CN208422547U - A kind of Chip-R - Google Patents
A kind of Chip-R Download PDFInfo
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- CN208422547U CN208422547U CN201820907726.7U CN201820907726U CN208422547U CN 208422547 U CN208422547 U CN 208422547U CN 201820907726 U CN201820907726 U CN 201820907726U CN 208422547 U CN208422547 U CN 208422547U
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- resistive layer
- heat dissipating
- chip
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Abstract
The purpose of the utility model is to provide a kind of Chip-Rs, including resistive layer, insulating cement and heat dissipating layer, insulating cement plays the role of insulation and is bonded between resistive layer and heat dissipating layer, resistive layer and heat dissipating layer periphery are coated with insulation glue-line, the both ends of resistive layer are equipped with copper electrode, without insulation glue-line between copper electrode and resistive layer.The utility model electric resistance alloy small using temperature coefficient, and conventional bonding technique is replaced using electroplating technology production electrode, do not occur generating uncontrollable influence so that low-resistance temperature coefficient is dropped, to ensure that the low-temperature coefficient of alloy Chip-R to the texture of electric resistance alloy because of welding high temperature in processing procedure.Using the high copper of thermal conductivity or almag as heat dissipating layer, the heat-sinking capability of resistance is enhanced, ensure that the high power of alloy Chip-R.
Description
Technical field
The invention belongs to technical field of electronic components, in particular to a kind of Chip-R.
Background technique
It, can be by the variation of magnetic flux in measure traverse line come feedback current, especially in the scheme of current sample
The appearance of low resistance resistance provides more reliable, convenient and fast design scheme for current sample, and principle is the electricity for being difficult to detection
Stream signal is converted to the voltage signal for being easy to detect, to feed back the size of current value out, plays protection circuit safety, feedback electricity
The effect of road signal, low resistance alloy Chip-R become because of the advantages that its size is small, power is big, precision is high, temperature coefficient is small
The first choice of current sample design.
The existing technique of alloy Chip-R mostly uses greatly the biggish alloy material of bulk area, first on alloy material
The slot for being recessed to prescribed depth downwards, a long side of the trough rim as resistance, then with same are formed using the methods of etching, cutting
Quadrat method forms another short side of resistance, and the difficult point of this technique is, not high using the product size precision after etching, no
Conducive to the Stable distritation of resistance value before product resistance trimming, it is difficult to guarantee the resistance accuracy of product after resistance trimming, and be existed using abrasive wheel cutting machine
The Chip-R body that cutting is separated into single on one piece of alloy patch is then lost greatly the grinding wheel of abrasive wheel cutting machine, increases product
Manufacturing cost.
Summary of the invention
The present invention uses new process program, produces alloy patch on the alloy compound material band of a rectangular cross-sectional
Resistance substantially increases production efficiency, using the method punching separation of mould punching at single resistance, it is only necessary to be punched alloy
Two faces of Chip-R, the alloy Chip-R than isolating single on the biggish alloy material of one piece of area reduce two
The cutting separation process in a face, reduces manufacturing process, improves production efficiency, reduces production cost, and more can guarantee production
The precision of product resistance value reduces the temperature coefficient of product.
In order to achieve the above object, the technical solution of the present invention is as follows:
A kind of Chip-R, including resistive layer, insulating cement and heat dissipating layer, insulating cement rise between resistive layer and heat dissipating layer
To the effect insulated and bonded, resistive layer and heat dissipating layer periphery are coated with insulation glue-line, and the both ends of resistive layer are equipped with copper electrode, copper
Without insulation glue-line between electrode and resistive layer.
Preferably, copper electrode is equipped with tin coating.
Preferably, copper electrode is equipped with nickel coating.
Preferably, tin coating is additionally provided on the nickel coating of copper electrode.
The preparation method comprises the following steps: a kind of method that alloy Chip-R is made for rectangular metal composite material strip in section, 1) it will
Two metal material belts are bonded together by insulating cement, and Formation cross-section is rectangular metal composite material strip, two metal material belts
Between pass through insulating cement partition insulation, in which: metal material belt is another to the electric resistance alloy material strip as resistive layer
Metal material belt can be the high heat dissipation alloy material band to as heat dissipating layer of thermal conductivity；It 2) is that rectangular metal is answered by section
Close material strip coating insulation glue-line；3) laser burns power down hinders SI semi-insulation glue-line of the alloy material with both ends, and the glue-line that insulate is fallen in calcination
Width it is equal with electrode width；It 4) is cathode in the parcel plating metal that the glue-line that insulate is fallen in calcination；5) in resistance compound material band
Specific resistor path is made using laser burns, etching or the method for chemical attack, with accurate resistance trimming；6) it is punched to list
Alloy Chip-R.
