CN208362451U - For removing the device of evaporator vapor deposition mouth deposition materials - Google Patents
For removing the device of evaporator vapor deposition mouth deposition materials Download PDFInfo
- Publication number
- CN208362451U CN208362451U CN201820921465.4U CN201820921465U CN208362451U CN 208362451 U CN208362451 U CN 208362451U CN 201820921465 U CN201820921465 U CN 201820921465U CN 208362451 U CN208362451 U CN 208362451U
- Authority
- CN
- China
- Prior art keywords
- heat block
- vapor deposition
- mouth
- fixing rack
- down fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000463 material Substances 0.000 title claims abstract description 35
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 25
- 230000008021 deposition Effects 0.000 title claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 230000003028 elevating effect Effects 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 3
- 238000010025 steaming Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 10
- 238000000576 coating method Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000008030 elimination Effects 0.000 abstract description 2
- 238000003379 elimination reaction Methods 0.000 abstract description 2
- 238000000151 deposition Methods 0.000 description 13
- 238000001704 evaporation Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000002309 gasification Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
The utility model discloses a kind of for removing the device of evaporator vapor deposition mouth deposition materials, component is removed including heating, it includes heat block down fixing rack that component is removed in heating, the heat block down fixing rack is placed in the working chamber of evaporator, and heat block down fixing rack lower surface is fixed with heat block, the corresponding vapor deposition outlet top for being placed in crucible cover of the heat block, the heat block down fixing rack are moved up and down by elevating mechanism driving.The utility model is easy to operate, and the operation for closing or stopping whole equipment not being needed when removing deposition materials, ensure that normal production work efficiency；Elimination effect is good, can be avoided Coating Materials and is excessively deposited on crucible cover, more avoids and block mouth of pot.
Description
Technical field
The utility model relates to a kind of for removing the device of evaporator vapor deposition mouth deposition materials, belong to semiconductor preparation dress
It sets.
Background technique
Vapor deposition refers under vacuum conditions, using certain heating evaporation mode structural evaporation coating film material (or coating materials) and makes
Gasification, particle fly to substrate surface agglomerate film forming process.Vapour deposition method is heavy using the gas phase wide compared with early, purposes
Product technology has many advantages, such as simple film build method, film purity and compactness height, membrane structure and unique properties, mainly uses
Equipment is vacuum evaporation plating machine, however is found in practical operation, and Coating Materials can be often deposited on crucible cover in evaporation process, is sunk
Product excessively can directly block the mouth of pot of crucible cover, then influence the normal operation of equipment.In order to guarantee the normal operation of equipment,
It can only stop the operation of evaporator at regular intervals, and periodically remove the deposition materials of mouth of pot, processing operation trouble, and
Reduce the efficiency of normal work.
Summary of the invention
It is persistently transported in view of the above-mentioned problems of the prior art, the purpose of the utility model is to provide one kind in guarantee equipment
In the case where row, the deposition materials on crucible cover can be smoothly removed, it is easy to operate and will not influence normal production work effect
Rate.
It is a kind of heavy for removing evaporator vapor deposition mouth that in order to achieve the above purposes, the technical solution adopted by the utility model is:
Component is removed in the device of product material, including heating, and it includes heat block down fixing rack that component is removed in heating, the heat block lifting
Fixation is placed in the working chamber of evaporator, and heat block down fixing rack lower surface is fixed with heat block, the heat block pair
It should be placed in the vapor deposition outlet top of crucible cover, the heat block down fixing rack is moved up and down by elevating mechanism driving.
Preferably, the vapor deposition outlet has two groups, and every group of vapor deposition outlet includes the multiple mouth of pot being set side by side；It is described to add
There are two heat blocks, is symmetrically arranged at the lower surface of heat block down fixing rack, and on each heat block with mouth of pot face be equipped with it is more
A conducting syringe needle.When heat block is bonded as heat block down fixing rack drops to crucible cover, conducting syringe needle can be right respectively
Each mouth of pot should be passed through, directly get through the mouth of pot blocked by evaporation material, so that further improving removal is covered on steaming
The efficiency of deposition materials in plating outlet.
