CN208421760U - cooling device for computer storage medium - Google Patents
cooling device for computer storage medium Download PDFInfo
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- CN208421760U CN208421760U CN201821273954.XU CN201821273954U CN208421760U CN 208421760 U CN208421760 U CN 208421760U CN 201821273954 U CN201821273954 U CN 201821273954U CN 208421760 U CN208421760 U CN 208421760U
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- Prior art keywords
- heat
- heat sink
- storage medium
- computer storage
- link slot
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Abstract
Cooling device for computer storage medium, belong to the field of radiating of computer storage medium, including two heat sinks, the space for storage medium installation is formed between two heat sinks, it is attached between two heat sinks by connection structure, the connection structure includes connecting rod and link slot, link slot is offered on any heat sink, another heat sink is equipped with connecting rod, the connecting rod extends to the inside of the link slot and is attached with the link slot by spring in the link slot, the buffer structure for being buffered to the heat sink is also connected between two heat sinks, the open end of the heat sink is equipped with for carrying out thermally conductive heat-transfer device to heat sink, it is asked for solve that the heat that existing computer storage medium generates during the work time can not distribute in time Topic.
Description
Technical field
The utility model relates to the field of radiating of computer storage medium, are situated between more particularly to one kind for computer storage
The cooling device of matter.
Storage medium one of of the background technique hard disc of computer as computer, can generate heat during the work time,
Excessively high temperature can seriously affect the normal work of computer memory device, and the prior art is to including hard disc of computer
Hard disc of computer etc. is usually placed on the installation with certain heat sinking function into when cooling down radiating treatment by computer storage medium
In frame, but in radiation processes, the heat in installing frame can not usually be discharged in time and accumulate in installing frame, can not play
Good heat dissipation effect, therefore, when carrying out cooling or radiating treatment to computer storage medium, to storage medium heat dissipation
It needs in time to be exported heat after reason, to guarantee the normal work of storage medium.
Utility model content
For above situation, for the defect for overcoming the prior art, the utility model provides a kind of for computer storage Jie
The cooling device of matter, solve that the heat that existing computer storage medium generates during the work time can not distribute in time asks
Topic carries out efficient radiating treatment in time to computer storage medium.
Its technical solution is, for the cooling device of computer storage medium, the heat sink including two "u"-shapeds,
The opening direction of two heat sinks is opposite, and the sky for computer storage medium installation is formed between two heat sinks
Between, which is characterized in that be attached between two heat sinks by connection structure, the connection structure include connecting rod and
Link slot offers link slot on any heat sink, and another heat sink is equipped with connecting rod, and the connecting rod extends
To the link slot inside and be attached with the link slot by spring in the inside of the link slot, two are described scattered
The buffer structure for being buffered to the heat sink is also connected between hot plate, the open end of the heat sink, which is equipped with, to be used for
Thermally conductive heat-transfer device is carried out to heat sink.
Further, the buffer structure includes the connecting plate for being fixed on two left and right both ends of heat sink, is located at
Connecting plate on two heat sinks is horizontal and is arranged in parallel, and is connected between two connecting plates by buffer spring
It connects.
Further, the heat-transfer device includes heat-conducting plate, end of the heat-conducting plate in the heat sink open end
It is attached with the heat sink, forms cavity between the heat-conducting plate and the heat sink, the cavity inside is equipped with scattered
Hot-air fan.
Further, fixing groove is offered on the heat-conducting plate, the end of the heat sink is extended with thermal conductive wire, described
The shape of fixing groove is adapted with the thermal conductive wire, the thermal conductive wire by the fixing groove be embedded in the heat-conducting plate, institute
It states and is uniformly provided with several cooling fins for heat dissipation on the outside of heat sink.
Further, the radiator fan is mounted in fixed frame, and the fixed frame forms the frame like structure of rectangle, institute
The flabellum part for stating radiator fan is not contacted with the fixed frame, and the fixed frame is mounted on the heat-conducting plate.
