CN208350849U - A kind of ICT automatic aligning test fixture - Google Patents
A kind of ICT automatic aligning test fixture Download PDFInfo
- Publication number
- CN208350849U CN208350849U CN201820966225.6U CN201820966225U CN208350849U CN 208350849 U CN208350849 U CN 208350849U CN 201820966225 U CN201820966225 U CN 201820966225U CN 208350849 U CN208350849 U CN 208350849U
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- China
- Prior art keywords
- silica gel
- upper die
- plate
- fixing device
- test fixture
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- 238000012360 testing method Methods 0.000 title claims abstract description 96
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 91
- 239000000741 silica gel Substances 0.000 claims abstract description 88
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 88
- 238000006243 chemical reaction Methods 0.000 claims abstract description 16
- 239000012780 transparent material Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 description 18
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- -1 acryl Chemical group 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model provides a kind of ICT automatic aligning test fixture, including upper die and lower die, lower die includes the lower mold body made of transparent material, lower mold body is equipped with multiple pins, multiple pins are connect with lower mold body, multiple pins surround the detent being adapted with the outer dimension of test board, and test board is set in detent；Upper mold includes upper mould body, upper mould body is equipped with the fixed device of cylinder, spring needle, silica gel and pin hole, the fixed device of cylinder, spring needle and silica gel is connect with upper mould body, the fixed device of silica gel is equipped with silica gel block, silica gel block is connect with the fixed device of silica gel, cylinder is connect with the fixed device of silica gel, and the mutual cooperation of cylinder and spring needle simultaneously drives the fixed device of silica gel to move up and down；Test board is correspondingly connected with test conversion plate and the silica gel block by connecting on the fixed device of silica gel is pushed down, and pin is set in pin hole.The utility model is cooperated by cylinder, spring needle, the fixed device of silica gel, silica gel block, improves the efficiency of test.
Description
Technical Field
The utility model belongs to the technical field of electronic components tests, especially, relate to an ICT automatic alignment test fixture.
Background
At present, when a contact point between an FPC and a display screen is tested, a large amount of manual equipment and manpower resources are needed, so that the contact pressure point is easily inaccurate, the test omission is easily caused, the productivity is low, the misjudgment rate is high, the test cost is high, and the test efficiency is low.
The above disadvantages need to be improved.
SUMMERY OF THE UTILITY MODEL
In order to overcome the not enough of current technique, the utility model provides a ICT automatic alignment test fixture.
The utility model discloses technical scheme as follows:
an ICT automatic alignment test fixture comprises an upper die and a lower die,
the lower die comprises a lower die main body made of transparent materials, a plurality of pins are arranged on the lower die main body and are connected with the lower die main body, a clamping position matched with the overall dimension of a test board is defined by the pins, and the test board is arranged in the clamping position;
the upper die comprises an upper die main body, the upper die main body is provided with an air cylinder, a spring pin, a silica gel fixing device and a pin hole, the air cylinder, the spring pin and the silica gel fixing device are all connected with the upper die main body, a silica gel block is arranged on the silica gel fixing device, the silica gel block is connected with the silica gel fixing device, the air cylinder is connected with the silica gel fixing device, and the air cylinder and the spring pin are matched with each other and drive the silica gel fixing device to move up and down;
the test board is correspondingly connected with the test conversion board and pressed by the silica gel block connected on the silica gel fixing device, and the pin is arranged in the pin hole.
Furthermore, small salient points are arranged on the lower die main body corresponding to the golden fingers of the test board.
Further, the lower mould main part includes bottom plate and panel, the panel is located the top of bottom plate and with the bottom plate is connected, the panel includes the first panel of making by ya keli material and the second panel of making by quartz glass, the golden finger of surveying the test panel is located the top of second panel.
Further, the pin includes the nail body and the nail awl, the nail body with nail awl formula structure as an organic whole, the end of nail awl is equipped with the cambered surface.
Further, a steel adhesive tape is arranged on the surface of the silica gel block and connected with the silica gel block;
or,
the surface of silica gel piece is equipped with from type paper, from type paper with the silica gel piece is connected.
