CN208271857U - A kind of flip-chip micro-group installation - Google Patents
A kind of flip-chip micro-group installation Download PDFInfo
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- CN208271857U CN208271857U CN201820853644.9U CN201820853644U CN208271857U CN 208271857 U CN208271857 U CN 208271857U CN 201820853644 U CN201820853644 U CN 201820853644U CN 208271857 U CN208271857 U CN 208271857U
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- chip
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- positioning
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- mechanical arm
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Abstract
The utility model provides a kind of flip-chip micro-group installation, it is used in integrated circuit the dress of the flip-over type micro-group between chip and substrate, and the flip-chip micro-group installation includes: turnover mechanism, the first positioning mechanism, the first transport mechanism, the second transport mechanism, aligning gear, load mechanism and the second positioning mechanism.The flip-chip micro-group of the utility model installs by being overturn to chip, the positioning and calibration of position, it ensure that the precision of the upside-down mounting between chip and substrate, the flip-chip micro-group installation of the utility model simultaneously carries out flip chip mounting process by the way that multiple manipulators are synchronous, higher upside-down mounting efficiency is obtained, the demand of modernization industry production is sufficiently met.
Description
Technical field
The utility model relates to a kind of flip-chip micro-group installation more particularly to a kind of long range, high-precision, high speed,
More movement flip-chip micro-group installations.
Background technique
Flip chip is also known as flip-chip, is the deposition tin-lead ball on I/O pad, and then chip is overturn heating and utilized and is melted
The tin-lead ball melted is combined with substrate.In reverse installation process, 180 ° are overturn after needing first to take off chip from wafer, then will
Chip accurately mounts on substrate.However, the size due to chip is smaller, and when chip and when being closely sized to of substrate, then
The requirement of higher load precision and efficiency is proposed to automatic placement equipment.Therefore, in view of the above-mentioned problems, it is necessary to propose into one
The solution of step.
Utility model content
The utility model is intended to provide a kind of flip-chip micro-group installation, to overcome the deficiencies in the prior art.
In order to solve the above technical problems, the technical solution of the utility model is:
A kind of flip-chip micro-group installation, the flip-over type micro-group dress being used in integrated circuit between chip and substrate,
The flip-chip micro-group installation includes: turnover mechanism, the first positioning mechanism, the first transport mechanism, the second transport mechanism, school
Positive mechanism, load mechanism and the second positioning mechanism；
The turnover mechanism is located at the top of first positioning mechanism comprising: turning mechanical arm and overturning motor,
The turning mechanical arm passes through the sucker absorption chip of its end, and under the driving of the overturning motor, drives the chip
180 ° of overturning, and the chip of absorption is transferred to first transport mechanism；
First positioning mechanism includes: positioning disk and the First look above the positioning disk, the positioning
Disk provides the chip that the turnover mechanism is drawn, and the First look is located above the positioning disk, and the positioning disk is according to institute
The detection signal for stating First look drives the chip motion to drawing position；
The aligning gear include: turntable, the groove for holding fluxing agent being set on the turntable and be located at institute
The second vision above turntable is stated, the groove receives the core from the positioning disk transmitted by first transport mechanism
Piece, second vision are positioned above the turntable, and the turntable drives the core according to the detection signal of second vision
Piece moves to correction position；
The load mechanism includes: load manipulator and load base station, and the load base station reception is transmitted by described second
The chip from the aligning gear of mechanism transmission, chip is incorporated on the substrate by the load manipulator, and described the
Two positioning mechanisms include third vision, are located at the top of the load board.
The improvement that flip-chip micro-group as the utility model is installed, first positioning mechanism further include driving institute
The rotating wheel of positioning disc spins is stated, the rotating wheel is sequentially connected by transmission belt and the positioning disk.
The improvement that flip-chip micro-group as the utility model is installed, first transport mechanism are set to described the
Between one positioning mechanism and aligning gear comprising: first mechanical arm, the first suction nozzle for being installed on the first mechanical arm end
And the first motor for driving the first mechanical arm level to pivot.
