CN208456980U - Sealing adhesive device - Google Patents
Sealing adhesive device Download PDFInfo
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- CN208456980U CN208456980U CN201820929159.5U CN201820929159U CN208456980U CN 208456980 U CN208456980 U CN 208456980U CN 201820929159 U CN201820929159 U CN 201820929159U CN 208456980 U CN208456980 U CN 208456980U
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- Prior art keywords
- sealing
- die assembly
- clamping cap
- lug boss
- adhesive device
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Abstract
This application discloses a kind of sealing adhesive device, which includes the first die assembly and clamping cap being oppositely arranged；The first receiving portion is provided on first die assembly, the first receiving portion is for accommodating LED module；Clamping cap includes multiple lug bosses, the light-emitting surface sealing that the surface segmentation of clamping cap is used at multiple sealing portions, sealing portion as LED module by lug boss close to the side of the first die assembly.Sealing can be carried out to the luminescence unit in entire LED module using the sealing adhesive device, it is high-efficient, production capacity can be improved, and homogeneity is good.
Description
Technical field
This application involves LED display fields, more particularly to a kind of sealing adhesive device.
Background technique
Patch type SMD LED light is a kind of plastic packaging band lead chip carrier, its main feature is that small in size, thin, application range is big,
Securely, good heat dissipation has higher reliability, thus has obtained most commonly used application for encapsulation, such as the LED light that SMD is encapsulated
With on a display screen.But SMD LED light is directly exposed to when applying to display screen outer, therefore inevitably may
The case where appearance is collided with, moreover, because different scenes require the difference of LED light source mould group, the shape after sealing has
Different requirements, to solve the above-mentioned problems, currently used method are to carry out solidification sealing to SMD LED light to prevent single
LED light is collided with, and can only single sealing, efficiency is very slow.
Utility model content
The application, can be to entire using the sealing adhesive device mainly solving the technical problems that provide a kind of sealing adhesive device
Luminescence unit 321 in LED module carries out sealing, high-efficient, production capacity can be improved, and homogeneity is good.
In order to solve the above technical problems, first technical solution that the application uses is: providing a kind of sealing adhesive device, wrap
It includes: the first die assembly and clamping cap being oppositely arranged；It is provided with the first receiving portion on first die assembly, described
One receiving portion is for accommodating LED module；The clamping cap includes multiple lug bosses close to the side of first die assembly,
By the surface segmentation of the clamping cap at multiple sealing portions, the sealing portion is used for as the LED module lug boss
Light-emitting surface sealing.
Preferably, the clamping cap includes multiple extending along first direction close to the side of first die assembly
First lug boss and multiple the second lug bosses to extend in a second direction, first lug boss and second lug boss are handed over
Mistake forms the sealing portion.
Preferably, the first direction is mutually perpendicular to the second direction, the distance between described first lug boss phase
Deng the distance between described second lug boss is equal, and the cross sectional shape of first lug boss and second lug boss are cut
Face shape is identical.
Preferably, the surface of the lug boss is higher than the surface in the sealing portion, the surface of the lug boss and the envelope
The difference in height range on the surface in glue portion is 0.3mm~0.5mm.
Preferably, the surface in the sealing portion is along the curved surface far from the first die assembly protrusion.
Preferably, the surface in the sealing portion is plane.
Preferably, the sealing adhesive device further includes the second die assembly, and second die assembly is provided with the second receiving
Portion, for accommodating the clamping cap, the clamping cap is flexibly connected with second die assembly for second receiving portion；
Second die assembly with first die assembly for being bonded to be formed by first receiving portion and institute
State the sealing of the second receiving portion formation.
Preferably, gas vent is provided on second die assembly, one end of the gas vent and the sealing connect
Logical, the other end of the gas vent is connect with air extractor；
The clamping cap has first position and the second position relative to second die assembly；In the mold pressure
When plate is located at first position relative to second die assembly, the air extractor passes through the gas vent for the sealing
Drain into vacuum state；When the clamping cap is located at the second position relative to second die assembly, the clamping cap
The colloid being covered on the light-emitting surface of the LED module is compressed, to be formed and the sealing on the light-emitting surface of the LED module
The corresponding adhesive layer in portion.
Preferably, heating device is additionally provided on the clamping cap, the heating device is used to carry out the colloid
Heating.
Preferably, the clamping cap is connect with the second die assembly screw thread or piston.
