectangular slab, setting is respectively arranged with a lug boss 216, lug boss 216 on two sides of the length direction of supporting plate 210 Can be rectangular strip, after supporting plate 210 is mounted on plummer 140, lug boss 216 and the interval of plummer 140 are arranged, in this way, Supporting plate 210 is picked and placed convenient for operating projection portion 216, is operated convenient reliable.There are two fixed for installation in 210 1 plate face of supporting plate Position block, two locating pieces are spirally connected with supporting plate 210, and two locating pieces are intervally arranged along 210 width direction of supporting plate, two positioning Block and supporting plate 210 form limiting slot 212, the generally rectangular shaped slot of limiting slot 212.Clamping groove is provided on each locating piece 213, clamping groove 213 includes the first slot section and the second slot section, and one end of the first slot section extends in limiting slot 212, the second slot Duan Liantong the first slot section, and the groove width of the second slot section is greater than the groove width of the first slot section.

Further, sliding channel 214 is provided on supporting plate 210, sliding channel 214 is that rectangle is poroid, and sliding is logical Length direction of the road 214 with limiting slot 212 along supporting plate 210 is intervally arranged, and is provided with and slides in a plate face of supporting plate 210 The card hole 215 that dynamic channel 214 is connected to, the plate face and 211 place plate face of card slot for being provided with card hole 215 are same plate face, and sliding is logical The length direction in road 214 is parallel with the length direction of supporting plate 210, and one end along its length of sliding channel 214 extends To the side of supporting plate 210, sliding is provided with snap-gauge 220 in sliding channel 214, and snap-gauge 220 is rectangular slab, on snap-gauge 220 It is provided with limit hole 221, the second clamping block 230 is installed on snap-gauge 220, snap-gauge 220 is slidably arranged in sliding channel 214, Meanwhile card hole 215 can be connected to limit hole 221 in 220 sliding process of snap-gauge, at this point, being plugged on 215 He of card hole using bolt The relatively fixed of snap-gauge 220 and supporting plate 210, and then the fixation of the second clamping block 230 of realization are realized in location hole.

It should be noted that the second clamping block 230 includes mounting portion 231 and clamping portion 232, mounting portion 231 is mounted on On snap-gauge 220, clamping portion 232 is mounted on side of the mounting portion 231 far from snap-gauge 220, and clamping portion 232 has protrusion mounting portion 231 part, one side of the clamping portion 232 far from snap-gauge 220 is guiding surface 233.

Optionally, flip lid 240 is rectangular slab, and the side for renovating 240 is provided with clamping bar, for being connected to clamping groove 213 Interior, flip lid 240 is provided with the first clamping block 250, the first clamping block 250 and the second clamping block 230 adjacent to the plate face of supporting plate 210 Structure it is identical, flip lid 240 is when being fitted on supporting plate 210, and the first clamping block 250 squeezes the second clamping block 230 and with second Clamping is realized in the clamping portion 232 of clamping block 230, and then completes the installation of supporting plate 210 and flip lid 240.It needs to open supporting plate 210 and when flip lid 240, bolt is extracted, then sliding jaw 220, separates the first clamping block 250 and the second clamping block 230. For example, as shown in Figure 8, snap-gauge 220 can be pushed inwardly, 230 slid inward of the second clamping block is driven, and then make the first clamping Block 250 and the separation of the second clamping block 230.Obviously, the installation position of the first clamping block 250 and the second clamping block 230 can also be into Row exchanges, herein without illustrating.

Optional in the present embodiment, heating mechanism 300 includes ceramic heating flake 310 and heat transfer head 320, ceramic heating flake 310 are mounted in heat transfer head 320, and heat transfer head 320 is mounted on the lift side of elevating mechanism 400, and heat transfer head 320 can extend into guiding Mouth 217 is simultaneously fitted on chip 001 to be heated.Ceramic heating flake 310 converts electrical energy into thermal energy, first carries out to heat transfer head 320 Heat transfer head 320 is heated to after set temperature being again extremely bonded the jacking of heat transfer head 320 with chip by elevating mechanism 400 by heating, Realize the heating to chip.

Optional in this example, elevating mechanism 400 can be cylinder assembly or hydraulic pressure cylinder assembly.

Optional in the present embodiment, placing frame 003 includes front side board 006, right side plate 007, left plate 008, right side plate 007, bottom plate 011 and cover board 012, the front side board 006, the left plate 008, the back side panel 010 and the right side Plate 007 is sequentially connected end to end the structure for surrounding open at both ends, and the bottom plate 011 is mounted on the front side board 006, the left plate 008, the bottom of the back side panel 010 and the right side plate 007, and cover an opening；The limit plate 014 and institute It states bottom plate 011, left plate 008 and right side plate 007 to connect, be limited between the limit plate 014 and the front side board 006 described Second placing groove 005 limits first placing groove 004 between the limit plate 014 and the back side panel 010.Cover board 012 Lid is located at the notch of the first placing groove 004.