Having the technical effect that for the utility model is formed between two heat sinks for installing computer storage medium
Space is attached between two heat sinks by connection structure, and the connection structure can make the heat sink and meter
Calculation machine storage medium is adequately contacted, and reinforces the heat sink to the heat-conducting effect of storage medium, the heat sink also connects
It is connected to heat-transfer device, the heat-transfer device is used to conduct computer storage medium to the heat on the heat sink and carry out in time
Export, realize near computer storage medium position carry out rapid cooling processing, prevent computer storage medium because of temperature
It spends height to damage, buffer structure is additionally provided on the heat sink, the buffer structure is for proposing computer storage medium
For buffer protection, the further normal work for guaranteeing computer storage medium.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model.
Fig. 2 is the enlarged drawing of part A in Fig. 1.
Fig. 3 is the structural schematic diagram of heat-conducting plate in the utility model.
Specific embodiment
Below in conjunction with Figure of description, specific embodiment is described in further details.
Heat sink 1: the bottom plate of the heat sink 1 including rectangular plate-like structure and be located at the bottom plate arranged on left and right sides with
The vertical side plate of the bottom plate, the side plate are similarly the plate structure of rectangle, are formed between the bottom plate and the side plate
"U" shaped structure, there are two the quantity of the heat sink 1, and the opening direction of two heat sinks 1 is on the contrary, described in two
The space for computer storage medium installation is formed between heat sink 1, the heat sink 1 selects the preferable material of heating conduction
Material, the material of the heat sink 1 includes but is not limited to metallic copper and aluminium, and computer storage medium here is primarily referred to as hard disk,
It is attached between two heat sinks 1 by connection structure.
Connection structure: the connection structure includes connecting rod 2 and link slot 3, and the connecting rod 2 is located at any heat dissipation
On the bottom plate of plate 1, the connecting rod 2 is vertically arranged with the bottom plate, and there are two the quantity of the connecting rod 2, and described in two
Connecting rod 2 is located at the arranged on left and right sides of 1 bottom plate of heat sink, and the connecting rod 2 can be cylindrical-shaped structure, the company
Connection type between extension bar 2 and the heat sink 1 includes but is not limited to weld, and is opened up on the bottom plate of another heat sink 1
There is link slot 3 compatible with the connecting rod 2, the inside of the link slot 3 forms cylinder compatible with the connecting rod 2
The cavity of body structure, the connecting rod 2 are plugged in the link slot 3, and the diameter of the link slot 3 is slightly larger than the connecting rod
2 diameter, and form the connecting rod 2 and can carry out upper and lower movable structure inside the link slot 3, the connecting rod 2
Bottom end and the bottom end of the link slot 3 are attached by spring 4, and the spring 4 can be helical spring, the spring 4
Both ends are fixedly connected with the link slot 3 and the connecting rod 2 respectively, and the spring 4 does not occur elastically-deformable
In the case of, the distance between two described heat sinks 1 are less than the thickness of hard disc of computer, and the hard disc of computer is placed on two
After between a heat sink 1, the spacing increase between two heat sinks 1 is adapted with the thickness of hard disc of computer, institute
The bottom end for stating connecting rod 2 and the bottom end distance of the link slot 3 increase, and elastic deformation occurs for the spring 4, and generates centainly
Elastic force, under the elastic force effect of the spring 4, hard disc of computer is fixed in two heat sinks 1, while guarantee and institute
The bottom plate for stating heat sink 1 is adequately contacted with the upper and lower end face of the hard disc of computer, to hard disc of computer worked
The heat generated in journey is timely exported, and the heat-conducting effect to hard disc of computer is effectively reinforced.