The improvement that flip-chip micro-group as the utility model is installed, second transport mechanism are set to the school
Between positive mechanism and load mechanism comprising: second mechanical arm, be installed on the second mechanical arm end the second suction nozzle and
The second motor for driving the second mechanical arm level to pivot.
The improvement that flip-chip micro-group as the utility model is installed, the correction position are tieed up by the first of X-direction
Second dimension of degree and Y-direction is limited, and the aligning gear includes third motor, and the third motor drives the turntable rotation
Go to position defined by preset first dimension and the second dimension.
The improvement that flip-chip micro-group as the utility model is installed, the groove have +X direction and -X direction
Movement travel.
The improvement that flip-chip micro-group as the utility model is installed, is additionally provided with lasting benefit above the groove
Fill the funnel of scaling powder.
Compared with prior art, the utility model has the beneficial effects that the flip-chip micro-group of the utility model is installed
By being overturn to chip, the positioning and calibration of position, ensure that the precision of the upside-down mounting between chip and substrate, while this reality
Flip chip mounting process is carried out by the synchronization of multiple manipulators with novel flip-chip micro-group installation, obtain it is higher
Efficiency is filled, the demand of modernization industry production is sufficiently met.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments recorded in the utility model, for those of ordinary skill in the art, is not making the creative labor
Under the premise of, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the top view of flip-chip micro-group one specific embodiment of installation of the utility model；
Status diagram when Fig. 2 is turnover mechanism overturning in the installation of flip-chip micro-group.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
As shown in Figure 1, the utility model provides a kind of installation of flip-chip micro-group, be used in integrated circuit chip with
Flip-over type micro-group dress between substrate.Specifically, the flip-chip micro-group installation includes: turnover mechanism 7, the first localization machine
Structure 1, the first transport mechanism 3, the second transport mechanism 4, aligning gear 5, load mechanism 6 and the second positioning mechanism.
As shown in Fig. 2, pickup and overturning of the turnover mechanism 7 for realizing chip.Specifically, the turnover mechanism 7
Include: turning mechanical arm 71 and overturning motor 72, the turning mechanical arm 71 by the sucker absorption chip of its end, and
Under the driving of the overturning motor 92, the chip is driven to overturn 180 °, and the chip of absorption is transferred to first transmission
Mechanism 3.
The principle of first positioning mechanism, the 1 view-based access control model detection carries out preliminary positioning to chip comprising: positioning disk
11 and the First look 13 above the positioning disk 11.
The positioning disk 11 is used to receive the chip after overturning.Specifically, the positioning disk 11 is a disc-shaped structure,
Top surface platform is placed with the chip along x, the positioning of y-axis direction.The First look 13 is located at 11 top of positioning disk.By institute
The positioning of First look 13 is stated, the positioning disk 11 drives the chip motion extremely according to the positioning signal of the First look 13
Draw position.Meanwhile the First look 13 can also carry out elevating movement in z-axis direction, to meet core with different thickness
The location requirement of piece.
Further, first positioning mechanism 1 further includes the rotating wheel 12 for driving the positioning disk 11 to rotate, the rotation
Runner 12 is sequentially connected by transmission belt and the positioning disk 11, to realize chip on the positioning disk 11 along x, y-axis direction
Positioning.
First transport mechanism 3 is used to that the aligning gear 5 will to be transported to by the chip of positioning.In an embodiment party
In formula, first transport mechanism 3 is set between first positioning mechanism 1 and aligning gear 5 comprising: first is mechanical
Arm 31, the first suction nozzle for being installed on 31 end of first mechanical arm and drive horizontal the pivoted of the first mechanical arm 31
One motor 32.To which under the driving of the first motor 32, the first mechanical arm 31 drives the first suction nozzle movement thereon
To the top for the chip for drawing position, and by suction function absorption chip, the first mechanical arm 31 further passes through rotation
The chip of absorption is put on the aligning gear 5 and is corrected.