The beneficial effects of the present invention are:
1. need to only be punched two faces of resistance The present invention reduces cutting separation process.
2. blanking process of the present invention is assemblied on high velocity ram machine using mold and is punched, improves and cut isolated efficiency, drop
Low production cost；
3. overall process of the present invention is that alloy Chip-R, processing procedure is made in rectangular metal composite material strip by a roll of section
It is middle to use material retractable system, it is ensured that the stability of process and the continuity for guaranteeing processing procedure process, centre does not need in short-term
Between change raw material, saved handling time, improved production efficiency.
4. alloy Chip-R of the invention, using the small electric resistance alloy of temperature coefficient, and using electroplating technology production electricity
Pole replaces conventional bonding technique, does not occur generating uncontrollable influence to the texture of electric resistance alloy because of welding high temperature in processing procedure
To drop low-resistance temperature coefficient, to ensure that the low-temperature coefficient of alloy Chip-R.Using the high copper of thermal conductivity or
Almag enhances the heat-sinking capability of resistance as heat dissipating layer, ensure that the high power of alloy Chip-R.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the embodiment of the present invention 1；
Fig. 2 is the structural schematic diagram of the embodiment of the present invention 2；
Fig. 3 is the structural schematic diagram of the embodiment of the present invention 3；
In figure: 1, resistive layer；2, insulating cement；3, heat dissipating layer；4, insulate glue-line；5, copper electrode；6, tin coating；7, nickel plating
Layer.
Specific embodiment
One embodiment of the present invention is further illustrated with reference to the accompanying drawings.
Embodiment 1: Fig. 1 is referred to:
A kind of Chip-R, including resistive layer 1, insulating cement 2 and heat dissipating layer 3, insulating cement 2 are located at resistive layer 1 and heat dissipating layer 3
Between play the role of insulation and bond, resistive layer 1 and 3 periphery of heat dissipating layer are coated with insulation glue-line 4, and the both ends of resistive layer are equipped with
Copper electrode 5, without insulation glue-line between copper electrode 5 and resistive layer 1.
The preparation method comprises the following steps: 1) two metal material belts are bonded together by insulating cement, Formation cross-section is rectangular gold
Belong to compound material band, separated between two metal material belts by insulating cement and insulated, in which: a metal material belt is to as resistance
The electric resistance alloy material strip of layer, another metal material belt can be the high heat dissipation alloy material band to as heat dissipating layer of thermal conductivity；
It 2) is rectangular metal composite material strip coating insulation glue-line by section；3) laser burns power down hinders part of the alloy material with both ends
Insulate glue-line, and the width that the glue-line that insulate is fallen in calcination is equal with electrode width；4) it is in the parcel plating copper that the glue-line that insulate is fallen in calcination
Cathode；5) specific resistor path is made using laser burns, etching or the method for chemical attack in resistance compound material band,
With accurate resistance trimming；6) it is punched to single alloy Chip-R.
Embodiment 2: Fig. 2 is referred to:
A kind of resistance, including resistive layer 1, insulating cement 2 and heat dissipating layer 3, insulating cement 2 is between resistive layer 1 and heat dissipating layer 3
Play the role of insulation and bond, resistive layer 1 and 3 periphery of heat dissipating layer are coated with insulation glue-line 4, and the both ends of resistive layer are equipped with copper electricity
Pole 5, copper electrode 5 are equipped with tin coating 6, without insulation glue-line between copper electrode 5 and resistive layer 1, the preparation method comprises the following steps: 1) by two
Metal material belt is bonded together by insulating cement, and Formation cross-section is rectangular metal composite material strip, between two metal material belts
Separated by insulating cement and insulated, in which: a metal material belt is to the electric resistance alloy material strip as resistive layer, another metal
Material strip can be the high heat dissipation alloy material band to as heat dissipating layer of thermal conductivity；It 2) is rectangular metal composite material by section
Band coating insulation glue-line；3) laser burns power down hinders SI semi-insulation glue-line of the alloy material with both ends, and the width of glue-line that insulate is fallen in calcination
It spends equal with electrode width；It 4) is cathode, the then electrotinning on copper electrode in the parcel plating copper that the glue-line that insulate is fallen in calcination；5)
Specific resistor path is made using laser burns, etching or the method for chemical attack in resistance compound material band, with accurate
Resistance trimming；6) it is punched to single alloy Chip-R.
Embodiment 3: Fig. 3 is referred to:
A kind of Chip-R, including resistive layer 1, insulating cement 2 and heat dissipating layer 3, insulating cement 2 are located at resistive layer 1 and heat dissipating layer 3
Between play the role of insulation and bond, resistive layer 1 and 3 periphery of heat dissipating layer are coated with insulation glue-line 4, and the both ends of resistive layer are equipped with
Copper electrode 5 is successively arranged nickel coating 7 and tin coating 6 on copper electrode 5, without insulation glue-line, system between copper electrode 5 and resistive layer 1
Preparation Method is 1) two metal material belts are bonded together by insulating cement, Formation cross-section is rectangular metal composite material strip,
Separated between two metal material belts by insulating cement and insulated, in which: a metal material belt is to the resistance conjunction as resistive layer
Golden material strip, another metal material belt can be the high heat dissipation alloy material band to as heat dissipating layer of thermal conductivity；2) it is by section
Rectangular metal composite material strip coating insulation glue-line；3) laser burns power down hinders SI semi-insulation glue-line of the alloy material with both ends,
The width that the glue-line that insulate is fallen in calcination is equal with electrode width；It 4) is cathode in the parcel plating copper that the glue-line that insulate is fallen in calcination, then
The first electronickelling re-plating tin on copper electrode；5) laser burns, etching or the side of chemical attack are used in resistance compound material band
Method makes specific resistor path, with accurate resistance trimming；6) it is punched to single alloy Chip-R.
The above is not intended to limit the scope of the present invention, and all technical spirits according to the present invention are to above
Any modification, equivalent variations and modification made by embodiment, in the range of still falling within technical solution of the present invention.
Claims (4)
1. a kind of Chip-R, it is characterised in that: including resistive layer, insulating cement and heat dissipating layer, insulating cement is located at resistive layer and dissipates
Play the role of insulation between thermosphere and bond, resistive layer and heat dissipating layer periphery are coated with insulation glue-line, and the both ends of resistive layer are set
There is copper electrode, without insulation glue-line between copper electrode and resistive layer.
2. Chip-R according to claim 1, it is characterised in that: copper electrode is equipped with tin coating.
3. Chip-R according to claim 1, it is characterised in that: copper electrode is equipped with nickel coating.
4. Chip-R according to claim 3, it is characterised in that: be additionally provided with tin coating on nickel coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820907726.7U CN208422547U (en) | 2018-06-12 | 2018-06-12 | A kind of Chip-R |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820907726.7U CN208422547U (en) | 2018-06-12 | 2018-06-12 | A kind of Chip-R |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208422547U true CN208422547U (en) | 2019-01-22 |
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ID=65109824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820907726.7U Active CN208422547U (en) | 2018-06-12 | 2018-06-12 | A kind of Chip-R |
Country Status (1)
| Country | Link |
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| CN (1) | CN208422547U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108806906A (en) * | 2018-06-12 | 2018-11-13 | 深圳市业展电子有限公司 | The method and its Chip-R of alloy Chip-R are made for rectangular metal composite material strip for a kind of section |
| CN112002509A (en) * | 2020-08-11 | 2020-11-27 | 深圳市业展电子有限公司 | Forming process of chip resistor |
-
2018
- 2018-06-12 CN CN201820907726.7U patent/CN208422547U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108806906A (en) * | 2018-06-12 | 2018-11-13 | 深圳市业展电子有限公司 | The method and its Chip-R of alloy Chip-R are made for rectangular metal composite material strip for a kind of section |
| CN112002509A (en) * | 2020-08-11 | 2020-11-27 | 深圳市业展电子有限公司 | Forming process of chip resistor |
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