CN219113219U - Multilayer film composite solder preparation device - Google Patents
Multilayer film composite solder preparation device Download PDFInfo
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- CN219113219U CN219113219U CN202220754012.3U CN202220754012U CN219113219U CN 219113219 U CN219113219 U CN 219113219U CN 202220754012 U CN202220754012 U CN 202220754012U CN 219113219 U CN219113219 U CN 219113219U
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Abstract
A preparation device of a multilayer film composite solder comprises a rack, and an arc ion plating chamber and a magnetic sputtering vacuum chamber which are arranged on the rack; the arc ion plating chamber and the magnetic sputtering vacuum chamber are both provided with a vacuum adjusting component for adjusting air pressure; the arc ion plating chamber comprises a plating chamber body and an inner circle frame arranged in the plating chamber body, a plurality of ion sources are arranged on the side wall of the plating chamber body, a rotating assembly is arranged at the bottom of the plating chamber body and used for driving the inner circle frame to rotate, a sample support is fixed on the inner circle frame, and a heating rod is arranged in the inner circle frame in a penetrating manner along the axial direction; the magnetron sputtering vacuum chamber comprises a magnetron sputtering vacuum chamber body, a magnetron sputtering gun and a sample support, wherein the magnetron sputtering gun is arranged at the top in the magnetron sputtering vacuum chamber body, and the sample support is rotatably arranged at the bottom in the magnetron sputtering vacuum chamber body. The utility model can prepare the titanium-based multilayer film composite solder with good wettability and low soldering temperature, and makes up the blank of a multilayer film composite solder preparation device in the market.
Description
Technical Field
The utility model relates to the technical field of brazing material preparation, in particular to a device for preparing a multilayer film composite brazing filler metal.
Background
The filler is added in or beside the gap to realize the combination of two materials or parts, and is suitable for connecting complex, precise and multi-collar seams or welding of heterogeneous materials. The composite brazing filler metal is a brazing filler metal formed by compounding a high-temperature alloy, carbon fiber, ceramic, etc. in various forms as a reinforcing phase in a certain volume ratio into a general alloy brazing filler metal. The brazing filler metal forms a composite brazing filler metal similar to a metal matrix composite material through a composite effect, generally has the characteristics of good joint filling capability, low thermal expansion coefficient and the like, can realize the matching of ceramic and metal joints, reduces residual stress and improves the high-temperature strength of the joints. However, the titanium-based brazing filler metal itself is relatively brittle, poor in plasticity, poor in workability, and difficult to form, and has limitations and difficulties in preparing the ultra-thin titanium-based brazing filler metal. The multilayer film composite solder comprises a layer of composite solder serving as matrix solder and multilayer nano films covering two surfaces of the matrix solder, and the multilayer film solder can be successfully developed by utilizing the multilayer film solder preparation technology, so that the forming difficulty of the titanium-based thin solder puzzling the brazing worker is solved.
The Chinese patent No. CN107186373A discloses a method for preparing titanium-based multilayer film solder by utilizing vacuum in-situ and magnetron sputtering technology, but no relevant preparation device is provided, and the preparation device of the related multilayer film solder in the market is blank at present, so that the limitation exists in the aspect of high-quality molding of the multilayer film solder.
Disclosure of Invention
The utility model aims to solve the technical problems and provide a multilayer film composite solder preparation device which can prepare titanium-based multilayer film composite solder with good wettability and low soldering temperature and make up for the blank of a multilayer film composite solder preparation device in the market.
The utility model provides a technical scheme for solving the technical problems, which is as follows: a preparation device of a multilayer film composite solder comprises a rack, and an arc ion plating chamber and a magnetic sputtering vacuum chamber which are arranged on the rack; the vacuum adjusting components are used for adjusting the air pressure in the film plating chamber body and the magnetic sputtering vacuum chamber body; the arc ion plating chamber comprises a plating chamber body and an inner circle frame arranged in the plating chamber body, a plurality of ion sources are arranged on the side wall of the plating chamber body, a rotating assembly is arranged at the bottom of the plating chamber body and used for driving the inner circle frame to rotate, a sample support is fixed on the inner circle frame, and a heating rod is arranged in the inner circle frame in a penetrating manner along the axial direction; the magnetron sputtering vacuum chamber comprises a magnetron sputtering vacuum chamber body, a magnetron sputtering gun and a sample support, wherein the magnetron sputtering gun is arranged at the top in the magnetron sputtering vacuum chamber body, and the sample support is rotatably arranged at the bottom in the magnetron sputtering vacuum chamber body.
As a further optimization of the preparation device of the multilayer film composite solder, the utility model: the frame is provided with a control panel, and the control panel is electrically connected with a controller.