The beneficial effect of the application is: being different from the prior art, the sealing adhesive device of the application includes: first be oppositely arranged
Die assembly and clamping cap；The first receiving portion is provided on first die assembly, receiving portion is for accommodating LED module；Mold
Pressing plate includes multiple lug bosses close to the side of the first die assembly, and lug boss is by the surface segmentation of clamping cap at multiple sealings
Portion, the light-emitting surface sealing that sealing portion is used for as LED module.The sealing adhesive device of the application can be simultaneously in entire LED module
LED carries out sealing, high-efficient, production capacity can be improved, and homogeneity is good.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one embodiment of the application sealing adhesive device；
Fig. 2 is the cross section structure schematic diagram of one embodiment of clamping cap in Fig. 1；
Fig. 3 a is the cross section structure schematic diagram of one embodiment of Fig. 2 protrusions portion；
Fig. 3 b is the cross section structure schematic diagram of another embodiment in Fig. 2 protrusions portion；
Fig. 4 is the planar structure schematic diagram of one embodiment of clamping cap in Fig. 1；
Fig. 5 is the part plan structural schematic diagram of one embodiment of sealing portion in Fig. 4；
Fig. 6 a is the effect diagram using the sealing adhesive device in Fig. 1 to the embodiment after LED module sealing；
Fig. 6 b is the effect diagram using the sealing adhesive device in Fig. 1 to another embodiment after LED module sealing；
Fig. 7 is the structure of one embodiment when the clamping cap in Fig. 1 is located at the second position relative to the second die assembly
Schematic diagram.
Specific embodiment
The application provides a kind of sealing adhesive device, to make the purpose, technical solution and technical effect of the application definitely, clearly
Chu is below further described the application, it should be understood that specific implementation regulations described herein are only used for explaining this Shen
Please, it is not used to limit the application.
Also referring to FIG. 1 to FIG. 5, present embodiment provides a kind of sealing adhesive device, which includes: to be oppositely arranged
The first die assembly 1 and clamping cap 2, wherein the first receiving portion (not indicating in figure) is provided on the first die assembly 1,
For accommodating LED module 3, which includes circuit board 31 and the LED layer being arranged on circuit board 31 for first receiving portion
32, wherein LED layer 32 includes multiple luminescence units 321, which can be arranged in array or other modes
Arrangement.
Wherein, clamping cap 2 includes multiple lug bosses 21 close to the side of the first die assembly 1, and lug boss 21 is by mold
The light-emitting surface sealing that the surface segmentation of pressing plate 2 is used at multiple sealing portions 24, the sealing portion 24 as LED module 3.Specifically, convex
Playing 21 cross sectional shape of portion can be trapezoidal or each apex angle rounding angle trapezoidal, so that the surface of clamping cap 2 is wave-shaped, from
And makes the surface of LED module 3 after sealing wave-shaped or be inverted bowl-shape.An embodiment wherein, such as Fig. 3 a institute
Show, the cross sectional shape of lug boss 21 is trapezoidal and trapezoidal upper bottom edge (the lesser side of side length) close to the first die assembly
1, wherein trapezoidal upper bottom edge length a range is 0.25mm~0.35mm, such as upper bottom edge length a=0.3mm.In addition, trapezoidal
Upper bottom edge and bevel edge angle e range be 95 degree~105 degree, for example, angle e=100 degree.In another embodiment,
As shown in Figure 3b, 21 cross sectional shape of lug boss is the trapezoidal of each apex angle rounding angle, so that being covered on the envelope in LED module 3
The interface rounding off of glue-line connects, thus be emergent light more evenly.Wherein, the angle of fillet according to the actual situation depending on.
In one of them embodiment, as shown in figure 5, clamping cap 2 includes close to the side of the first die assembly 1
The second lug boss 23 that multiple the first lug bosses 22 to extend along first direction a and multiple b in a second direction extend, first is convex
It plays portion 22 and the second lug boss 23 is staggered to form sealing portion 24.Wherein, the arrow of the first direction a in figure and second direction b
It is only used for indicating that the first lug boss 22 and the second lug boss 23 can extend along the direction of arrow.
Since the luminescence unit 321 in LED module 3 is usually according to array arrangement, in order to preferably to LED module 3
Sealing is carried out, the distribution in sealing portion 24 and the distribution of the luminescence unit 321 in LED module 3 on clamping cap 2 match.?