It should be noted that front side board 006, right side plate 007, left plate 008, back side panel 010, bottom plate 011 and cover board 012 It can be set to rectangular slab.After the completion of actual installation, front side board 006 is parallel with back side panel 010, right side plate 007 and left plate 008 is parallel, and front side board 006, left plate 008 and bottom plate 011 are vertical two-by-two, i.e., placing frame 003 is substantially in a side opening Cuboid structure.The lid of cover board 012 is located at the notch of the first placing groove 004, and the noise in the course of work of fan 022 is not It easily passes out, and fan 022 is not easy to be covered with dust, long service life.

Further, left plate 008, right side plate 007, back side panel 010 height be above the height of front side board 006, from It places at front side board 006 and takes support plate 002, it is more convenient.Left plate 008 and right side plate 007 are close to the one of front side board 006 Side setting jagged 009, so that the height with the part at notch 009 is lower, in this way, being equally convenient for the placement of support plate 002 With take.

Further, the heat release hole 013 being connected to the first placing groove 004, heat release hole 013 are provided on placing frame 003 It can be circular hole or square hole, the quantity of heat release hole 013 is arranged on demand, is such as, but not limited to, heat release hole 013 is provided with ten A, five heat release holes 013 are one group, and two groups of heat release holes 013 are located on left plate 008 and right side plate 007, are located at same group Five heat release holes 013 be intervally arranged along the direction perpendicular to bottom plate 011.Fan 022 is placed in the first placing groove 004, wind It fans the heat generated in 022 course of work to be discharged from heat release hole 013, fan 022 radiates well, 022 long service life of fan, wind The heat that 022 work of fan generates not easily passs through limit plate 014 and is transferred in the first placing groove 004, will not influence the first placing groove The cooling of support plate 002 in 004.

Optional in the present embodiment, limit plate 014 is rectangular slab, and limit plate 014 is vertically mounted on bottom plate 011, and is limited Position plate 014 is vertical with left plate 008, and the height of limit plate 014 is consistent with the height of back side panel 010.Limit plate 014 and front side board Setting is spaced between 006, the at limit plate 014, bottom plate 011, left plate 008, right side plate 007 and the common restriction of front side board 006 Two placing grooves 005, the second placing groove 005 are rectangular channel.It is spaced and is arranged between limit plate 014 and back side panel 010, limit plate 014, First placing groove 004 at bottom plate 011, left plate 008, right side plate 007 and the common restriction of back side panel 010, the first placing groove 004 are Rectangular channel.It should be noted that limit plate 014 and bottom plate 011 can be fixedly connected using the Nian Jie, modes such as be spirally connected, it is corresponding, Limit plate 014 and left plate 008, limit plate 014 and right side plate 007 can by the way of being spirally connected or be Nian Jie the company of fixation It connects.

Further, at least one ventilation opening 015 is provided on limit plate 014, ventilation opening 015 can be round hole, use It is connected in the air outlet of fan 022.It is arranged in the plate face for limiting the second placing groove 005 of limit plate 014 fluted 016, groove 016 can be rectangular channel, board direction of the groove depth direction of groove 016 perpendicular to limit plate 014, ventilation opening 015 It is connected to groove 016.

The quantity of partition 017 is arranged on demand, one or more can be set in partition 017, such as partition 017 can be set Two, three, four etc..Multiple partitions 017 are mounted in the second placing groove 005, and the second placing groove 005 is separated to form at least Three placement regions, each placement region can place one piece of support plate 002, and then can carry out simultaneously to muti-piece support plate 002 cold But.

Optionally, partition 017 is arranged both perpendicular to bottom plate 011 and limit plate 014, the part of the one side of partition 017 It is fitted on front side board 006, the another side of partition 017 is fitted on limit plate 014, recessed due to being provided on limit plate 014 Slot 016, partition 017 and limit plate 014 have interval in the position of groove 016, in this way, convenient for air from limit plate 014 Ventilation opening 015 is blown out, meanwhile, when support plate 002 is placed in the second placing groove 005, the contact area of air and support plate 002 increases Greatly, accelerate cooling.

Further, partition 017 includes the first rectangular plate portion 018 and the second rectangular plate portion 019, the One plate portion 018 has the first opposite side and second side, and the first side is fitted on bottom plate 011, and the second plate portion 019 is mounted on second Side is in convex shape relative to the first plate portion 018 close to one end of limit plate 014, the second plate portion 019.In second side far from second The one end in plate portion 019 is provided with fillet 021.Such structure design, partition 017 is lower close to the side of front side board 006 height, Convenient for the placement of support plate 002, and it is provided with fillet 021 on partition 017, is not easy to scrape during placing and taking, it is safer.

In other embodiments, at least one equal air port 020, the air energy blown out by fan 022 are provided on partition 017 Enough equal air ports 020 on partition 017 are flowed in the second placing groove 005, are placed by the air that fan 022 is blown out second Flow path in slot 005 increases, and increases the time of contact of air Yu support plate 002, convenient for air by the heat band of support plate 002 It walks, improves cooling efficiency.Air port 020 can be set multiple, and multiple equal air ports 020 can be arranged with rectangular array.

Obviously, the shape in equal air port 020 can be round hole or square hole etc., herein without enumerating.