Preferably, in order to promote heating efficiency, the heat block is fine copper heat block.Fine copper heat block thermal conductivity is high, leads to
Deposition materials can be disposed in the shortest time with quick response after electricity, can guarantee that Coating Materials will not deposit.
Preferably, the elevating mechanism is drive cylinder, and the oil cylinder rod head end of the drive cylinder is connected to heat block liter
It drops on fixed frame, the cylinder tube pedestal of drive cylinder is located on the fixed bracket of an oil cylinder.The fixed bracket of oil cylinder can be located at work
In chamber, in order to save the space of working chamber, it can also be located at outside working chamber.
Working principle: when crucible cover and excessive vapor deposition outlet deposition materials, elevating mechanism drives heat block lifting to fix
Frame is mobile, heat block down fixing rack is put down until heat block fits to crucible cap upper surface, heat block electrified regulation makes to sink
Product material is distilled at high temperature, is then directly extracted out by the vacuum pump in working chamber；After Coating Materials removal to be deposited,
Heat block power-off, heat block down fixing rack, which is lifted, can make heat block far from crucible cap upper surface.
The utility model is easy to operate, and the operation for closing or stopping whole equipment not being needed when removing deposition materials, is guaranteed
Normal production work efficiency；Elimination effect is good, can be avoided Coating Materials and is excessively deposited on crucible cover, more avoids stifled
Firmly mouth of pot.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the enlarged drawing in Fig. 1 at A；
In figure, 1. working chambers, 21. heat block down fixing racks, 22. heat blocks, 22-1. conducting syringe needle, 23. elevators
Structure, 23-1. drive cylinder, the fixed bracket of 23-2. oil cylinder, 3. crucible covers, 31. vapor deposition outlets.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawing.
As shown, a kind of for removing the device of evaporator vapor deposition mouth deposition materials, including heating removing component, heating
Removing component includes heat block down fixing rack 21, and the heat block down fixing rack 21 is placed in the working chamber 1 of evaporator, and
21 lower surface of heat block down fixing rack is fixed with heat block 22, the corresponding vapor deposition outlet for being placed in crucible cover 3 of the heat block 22
31 tops, the heat block down fixing rack 21 are moved up and down by the driving of elevating mechanism 23.
In use, substrate and Coating Materials (not shown) are placed in 3 lower section of crucible cover in working chamber 1, heating plating
Membrane material, which is allowed to evaporation gasification, to agglomerate film forming layer in substrate surface.When 3 surface of crucible cover and vapor deposition outlet 31 are deposited with plating
When membrane material, elevating mechanism 23 drives heat block down fixing rack 21 mobile, heat block down fixing rack 21 is put down until adding
Heat block 22 fits to 3 upper surface of crucible cover, 22 electrified regulation of heat block, so that deposition materials is distilled at high temperature, then can be straight
It connects by the vacuum pump extraction in working chamber 1；After Coating Materials removal to be deposited, heat block 22 is powered off, by heat block liter
Drop fixed frame 21, which lifts, can make heat block 22 far from 3 upper surface of crucible cover.
Different evaporators may arrange have multiple vapor deposition outlets 31 as needed.Preferably, the vapor deposition outlet 31 has
Two groups, every group of vapor deposition outlet 31 includes the multiple mouth of pot being set side by side；There are two the heat blocks 22, is symmetrically arranged at heat block
The lower surface of down fixing rack 21, and multiple conducting syringe needle 22-1 are equipped with mouth of pot face on each heat block 22.Heat block
22 with heat block down fixing rack 21 drop to be bonded with crucible cover 3 when, conducting syringe needle 22-1 can respectively correspond across each
A mouth of pot directly gets through the mouth of pot blocked by evaporation material, so that further improving removal is covered on vapor deposition outlet 31
On deposition materials efficiency.