In one of embodiment, first direction a is mutually perpendicular to first direction b, and the distance between first lug boss 22 is equal,
The distance between second lug boss 23 is equal, the cross sectional shape phase of the cross sectional shape of the first lug boss 22 and the second lug boss 23
Together.Wherein, the cross sectional shape of the first lug boss 22 and the cross sectional shape of the second lug boss 23 can lead for trapezoidal or each apex angle
Fillet it is trapezoidal, can be designed according to actual conditions.
Specifically, being provided with the distance between multiple first lug bosses 22, adjacent first lug boss 22 along first direction a
Equal, b is provided with multiple second lug bosses 23 in a second direction, and the distance between adjacent second lug boss 23 is equal.According to this
Mode is arranged, and by the surface segmentation of clamping cap 2 at the sealing portion 24 of multiple area equations, which can be to multiple hairs
Light unit 321 carries out the sealing of array arrangement mode, for example, hair of the sealing portion 24 to array arrangements such as 4*3,5*6 or 8*8
Light unit 321 carries out sealing.As shown in figure 5, a sealing portion 24 carries out sealing to 12 luminescence units 321 (4*3 array),
In actual use, it can design according to the actual situation between the distance between first lug boss 22 and the second lug boss 23
Distance, to meet different package requirements.
In practical application scene, the surface for being covered on the adhesive layer of LED module 3 is 0.3mm higher than the groove of adhesive layer
~0.5mm, such light-out effect are more preferable.In order to meet aforementioned claim, such as Fig. 2, the surface S2 of the upper projecting portion 21 of clamping cap 2
Higher than the surface S1 in sealing portion 24, and the difference in height range of the surface S2 of lug boss 21 and the surface S1 in sealing portion 24 are 0.3mm
~0.5mm, since the shape of the adhesive layer and the sealing portion 24 for being covered on LED module 3 that are covered on LED module 3 is to mutually compensate
, requirement above-mentioned can be satisfied, improve the performance of LED module 3.
Further, the surface in sealing portion 24 can be plane, then in such cases, the sealing being covered in LED module 2
The surface of layer is plane, and due to refraction effect, the light direction for the light that luminescence unit 321 is issued relatively dissipates, specific effect
Figure please refers to Fig. 6 a, and Fig. 6 a is illustrated using effect of the sealing adhesive device in Fig. 1 to the embodiment after LED module sealing
Figure.In addition, the surface in sealing portion 24 is then in such cases to be covered on LED along the curved surface far from 1 protrusion of the first die assembly
The surface of adhesive layer in mould group 2 is, due to refraction effect, to shine single along the curved surface (such as dome shape) far from luminescence unit 321
The light direction for the light that member 321 is issued relatively is concentrated, and specific effect picture please refers to Fig. 6 b, and Fig. 6 b is using the sealing in Fig. 1
Effect diagram of the device to another embodiment after LED module sealing.In practical application scene, the surface in sealing portion 24
Shape can be designed according to actual conditions.
With continued reference to Fig. 1, sealing adhesive device further includes the second die assembly 4, and the second die assembly 4 is provided with the second receiving portion
(not indicating in figure), for accommodating clamping cap 2, clamping cap 2 is flexibly connected with the second die assembly 4 for the second receiving portion.The
Two molds component 4 with the first die assembly 1 for being bonded to form the sealing formed by the first receiving portion and the second receiving portion
(not indicated in figure).
Wherein, clamping cap 2 is connect with 4 screw thread of the second die assembly or piston, to guarantee clamping cap 2 relative to second
The position-adjustable of die assembly 4.In one of them embodiment, it is all provided on the second die assembly 4 and clamping cap 2
It is equipped with threaded hole, screw rod 6 is threadedly coupled with the second die assembly 4 and 2 upper screwed hole of clamping cap, and then realizes mold pressure
Plate 2 is flexibly connected with the second die assembly 4.Meanwhile realizing that clamping cap 2 and the second die assembly 4 are detachably connected, with
Different types of clamping cap 2 is selected according to the actual situation.
Further, the two sides of the second die assembly 4 are provided with gas vent 41, and one end of gas vent 41 and sealing connect
Logical, the other end of gas vent 41 is connect with air extractor (not shown).Wherein, one end of gas vent 41 and the second set of molds
Second receiving portion of part 4 is connected to, and then is connected to sealing.Herein, it should be noted that clamping cap 2 is contained in the second receipts
When appearance portion, the side wall of the two sides of clamping cap 2 and the second receiving portion, which exists, to be spaced, to guarantee one end and the second mould of gas vent 41
Has the second receiving portion connection of component 4.Second die assembly 4 further includes valve 42, in after vacuum state in sealing, is passed through
42 seal vents 41 of valve, and then guarantee always to be in vacuum state in sealing during sealing.