Further, the upper die main body comprises a first upper die plate, a second upper die plate, a third upper die plate, a fourth upper die plate and a fifth upper die plate, and the first upper die plate, the second upper die plate, the third upper die plate, the fourth upper die plate and the fifth upper die plate are sequentially connected.
Further, silica gel fixing device is including the silica gel recess and the connecting plate that are used for placing the silica gel piece, the silica gel recess with connecting plate formula structure as an organic whole, seted up on the fifth cope match-plate pattern with the same silica gel recess hole of silica gel recess overall dimension, the silica gel recess passes silica gel recess hole, the connecting plate with the fifth cope match-plate pattern is connected.
Furthermore, the fifth upper die plate, the fourth upper die plate and the third upper die plate are all provided with connecting plate holes matched with the overall dimension of the connecting plate, the silica gel fixing device penetrates through the connecting plate holes, and the connecting plate is connected with the fifth upper die plate.
Furthermore, the edge of connecting plate has been seted up the spacing portion of first spring needle, the fourth cope match-plate pattern reaches the spacing portion of second spring needle has been seted up to the third cope match-plate pattern, the spacing portion of first spring needle with the spacing portion cooperation of second spring needle forms the spring pinhole, the spring needle is located in the spring pinhole, the spring needle with the fifth cope match-plate pattern is connected.
Furthermore, the third upper die plate, the second upper die plate and the first upper die plate are provided with cylinder limiting holes for fixing the cylinders, and the cylinders penetrate through the cylinder limiting holes and are connected with the third upper die plate and the second upper die plate.
According to the above scheme the utility model discloses, its beneficial effect lies in: the ICT automatic alignment test fixture provided by the utility model enables the test board and the test conversion board to be accurately and correspondingly connected, and through the driving cylinder, the cylinder and the spring pin are matched to enable the silica gel fixing device to drive the silica gel block to tightly press the test board and the test conversion board which are accurately and correspondingly connected, so that the test is more accurate, and the test efficiency is improved; the utility model discloses simple structure, standardized anchor clamps and test to the cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a first schematic structural diagram of the utility model;
FIG. 2 is a second schematic structural view of the present invention;
fig. 3 is a schematic diagram of an explosive structure of the utility model;
fig. 4 is a schematic structural view of the silica gel fixing device of the utility model;
fig. 5 is a schematic diagram of the pin structure of the utility model.
Wherein, in the figures, the respective reference numerals:
1-upper mould;
11-an upper die body; 12-a cylinder; 13-pogo pins; 14-silica gel fixing device; 15-pin holes; 16-a silica gel block;
111-a first upper template; 112-a second upper template; 113-a third upper template; 114-a fourth upper template; 115-fifth upper template;
1131 — connecting plate holes; 1132-a second pogo pin locating portion;
141-a silica gel groove; 142-a connecting plate; 1421-a first pogo pin holder;
1151-silica gel groove holes;
2-lower mould;
21-a lower die main body; 22-a pin; 23-clamping;
211-a base plate; 212 a faceplate;
2121-a first panel; 2122-a second panel;
221-a nail body; 222-nail cone; 223-arc surface.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
It will be understood that when an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
Referring to fig. 1 to 5, an ICT automatic alignment test fixture includes an upper die 1 and a lower die 2,
the lower die 2 comprises a lower die main body 21 made of transparent material, a plurality of pins 22 are arranged on the lower die main body 21, the plurality of pins 22 are all connected with the lower die main body 21, a clamping position 23 matched with the outline dimension of a test board (not shown in the figure, the same below) is enclosed by the plurality of pins 22, and the test board is arranged in the clamping position 23;
the upper die 1 comprises an upper die main body 11, the upper die main body 11 is provided with an air cylinder 12, a spring pin 13, a silica gel fixing device 14 and a pin hole 15, the air cylinder 12, the spring pin 13 and the silica gel fixing device 14 are all connected with the upper die main body 11, a silica gel block 16 is arranged on the silica gel fixing device 14, the silica gel block 16 is connected with the silica gel fixing device 15, the air cylinder 12 is connected with the silica gel fixing device 14, and the air cylinder 12 and the spring pin 13 are matched with each other and drive the silica gel fixing device 14 to move up and down;
the test board is correspondingly connected with a test conversion board (not shown in the figure, the same below) and pressed by a silicone block 16 connected with a silicone fixing device 14, and a pin 22 is arranged in a pin hole 15.