It should be noted that fan 022 directly can connect alternating current using power supply line, or installed in the first placing groove 004 Battery 023, battery 023 are electrically connected with fan 022.

Optional in this implementation, pressing plate can be rectangular slab, and lifting assembly can be cylinder, press machine or hydraulic cylinder, It can make platen presses on flip lid after lifting assembly driving pressing plate decline, overall structure is more reliable and more stable.

The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model Within, any modification, equivalent replacement, improvement and so on should be included within the scope of protection of this utility model.

Claims (10)

1. a kind of chip heating tool, which is characterized in that it includes:

Lower mold assemblies, the lower mold assemblies include pedestal, support platform, load bearing unit, heating unit and cooling unit, described Chassis interior is provided with chamber, and the chamber is provided with switch gate, and opening, the support platform are provided in the support platform Be mounted on the base, the load bearing unit includes supporting plate and flip lid, be provided on the supporting plate targeting port and For being embedded the card slot of chip to be heated, the targeting port is connected to the card slot, and the flip lid lid is located on the supporting plate, The flip lid wraps up the chip to be heated with the supporting plate, and the supporting plate is mounted in the support platform, described Targeting port and the open communication；The heating unit includes elevating mechanism and heating mechanism, and the elevating mechanism is mounted on The lower section of the support platform, the heating mechanism are mounted on the lift side of the elevating mechanism, and the elevating mechanism was gone up and down Cheng Zhong, the fire end of the heating mechanism can stretch in the targeting port from the opening, and with the chip to be heated Fitting；The cooling unit is placed in the chamber, and the cooling unit includes placing frame, limit plate, partition and fan, institute Placing frame is stated with recessed portion, the limit plate is mounted in the recessed portion, and the limit plate is by the depressed section every shape The second placing groove at the first placing groove and for placing support plate, the notch of first placing groove and second placing groove Notch be located at the same side, ventilation opening is provided on the limit plate, the partition is mounted in second placing groove, described Second placing groove is separated to form two side-by-side placement region by partition, and the ventilation opening is connected to described two rest areas Domain, the fan are mounted in first placing groove, and the air outlet of the fan is connected to the ventilation opening；

Upper die component, the upper die component include top mold holder, pressing plate and lifting assembly, and the top mold holder is mounted on the support On platform, the lifting assembly is mounted in the top mold holder, and the lifting assembly is drivingly connected the pressing plate, drives the pressure Plate along the direction perpendicular to the support platform close to or far from the flipping motion.

2. chip heating tool according to claim 1, which is characterized in that the support platform includes support plate and branch Support leg, the supporting leg are supported in the support plate, and the opening is set in the support plate, and the supporting plate is mounted on In the support plate, the top mold holder is mounted in the support plate.

3. chip heating tool according to claim 2, which is characterized in that be provided with the first positioning in the support plate Part, the second locating piece is provided on the supporting plate, and first locating piece and second locating piece are engaged by clamping.

4. chip heating tool according to claim 3, which is characterized in that first locating piece includes positioning column, institute It states positioning column to be arranged perpendicular to the support plate, second locating piece includes locating slot, and the locating slot is located at the support The side of plate, the positioning column are connected in the locating slot.

5. chip heating tool according to claim 1, which is characterized in that the placing frame include front side board, back side panel, Left plate, right side plate and bottom plate, the front side board, the left plate, the back side panel and the right side plate successively head and the tail Connection surrounds the structure of open at both ends, and the bottom plate is mounted on the front side board, the left plate, the back side panel and described The bottom of right side plate, and cover an opening；The limit plate is connect with the bottom plate, left plate and right side plate, described Second placing groove is limited between limit plate and the front side board, and institute is limited between the limit plate and the back side panel State the first placing groove.

6. chip heating tool according to any one of claims 1-5, which is characterized in that a plate of the supporting plate It is provided with limiting slot on face, retention bead is provided on the flip lid, the retention bead is plugged in the limiting slot.

7. chip heating tool according to any one of claims 1-5, which is characterized in that the limit plate with it is described Fluted, the ventilation opening connection groove, the partition and the groove are set in the corresponding plate face of the second placing groove Slot bottom interval setting.

8. chip heating tool according to any one of claims 1-5, which is characterized in that be arranged on the supporting plate The card hole for having sliding channel and being connected to the sliding channel, one end of the sliding channel extend to the side of the supporting plate On face, it is slidably fitted with snap-gauge in the sliding channel, the second clamping block is installed on the snap-gauge, is provided on the snap-gauge Bolt is plugged in limit hole corresponding with the card hole, the card hole and the limit hole.

9. chip heating tool according to any one of claims 1-5, which is characterized in that the heating mechanism includes Ceramic heating flake and heat transfer head, the ceramic heating flake are mounted in the heat transfer head, and the heat transfer head is mounted on the liter The lift side of descending mechanism, the heat transfer head can extend into the targeting port and be fitted on the chip to be heated.

10. chip heating tool according to any one of claims 1-5, which is characterized in that the partition is provided with more It is a, multiple partition parallel intervals settings, multiple partitions by second placing groove be separated to form three side by side with On placement region.