CN208279681U - A kind of multi-source Sputting film-plating apparatus - Google Patents
A kind of multi-source Sputting film-plating apparatus Download PDFInfo
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- CN208279681U CN208279681U CN201820718669.8U CN201820718669U CN208279681U CN 208279681 U CN208279681 U CN 208279681U CN 201820718669 U CN201820718669 U CN 201820718669U CN 208279681 U CN208279681 U CN 208279681U
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- outer casing
- cylindrical outer
- target surface
- surface window
- target
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Abstract
The utility model relates to a kind of multi-source Sputting film-plating apparatus, including target surface window, sputtering target, cylindrical outer casing, transmission mechanism, work rest, heated filament, sputtering target is oppositely arranged on cylindrical outer casing, the centre of cylindrical outer casing is fixed with work rest, heated filament is equipped between sputtering target and work rest, it is equipped with target surface window between heated filament and sputtering target, track is equipped in cylindrical outer casing, target surface window can opposite folding in orbit by transmission mechanism.Advantage is: the device overall structure is simple, the opposite folding of target surface window can be realized using transmission mechanism, cooperate the multiple sputtering targets being oppositely arranged, realize that mixing sputters the film preparation of a variety of thin-film materials, it can also be realized by way of successively pulling open target surface window on demand and successively choose different targets successively sputtered film, improve plating membrane efficiency.
Description
Technical field
The utility model relates to sputter coating field more particularly to a kind of multi-source Sputting film-plating apparatus.
Background technique
With the development of industry, the fields such as automobile, aerospace great-leap-forward progress, associated materials, tool and spare and accessory parts etc.
The multi-field demand to surface coating technique is more obvious, and technique requires higher and higher.
The preparation of film is not only limited to the beautification of appearance, is more focused on raising, the life-time dilatation of device performance, sputtering
Important means of the plated film as film preparation, the structure design and the adjustment of technological parameter of equipment are continuously improved.
Conventional sputter filming equipment is mostly single target or double target structures, and target selection has limitation, and thin-film material is single,
Film preparation low efficiency.
Summary of the invention
In order to overcome the deficiencies of the prior art, it the purpose of the utility model is to provide a kind of multi-source Sputting film-plating apparatus, can splash
A variety of thin-film materials are penetrated, can simultaneously or sequentially select different targets to prepare film.
To achieve the above object, the utility model is achieved through the following technical solutions:
A kind of multi-source Sputting film-plating apparatus, including target surface window, sputtering target, cylindrical outer casing, transmission mechanism, work rest, heat
Silk, sputtering target are oppositely arranged on cylindrical outer casing, and the centre of cylindrical outer casing is fixed with work rest, sets between sputtering target and work rest
There is heated filament, target surface window is equipped between heated filament and sputtering target, track is equipped in cylindrical outer casing, target surface window can by transmission mechanism
Opposite folding in orbit.
The transmission mechanism includes gear, rack gear, travelling wheel, and travelling wheel is fixed on target surface window, travelling wheel and rail
Road rolls connection, and rack gear is fixed on target surface bottom of window, rack and pinion intermeshing, and gear is fixedly connected with crank.
The crank is connect with cylindrical outer casing by sealed bearing.
The sputtering target is in cylindrical outer casing at circumference uniform distribution.
The sputtering target is 4 or more.
Compared with prior art, the utility model has the beneficial effects that
Multi-source Sputting film-plating apparatus overall structure is simple, can realize that the opposite of target surface window opens and closes using transmission mechanism, match
The multiple sputtering targets being oppositely arranged are closed, realize that mixing sputters the film preparation of a variety of thin-film materials, it can also be on demand by successively
The mode for pulling open target surface window, which is realized, successively chooses different targets successively sputtered film, improves plating membrane efficiency;Sputtering one can be achieved
While kind target, guarantee other target impurity that undope.Using push-pull fashion, folding space occupied is small, effectively prevent target surface
In window moving process with the scraping collision of workpiece in cylindrical outer casing.Heated filament plays the role of increasing plasma ionization level, improves
Target as sputter efficiency improves film preparation effect.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the structural schematic diagram of transmission mechanism.
In figure: 1- target surface window 2- cylindrical outer casing 3- sputtering target 4- work rest 5- heated filament 6- track 7- gear 8-
Rack gear 9- travelling wheel.
Specific embodiment
The utility model is described in detail with reference to the accompanying drawings of the specification, it should be noted that the utility model
Implement embodiment not limited to the following.