The ICT automatic alignment test fixture provided by the embodiment has the following working principle: the lower die main body 21 is made of transparent materials, so that whether the camera shooting test board and the test conversion board are correspondingly connected or not is facilitated, wherein the camera shooting test board is arranged below the lower die main body 21; a test board to be tested is placed in a clamping position 23 defined by pins 22, an air cylinder 12 is driven, the air cylinder 12 is matched with spring pins 13, so that a silica gel fixing device 14 drives a silica gel block 16 to move downwards, the silica gel block 16 presses the test board and a test conversion board, the connection condition of the test board and the test conversion board is known through a camera, when the test board and the test conversion board are correspondingly connected, then the test is carried out, meanwhile, the pins 22 are placed in corresponding pin holes 15, an upper die 1 and a lower die 2 are matched with each other to tightly press the test board and the test conversion board, and therefore the test accuracy is improved; when the test board is not correspondingly connected with the test conversion board, the cylinder 12 is driven, the cylinder 12 is matched with the spring pins 3 to enable the silica gel fixing device 14 to drive the silica gel block 16 to move upwards, the test conversion board is adjusted until the test board is correspondingly connected with the test conversion board, the cylinder 12 is driven, the cylinder 12 is matched with the spring pins 13 to enable the silica gel fixing device 14 to drive the silica gel block 16 to move downwards, the silica gel block 16 is enabled to press the test board against the test conversion board, then the test is carried out, meanwhile, the pins 22 are arranged in the corresponding pin holes 15, the upper die 1 and the lower die 2 are mutually matched to tightly press the test board against the test conversion board, and therefore the test accuracy is improved.
The ICT automatic alignment test fixture provided by the embodiment has the beneficial effects that: the utility model provides an ICT automatic alignment test fixture, after making test panel and test the accurate correspondence of converter plate to be connected, through driving actuating cylinder 12, cylinder 12 cooperates with pogo pin 13 to make silica gel fixing device 14 drive silica gel block 16 tightly to push down test panel and test converter plate after accurate correspondence connection, make the test more accurate, thus improved the efficiency of testing; the utility model discloses simple structure, standardized anchor clamps and test to the cost is reduced.
Preferably, the lower mold body corresponding to the gold finger of the test board is provided with a small bump (not shown, the same applies below). The arrangement of the small salient points prevents the test board from being worn and not easy to slide in the test process, so that the test board is well protected from being damaged easily in the test process, and the qualification rate of the test board is improved.
Preferably, the number of the small salient points is three, and the distance between every two adjacent small salient points is equal. The number of the small salient points is three, so that the test board is more stable and not easy to incline when being arranged on the small salient points.
Preferably, the height of the small bump projection is not more than 0.3 mm.
Preferably, the height of the small bump projection is 0.3 mm.
Preferably, the lower mold body 21 includes a base plate 211 and a face plate 212, the face plate 212 is disposed above the base plate 211 and is coupled to the base plate 211, the face plate 212 includes a first face plate 2121 made of an acryl material and a second face plate 2122 made of quartz glass, and the gold finger of the test board is disposed above the second face plate 2122. The position that the golden finger that surveys the board corresponds is provided with second panel 2122 by quartz glass makes, and the area of second panel 2122 compares in the area of first panel 2121 and accounts for very little, and second panel 2122 hardness that quartz glass made is high, is difficult for scraping the flower, thereby protect the golden finger that surveys the board better, and panel 212 mainly includes and makes first panel 2121 by the ya keli material, and ya keli material low cost, thereby the realization has reduced the cost of whole panel 211.
Preferably, the small bumps are provided on the second panel 2122.
Preferably, the first panel 2121 and the second panel 2122 are of equal thickness. The arrangement makes the product more flattened.
Preferably, the first panel 2121 and the second panel 2122 are each 2mm thick.
Referring to fig. 5, preferably, the pin 22 includes a pin body 221 and a pin cone 222, the pin body 221 and the pin cone 222 are of an integral structure, and the end of the pin cone 222 is provided with an arc 223. The tail end of the nail cone 222 is provided with the cambered surface 223, so that the test board cannot be scratched when being placed in the clamping position 23 defined by the pin 22, and the test board is better protected from being damaged.