Heat-transfer device: the heat sink 1 is by after the heat derives generated in hard disc of computer work process, the thermally conductive dress
It sets and further by heat derives, realizes that the rapid cooling to hard disc of computer neighbouring position is handled, guarantee hard disc of computer just
Often work, the heat-transfer device includes the heat-conducting plate 6 of rectangular plate-like structure, the heat-conducting plate 6 and 1 open end of heat sink
End is attached, and is fixedly connected between the heat-conducting plate 6 and the heat sink 1, the heat-conducting plate 6 and the heat sink
Connection type between 1 includes but is not limited to be bolted, and cuboid knot is formed between the heat-conducting plate 6 and the heat sink 1
The space of structure is equipped with radiator fan 7 between the heat-conducting plate 6 and the heat sink 1, the outside of the heat-conducting plate 6, which is equipped with, to be dissipated
Backing 10 is also provided with fixing groove 8 on the heat-conducting plate 6, and several thermal conductive wires 9 are extended in the end of 1 open end of heat sink,
The thermal conductive wire 9 is embedded in the inside of the fixing groove 8, and the shape of the thermal trough 8 is adapted with the shape of the thermal conductive wire 9,
The thermal conductive wire 9 can be cylindrical structure, and the thermal conductive wire 9 can select the preferable metallic copper of thermal conductivity, be led by described
Hot line 9, the heat on the heat sink 1 can quickly be conducted to the heat-conducting plate 6, the thermal conductive wire 9 and the fixing groove 8
Quantity has multiple, and each fixing groove 8 is uniformly distributed on the heat-conducting plate 6, and each 8 level of fixing groove is provided with described
On heat-conducting plate 6, and each fixing groove 8 runs through the heat-conducting plate 6, the thermal conductive wire 9 after being embedded in the fixing groove 8 with it is described
Heat-conducting plate 6 is adequately contacted, and the heat-conducting effect to the heat sink 1 is further enhanced.
The radiator fan 7 is attached in the cabinet inside with power end by conducting wire, and the radiator fan 7 is installed
In the fixed frame 12, the fixed frame 12 is the frame structure of rectangle, the flabellum and the fixed frame of the radiator fan 7
There are certain gaps for 12 each frame, and the fixed frame 12 is movably arranged on the heat-conducting plate 6 by screw, described
Radiator fan 7 can accelerate the radiating rate of the heat-conducting plate 6, and the heat on the heat-conducting plate 6 is fast through the cooling fin 10
Speed export, told radiator fan 7 carry out radiating treatment to the heat-conducting plate 6 simultaneously with the cooling fin 10, may be implemented to meter
The fast cooling of calculation machine hard disk neighbouring position is handled, and improves heat dissipation effect, guarantees the normal table work of hard disc of computer.
Buffer structure: hard disc of computer can also generate certain vibration during the work time, and hard disc of computer shakes
It is likely to cause hard disc of computer certain damage, and influences its normal work, the buffer structure includes 5 He of connecting plate
The side plate of buffer spring 11 between the connecting plate 5, the connecting plate 5 and the heat sink 1 is orthogonal, the company
Fishplate bar 5 is the plate structure of rectangle, is fixedly connected between the connecting plate 5 and the side plate of the heat sink 1, the connection
Connection type between plate 5 and the side plate of the heat sink 1 includes but is not limited to be bolted, and the connecting plate 5 is fixed on institute
The middle position of 1 side plate of heat sink is stated, the buffer spring 11 can be helical spring, the both ends of the buffer spring 11
It is fixedly connected respectively with upper and lower two connecting plates 5, the buffer spring 11 can be to meter when elastic deformation occurs
The vibration generated during calculation machine hard disk operational is buffered, and the buffer structure can provide hard disc of computer slow well
Punching protection, the further normal work for guaranteeing hard disc of computer.
Having the technical effect that for the utility model is formed between two heat sinks for installing computer storage medium
Space is attached between two heat sinks by connection structure, and the connection structure can make the heat sink and meter
Calculation machine storage medium is adequately contacted, and reinforces the heat sink to the heat-conducting effect of storage medium, the heat sink also connects
It is connected to heat-transfer device, the heat-transfer device is used to conduct computer storage medium to the heat on the heat sink and carry out in time
Export, realize near computer storage medium position carry out rapid cooling processing, prevent computer storage medium because of temperature
It spends height to damage, buffer structure is additionally provided on the heat sink, the buffer structure is for proposing computer storage medium
For buffer protection, the further normal work for guaranteeing computer storage medium.