Heat block 22 can use multiple heating mode, such as electric heating, Ion Heating, microwave heating.Preferably, in order to
Heating efficiency is promoted, the heat block 22 is fine copper heat block.It is high using electrically heated fine copper heat block thermal conductivity, it can after energization
With quick response, deposition materials are disposed in the shortest time, can guarantee that Coating Materials will not deposit.
Elevating mechanism 23 can be using a variety of mechanical structures with elevating function, such as cylinder, electric telescopic rod etc..It is excellent
Choosing, the elevating mechanism 23 is drive cylinder 23-1, and the oil cylinder rod head end of the drive cylinder 23-1 is connected to heat block liter
It drops on fixed frame 21, the cylinder tube pedestal of drive cylinder 23-1 is located on the fixed bracket 23-2 of an oil cylinder.Oil cylinder fixes bracket 23-
2 can be located in working chamber 1, in order to save the space of working chamber 1, can also be located at outside working chamber 1.
Claims (4)
1. a kind of for removing the device of evaporator vapor deposition mouth deposition materials, which is characterized in that remove component, heating including heating
Removing component includes heat block down fixing rack (21), and the heat block down fixing rack (21) is placed in the working chamber of evaporator
(1) in, and heat block down fixing rack (21) lower surface is fixed with heat block (22), and heat block (22) correspondence is placed in crucible
It covers above the vapor deposition outlet (31) of (3), the heat block down fixing rack (21) is moved up and down by elevating mechanism (23) driving.
2. according to claim 1 for removing the device of evaporator vapor deposition mouth deposition materials, which is characterized in that the steaming
Plating outlet (31) has two groups, and every group of vapor deposition outlet (31) includes the multiple mouth of pot being set side by side；The heat block (22) has two
It is a, be symmetrically arranged at the lower surface of heat block down fixing rack (21), and on each heat block (22) with mouth of pot face be equipped with it is more
A conducting syringe needle (22-1).
3. according to claim 1 for removing the device of evaporator vapor deposition mouth deposition materials, which is characterized in that described to add
Heat block (22) is fine copper heat block.
4. according to claim 1 for removing the device of evaporator vapor deposition mouth deposition materials, which is characterized in that the liter
Descending mechanism (23) is drive cylinder (23-1), and the oil cylinder rod head end of the drive cylinder (23-1) is connected to heat block lifting and fixes
On frame (21), the cylinder tube pedestal of drive cylinder (23-1) is located on an oil cylinder fixed bracket (23-2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820921465.4U CN208362451U (en) | 2018-06-13 | 2018-06-13 | For removing the device of evaporator vapor deposition mouth deposition materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820921465.4U CN208362451U (en) | 2018-06-13 | 2018-06-13 | For removing the device of evaporator vapor deposition mouth deposition materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208362451U true CN208362451U (en) | 2019-01-11 |
Family
ID=64928964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820921465.4U Active CN208362451U (en) | 2018-06-13 | 2018-06-13 | For removing the device of evaporator vapor deposition mouth deposition materials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208362451U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110029311A (en) * | 2019-03-29 | 2019-07-19 | 新冶高科技集团有限公司 | A kind of evaporation coating device and method |
-
2018
- 2018-06-13 CN CN201820921465.4U patent/CN208362451U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110029311A (en) * | 2019-03-29 | 2019-07-19 | 新冶高科技集团有限公司 | A kind of evaporation coating device and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200608 Address after: 201201, room 1, building 6111, 509 East Dragon Road, Shanghai, Pudong New Area Patentee after: SHANGHAI TIANMA AM-OLED Co.,Ltd. Address before: 221300 Pizhou Jiangsu Economic Development Zone, West Liaohe Road, north of Huashan Road West Patentee before: JIANGSU SHIWEI SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211025 Address after: No.8, liufangyuan Henglu, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee after: WUHAN TIANMA MICROELECTRONICS Co.,Ltd. Patentee after: Wuhan Tianma Microelectronics Co.,Ltd. Shanghai Branch Address before: Room 509, building 1, No. 6111, Longdong Avenue, Pudong New Area, Shanghai, 201201 Patentee before: SHANGHAI TIANMA AM-OLED Co.,Ltd. |