As a further optimization of the preparation device of the multilayer film composite solder, the utility model: the vacuum adjusting assembly comprises a high-pressure gas storage tank and a vacuum pump, the high-pressure gas storage tank is communicated with the film plating chamber body and the magnetic sputtering vacuum chamber body through an air inlet pipe, and the vacuum pump is communicated with the film plating chamber body and the magnetic sputtering vacuum chamber body through an exhaust pipe.
As a further optimization of the preparation device of the multilayer film composite solder, the utility model: the vacuum adjusting assembly further comprises pressure sensors arranged in the film coating chamber body and the magnetic sputtering vacuum chamber body.
As a further optimization of the preparation device of the multilayer film composite solder, the utility model: the gas stored in the high-pressure gas storage tank is argon.
As a further optimization of the preparation device of the multilayer film composite solder, the utility model: the inner circle frame is of a hollow cylindrical structure, the rotating assembly comprises a speed reducer and a motor, and the bottom end of the inner circle frame is connected with the motor in a transmission manner through the speed reducer.
As a further optimization of the preparation device of the multilayer film composite solder, the utility model: the magnetic sputtering vacuum chamber is characterized in that a rotary table is arranged at the bottom of the magnetic sputtering vacuum chamber body, a variable frequency motor is connected to the bottom end of the rotary table in a transmission mode, and a sample support is fixed on the rotary table.
As a further optimization of the preparation device of the multilayer film composite solder, the utility model: and observation mirrors are arranged on the film plating chamber body and the magnetic sputtering vacuum chamber body.
The preparation device for the multilayer film composite solder has the beneficial effects that
1. The device fills the gap of a preparation device for the multilayer film composite solder in the market, effectively realizes the preparation of the multilayer film composite solder through the cooperation of the arc ion plating chamber and the magnetic sputtering vacuum chamber, has the advantages of simple structure, simple and convenient operation, high production efficiency, wide application range and good quality of the produced solder, and can realize the direct molding of the multilayer film solder.
2. The multilayer film composite solder prepared by the utility model not only comprises titanium-based multilayer film solder, but also comprises nickel-based, silver-based, copper-based and other series foil-tape solder, has low melting temperature, good wettability, strong plasticity and strong processability, and solves the problems of high brittleness, difficult forming and poor performance of the traditional multilayer film solder.
Drawings
FIG. 1 is a schematic structural view of a multilayer film composite solder preparation apparatus;
FIG. 2 is a partial cross-sectional view of a multilayer film composite solder preparation apparatus;
FIG. 3 is a right side view of the apparatus for preparing the multilayer film composite solder;
FIG. 4 is a schematic view of an arc ion plating chamber;
the marks in the figure: 1. the device comprises a frame, 2, a control panel, 3, a coating chamber body, 4, a magnetron sputtering gun, 5, a magnetron sputtering vacuum chamber body, 6, an inner circle frame, 7, a speed reducer, 8, an ion source, 9, a pressure sensor, 10, a heating rod, 11 and a viewing mirror.
Detailed Description
The following detailed description of the utility model refers to the accompanying drawings and preferred embodiments.
As shown in fig. 1-3: a multilayer film composite solder preparation device comprises a frame 1, an arc ion plating chamber arranged on the frame 1 and a magnetic sputtering vacuumThe arc ion plating chamber is used for generating a barrier layer on the surface of the composite matrix solder, the target material is used for obtaining uniform film thickness distribution on the surface of a workpiece in the arc ion plating process, and the magnetic sputtering vacuum chamber is used for magnetron sputtering a nano film with the same components as the matrix solder on the surface of the barrier layer of the composite matrix solder. According to the prior art, the arc ion plating technology belongs to cold field arc discharge, and the arc ion plating technology comprises the following technical processes: and (5) baking and heating the workpiece and purifying by ammonia ion double striking. And cleaning the workpiece, and vacuumizing the workpiece. When the vacuum degree reaches 6x10 -3 After Pa, the baking heating power is turned on, and the workpiece can be heated by the heating rod 10. After reaching a certain temperature, ammonia gas is introduced, the vacuum degree is reduced to 2-3 Pa, the bias power supply of the workpiece is connected, and the voltage is regulated to 800-1000V. At this time, glow discharge was generated, and argon ions were obtained. The argon ions bombard and purify the workpiece under the action of the negative bias electric field, and the loading time is 10-20min.
The frame 1 is provided with a control panel 2, the control panel 2 is electrically connected with a controller, and the controller refers to a master device for changing the wiring of a main circuit or a control circuit according to a preset sequence and changing the resistance value in the circuit to control the starting, speed regulation, braking and reversing of the motor. The device consists of a program counter, an instruction register, an instruction decoder, a time sequence generator and an operation controller. The functions of controlling the vacuum pump set, the sputtering power supply and the like can be realized through the cooperation of the control panel 2 and the controller.