The aligning gear 5 is corrected chip comprising: turntable 51 is set to holding on the turntable and helps
The groove of solder flux, the second vision 53 above the turntable 51 and third motor 52.Meanwhile the groove is received by institute
The chip from the positioning disk 11 for stating the transmission of the first transport mechanism 3, is such that on chip and adheres to scaling powder, for after
Continuous upside-down mounting is prepared.It is carried out in this way, the correction of chip is synchronous with attachment scaling powder, further improves the effect of production and processing
Rate.
Specifically, the groove has the movement travel of +X direction and -X direction.In this way, to facilitate reception to be transmitted to
Chip, and chip is transferred to next station by the second transmission mechanism of scheme 4.Lasting supplement is additionally provided with above the groove to help
The funnel of solder flux may make the liquid level position of the scaling powder in groove to keep stablizing by the funnel, and chip attachment is facilitated to help weldering
Agent.
Second vision 53 is located at 51 top of turntable.By the positioning of second vision 53, the turntable 51
Drive the chip motion to correcting position according to the positioning signal of second vision 53.Wherein, the sky of the correction position
Between dimension limited by the first dimension of X-direction and the second dimension of Y-direction.To which timing, the third motor 52 drives
The turntable 51 is rotated to position defined by preset first dimension and the second dimension.Meanwhile second vision 53 may be used also
Elevating movement is carried out in z-axis direction, to meet the location requirement of the chip of different-thickness.
Second transport mechanism 4 is used to corrected chip being transported to the load mechanism 6.To which this is practical
It is novel that the pickup of flip chip mounting process, overturning, primary transfer, correction, attachment scaling powder, secondary transferring, attachment are passed through into overturning
Mechanism 7, the first transport mechanism 3, the second transport mechanism 4, aligning gear 5, load mechanism 6 are synchronous to be carried out, and chip is significantly improved
The efficiency of upside-down mounting.Meanwhile the pivoting centre of first transport mechanism 3, the second transport mechanism 4 and turnover mechanism 7 is located at together
Requirement on straight line, so to guarantee chip transmitting.
In one embodiment, second transport mechanism 4 is set between the aligning gear 5 and load mechanism 6,
Comprising: which second mechanical arm 41, the second suction nozzle for being installed on 41 end of second mechanical arm and drive described second are mechanical
Horizontal the second motor 42 pivoted of arm 41.To which under the driving of second motor 42, the second mechanical arm 41 drives it
On the second suction nozzle move to correction position chip top, and by suction function absorption chip, the second mechanical arm
41 are further put into the chip of absorption in the load mechanism 6 and substrate progress load by rotation.First conveyer
Structure 3 and the second transport mechanism 4 can continuously work simultaneously, to improve the efficiency of load.
The load mechanism 6 is for realizing the combination between substrate and chip comprising: load manipulator and load base
Platform.Wherein, the load base station 61 receives the chip from the aligning gear 5 transmitted by second transport mechanism 4, institute
Load manipulator is stated by flip-chip to be incorporated on the substrate.In addition, being additionally provided with several suctions on the load base station 61
Stomata hole, so set, so that substrate is firmly adhered on the load base station 61.
In addition, second positioning mechanism includes third vision 8, it is located at the top of the load board 61.To institute
State load mechanism 6 can according to the testing result of the third vision 8 adjust load chip and substrate along x, y-axis direction position
It sets, to meet the needs of load.
