CN208402206U - A kind of soft or hard combination package substrate of high thermal conductivity height insulation - Google Patents
A kind of soft or hard combination package substrate of high thermal conductivity height insulation Download PDFInfo
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- CN208402206U CN208402206U CN201820996991.7U CN201820996991U CN208402206U CN 208402206 U CN208402206 U CN 208402206U CN 201820996991 U CN201820996991 U CN 201820996991U CN 208402206 U CN208402206 U CN 208402206U
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Abstract
A kind of soft or hard combination package substrate of high thermal conductivity height insulation, it is characterized by: the high thermal conductivity height insulate, soft or hard combination package substrate includes the top line on the ceramic wafer set gradually from bottom to up, soft board, insulating layer and addition surface on the insulating layer, ceramic wafer is mounted on the lower surface of soft board, insulating layer is pressed together on the upper surface of soft board, addition is electroplate with the conducting copper post being conducted with top line and heat dissipation copper post on soft board, is connected wherein the lower end of heat dissipation copper post passes through soft board with the upper surface of ceramic wafer.This process structure is simple, using Rigid Flex of the soft board in conjunction with ceramic wafer as substrate, product size is stablized, the insulation of high thermal conductivity height, and cost is relatively low, high thermal conductivity height obtained insulate, and soft or hard combination package substrate dimensionally stable, thermally conductive pathways are simple, perfect heat-dissipating.
Description
Technical field
The utility model relates to printed circuit board manufacturing technology field more particularly to a kind of soft or hard combinations of high thermal conductivity height insulation
Package substrate.
Background technique
Package substrate is commonly used in technical field of semiconductor encapsulation, package substrate is Substrate (abbreviation SUB), that is, is printed
Term in brush wiring board.Substrate can provide electrical connection, protection, support, heat dissipation, assembling and other effects for chip, to realize draw more
Foot, the purpose for reducing encapsulating products volume, improving electrical property and thermal diffusivity, ultra high density or multi-chip module.Currently, envelope
Dress substrate just develops towards the direction of densification.
Encapsulation technology is most important for the function of playing power semiconductor.Good electric isolution and heat management, it is minimum
Parasitic capacitance, few distributed inductance will be realized by well-designed encapsulating structure.When power semiconductor works
The power consumption of generation is converted into thermal energy, increases device temperature.Semiconductor devices power consumption is more than a critical value, will result in heat not
Stable and thermal breakdown.Meanwhile many parameters of device can also be adversely affected because temperature increases, therefore limit power and partly lead
The die temperature of body device is no more than certain value, and it is very important.And this measure is realized by encapsulation.
The package substrate of high thermal conductivity height insulation at present is generally divided into three kinds: one, through-hole conducting FPC plate+ceramic wafer, this knot
The heat conduction path of structure is: ceramic wafer → tinfoil paper → IMC layers → tin+soft board hole copper → conducting resinl → steel disc, its advantage is that wiring board
Processing procedure is simpler, and disadvantage is: must arrange in pairs or groups ceramic substrate, and thermally conductive pathways are complicated, and heat-conducting area is small, and heat dissipation is general, via hole
Interior tin can not completely fill out.Two, FPC plate+ceramic wafer is connected in blind hole, and the heat conduction path of this structure is: ceramic wafer → tinfoil paper
→ IMC layers → tin+soft board hole copper → conducting resinl → steel disc, its advantage is that: wiring board processing procedure is simpler, the wind in non-soldering tin cavity
Danger, disadvantage are: must arrange in pairs or groups ceramic substrate, and thermally conductive pathways are complicated, and heat-conducting area is small, and poor heat radiation has laser drilling process.
Three, the soft or hard combination package substrate of high thermal conductivity, the heat conduction path of this structure is: ceramic wafer pad → copper post → fine copper stiffening plate,
Its advantage is that: thermal diffusivity is good, and heat eliminating medium is fine copper, and without using ceramic substrate, total plate thickness is adjustable, and disadvantage is: cost
Increase.
Through looking into, the Chinese patent " high thermal conductivity package substrate " of existing Patent No. CN201710119406.5, by two-sided deposited
The ceramics and micro heat pipe for having conductive layer are constituted, it is characterized in that: conductive layer has pattern, a face pattern is for encapsulating power power electronics
Device, power microwave device, logic control circuit, detection circuit, lead etc.；Another side pattern is connected with micro heat pipe.This envelope
It fills substrate and vacuum welding, vacuum friction welding (FW), active metal brazing, nanometer silver soldering is passed through using micro heat pipe and high-heat-conductivity ceramic circuit board
It the means such as connects and reaches metallurgical bonding, reduce thermal resistance, realize high efficiency and heat radiation, but preparation process is also more complicated, cost is also higher.