In the present embodiment, clamping cap 2 has first position and the second position relative to the second die assembly 4,
When clamping cap 2 is located at first position relative to the second die assembly 4, air extractor is drained into sealing very by gas vent 41
Dummy status；When clamping cap 2 is located at the second position relative to the second die assembly 4, clamping cap 2, which compresses, is covered on LED mould
Colloid 5 on the light-emitting surface of group 3, to form adhesive layer corresponding with sealing portion 24 on the light-emitting surface of LED module 3.
With continued reference to Fig. 2, heating device 25 is additionally provided on clamping cap 2, during sealing, heating device 25 is used
It is heated in colloid 5, wherein heating device 25 can be uniformly distributed clamping cap 2, to guarantee the mistake in sealing to be multiple
Cheng Zhong, heating device 25 can be evenly heated colloid 5, for example, can cross in the first lug boss 22 and the second lug boss 23
Place setting heating device 25.
Illustrate the process of sealing below with reference to Fig. 1, Fig. 2 and Fig. 7.Wherein, the clamping cap 2 in Fig. 1 is relative to second
Die assembly 1 is located at first position.
Firstly, LED module 3 is placed in the first receiving portion of the first die assembly 1, then colloid 5 is covered LED mould
Above group 3, wherein the size of colloid 5 is equal or a little bit smaller with LED module 3, and the surface of colloid 5 is received with first substantially at this time
The thickness range of the flush in appearance portion, colloid 5 is 0.15mm~0.3mm, such as can be 0.2mm.
Then, the second die assembly 4 is pushed, so that the sealing formed by the first receiving portion and the second receiving portion,
In, the openings of sizes of the second receiving portion is greater than the openings of sizes of the first receiving portion.Clamping cap 2 is adjusted again relative to the second mold
The position of component 4, specifically, rotating screw 6 moves downward clamping cap 2 relative to the second die assembly 4, until
Clamping cap 2 is located at first position relative to the second die assembly 4, as shown in Figure 1, at this point, lug boss 21 just connects with colloid 5
Touching or close contact.Then, air extractor is opened, sealing is evacuated to vacuum state by gas vent 41 by air extractor, then is closed
Upper valve 42 to guarantee that air will not be entered after colloid 5 melts, and then prevents the generation of bubble, to guarantee the outgoing side of light
To homogeneity.After being evacuated to vacuum state, heating device 25 in opening mold pressing plate 2, heating device 25 melts colloid 5
Afterwards, heating device 25 is closed, after colloid 5 naturally cools to surface cure, rotating screw 6 makes clamping cap 2 relative to the
Two molds component 4 moves downward, until clamping cap 2 is located at the second position relative to the second die assembly 4, as shown in fig. 7, this
When, the peripheral edge (not set lug boss 21) of clamping cap 2 is contacted with the first die assembly 1, after being kept for a period of time, colloid
5 are cooled and shaped completely, demould, and take out LED module 3 and complete sealing, then carry out baking 0.5~2 hour, in shining for LED module 3
Adhesive layer 33 is formed on layer 32, to complete the preparation of LED light source mould group.
It is different from existing sealing mode, when carrying out sealing to LED module using the sealing adhesive device in above embodiment,
Be covered on the adhesive layer in LED module concrete shape can be according to actual conditions depending on, be suitable for plurality of application scenes, especially
It is in the application scenarios for needing to carry out secondary sealing or optical analog.
It is different from the prior art, the sealing adhesive device of the application includes: the first die assembly and clamping cap being oppositely arranged；
The first receiving portion is provided on first die assembly, receiving portion is for accommodating LED module；Clamping cap is close to the first die assembly
Side include multiple lug bosses, by the surface segmentation of clamping cap at multiple sealing portions, sealing portion is used to be LED mould lug boss
The light-emitting surface sealing of group.The sealing adhesive device of the application can carry out sealing to the LED in entire LED module simultaneously, high-efficient, can
Production capacity is improved, and homogeneity is good.
