CN208275776U - Chip detecting system - Google Patents
Chip detecting system Download PDFInfo
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- CN208275776U CN208275776U CN201820469738.6U CN201820469738U CN208275776U CN 208275776 U CN208275776 U CN 208275776U CN 201820469738 U CN201820469738 U CN 201820469738U CN 208275776 U CN208275776 U CN 208275776U
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Abstract
The utility model discloses a kind of chip detecting system, further includes PLC controller, package mechanism, defective products separating mechanism and the pin arrangement mechanism set gradually, the first testing agency, code-spraying mechanism and the second testing agency including the transport mechanism for transmitting chip；The PLC controller is connect with the transport mechanism, pin arrangement mechanism, the first testing agency, code-spraying mechanism, the second testing agency, defective products separating mechanism and package mechanism simultaneously；Wherein, chip is transmitted between the pin arrangement mechanism, the first testing agency, code-spraying mechanism, the second testing agency, defective products separating mechanism and package mechanism by the transport mechanism.For the utility model by focusing on all detection processes of chip in one work station, detection efficiency is high, can effectively reduce the turnover program of chip to be detected, reduce production cost.
Description
Technical field
The utility model relates to chip detection fields, and in particular to a kind of chip detecting system and detection method.
Background technique
With the development of science and technology, power electronic product is increasingly diversified, complicates, and in each electronic product, is
Improve the functional reliability of circuit in product, it is often necessary to which together by a plurality of circuit integration, chip also just comes into being.Core
Piece, also known as microcircuit, microchip, integrated circuit, typically refer to the silicon wafer for including integrated circuit, and volume very little often calculates
A part of machine or other electronic equipments, can also be into after the completion of chip production before chip factory since chip is accurate device
Multiple detection work such as the detection of row chip pin and correction, performance detection, appearance detection, to ensure chip energy in electronic product
Enough reliably to work, existing chip detecting system is multiple-workstation operation (each work station does a Detection task), because
It is multiple-workstation operation, the chip between each work station needs to be transported to another work station upon completion of the assays, leads to chip
Detection cycle is too long, and low efficiency while also wastes a large amount of manpower and material resources.
Utility model content
In view of this, the present invention provides a kind of chip detecting system and detection methods, by all detections of chip
Process focuses in a work station, and detection efficiency is high, can effectively reduce the turnover program of chip to be detected, reduction is produced into
This.This programme is realized by following technological means:
Chip detecting system further includes PLC controller, package mechanism, bad including the transport mechanism for transmitting chip
Product separating mechanism and the pin arrangement mechanism set gradually, the first testing agency, code-spraying mechanism and the second testing agency；
The pin arrangement mechanism: for correcting the undesirable pin of chip；
First testing agency: for being detected to chip parameter and appearance；
The code-spraying mechanism: bar code is printed for the chip qualified to the detection of the first testing agency；
Second testing agency: for being detected to the bar code on chip；
The defective products separating mechanism: the defective products detected for separating the first testing agency and the second testing agency；
The package mechanism: for being packed to qualified chip；
The PLC controller: at the same with the transport mechanism, pin arrangement mechanism, the first testing agency, code-spraying mechanism, second
Testing agency, defective products separating mechanism are connected with package mechanism；
Wherein, chip is by the transport mechanism in the pin arrangement mechanism, the first testing agency, code-spraying mechanism, the second inspection
It surveys between mechanism, defective products separating mechanism and package mechanism and transmits.
Further, first testing agency include the resistance test mechanism being sequentially arranged, electric parameter testing agency,
Chip sides visual inspection machine structure and chip front side visual inspection machine structure.
Further, the defective products separating mechanism includes arrangement corresponding with the testing agency in first testing agency
Pressure-resistant defective products separating mechanism, electric parameter defective products separating mechanism, side bad order product separating mechanism and front appearance
Defective products separating mechanism, the defective products separating mechanism further include the bar code defective products of arrangement corresponding with second testing agency
Separating mechanism.
Further, the transport mechanism is provided with the first mechanical crawl hand, the second mechanical crawl hand, the crawl of third machinery
Hand, the 4th mechanical crawl hand and the 5th mechanical crawl hand, the transport mechanism are additionally provided with:
First slideway: the pin arrangement mechanism is exported by the first slideway again after carrying out whole foot to the chip on the first slideway；
Two the second slideways: being separately positioned on the first slideway two sides, and the chip of the first slideway output passes through the first mechanical gripping
Hand is taken to be individually positioned on two the second slideways, the chip on the second slideway is placed into resistance test by the second mechanical crawl hand
In mechanism, qualified chip is detected in the resistance test mechanism by third machinery crawl hand and is placed into the electric parameter inspection
It surveys in mechanism；
Two third slideways: it is opposite with two the second slideways respectively, qualification is detected in the electric parameter testing agency
Chip is individually positioned on two articles of third slideways by the 4th mechanical crawl hand；
4th slideway: being arranged among two articles of third slideways, and the chip on third slideway is put by the 5th mechanical crawl hand
It sets on the 4th slideway.
Further, the quantity of the resistance test mechanism and electric parameter testing agency is 2, one of pressure resistance inspection
It surveys mechanism and an electric parameter testing agency is used to detect the chip on second slideway, another resistance test
Mechanism and another electric parameter testing agency are for detecting the chip on another the second slideway.
It further, further include drying mechanism, the bar code for printing to the code-spraying mechanism carries out drying operation, setting
Between the code-spraying mechanism and second testing agency.
Chip detecting system provided by the utility model focuses on all detection work of chip in one work station,
Detection efficiency is high, can effectively reduce the turnover program of chip to be detected, reduces production cost；Secondly, the utility model passes through
Two-way mechanism carries out resistance test and electric parameter to chip and detects, and substantially increases chip detection efficiency, reduce the time at
This, shortens chip detection cycle；In addition, the utility model is additionally provided with the defective products separating mechanism of multiple types, to corresponding
Detect underproof chip to be separated, not only act as the purpose for separating unqualified chip, at the same also to chip not
Qualified type is classified, and is conducive to that unqualified chip is recycled and handled, or even is recycled；Meanwhile this is practical new
Type first detects the appearance of chip, prints bar code to chip again after detection is qualified, can detect again to avoid first printing bar code
When chip appearance is unqualified out, this cumbersome process is cleaned to also to carry out bar code in chip recycling reprocessing process.
Detailed description of the invention
Fig. 1 is the chip detecting system structural schematic diagram that embodiment 1 provides.
Appended drawing reference: 1-transport mechanism, the 101-the first slideway, the 102-the second slideway, 103-third slideways, 104-
4th slideway, 2-pin arrangement mechanisms, the 3-the first testing agency, 301-resistance test mechanisms, 302-electric parameter testing agencies,
303-chip sides visual inspection machine structures, 304-chip front side visual inspection machine structures, 4-code-spraying mechanisms, 5-drying mechanisms,
6-the second testing agency, 7-package mechanisms.
Specific embodiment
In order to make those skilled in the art more fully understand the technical solution of the utility model, with reference to the accompanying drawing and have
The utility model is described in further detail for body embodiment.
Embodiment 1
As shown in Figure 1, the present embodiment provides a kind of chip detecting system, including the transport mechanism 1 for transmitting chip, also
Including PLC controller, package mechanism 7, defective products separating mechanism and the pin arrangement mechanism 2 set gradually, the first testing agency 3, spray
Ink recorder structure 4 and the second testing agency 6；
The pin arrangement mechanism 2: for correcting the undesirable pin of chip；
First testing agency 3: for being detected to chip parameter and appearance；
The code-spraying mechanism 4: bar code is printed for detecting qualified chip to the first testing agency 3；
Second testing agency 6: for being detected to the bar code on chip；
The defective products separating mechanism: for separate the first testing agency 3 and the second testing agency 6 detect it is bad
Product；
The package mechanism 7: for being packed to qualified chip；
The PLC controller: at the same with the transport mechanism 1, pin arrangement mechanism 2, the first testing agency 3, code-spraying mechanism 4,
Second testing agency 6, defective products separating mechanism and package mechanism 7 connect；
Wherein, chip is by the transport mechanism 1 in the pin arrangement mechanism 2, the first testing agency 3, code-spraying mechanism 4,
It is transmitted between two testing agencies 6, defective products separating mechanism and package mechanism 7.
