CN208352267U - The smooth carrier of semiconductor substrate - Google Patents
The smooth carrier of semiconductor substrate Download PDFInfo
- Publication number
- CN208352267U CN208352267U CN201821058166.9U CN201821058166U CN208352267U CN 208352267 U CN208352267 U CN 208352267U CN 201821058166 U CN201821058166 U CN 201821058166U CN 208352267 U CN208352267 U CN 208352267U
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- CN
- China
- Prior art keywords
- cover board
- bottom plate
- substrate
- smooth
- positioning region
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of smooth carrier of semiconductor substrate, it can be fixed including the bottom plate for being horizontally arranged substrate and up and down with the bottom plate so that the substrate is sandwiched in the smooth cover board of intermediate holding, there is the first positioning region on the bottom plate, there is the second positioning region cooperated with first positioning region on the cover board, and there are the hollow-out parts of the process island for exposed substrate on the cover board.Substrate is sandwiched in centre by bottom plate and cover board by the utility model, to keep smooth, each process equipment is made to become simple, it does not need in addition to install flattening mechanism additional, it is versatile, so that upstream and downstream technique is become more smooth, to make processing technology become simply, while also saving cost.
Description
Technical field
The utility model relates to technical field of semiconductors more particularly to a kind of smooth carriers of semiconductor substrate.
Background technique
In semiconductor rear section packaging technology, when carrying out the techniques processing such as Flip chip, heating cleaning, substrate is put down
Whole degree has strict requirements and limitation, and because of the characteristic of substrate warpage itself, extraneous mechanism must be accommodated to help base by determining
Plate is smooth to realize.
Traditional solution is that all have substrate flattening mechanism to each process equipment, smooth and for different process
Mechanism is inconsistent, to increase the difficulty of each process equipment, is also unfavorable for the fluency of upstream and downstream technique.
Utility model content
Based on this, in view of the above technical problems, a kind of smooth carrier of semiconductor substrate is provided.
In order to solve the above technical problems, the utility model adopts the following technical solution:
A kind of smooth carrier of semiconductor substrate can be consolidated including the bottom plate for being horizontally arranged substrate and up and down with the bottom plate
Determine that there is the first positioning region on the bottom plate, have on the cover board so that the substrate is sandwiched in intermediate holding smooth cover board
The second positioning region cooperated with first positioning region, and there are the hollow-out parts of the process island for exposed substrate on the cover board.
The upper surface of the bottom plate forms the saddle for holding up the substrate, and the two sides of the saddle have for disassembling pawl
Stretch to the notch on the downside of substrate.
The bottom plate and cover board can upper and lower magnetic attractings.
The surrounding of the plate upper surface is uniformly provided with multiple magnet, and the cover board is magnetic material cover board.
First positioning region is the pilot pin that may pass upwardly through the first positioning hole of the substrate edges, the pilot pin
Positioned at the edge of the plate upper surface, second positioning region is the second location hole penetrated for the pilot pin.
The hollow-out parts include for the rectangular aperture of exposed core function process island and for exposed identification function work
The rectangular notch in skill area and strip aperture.
Substrate is sandwiched in centre by bottom plate and cover board by the utility model, to keep smooth, becomes each process equipment
It obtains simply, does not need in addition to install flattening mechanism additional, it is versatile, so that upstream and downstream technique is become more smooth, to make to process work
Skill becomes simply, while also saving cost.
Detailed description of the invention
The utility model is described in detail with reference to the accompanying drawings and detailed description:
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the decomposition texture schematic diagram of the utility model；
Fig. 3 is the A-A cross-sectional view of Fig. 1；
Fig. 4 is the B-B cross-sectional view of Fig. 2.
Specific embodiment
As shown in Figs 1-4, the smooth carrier of a kind of semiconductor substrate, including for being horizontally arranged substrate bottom plate 110 and
It can be fixed substrate 20 is sandwiched in the smooth cover board 120 of intermediate holding with about 110 bottom plate.
In the present embodiment, bottom plate 110 and cover board 120 can upper and lower magnetic attractings.
Specifically, the surrounding of 110 upper surface of bottom plate is uniformly provided with multiple magnet, and cover board 120 is magnetic material cover board.
There is the first positioning region 111 on bottom plate 110.
In order to which, convenient for dismantling carrier, the upper surface of bottom plate 110 forms the saddle for holding up substrate 20 after the completion of technique
112, saddle 112 has the notch 112a that 20 downside of substrate is stretched to for dismantling pawl in the two sides of 110 length direction of bottom plate.
In the present embodiment, notch 112a is arc-shaped, and totally six, six notch 112a are arranged symmetrically.
There is the second positioning region 121 cooperated with the first positioning region 111 on cover board 120, and have on the cover board 120 and be used for
The hollow-out parts of the process island of exposed substrate 20.