The above description is only the embodiments of the present invention, and therefore it does not limit the scope of the patent of the utility model, all
Skill between equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, such as each embodiment
Be combineding with each other for art feature, is applied directly or indirectly in other relevant technical fields, and is similarly included in the utility model
Scope of patent protection in.
Claims (10)
1. a kind of sealing adhesive device characterized by comprising the first die assembly and clamping cap being oppositely arranged；
The first receiving portion is provided on first die assembly, first receiving portion is for accommodating LED module；
The clamping cap includes multiple lug bosses close to the side of first die assembly, and the lug boss is by the mold
The light-emitting surface sealing that the surface segmentation of pressing plate is used at multiple sealing portions, the sealing portion as the LED module.
2. sealing adhesive device according to claim 1, which is characterized in that the clamping cap is close to first die assembly
Side include it is multiple along first direction extend the first lug boss and multiple the second lug bosses to extend in a second direction, institute
It states the first lug boss and second lug boss is staggered to form the sealing portion.
3. sealing adhesive device according to claim 2, which is characterized in that the first direction and the second direction are mutually hung down
Directly, the distance between described first lug boss is equal, and the distance between described second lug boss is equal, first lug boss
Cross sectional shape is identical as the cross sectional shape of second lug boss.
4. sealing adhesive device according to claim 1, which is characterized in that the surface of the lug boss is higher than the sealing portion
The difference in height range on the surface in surface, the surface of the lug boss and the sealing portion is 0.3mm~0.5mm.
5. sealing adhesive device according to claim 4, which is characterized in that the surface in the sealing portion is along far from described first
The curved surface of die assembly protrusion.
6. sealing adhesive device according to claim 4, which is characterized in that the surface in the sealing portion is plane.
7. sealing adhesive device according to claim 1, which is characterized in that the sealing adhesive device further includes the second die assembly,
Second die assembly is provided with the second receiving portion, and second receiving portion is for accommodating the clamping cap, the mold
Pressing plate is flexibly connected with second die assembly；
Second die assembly is formed for being bonded with first die assembly by first receiving portion and described the
The sealing that two receiving portions are formed.
8. sealing adhesive device according to claim 7, which is characterized in that it is provided with gas vent on second die assembly,
One end of the gas vent is connected to the sealing, and the other end of the gas vent is connect with air extractor；
The clamping cap has first position and the second position relative to second die assembly；In the clamping cap phase
When being located at first position for second die assembly, the air extractor is drained into the sealing by the gas vent
Vacuum state；When the clamping cap is located at the second position relative to second die assembly, the clamping cap is compressed
The colloid being covered on the light-emitting surface of the LED module, to be formed and sealing portion phase on the light-emitting surface of the LED module
Corresponding adhesive layer.
9. sealing adhesive device according to claim 8, which is characterized in that it is additionally provided with heating device on the clamping cap,
The heating device is for heating the colloid.
10. sealing adhesive device according to claim 7, which is characterized in that the clamping cap and second die assembly
Screw thread or piston connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820929159.5U CN208456980U (en) | 2018-06-14 | 2018-06-14 | Sealing adhesive device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820929159.5U CN208456980U (en) | 2018-06-14 | 2018-06-14 | Sealing adhesive device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208456980U true CN208456980U (en) | 2019-02-01 |
Family
ID=65160039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820929159.5U Active CN208456980U (en) | 2018-06-14 | 2018-06-14 | Sealing adhesive device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208456980U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108547839A (en) * | 2018-06-14 | 2018-09-18 | 深圳市德彩光电有限公司 | Sealing adhesive device |
-
2018
- 2018-06-14 CN CN201820929159.5U patent/CN208456980U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108547839A (en) * | 2018-06-14 | 2018-09-18 | 深圳市德彩光电有限公司 | Sealing adhesive device |
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| CP03 | Change of name, title or address |
Address after: 518000 201, No. 13, Huiye Road, Tangjia community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Patentee after: Shendecai photoelectric (Shenzhen) Co., Ltd Address before: 518000 Guangdong province Shenzhen Guangming New District Gongming building village community Zhongtai road 18 German color Industrial Park Patentee before: Shenzhen Dicolor Optoelectronics Co., Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 201, No. 13, Huiye Road, Tangjia community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Patentee after: Shendecai Technology (Shenzhen) Co., Ltd Address before: 518000 201, No. 13, Huiye Road, Tangjia community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Patentee before: Shendecai photoelectric (Shenzhen) Co.,Ltd. |