CN208352273U - Semiconductor baseplate carrier blanking dismantling picks and places mobile phone structure - Google Patents
Semiconductor baseplate carrier blanking dismantling picks and places mobile phone structure Download PDFInfo
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- CN208352273U CN208352273U CN201821058190.2U CN201821058190U CN208352273U CN 208352273 U CN208352273 U CN 208352273U CN 201821058190 U CN201821058190 U CN 201821058190U CN 208352273 U CN208352273 U CN 208352273U
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- pedestal
- carrier
- picks
- mobile phone
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Abstract
A kind of semiconductor baseplate carrier blanking dismantling picks and places mobile phone structure, comprising: can up and down, the pedestal that moves left and right；For the vacuum chuck of carrier cover board to be sucked from top, the vacuum chuck is located at the downside of the pedestal, and fixes with the pedestal；Bilateral symmetry is fixed on the lower section of the pedestal and can left and right two handgrip close to each other or separate, have on the handgrip for multiple finger portions below substrate can be extended to from the notch level of carrier bottom panel side when left and right is close to each other, the multiple finger portion time interval is sequentially distributed.The utility model can disassemble carrier in substrate process automatically after processing is completed, Carrier base be separated with substrate and carrier cover board, and then by substrate blanking to follow-up mechanism, and recycle carrier cover board, high-efficient.
Description
Technical field
The utility model relates to technical field of semiconductors more particularly to a kind of semiconductor baseplate carrier blanking dismantling to pick and place hand
Mechanism.
Background technique
In semiconductor rear section packaging technology, when carrying out the techniques processing such as Flip chip, heating cleaning, substrate is put down
Whole degree has strict requirements and limitation, and because of the characteristic of substrate warpage itself, extraneous mechanism must be accommodated to help base by determining
Plate is smooth to realize.
Traditional solution is that all have substrate flattening mechanism to each process equipment, smooth and for different process
Mechanism is inconsistent, to increase the difficulty of each process equipment, is also unfavorable for the fluency of upstream and downstream technique.
Therefore in order to cooperate a kind of semiconductor substrate that substrate can be kept smooth to load carrier, need a kind of semiconductor-based onboard
Have blanking dismantling and pick and place mobile phone structure, carrier can be disassembled after processing is completed in technique automatically, by Carrier base and substrate and carrier
Cover board separation, and then by substrate blanking to follow-up mechanism, and recycle carrier cover board.
Utility model content
Based on this, in view of the above technical problems, a kind of semiconductor baseplate carrier blanking dismantling pick-and-place mobile phone structure is provided.
In order to solve the above technical problems, the utility model adopts the following technical solution:
A kind of semiconductor baseplate carrier blanking dismantling pick-and-place mobile phone structure, comprising:
Can up and down, the pedestal that moves left and right；
For being sucked the vacuum chuck of carrier cover board from top, the vacuum chuck is located at the downside of the pedestal, and with
The pedestal is fixed；
Bilateral symmetry be fixed on the pedestal lower section and can left and right two handgrips close to each other or separate, it is described to grab
Have on hand for multiple finger portions below substrate can be extended to from the notch level of carrier bottom panel side when left and right is close to each other,
The multiple finger portion time interval is sequentially distributed.
The pedestal is in rectangle, and front and rear sides extend outward to form former and later two fixed parts, the fixed part be equipped with to
The guide post of lower extension, the rear and front end of the vacuum chuck passes through a spring respectively and fixes with described two fixed parts, described
One end of spring is sheathed in the guide post and connect with fixed part, and the other end is connect with the vacuum chuck.
Described two handgrips are fixed on the lower section of the pedestal by parallel cylinder.
The handgrip includes supporting beam, and the supporting beam is fixed with the parallel cylinder, and the finger portion is L-shaped, vertical
Section is fixed with the supporting beam.
The pedestal is fixed by connector and a reciprocating mechanism, and the reciprocating mechanism is fixed on one or so water
In flat mobile mechanism.