See Fig. 1, Fig. 2, a kind of multi-source Sputting film-plating apparatus, including target surface window 1, sputtering target 3, cylindrical outer casing 2, driver
Structure, work rest 4, heated filament 5, sputtering target 3 are oppositely arranged on cylindrical outer casing 2, and the centre of cylindrical outer casing 2 is fixed with work rest 4, are splashed
It shoots at the target and is equipped with heated filament 5 between 3 and work rest 4, target surface window 1 is equipped between heated filament 5 and sputtering target 3, is equipped with rail in cylindrical outer casing 2
Road 6, target surface window 1 can the opposite foldings on track 6 by transmission mechanism;Target surface window 1 is corresponding with sputtering target 3, works as target surface
When window 1 is closed, sputtering target 3 can be blocked completely;It, can be completely exposed by sputtering target 3 when target surface window 1 is opened.
Transmission mechanism includes gear 7, rack gear 8, travelling wheel 9, and travelling wheel 9 is fixed on target surface window 1, travelling wheel 9 and rail
Road 6, which rolls, to be connected, and rack gear 8 is fixed on 1 bottom of target surface window, and rack gear 8 and gear 7 are intermeshed, gear 7 and the fixed company of crank
It connects, crank is connect with cylindrical outer casing 2 by sealed bearing.Motor work also can be used in addition to using hand crank in transmission mechanism
For power source, motor be may be provided in cylindrical outer casing 2.
For sputtering target 3 in cylindrical outer casing 2 at circumference uniform distribution, sputtering target 3 is 4 or more.Track 6 can be upper and lower two, improve
The operation stability of target surface window 1.
The push-and-pull folding of target surface window 1 of the utility model occupies little space, and effectively avoids target in 1 moving process of target surface window
Contact and collision of the face-port mouth 1 with workpiece control target surface window 1 by crank, realize the control of preparation heterogeneity film, together
When by the heated filament 5 for being used to enhance plasma inside cylindrical outer casing 2 closer to target surface, and then increase plasma ionization level, mention
High target as sputter efficiency, improves film preparation effect.
Claims (5)
1. a kind of multi-source Sputting film-plating apparatus, which is characterized in that including target surface window, sputtering target, cylindrical outer casing, transmission mechanism,
Work rest, heated filament, sputtering target are oppositely arranged on cylindrical outer casing, and the centre of cylindrical outer casing is fixed with work rest, sputtering target and work
It is equipped with heated filament between part frame, target surface window is equipped between heated filament and sputtering target, is equipped with track in cylindrical outer casing, target surface window passes through
Transmission mechanism can opposite folding in orbit.
2. a kind of multi-source Sputting film-plating apparatus according to claim 1, which is characterized in that the transmission mechanism includes tooth
Wheel, rack gear, travelling wheel, travelling wheel are fixed on target surface window, and travelling wheel and track are rolled and connected, and rack gear is fixed on target surface window
Bottom, rack and pinion intermeshing, gear are fixedly connected with crank.
3. a kind of multi-source Sputting film-plating apparatus according to claim 2, which is characterized in that the crank and cylindrical outer casing
It is connected by sealed bearing.
4. a kind of multi-source Sputting film-plating apparatus according to claim 1, which is characterized in that the sputtering target is outside tubular
Shell is at circumference uniform distribution.
5. a kind of multi-source Sputting film-plating apparatus according to claim 1, which is characterized in that the sputtering target be 4 with
On.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201820718669.8U CN208279681U (en) | 2018-05-15 | 2018-05-15 | A kind of multi-source Sputting film-plating apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201820718669.8U CN208279681U (en) | 2018-05-15 | 2018-05-15 | A kind of multi-source Sputting film-plating apparatus |
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CN208279681U true CN208279681U (en) | 2018-12-25 |
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CN201820718669.8U Active CN208279681U (en) | 2018-05-15 | 2018-05-15 | A kind of multi-source Sputting film-plating apparatus |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102059638B1 (en) * | 2019-08-28 | 2019-12-26 | 주식회사 탑테크이십일 | Ion plating apparatus with multiple target |
-
2018
- 2018-05-15 CN CN201820718669.8U patent/CN208279681U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102059638B1 (en) * | 2019-08-28 | 2019-12-26 | 주식회사 탑테크이십일 | Ion plating apparatus with multiple target |
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