Utility model content
Technical problem to be solved in the utility model be for the above-mentioned state of the art and to provide a kind of structure simple, scattered
Good in thermal property and the soft or hard combination package substrate of high thermal conductivity height at low cost insulation.
The utility model solves technical solution used by above-mentioned first technical problem are as follows: a kind of high thermal conductivity height insulation is soft
Package substrate is closed in scleroma, it is characterised in that: the high thermal conductivity height insulate soft or hard combination package substrate including successively setting from bottom to up
The top line on ceramic wafer, soft board, insulating layer and the addition set surface on the insulating layer, ceramic wafer are mounted on the following table of soft board
Face, insulating layer are pressed together on the upper surface of soft board, and addition is electroplate with the conducting copper post and heat dissipation being conducted with top line on soft board
Copper post is connected wherein the lower end of heat dissipation copper post passes through soft board with the upper surface of ceramic wafer.
It is preferred that the ceramic wafer is that pure ceramic wafer or single side cover copper ceramic wafer or double-sided copper-clad ceramic wafer.
Further, the lower surface of the soft board is pasted with the glue-line for covering copper face and fitting with ceramic wafer.
It is preferred that the soft board is equipped with the windowing placed for heat dissipation copper post, the diameter for the copper post that radiates is 50 μm~3.0mm.
Finally, the minimum 0.05mm of diameter of the conducting copper post.
Compared with the prior art, the advantages of the utility model are: the Rigid Flex using soft board in conjunction with ceramic wafer
As substrate, product size is stablized, the insulation of high thermal conductivity height；Addition plating conducting copper post instead of original hardboard power auger
Hole, laser drill conduction mode, finer route can not only be produced, many wiring spaces have also been saved, mentioned significantly
The density for rising wiring is able to satisfy cabling requirement for the product of same pixel product size does not increase, and wiring will no longer
Limitation by manufacture craft；In addition, addition plating heat dissipation copper post, not only thermally conductive pathways are simple, also improve heat dissipation effect；Absolutely
Edge layer is thick, realizes high insulation.The utility model process structure is simple, and cost is relatively low, the soft or hard knot of high thermal conductivity height insulation obtained
Close that package substrate dimensionally stable, thermally conductive pathways are simple, perfect heat-dissipating.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for the soft board that the embodiments of the present invention provide；
Fig. 2 is the structural schematic diagram that glue-line is mounted on soft board；
Fig. 3 is the structural schematic diagram in soft board uplifting window；
Fig. 4 is that soft board mounts the structural schematic diagram after upper ceramic wafer；
Fig. 5 is the structural schematic diagram of addition heat dissipation copper post and conducting copper post on soft board；
Fig. 6 is the structural schematic diagram for pressing insulating layer on soft board and pasting after grinding pedestal；
Fig. 7 is that insulating layer grinds and removes the structural schematic diagram after mill pedestal；
Fig. 8 is the structural schematic diagram of addition top line on the insulating layer.
Specific embodiment
The utility model is described in further detail below in conjunction with figure embodiment.
As shown in Fig. 1~8, a kind of soft or hard combination package substrate of high thermal conductivity, including the ceramic wafer set gradually from bottom to up
2, the top line 6 on soft board 1, insulating layer 3 and addition surface on the insulating layer 3, ceramic wafer 2 are mounted on the lower surface of soft board 1,
Insulating layer 3 is pressed together on the upper surface of soft board 1, and addition is electroplate with the conducting copper post 4 being conducted with top line 4 and dissipates on soft board 1
Hot copper post 5 is connected wherein the lower end of heat dissipation copper post 5 passes through soft board 1 with the upper surface of ceramic wafer 2；Ceramic wafer 2 can be pure pottery
Porcelain plate or single side cover copper ceramic wafer or double-sided copper-clad ceramic wafer, and the ceramic wafer 2 of the present embodiment is double-sided copper-clad ceramic wafer, soft board 1
Lower surface be pasted with the glue-line 7 to fit with ceramic wafer 2, glue-line 7 can insulate or nonisulated；It is offered on soft board 1 for dissipating
The windowing 11 that hot copper post 5 places, the diameter of heat dissipation copper post 5 are 50 μm~3.0mm, and the minimum 0.05mm of diameter of copper post 4 is connected,
Finer route can be produced, such 1 route of soft board just passes through conducting copper post 4 and is connected with top line 6；Radiate copper post 5
Diameter it is thicker, usual 50 μm~3.0mm, heat-conducting area is big, convenient for heat dissipation；
The high thermal conductivity height of the present embodiment insulate the preparation method of soft or hard combination package substrate, specific steps are as follows:
1) soft board 1 (such as Fig. 1) is made, detailed process are as follows: first to soft board sawing sheet, conducting is drilled and be electroplated, using machine
Tool drilling or laser drill, then to soft board circuit etching, and make soft board route seed copper, press mold；
2) glue-line 7 (such as Fig. 2) is mounted in the lower surface of soft board 1, glue-line 7, which insulate, nonisulated all may be used；