Preferably, the shank 221 is cylindrical.
Preferably, the bottom of the nail body 221 is arc-shaped. This arrangement facilitates the pinning of the pins to the lower die.
Preferably, the pin hole 15 has a diameter equal to the diameter of the pin body 221. This arrangement makes the upper and lower molds 1 and 2 more firmly coupled.
Preferably, the surface of the silicone block 16 is provided with a steel tape (not shown, the same applies below), and the steel tape is connected with the silicone block 16. This arrangement prevents the silicone block 16 from sticking to the test plate.
Preferably, the surface of the silicone block 16 is provided with a release paper (not shown, the same applies below), and the release paper is connected with the silicone block 16. This arrangement prevents the silicone block 16 from sticking to the test plate.
Preferably, the upper die main body 11 includes a first upper die plate 111, a second upper die plate 112, a third upper die plate 113, a fourth upper die plate 114 and a fifth upper die plate 115, and the first upper die plate 111, the second upper die plate 112, the third upper die plate 113, the fourth upper die plate 114 and the fifth upper die plate 115 are sequentially connected.
Referring to fig. 3 and 4, preferably, the silicone fixing device 14 includes a silicone groove 141 for placing the silicone block 16 and a connecting plate 142, the silicone groove 141 and the connecting plate 142 are of an integral structure, a silicone groove hole 1151 having the same size as the silicone groove 141 is formed in the fifth upper mold plate 115, the silicone groove 141 penetrates through the silicone groove hole 1151, and the connecting plate 142 is connected to the fifth upper mold plate 115. The arrangement facilitates the use of the silica gel fixing device 14, and simultaneously, the connection between the silica gel fixing device 14 and the upper die main body 11 is more stable.
Preferably, the silicone groove 141 is press-coupled with the silicone block 16.
Preferably, the block 16 of silicone rubber is rectangular parallelepiped.
Preferably, the fifth upper template 115, the fourth upper template 114 and the third upper template 113 are all provided with a connecting plate hole 1131 matched with the shape and size of the connecting plate 142, the silica gel fixing device 14 penetrates through the connecting plate hole 1131, and the connecting plate 142 is connected with the fifth upper template 115. The arrangement of the connecting plate holes 1131 facilitates the connection of the silica gel fixing device 14 with the upper mold main body 11.
Preferably, the edge of the connecting plate 142 is provided with a first spring pin limiting portion 1421, the fourth upper mold plate and the third upper mold plate are provided with a second spring pin limiting portion 1132, the first spring pin limiting portion 1421 and the second spring pin limiting portion 1132 are matched to form a spring pin hole, the spring pin 13 is arranged in the spring pin hole, and the spring pin 13 is connected with the fifth upper mold plate 115. Set up like this and make more firm that spring needle 13 connects, and more stable when spring needle 13 takes place elastic deformation to when making cylinder 12 drive silica gel fixing device 14, better and cylinder 12 cooperation use, and then improved work efficiency.
Preferably, the number of the pogo pins 13 is four, and two pogo pins 13 are provided at both ends of the connection plate 142.
Preferably, the third upper die plate 113, the second upper die plate 112 and the first upper die plate 111 are all provided with cylinder limiting holes 1121 for fixing the cylinder 12, and the cylinder 12 passes through the cylinder limiting holes 1121 and is connected with the third upper die plate 113 and the second upper die plate 112. This allows the cylinder 12 to be more stably attached to the upper die main body.
Preferably, the number of cylinders 12 is 3.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The utility model provides an ICT automatic alignment test fixture which characterized in that: comprises an upper die and a lower die,
the lower die comprises a lower die main body made of transparent materials, a plurality of pins are arranged on the lower die main body and are connected with the lower die main body, a clamping position matched with the overall dimension of a test board is defined by the pins, and the test board is arranged in the clamping position;
the upper die comprises an upper die main body, the upper die main body is provided with an air cylinder, a spring pin, a silica gel fixing device and a pin hole, the air cylinder, the spring pin and the silica gel fixing device are all connected with the upper die main body, a silica gel block is arranged on the silica gel fixing device, the silica gel block is connected with the silica gel fixing device, the air cylinder is connected with the silica gel fixing device, and the air cylinder and the spring pin are matched with each other and drive the silica gel fixing device to move up and down;
the test board is correspondingly connected with the test conversion board and pressed by the silica gel block connected on the silica gel fixing device, and the pin is arranged in the pin hole.