The utility model can disassemble carrier in substrate process automatically after processing is completed, by Carrier base and substrate and carrier lid
Plate separation, so by substrate blanking to follow-up mechanism, and carrier cover board is recycled, it is high-efficient.
Detailed description of the invention
The utility model is described in detail with reference to the accompanying drawings and detailed description:
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is that the handgrip of the utility model clamps schematic diagram；
Fig. 3 is the structural schematic diagram of the handgrip of the utility model；
Fig. 4 is the exploded view of carrier.
Specific embodiment
As shown in Figure 1-3, a kind of semiconductor baseplate carrier blanking dismantling picks and places mobile phone structure, including pedestal 110, vacuum chuck
120 and two handgrips 130.
Pedestal 110 is fixed by connector 111 and reciprocating mechanism 112, and reciprocating mechanism 112 is fixed on left and right water
In flat mobile mechanism 113, above and below realization, move left and right.
Wherein, reciprocating mechanism 112 and left and right horizontal mobile mechanism 113 can be cylinder or electric cylinders.
Vacuum chuck 120 is used to from top carrier cover board 23 be sucked, and is located at the downside of pedestal 110, and with the pedestal 110
It is fixed.
In the present embodiment, pedestal 110 is in rectangle, and front and rear sides extend outward to form former and later two fixed parts 114, Gu
Determine portion 114 and be equipped with the guide post 115 extended downwardly, the rear and front end of vacuum chuck 120 passes through spring 121 and two fixations respectively
Portion 114 is fixed, and one end of spring 121 is sheathed in guide post and connect with fixed part 114, and the other end and vacuum chuck 120 connect
It connects.
Two 130 bilateral symmetries of handgrip be fixed on the lower section of pedestal 110 and can left and right it is close to each other or separate, handgrip
Have on 130 for that can be extended to below substrate 22 from the notch 21a level of 21 side of carrier bottom plate when left and right is close to each other
Multiple finger portions 131, multiple 131 time intervals of finger portion are sequentially distributed.
In the present embodiment, two handgrips 130 are fixed on the lower section of pedestal 110 by parallel cylinder 132 comprising support
Beam 133, supporting beam 133 and parallel cylinder 132 are fixed, refer to that portion 131 is L-shaped, and vertical section and supporting beam 133 are fixed.
As shown in figure 4, substrate 22 can be sandwiched in centre by bottom plate 21 and about 23 fixation of cover board, so that substrate 22 be made to keep flat
Whole, the left and right sides of bottom plate 21 has notch 21a, has the rectangular aperture for exposed core function process island on cover board 23
23a and rectangular notch 23b and strip aperture 23c for exposed identification function process island.It is defeated that carrier carries substrate 22
It send to processing systems, downstream process process equipment can pass through rectangular aperture 23a, rectangular notch 23b and elongate holes
Mouth 23c can be carried out technique processing.
Before dismantling, substrate 22 and base board carrier are on vaccum bench 3, and carrier bottom plate 21 is fixed by vacuum suction, and two are grabbed
Hand 130 is in open configuration, and two handgrips 130 are moved to the top of substrate 22 and carrier by pedestal 110, and begin to decline,
Vacuum chuck 120 first contacts cover board 23, continues to decline, and since the action vacuum sucker 120 of spring 121 is compressed, inhales vacuum
Disk 120 carries out saturation with cover board 23 and contacts, and 120 vacuum of vacuum chuck is opened, and cover board 23 is sucked；Then two handgrips 130 are mutual
It is close, refer to that portion 131 extends to 22 lower section of substrate from notch 21a level, so that substrate 22 and cover board 23 are clamped together, on
The two can be detached from after rising from bottom plate 21, disassemble and come；It is first moved horizontally at substrate blanking later, by two handgrips
130 unclamp, and carry out blanking to substrate, are then moved horizontally at cover board recycling, the vacuum release of vacuum chuck 120, to return
Receive cover board 23.
The utility model can disassemble carrier in substrate process automatically after processing is completed, by Carrier base and substrate and carrier lid
Plate separation, so by substrate blanking to follow-up mechanism, and carrier cover board is recycled, it is high-efficient.