What needs to be explained here is that when implementing the present embodiment, PLC controller can be divided into whole foot part PLC controller,
Electric part PLC controller, appearance parts PLC controller, bar code part PLC controller and packaged unit PLC controller.Whole foot
Part PLC controller is for controlling detection and correction of the pin arrangement mechanism 2 to chip pin, detection point of the pin arrangement mechanism 2 to pin
It is detected for (left and right skew) detection of pin skew and pin out-of-flatness (pin is not in same plane), then to corresponding crooked pin
It is corrected with out-of-flatness pin；Electric part PLC controller and appearance parts PLC controller act on the first testing agency
3, the first testing agency 3 is controlled respectively, and parameter detecting and appearance detection are carried out to chip, control defective products point unqualified when detecting
Structure of disembarking is separated to underproof chip is detected；Bar code part PLC controller is for controlling the second testing agency 6 to chip
Bar code detection is carried out, unqualified when detecting, control defective products separating mechanism is separated to underproof chip is detected；Packing department
Point PLC controller controls 7 pairs of the package mechanism qualified chips of detection and packs, and packaged chip only needs to wait for factory investment
Use.
It should also be noted that, the present embodiment in transport mechanism 1 mainly with belt synchronizing wheel transmission based on, mechanical arm
Supplemented by carrying, belt is electronic by stepper motor, is contacted between station and station by transport mechanism.
Specifically, in the present embodiment, the first testing agency 3 may include the resistance test mechanism 301 being sequentially arranged, electrical
Parameter detecting mechanism 302, chip sides visual inspection machine structure 303 and chip front side visual inspection machine structure 304.Correspondingly, this reality
Apply the pressure-resistant defective products that the defective products separating mechanism in example may include arrangement corresponding with the testing agency in the first testing agency 3
Separating mechanism, electric parameter defective products separating mechanism, side bad order product separating mechanism and front appearance defective products seperator
Structure, meanwhile, the defective products separating mechanism in the present embodiment can also include that the bar code of arrangement corresponding with the second testing agency 6 is bad
Product separating mechanism.
Specifically, in the present embodiment, transport mechanism 1 is provided with the first mechanical crawl hand, the second mechanical crawl hand, third machine
Tool grabs hand, the 4th mechanical crawl hand and the 5th mechanical crawl hand, transport mechanism 1 and is additionally provided with:
First slideway 101: the pin arrangement mechanism 2 is slided by first again after carrying out whole foot to the chip on the first slideway 101
Road 101 exports；
Two the second slideways 102: being separately positioned on 101 two sides of the first slideway, and the chip of the first slideway 101 output passes through the
One mechanical crawl hand is individually positioned on two the second slideways 102, and the chip on the second slideway 102 passes through the second mechanical crawl hand
It is placed into resistance test mechanism 301, qualified chip is detected in the resistance test mechanism 301 by third machinery and grabs hand
It is placed into the electric parameter testing agency 302；
Two third slideways 103: it is opposite with two the second slideways 102 respectively, it is examined in the electric parameter testing agency 302
Qualified chip is surveyed to be individually positioned on two articles of third slideways 103 by the 4th mechanical crawl hand；
4th slideway 104: being arranged among two articles of third slideways 103, and the chip on third slideway 103 is mechanical by the 5th
Crawl is manually placed on the 4th slideway 104.
Specifically, the quantity of the resistance test mechanism 301 and electric parameter testing agency 302 is 2, one of them is resistance to
Pressure testing agency 301 and an electric parameter testing agency 302 are used to detect the chip on second slideway 102,
Another resistance test mechanism 301 and another electric parameter testing agency 302 are used for the core on another the second slideway 102
Piece is detected.
What needs to be explained here is that the first slideway 101, the second slideway 102, third slideway 103 are parallel with the 4th slideway 104
Setting, in actually detected operation, in order to improve detection efficiency, on the first slideway 101 chip carry out pin detection and
After correction, chip be diverted on two the second slideways 102, it is resistance to dividing two-way to carry out the chip on the second slideway 102
Pressure detection and electric parameter detection, and underproof chip carries out pressure-resistant defective products separation respectively and electric parameter is bad to detecting
Product separation, the chip qualified for electric parameter detection divides two-way to be placed on third slideway 103 again, finally by two third slideways
Chip conjunction on 103 is expected on the 4th slideway 104, then successively carries out side appearance inspection to the chip on the 4th slideway 104 again
It surveys and front appearance detects, and underproof chip carries out the separation of side bad order product respectively and front appearance is bad to detecting
Product separation.
The present embodiment can also include drying mechanism 5, the bar code that drying mechanism 5 is used to print the code-spraying mechanism 4 into
Row drying operation, is set between the code-spraying mechanism 4 and second testing agency 6.