2. The ICT automatic alignment test fixture of claim 1, characterized in that: and small salient points are arranged on the lower die main body corresponding to the golden fingers of the test board.
3. The ICT automatic alignment test fixture of claim 1, characterized in that: the lower mould main part includes bottom plate and panel, the panel is located the top of bottom plate and with the bottom plate is connected, the panel includes the first panel of making by ya keli material and the second panel of making by quartz glass, survey the golden finger of surveying the board and locate the top of second panel.
4. The ICT automatic alignment test fixture of claim 1, characterized in that: the pin includes the nail body and nail awl, the nail body with nail awl formula structure as an organic whole, the end of nail awl is equipped with the cambered surface.
5. The ICT automatic alignment test fixture of claim 1, characterized in that: a steel adhesive tape is arranged on the surface of the silica gel block and connected with the silica gel block;
or,
the surface of silica gel piece is equipped with from type paper, from type paper with the silica gel piece is connected.
6. The ICT automatic alignment test fixture of claim 1, characterized in that: the upper die main body comprises a first upper die plate, a second upper die plate, a third upper die plate, a fourth upper die plate and a fifth upper die plate, and the first upper die plate, the second upper die plate, the third upper die plate, the fourth upper die plate and the fifth upper die plate are sequentially connected.
7. The ICT automatic alignment test fixture of claim 6, characterized in that: silica gel fixing device is including the silica gel recess and the connecting plate that are used for placing the silica gel piece, the silica gel recess with connecting plate formula structure as an organic whole, set up on the fifth cope match-plate pattern with the same silica gel recess hole of silica gel recess overall dimension, the silica gel recess passes silica gel recess hole, the connecting plate with the fifth cope match-plate pattern is connected.
8. The ICT automatic alignment test fixture of claim 7, wherein: fifth cope match-plate pattern fourth cope match-plate pattern reaches the third cope match-plate pattern all seted up with connecting plate overall dimension assorted connecting plate hole, silica gel fixing device passes connecting plate hole, the connecting plate with the fifth cope match-plate pattern is connected.
9. The ICT automatic alignment test fixture of claim 7, wherein: the edge of connecting plate has been seted up the spacing portion of first spring needle, the fourth cope match-plate pattern reaches the spacing portion of second spring needle has been seted up to the third cope match-plate pattern, the spacing portion of first spring needle with the spacing portion cooperation of second spring needle forms the spring pinhole, the spring needle is located in the spring pinhole, the spring needle with the fifth cope match-plate pattern is connected.
10. The ICT automatic alignment test fixture of claim 6, characterized in that: the third upper die plate, the second upper die plate and the first upper die plate are all provided with cylinder limiting holes for fixing the cylinders, and the cylinders penetrate through the cylinder limiting holes and are connected with the third upper die plate and the second upper die plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820966225.6U CN208350849U (en) | 2018-06-22 | 2018-06-22 | A kind of ICT automatic aligning test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820966225.6U CN208350849U (en) | 2018-06-22 | 2018-06-22 | A kind of ICT automatic aligning test fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208350849U true CN208350849U (en) | 2019-01-08 |
Family
ID=64881639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820966225.6U Active CN208350849U (en) | 2018-06-22 | 2018-06-22 | A kind of ICT automatic aligning test fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208350849U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108872645A (en) * | 2018-06-22 | 2018-11-23 | 深圳市同创精密自动化设备有限公司 | A kind of ICT automatic aligning test fixture |
-
2018
- 2018-06-22 CN CN201820966225.6U patent/CN208350849U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108872645A (en) * | 2018-06-22 | 2018-11-23 | 深圳市同创精密自动化设备有限公司 | A kind of ICT automatic aligning test fixture |
| CN108872645B (en) * | 2018-06-22 | 2024-08-02 | 深圳市同创精密自动化设备有限公司 | ICT automatic alignment test fixture |
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