But those of ordinary skill in the art it should be appreciated that more than embodiment be intended merely to illustrate this
Utility model, and being not used as the restriction to the utility model, if in the spirit of the utility model, to
Variation, the modification of the upper embodiment will all be fallen in the Claims scope of the utility model.
Claims (5)
1. a kind of semiconductor baseplate carrier blanking dismantling picks and places mobile phone structure characterized by comprising
Can up and down, the pedestal that moves left and right；
For being sucked the vacuum chuck of carrier cover board from top, the vacuum chuck is located at the downside of the pedestal, and with the bottom
Seat is fixed；
Bilateral symmetry be fixed on the lower section of the pedestal and can left and right two handgrips close to each other or separate, on the handgrip
It is described with for multiple finger portions below substrate can be extended to from the notch level of carrier bottom panel side when left and right is close to each other
Multiple finger portions time interval is sequentially distributed.
2. a kind of semiconductor baseplate carrier blanking dismantling according to claim 1 picks and places mobile phone structure, which is characterized in that described
Pedestal is in rectangle, and front and rear sides extend outward to form former and later two fixed parts, and the fixed part is equipped with the guiding extended downwardly
Column, the rear and front end of the vacuum chuck pass through a spring respectively and fix with described two fixed parts, an end cap of the spring
It is connect in the guide post and with fixed part, the other end is connect with the vacuum chuck.
3. a kind of semiconductor baseplate carrier blanking dismantling according to claim 1 or 2 picks and places mobile phone structure, which is characterized in that
Described two handgrips are fixed on the lower section of the pedestal by parallel cylinder.
4. a kind of semiconductor baseplate carrier blanking dismantling according to claim 3 picks and places mobile phone structure, which is characterized in that described
Handgrip includes supporting beam, and the supporting beam is fixed with the parallel cylinder, and the finger portion is L-shaped, vertical section and the support
Beam is fixed.
5. a kind of semiconductor baseplate carrier blanking dismantling according to claim 4 picks and places mobile phone structure, which is characterized in that described
Pedestal is fixed by connector and a reciprocating mechanism, and the reciprocating mechanism is fixed on a left and right horizontal mobile mechanism
On.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821058190.2U CN208352273U (en) | 2018-07-05 | 2018-07-05 | Semiconductor baseplate carrier blanking dismantling picks and places mobile phone structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821058190.2U CN208352273U (en) | 2018-07-05 | 2018-07-05 | Semiconductor baseplate carrier blanking dismantling picks and places mobile phone structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208352273U true CN208352273U (en) | 2019-01-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821058190.2U Active CN208352273U (en) | 2018-07-05 | 2018-07-05 | Semiconductor baseplate carrier blanking dismantling picks and places mobile phone structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110567986A (en) * | 2019-10-22 | 2019-12-13 | 苏州精濑光电有限公司 | Silicon-based OLED panel lighting inspection equipment |
-
2018
- 2018-07-05 CN CN201821058190.2U patent/CN208352273U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110567986A (en) * | 2019-10-22 | 2019-12-13 | 苏州精濑光电有限公司 | Silicon-based OLED panel lighting inspection equipment |
| CN110567986B (en) * | 2019-10-22 | 2020-11-17 | 苏州精濑光电有限公司 | Silicon-based OLED panel lighting inspection equipment |
| WO2021077551A1 (en) * | 2019-10-22 | 2021-04-29 | 苏州精濑光电有限公司 | Lightening inspection apparatus for silicon-based oled panel |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 201600 Building 1, No. 76, Jinma Road, Jiuting Town, Songjiang District, Shanghai Patentee after: Shanghai Shiyu Precision Equipment Co.,Ltd. Address before: 201600 Room 101, building 3, no.1589, Lianfu Road, Jiuting Town, Songjiang District, Shanghai Patentee before: SHANGHAI SHIYU PRECISION MACHINERY Co.,Ltd. |