The arc ion plating chamber comprises a plating chamber body 3 and an inner circle frame 6 arranged in the plating chamber body 3. Be provided with a plurality of ion sources 8 on coating film chamber body 3 lateral wall, coating film chamber body 3 bottom is provided with rotating assembly, and rotating assembly is used for driving interior circle frame 6 rotation, is fixed with the sample on the interior circle frame 6 and holds in the palm, runs through along the axial in the interior circle frame 6 and is provided with heating rod 10, and interior circle frame 6 can drive the sample and hold in the palm the rotation, accelerates compound base member solder surface and utilizes vacuum normal position to generate the barrier layer. The specific structure of the arc ion plating chamber adopts the existing mature arc ion plating equipment.
The inner circle frame 6 is of a hollow cylindrical structure, the rotating assembly comprises a rotating shaft, a speed reducer 7 and a motor, a heating rod 10 is sleeved outside the rotating shaft and penetrates through the inner circle frame 6, two ends of the rotating shaft are fixedly connected with the upper end face and the lower end face of the inner circle frame 6 respectively, the rotating shaft penetrates through the inner circle frame 6 and then is rotationally connected with the top of the coating chamber body 3, the bottom end of the rotating shaft is connected with the speed reducer 7, and the speed reducer 7 is in transmission connection with a power output shaft of the motor. The speed reducer 7 is a separate component consisting of a gear drive, a worm drive, a gear-worm drive enclosed in a rigid housing, and is commonly used as a reduction gear between the prime mover and the working machine, acting to match rotational speed and transfer torque between the prime mover and the working machine or the actuator.
The arc ion plating chamber and the magnetic sputtering vacuum chamber are both provided with vacuum adjusting components, and the vacuum adjusting components are used for adjusting the air pressure in the film plating chamber body 3 and the magnetic sputtering vacuum chamber body 5. The vacuum adjusting assembly comprises a high-pressure gas storage tank and a vacuum pump, the high-pressure gas storage tank is communicated with the film plating chamber body 3 and the magnetic sputtering vacuum chamber body 5 through an air inlet pipe, and the vacuum pump is communicated with the film plating chamber body 3 and the magnetic sputtering vacuum chamber body 5 through an exhaust pipe. The vacuum adjusting assembly further comprises a pressure sensor 9 arranged in the film coating chamber body 3 and the magnetic sputtering vacuum chamber body 5, and the pressure sensor 9 is in signal connection with the controller. The vacuum pump feeds back the pressure sensor 9 to the controller after vacuumizing the film coating chamber body 3 and the magnetic sputtering vacuum chamber body 5, the controller controls the high-pressure gas storage tank to introduce high-pressure gas into the film coating chamber body 3 and the magnetic sputtering vacuum chamber body 5 to a specified pressure, the high-pressure gas is argon, and the pressure sensor 9 feeds back to the controller again to stop introducing the high-pressure gas into the high-pressure gas storage tank.
The magnetic sputtering vacuum chamber comprises a magnetic sputtering vacuum chamber body 5, a magnetic sputtering gun 4 arranged on the magnetic sputtering vacuum chamber body 5 and a sample holder rotatably arranged at the bottom of the magnetic sputtering vacuum chamber body 5. The bottom of the magnetic sputtering vacuum chamber body 5 is provided with a rotary table, a variable frequency motor is connected to the bottom end transmission of the rotary table, and a sample support is fixed on the rotary table. Under the cooperation of the rotary table, the nano film of the magnetron sputtering on the surface of the barrier layer of the composite matrix solder is more uniform.
The film plating chamber body 3 and the magnetic sputtering vacuum chamber body 5 are both provided with the observation mirror 11, so that the relevant progress of preparing the matrix solder can be observed in real time.
The matrix solder used for the titanium-based multilayer film solder is composite solder, has better joint filling capability and lower thermal expansion coefficient, can reduce residual stress, and further improves the strength of a soldered joint.
The application method of the utility model comprises the following steps:
placing the composite matrix solder prepared according to the component content of the matrix solder on a sample holder in an arc ion plating chamber, and firstly generating a barrier layer on the surface of the composite matrix solder in vacuum in situ. Vacuum in situ specific parameters: vacuum degree of 10 -4 -10 -3 Pa, the voltage is 45-65V, and heating to 340-380 ℃.