In the present embodiment, the first positioning region 111 is the positioning that may pass upwardly through the first positioning hole 21 at 20 edge of substrate
Needle, pilot pin are located at the edge of 110 upper surface of bottom plate, and the second positioning region 121 is the second location hole penetrated for pilot pin.
Hollow-out parts include for the rectangular aperture 122 of exposed core function process island and for exposed identification function technique
The rectangular notch 123 in area and strip aperture 124.
Core function process island is the position that substrate 20 needs to carry out technique processing, and identification function process island needs for substrate 20
Carry out the position of the functions such as reading code and visual identity.
In the present embodiment, rectangular aperture 122 is four, and four rectangular apertures 122 arrange along its length, rectangular notch
123 be one, is located at the one side edge of 120 width direction of cover board, and strip aperture 124 is two, is respectively symmetrically located at lid
The two sides of 120 width direction of plate.
In use, substrate 20 is placed on bottom plate 110, by the first positioning hole 21 and bottom plate 110 on substrate 20
Pilot pin positioned, after placing, pilot pin is higher than the upper surface of substrate 20；Then cover board 120 is placed into base again
20 upper surface of plate is positioned by second location hole on cover board 120 and pilot pin, and after placing, pilot pin is lower than lid
The upper surface of plate 120.Substrate 20, bottom plate 110 and cover board 120 may be used for each process equipment at being integral in this way
Technique machined.
Substrate 20 is sandwiched in centre by bottom plate 110 and cover board 120 by the utility model, to keep smooth, makes each work
Skill equipment becomes simply, not needing in addition to install flattening mechanism additional, versatile, and upstream and downstream technique is made to become more smooth, thus
Become processing technology simply, while also saving cost.
But those of ordinary skill in the art it should be appreciated that more than embodiment be intended merely to illustrate this
Utility model, and being not used as the restriction to the utility model, if in the spirit of the utility model, to
Variation, the modification of the upper embodiment will all be fallen in the Claims scope of the utility model.
Claims (6)
1. a kind of smooth carrier of semiconductor substrate, which is characterized in that including for being horizontally arranged substrate bottom plate and can be with this
Bottom plate is fixed up and down to have the first positioning region on the bottom plate so that the substrate is sandwiched in intermediate holding smooth cover board, described
There is the second positioning region cooperated with first positioning region on cover board, and there is the process island for exposed substrate on the cover board
Hollow-out parts.
2. the smooth carrier of a kind of semiconductor substrate according to claim 1, which is characterized in that the upper surface shape of the bottom plate
At the saddle for holding up the substrate, the two sides of the saddle, which have, stretches to the notch on the downside of substrate for dismantling pawl.
3. the smooth carrier of a kind of semiconductor substrate according to claim 2, which is characterized in that the bottom plate and cover board can on
Magnetic is attracted.
4. the smooth carrier of a kind of semiconductor substrate according to claim 3, which is characterized in that the four of the plate upper surface
It is uniformly provided with multiple magnet week, the cover board is magnetic material cover board.
5. the smooth carrier of a kind of semiconductor substrate according to claim 2 or 4, which is characterized in that first positioning region
For may pass upwardly through the substrate edges first positioning hole pilot pin, the pilot pin is located at the side of the plate upper surface
Edge, second positioning region are the second location hole penetrated for the pilot pin.
6. the smooth carrier of a kind of semiconductor substrate according to claim 5, which is characterized in that the hollow-out parts include being used for
The rectangular aperture of exposed core function process island and rectangular notch and strip aperture for exposed identification function process island.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821058166.9U CN208352267U (en) | 2018-07-05 | 2018-07-05 | The smooth carrier of semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821058166.9U CN208352267U (en) | 2018-07-05 | 2018-07-05 | The smooth carrier of semiconductor substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208352267U true CN208352267U (en) | 2019-01-08 |
Family
ID=64904855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821058166.9U Active CN208352267U (en) | 2018-07-05 | 2018-07-05 | The smooth carrier of semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208352267U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116364563A (en) * | 2023-03-17 | 2023-06-30 | 无锡美科微电子技术有限公司 | Display screen substrate covering method |
-
2018
- 2018-07-05 CN CN201821058166.9U patent/CN208352267U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116364563A (en) * | 2023-03-17 | 2023-06-30 | 无锡美科微电子技术有限公司 | Display screen substrate covering method |
| CN116364563B (en) * | 2023-03-17 | 2023-10-24 | 无锡美科微电子技术有限公司 | Display screen substrate covering method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 201600 Building 1, No. 76, Jinma Road, Jiuting Town, Songjiang District, Shanghai Patentee after: Shanghai Shiyu Precision Equipment Co.,Ltd. Address before: 201600 Room 101, building 3, no.1589, Lianfu Road, Jiuting Town, Songjiang District, Shanghai Patentee before: SHANGHAI SHIYU PRECISION MACHINERY Co.,Ltd. |