The utility model is described in detail above by specific embodiment and embodiment, but these are not structure
At limitations of the present invention.In the case where not departing from the utility model principle, those skilled in the art can also be made
Many modification and improvement, these also should be regarded as the protection scope of the utility model.
Claims (5)
1. being used for the cooling device of computer storage medium, the heat sink (1) including two "u"-shapeds, two heat dissipations
The opening direction of plate (1) is opposite, and the space for computer storage medium installation is formed between two heat sinks (1),
It is characterized in that, is attached between two heat sinks (1) by connection structure, the connection structure includes connecting rod (2)
It with link slot (3), offers link slot (3) on any heat sink (1), another heat sink (1) is equipped with connecting rod
(2), the connecting rod (2) extends to the inside of the link slot (3) and in the inside of the link slot (3) and the link slot
(3) it is attached by spring (4), is also connected between two heat sinks (1) for delaying to the heat sink (1)
The open end of the buffer structure of punching, the heat sink (1) is equipped with for carrying out thermally conductive heat-transfer device to heat sink (1).
2. the cooling device according to claim 1 for computer storage medium, which is characterized in that the buffer structure
Connecting plate (5) including being fixed on two left and right both ends of the heat sink (1), the connection being located on two heat sinks (1)
Plate (5) is horizontal and is arranged in parallel, and is attached between two connecting plates (5) by buffer spring (11).
3. the cooling device according to claim 1 for computer storage medium, which is characterized in that the heat-transfer device
Including heat-conducting plate (6), the heat-conducting plate (6) is connected in the end of the heat sink (1) open end with the heat sink (1)
It connects, forms cavity between the heat-conducting plate (6) and the heat sink (1), the cavity inside is equipped with radiator fan (7).
4. the cooling device according to claim 3 for computer storage medium, which is characterized in that the heat-conducting plate
(6) offered on fixing groove (8), the end of the heat sink (1) is extended with thermal conductive wire (9), the shape of the fixing groove (8) with
The thermal conductive wire (9) is adapted, the thermal conductive wire (9) by the fixing groove (8) be embedded with the heat-conducting plate (6) in, it is described
Several cooling fins (10) for heat dissipation are uniformly provided on the outside of heat sink (6).
5. the cooling device according to claim 3 for computer storage medium, which is characterized in that the radiator fan
(7) it is mounted in fixed frame (12), the fixed frame (12) forms the frame like structure of rectangle, the flabellum of the radiator fan (7)
Part is not contacted with the fixed frame (12), and the fixed frame (12) is mounted on the heat-conducting plate (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821273954.XU CN208421760U (en) | 2018-08-08 | 2018-08-08 | cooling device for computer storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821273954.XU CN208421760U (en) | 2018-08-08 | 2018-08-08 | cooling device for computer storage medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208421760U true CN208421760U (en) | 2019-01-22 |
Family
ID=65121941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821273954.XU Expired - Fee Related CN208421760U (en) | 2018-08-08 | 2018-08-08 | cooling device for computer storage medium |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208421760U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111511169A (en) * | 2020-04-26 | 2020-08-07 | 淮南文峰航天电缆有限公司 | Multi-channel single-direction and two-direction regulation data transmission equipment |
-
2018
- 2018-08-08 CN CN201821273954.XU patent/CN208421760U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111511169A (en) * | 2020-04-26 | 2020-08-07 | 淮南文峰航天电缆有限公司 | Multi-channel single-direction and two-direction regulation data transmission equipment |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190122 Termination date: 20190808 |
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| CF01 | Termination of patent right due to non-payment of annual fee |