3) position for corresponding to heat dissipation copper post 5 on soft board 1 carries out windowing 11 (such as by laser, mold stamp or milling machine
Fig. 3)；
4) ceramic wafer 2 is mounted on to the lower surface (such as Fig. 4) of soft board 1 by glue-line 7, ceramic wafer 2 can be pure ceramic wafer
Or single side covers copper ceramic wafer or double-sided copper-clad ceramic wafer, the ceramic wafer 2 of the present embodiment is double-sided copper-clad ceramic wafer；
5) conducting copper post 4 and heat dissipation copper post 5 (such as Fig. 5) then are made in soft board 1, and to conducting copper post 4 and heat dissipation copper post 5
It is electroplated, wherein the windowing 11 that heat dissipation copper post 5 passes through soft board 1 is connected with the upper surface of ceramic wafer 1；Copper post 4 is connected and dissipates
The fabrication processing of hot copper post 5 are as follows: seed copper → press mold → exposure → development → plating conducting copper post 5 and heat dissipation copper post 6 →
Move back seed copper；
6) insulating layer 3 (such as Fig. 6) is pressed on soft board 1, and is pasting grinding pedestal 8；
7) carrying out grinding to the upper surface of insulating layer 3 makes to expose conducting copper post 4 and heat dissipation copper post 5, while removing grinding bottom
8 (such as Fig. 7) of seat；
8) one layer of conductive seeds copper is deposited on the insulating layer 3, and top line 6 (such as Fig. 8) is made using additive process process, is added
At the process flow of method technique production top line 6 are as follows: seed is moved back in seed copper → press mold → exposure → development → electroplating line →
Copper；Make copper post 4 to be connected and radiate copper post 5 and the connection of top line 6；
9) exposure of welding resistance silk-screen finally is carried out to top line 6.
The diameter minimum that copper post 4 is wherein connected can be 0.05mm, can produce finer route in this way, also save
Many wiring space, and the diameter for the copper post 5 that radiates is thicker, usually 50 μm~3.0mm, is connected to top line 6, passes through soft
The upper surface of plate 1, ceramic wafer 2 is connected, so that thermally conductive pathways are simple, heat-conducting area is big, convenient for more radiating.
The high thermal conductivity height of the utility model insulate soft or hard combination package substrate compared with existing package substrate, not only structure
Simply, easy to make, at low cost, and thermally conductive pathways are simple, heat-conducting area is big, and heat dissipation performance is more preferable.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
For art personnel, without deviating from the technical principle of the utility model, several improvements and modifications can also be made, these change
It also should be regarded as the protection scope of the utility model into retouching.
Claims (5)
- A kind of soft or hard combination package substrate 1. high thermal conductivity height insulate, it is characterised in that: the soft or hard combination envelope of high thermal conductivity height insulation Dress substrate includes the top layer line on the ceramic wafer set gradually from bottom to up, soft board, insulating layer and addition surface on the insulating layer Road, ceramic wafer are mounted on the lower surface of soft board, and insulating layer is pressed together on the upper surface of soft board, and addition is electroplate with and top layer line on soft board The conducting copper post and heat dissipation copper post that road is conducted, are connected wherein the lower end of heat dissipation copper post passes through soft board with the upper surface of ceramic wafer It connects.
- The soft or hard combination package substrate 2. high thermal conductivity height according to claim 1 insulate, it is characterised in that: the ceramic wafer is Pure ceramic wafer or single side cover copper ceramic wafer or double-sided copper-clad ceramic wafer.
- The soft or hard combination package substrate 3. high thermal conductivity height according to claim 1 insulate, it is characterised in that: under the soft board Surface mount has the glue-line for covering copper face and fitting with ceramic wafer.
- The soft or hard combination package substrate 4. high thermal conductivity height according to claim 1 insulate, it is characterised in that: set on the soft board There is the windowing placed for heat dissipation copper post, the diameter for the copper post that radiates is 50 μm~3.0mm.
- The soft or hard combination package substrate 5. high thermal conductivity height according to claim 1 insulate, it is characterised in that: the conducting copper post The minimum 0.05mm of diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820996991.7U CN208402206U (en) | 2018-06-27 | 2018-06-27 | A kind of soft or hard combination package substrate of high thermal conductivity height insulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820996991.7U CN208402206U (en) | 2018-06-27 | 2018-06-27 | A kind of soft or hard combination package substrate of high thermal conductivity height insulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208402206U true CN208402206U (en) | 2019-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820996991.7U Active CN208402206U (en) | 2018-06-27 | 2018-06-27 | A kind of soft or hard combination package substrate of high thermal conductivity height insulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208402206U (en) |
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2018
- 2018-06-27 CN CN201820996991.7U patent/CN208402206U/en active Active
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