Above are merely preferred embodiments of the utility model, it is noted that above-mentioned preferred embodiment should not regard
For limitations of the present invention, the protection scope of the utility model should be defined by the scope defined by the claims..For
For those skilled in the art, without departing from the spirit and scope of the utility model, it can also make several
Improvements and modifications, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (6)
1. chip detecting system, including the transport mechanism for transmitting chip, which is characterized in that further include PLC controller, packaging
Mechanism, defective products separating mechanism and the pin arrangement mechanism set gradually, the first testing agency, code-spraying mechanism and the second testing agency；
The pin arrangement mechanism: for correcting the undesirable pin of chip；
First testing agency: for being detected to chip parameter and appearance；
The code-spraying mechanism: bar code is printed for the chip qualified to the detection of the first testing agency；
Second testing agency: for being detected to the bar code on chip；
The defective products separating mechanism: the defective products detected for separating the first testing agency and the second testing agency；
The package mechanism: for being packed to qualified chip；
The PLC controller: while being detected with the transport mechanism, pin arrangement mechanism, the first testing agency, code-spraying mechanism, second
Mechanism, defective products separating mechanism are connected with package mechanism；
Wherein, chip is by the transport mechanism in the pin arrangement mechanism, the first testing agency, code-spraying mechanism, the second detection machine
It is transmitted between structure, defective products separating mechanism and package mechanism.
2. chip detecting system according to claim 1, which is characterized in that first testing agency includes being sequentially arranged
Resistance test mechanism, electric parameter testing agency, chip sides visual inspection machine structure and chip front side visual inspection machine structure.
3. chip detecting system according to claim 2, which is characterized in that the defective products separating mechanism include with it is described
The pressure-resistant defective products separating mechanism of the corresponding arrangement of testing agency in first testing agency, electric parameter defective products separating mechanism,
Side bad order product separating mechanism and front appearance defective products separating mechanism, the defective products separating mechanism further include with it is described
The bar code defective products separating mechanism of the corresponding arrangement of second testing agency.
4. chip detecting system according to claim 2, which is characterized in that the transport mechanism is provided with the first mechanical gripping
Take hand, the second mechanical crawl hand, third machinery crawl hand, the 4th mechanical crawl hand and the 5th mechanical crawl hand, the conveyer
Structure is additionally provided with:
First slideway: the pin arrangement mechanism is exported by the first slideway again after carrying out whole foot to the chip on the first slideway；
Two the second slideways: being separately positioned on the first slideway two sides, and the chip of the first slideway output passes through the first mechanical crawl hand
It is individually positioned on two the second slideways, the chip on the second slideway is placed into resistance test mechanism by the second mechanical crawl hand
In, qualified chip is detected in the resistance test mechanism by third machinery crawl hand is placed into the electric parameter detection machine
In structure；
Two third slideways: it is opposite with two the second slideways respectively, qualified chip is detected in the electric parameter testing agency
It is individually positioned on two articles of third slideways by the 4th mechanical crawl hand；
4th slideway: being arranged among two articles of third slideways, and the chip on third slideway is manually placed at by the 5th mechanical crawl
On 4th slideway.
5. chip detecting system according to claim 4, which is characterized in that the resistance test mechanism and electric parameter inspection
The quantity for surveying mechanism is 2, and one of resistance test mechanism and an electric parameter testing agency are used to slide one second
Chip on road is detected, another resistance test mechanism and another electric parameter testing agency are used for another second
Chip on slideway is detected.
6. chip detecting system according to claim 1, which is characterized in that further include drying mechanism, for the spray
The bar code of ink recorder structure printing carries out drying operation, is set between the code-spraying mechanism and second testing agency.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820469738.6U CN208275776U (en) | 2018-04-04 | 2018-04-04 | Chip detecting system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820469738.6U CN208275776U (en) | 2018-04-04 | 2018-04-04 | Chip detecting system |
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| Publication Number | Publication Date |
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| CN208275776U true CN208275776U (en) | 2018-12-25 |
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ID=64750398
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820469738.6U Active CN208275776U (en) | 2018-04-04 | 2018-04-04 | Chip detecting system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108686967A (en) * | 2018-04-04 | 2018-10-23 | 德阳帛汉电子有限公司 | Chip detecting system and detection method |
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2018
- 2018-04-04 CN CN201820469738.6U patent/CN208275776U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108686967A (en) * | 2018-04-04 | 2018-10-23 | 德阳帛汉电子有限公司 | Chip detecting system and detection method |
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