And step two, placing the matrix solder with the surface covered with the barrier layer obtained in the step one on a sample support in a magnetic sputtering vacuum chamber, and then sputtering a nano film with the same component as the matrix solder on the surface of the barrier layer in a magnetron manner. Sputtering titanium target and copper target or titanium target and nickel palladium simultaneously, and voltage power of 0.6-0.9kV and density of 27-30W/cm 2 The air pressure of the vacuum chamber is 1.85-2.05Pa, the sputtering power is 161-170W, and the deposition time is 6-8 minutes.
Step three, repeating the operation step one of the matrix solder obtained in the step two, generating a barrier layer on the surface of the nano film of the vacuum in-situ matrix solder, repeating the operation step two after the barrier layer is generated, and performing magnetron sputtering on the surface of the barrier layer again to obtain the nano film the same as that of the step two;
and step four, repeating the step three for 15 to 60 times to obtain the multilayer film composite solder.
The present utility model is not limited to the above-mentioned embodiments, but is intended to be limited to the following embodiments, and any modifications, equivalent changes and variations in the above-mentioned embodiments can be made by those skilled in the art without departing from the scope of the present utility model.
Claims (8)
1. A preparation device for a multilayer film composite solder is characterized in that: comprises a frame (1), and an arc ion plating chamber and a magnetic sputtering vacuum chamber which are arranged on the frame (1); the arc ion plating chamber and the magnetic sputtering vacuum chamber are both provided with vacuum adjusting components, and the vacuum adjusting components are used for adjusting the air pressure in the film plating chamber body (3) and the magnetic sputtering vacuum chamber body (5); the arc ion plating chamber comprises a plating chamber body (3) and an inner circle frame (6) arranged in the plating chamber body (3), wherein a plurality of ion sources (8) are arranged on the side wall of the plating chamber body (3), a rotating assembly is arranged at the bottom of the plating chamber body (3) and used for driving the inner circle frame (6) to rotate, a sample support is fixed on the inner circle frame (6), and a heating rod (10) is arranged in the inner circle frame (6) in a penetrating manner along the axial direction; the magnetron sputtering vacuum chamber comprises a magnetron sputtering vacuum chamber body (5), a magnetron sputtering gun (4) and a sample support, wherein the magnetron sputtering gun (4) is arranged at the top in the magnetron sputtering vacuum chamber body (5), and the sample support is rotatably arranged at the bottom in the magnetron sputtering vacuum chamber body (5).
2. The multilayer film composite solder preparation device as claimed in claim 1, wherein: the machine frame (1) is provided with a control panel (2), and the control panel (2) is electrically connected with a controller.
3. The multilayer film composite solder preparation device as claimed in claim 1, wherein: the vacuum adjusting assembly comprises a high-pressure gas storage tank and a vacuum pump, the high-pressure gas storage tank is communicated with the coating chamber body (3) and the magnetic sputtering vacuum chamber body (5) through an air inlet pipe, and the vacuum pump is communicated with the coating chamber body (3) and the magnetic sputtering vacuum chamber body (5) through an exhaust pipe.
4. A multilayer film composite solder preparation apparatus as claimed in claim 3, wherein: the vacuum adjusting assembly further comprises a pressure sensor (9) arranged in the film coating chamber body (3) and the magnetic sputtering vacuum chamber body (5).
5. A multilayer film composite solder preparation apparatus as claimed in claim 3, wherein: the gas stored in the high-pressure gas storage tank is argon.
6. The multilayer film composite solder preparation device as claimed in claim 1, wherein: the inner circle frame (6) is of a hollow cylindrical structure, the rotating assembly comprises a speed reducer (7) and a motor, and the bottom end of the inner circle frame (6) is connected with the motor in a transmission manner through the speed reducer (7).
7. The multilayer film composite solder preparation device as claimed in claim 1, wherein: the magnetic sputtering vacuum chamber is characterized in that a rotary table is arranged at the bottom of the magnetic sputtering vacuum chamber body (5), a variable frequency motor is connected to the bottom end of the rotary table in a transmission mode, and a sample support is fixed on the rotary table.
8. The multilayer film composite solder preparation device as claimed in claim 1, wherein: and the film plating chamber body (3) and the magnetic sputtering vacuum chamber body (5) are both provided with an observation mirror (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220754012.3U CN219113219U (en) | 2022-03-31 | 2022-03-31 | Multilayer film composite solder preparation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220754012.3U CN219113219U (en) | 2022-03-31 | 2022-03-31 | Multilayer film composite solder preparation device |
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| Publication Number | Publication Date |
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| CN219113219U true CN219113219U (en) | 2023-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220754012.3U Active CN219113219U (en) | 2022-03-31 | 2022-03-31 | Multilayer film composite solder preparation device |
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| CN (1) | CN219113219U (en) |
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- 2022-03-31 CN CN202220754012.3U patent/CN219113219U/en active Active
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