In conclusion the flip-chip micro-group of the utility model is installed by being overturn to chip, the positioning of position
And calibration, it ensure that the precision of the upside-down mounting between chip and substrate, while the flip-chip micro-group installation of the utility model will
Flip chip mounting process is carried out by the way that multiple manipulators are synchronous, is obtained higher upside-down mounting efficiency, is sufficiently met modernization industry
The demand of production.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in
All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting
Related claim.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (7)
1. a kind of flip-chip micro-group installation, the flip-over type micro-group dress being used in integrated circuit between chip and substrate,
It is characterized in that, the flip-chip micro-group installation includes: turnover mechanism, the first positioning mechanism, the first transport mechanism, the second biography
Send mechanism, aligning gear, load mechanism and the second positioning mechanism；
The turnover mechanism is located at the top of first positioning mechanism comprising: turning mechanical arm and overturning motor, it is described
Turning mechanical arm passes through the sucker absorption chip of its end, and under the driving of the overturning motor, the chip is driven to overturn
180 °, and the chip of absorption is transferred to first transport mechanism；
First positioning mechanism includes: positioning disk and the First look above the positioning disk, and the positioning disk mentions
For the chip that the turnover mechanism is drawn, the First look is located above the positioning disk, and the positioning disk is according to described the
The detection signal of one vision drives the chip motion to drawing position；
The aligning gear includes: turntable, the groove for holding fluxing agent being set on the turntable and turns positioned at described
The second vision above disk, the groove receive the chip from the positioning disk transmitted by first transport mechanism, institute
It states the second vision to be positioned above the turntable, the turntable drives the chip motion according to the detection signal of second vision
To correction position；
The load mechanism includes: load manipulator and load base station, and the load base station is received by second transport mechanism
Chip is incorporated on the substrate by the chip from the aligning gear of transmission, the load manipulator, and described second is fixed
Position mechanism includes third vision, is located at the top of the load board.
2. flip-chip micro-group according to claim 1 installation, which is characterized in that first positioning mechanism further includes
The rotating wheel of the positioning disc spins is driven, the rotating wheel is sequentially connected by transmission belt and the positioning disk.
3. flip-chip micro-group installation according to claim 1, which is characterized in that first transport mechanism is set to
Between first positioning mechanism and aligning gear comprising: first mechanical arm is installed on the of the first mechanical arm end
One suction nozzle and the first motor for driving the first mechanical arm level to pivot.
4. flip-chip micro-group installation according to claim 1, which is characterized in that second transport mechanism is set to
Between the aligning gear and load mechanism comprising: second mechanical arm, the second suction for being installed on the second mechanical arm end
Mouth and the second motor for driving the second mechanical arm level to pivot.
5. flip-chip micro-group installation according to claim 1, which is characterized in that the correction position is by X-direction
Second dimension of the first dimension and Y-direction is limited, and the aligning gear includes third motor, described in the third motor drive
Turntable is rotated to position defined by preset first dimension and the second dimension.
6. flip-chip micro-group installation according to claim 1, which is characterized in that the groove has +X direction and-X
The movement travel in direction.
7. flip-chip micro-group installation according to claim 1, which is characterized in that be additionally provided with above the groove
Persistently supplement the funnel of scaling powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820853644.9U CN208271857U (en) | 2018-05-22 | 2018-05-22 | A kind of flip-chip micro-group installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820853644.9U CN208271857U (en) | 2018-05-22 | 2018-05-22 | A kind of flip-chip micro-group installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208271857U true CN208271857U (en) | 2018-12-21 |
Family
ID=64689646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820853644.9U Withdrawn - After Issue CN208271857U (en) | 2018-05-22 | 2018-05-22 | A kind of flip-chip micro-group installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208271857U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108565241A (en) * | 2018-05-22 | 2018-09-21 | 苏州艾科瑞思智能装备股份有限公司 | A kind of flip-chip micro-group installation |
-
2018
- 2018-05-22 CN CN201820853644.9U patent/CN208271857U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108565241A (en) * | 2018-05-22 | 2018-09-21 | 苏州艾科瑞思智能装备股份有限公司 | A kind of flip-chip micro-group installation |
| WO2019223020A1 (en) * | 2018-05-22 | 2019-11-28 | 苏州艾科瑞思智能装备股份有限公司 | Flip chip-type micro-assembly machine for chips |
| CN108565241B (en) * | 2018-05-22 | 2020-03-24 | 苏州艾科瑞思智能装备股份有限公司 | Chip flip-chip micro-assembling machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20181221 Effective date of abandoning: 20200324 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20181221 Effective date of abandoning: 20200324 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |