CN208227427U - High temperature resistant circuit board - Google Patents
High temperature resistant circuit board Download PDFInfo
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- CN208227427U CN208227427U CN201820804540.9U CN201820804540U CN208227427U CN 208227427 U CN208227427 U CN 208227427U CN 201820804540 U CN201820804540 U CN 201820804540U CN 208227427 U CN208227427 U CN 208227427U
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- circuit board
- high temperature
- temperature resistant
- coating
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Abstract
The utility model discloses high temperature resistant circuit boards, including substrate and circuit board, substrate is disposed with heat dissipating layer from top to bottom, aluminium sheet and insulating layer, the both ends of circuit board are provided with multiple groups radiating fin, and radiating fin is placed in the upper surface of substrate, the upper surface of circuit board is covered with antistatic backing, the two sides of substrate are symmetrically arranged with two groups of mounting holes, the bottom of substrate is discrete to be provided with multiple groups transverse concave groove and longitudinal groove, and transverse concave groove and longitudinal groove are interlaced, multiple boss on substrate are formed between transverse concave groove and longitudinal groove, the heat release hole through substrate is disposed on boss, high-temperaure coating and adhesive layer are disposed in transverse concave groove and longitudinal groove, and transverse concave groove, longitudinal groove, boss, high-temperaure coating and adhesive layer are arranged on heat dissipating layer, this kind of high temperature resistant circuit board, with high temperature resistance Also have the function of preventing electrostatic damage, anti-static effect lasting stability simultaneously.
Description
Technical field
The utility model relates to circuit board technology fields, specially high temperature resistant circuit board.
Background technique
With the development and social progress of scientific research, in daily life and industrial production activities, all often
Such situation can be encountered, the working environment of circuit board is extremely harsh, high ambient temperature is many times born, than
In such as drilling platforms, steel-making enterprise and Military Electronic Equipment, many times circuit board ambient temperature can be considerably beyond collection
At circuit maximum temperature, the circuit board being chronically in such working environment, the service life can shorten or even can not work, can not be complete
It at predetermined function, can also cause related accident in some special cases, cause more serious loss.
Existing technology is exactly to coat high-temperature resistant coating in the whole surface of circuit board, but such coating area is very
Greatly, and its thermal expansion coefficient usually has certain difference with the thermal expansion coefficient of matrix, in actual work, in the work of thermal stress
Under, the coating of monolith large area is easy to produce coating shedding or crack problem.
So how to design high temperature resistant circuit board, becoming us will currently be solved the problems, such as.
Utility model content
The purpose of this utility model is to provide high temperature resistant circuit boards, to solve existing electricity mentioned above in the background art
Heat resistant coating area is very big on the plate of road, and its thermal expansion coefficient usually has certain difference with the thermal expansion coefficient of matrix, in reality
When border works, under the action of thermal stress, the problem of coating of monolith large area is easy to produce coating shedding or crackle.
To achieve the above object, the utility model provides the following technical solutions: high temperature resistant circuit board, including substrate and circuit
Plate, the substrate are disposed with heat dissipating layer, aluminium sheet and insulating layer from top to bottom, and the both ends of the circuit board are provided with multiple groups
Radiating fin, and the radiating fin is placed in the upper surface of the substrate, the upper surface of the circuit board is covered with antistatic backing,
The two sides of the substrate are symmetrically arranged with two groups of mounting holes, and the bottom of the substrate is discrete to be provided with multiple groups transverse concave groove and longitudinal direction
Groove, and the transverse concave groove and the longitudinal groove are interlaced, the shape between the transverse concave groove and the longitudinal groove
At multiple boss on the substrate, the heat release hole through the substrate is disposed on the boss, in the transverse concave groove and
High-temperaure coating and adhesive layer are disposed in the longitudinal groove, and the high-temperaure coating is attached to institute by the adhesive layer
It states on substrate, and the transverse concave groove, the longitudinal groove, the boss, the high-temperaure coating and adhesive layer setting
On the heat dissipating layer.
Further, the antistatic backing is acrylic acid and modified acrylic acid, and/or type siloxane and modified siloxane
Class macromolecule antistatic agent coating, coating layer thickness are 0.02~2um.
Further, the periphery of the circuit board is equipped with heat absorption strip.
Further, the surface of the high-temperaure coating and the lower surface of the substrate form the smooth table of smooth transition
Face.
Further, thermal expansion system of the thermal expansion coefficient of the adhesive layer between the substrate and the high-temperaure coating
Between number.
Further, the aluminium sheet is equipped with hollow-out parts, is filled with carbon-coating in the hollow-out parts.
Further, the bottom of the substrate is provided with foam-rubber cushion.
Compared with prior art, the utility model has the beneficial effects that
1. this kind of high temperature resistant circuit board is coated with adhesive layer in the bottom and inner wall of transverse concave groove and longitudinal groove, then will
High-temperaure coating is inserted in groove, and multiple local coating areas are formed, for existing bulk area Bulk coat,
It is fallen off using this more difficult monolith of coating area for being formed by opposite fritter by groove, even if certain block coating area occurs to take off
When falling, other coating areas, which still can then compare, to be securely bonded on substrate, it is not easy to Bulk coat be caused all to fall off.
2. this kind of high temperature resistant circuit board, the thermal expansion coefficient of the thermal expansion coefficient of adhesive layer between substrate and high-temperaure coating
Between, the relationship of this thermal expansion coefficient can eliminate the degree of thermal expansion larger difference between substrate and high-temperaure coating as far as possible
Brought influence.
3. this kind of high temperature resistant circuit board, also having while having the function of high temperature resistance prevents electrostatic damage, prevents
Electrostatic efficiency lasting stability.
4. aluminium sheet uses hollow design, internal to be filled with carbon-coating, carbon-coating has good thermal conductivity, aluminium sheet can be improved
Heating conduction.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the structural schematic diagram of the utility model base plate bottom；
Fig. 3 is one of substrate cross-sectional view of the utility model；
Fig. 4 is the two of the substrate cross-sectional view of the utility model；
In figure: 1- substrate；2- circuit board；3- antistatic backing；4- heat absorption strip；5- mounting hole；6- foam-rubber cushion；7- radiating fin
Piece；8- transverse concave groove；9- longitudinal groove；10- boss；11- heat release hole；12- high-temperaure coating；13- adhesive layer；14- aluminium sheet；
15- insulating layer；16- heat dissipating layer.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-4 is please referred to, the utility model provides a kind of technical solution: high temperature resistant circuit board, including substrate 1 and circuit board
2, the substrate 1 is disposed with heat dissipating layer 16, aluminium sheet 14 and insulating layer 15 from top to bottom, and the both ends of the circuit board 2 are all provided with
It is equipped with multiple groups radiating fin 7, and the radiating fin 7 is placed in the upper surface of the substrate 1, the upper surface of the circuit board 2 is covered
It is stamped antistatic backing 3, the two sides of the substrate 1 are symmetrically arranged with two groups of mounting holes 5, and the bottom of the substrate 1 is discrete to be provided with
Multiple groups transverse concave groove 8 and longitudinal groove 9, and the transverse concave groove 8 and the longitudinal groove 9 are interlaced, it is recessed in the transverse direction
Multiple boss 10 on the substrate 1 are formed between slot 8 and the longitudinal groove 9, are disposed on the boss 10 through described
The heat release hole 11 of substrate 1 is disposed with high-temperaure coating 12 and adhesive layer 13 in the transverse concave groove 8 and the longitudinal groove 9,
And the high-temperaure coating 12 is attached on the substrate 1 by the adhesive layer 13, and the transverse concave groove 8, the longitudinal direction
Groove 9, the boss 10, the high-temperaure coating 12 and the adhesive layer 13 are arranged on the heat dissipating layer 16, the above composition
The basic structure of the utility model.
The utility model uses such structure setting, as in Figure 2-4, recessed in the transverse concave groove 8 and the longitudinal direction
High-temperaure coating 12 and adhesive layer 13 are disposed in slot 9, and the high-temperaure coating 12 is attached to institute by the adhesive layer 13
State on substrate 1, in order to obtain bigger bond area, preferably in the transverse concave groove 8 and the longitudinal groove 9 bottom and
Inner wall is coated with adhesive layer 13, then high-temperaure coating 12 is entered in transverse concave groove 8 and longitudinal groove 9, forms multiple local paintings
Layer region, for existing bulk area Bulk coat, using this coating for being formed by opposite fritter by groove
The more difficult monolith in region falls off, even if certain block coating area is fallen off, other coating areas then still can be relatively more firm
Bonding is on substrate 1, it is not easy to Bulk coat be caused all to fall off.
It is said from another angle, this groove structure can be formed similar to latticed high-temperaure coating 12, be increased resistance to
The area that high temperature coating 12 and substrate 1 bond, so that high-temperaure coating 12 is bonded even closer, additionally, due to groove structure
In the presence of so that high-temperaure coating 12 is less likely to occur to loosen on the direction for being parallel to 1 surface of substrate, but also high-temperaure coating
12 are more difficult to fall off.
When selecting the material of adhesive layer 13, preferably the thermal expansion coefficient of adhesive layer 13 is between the substrate 1 and high temperature resistant
Between the thermal expansion coefficient of coating 12, the relationship of this thermal expansion coefficient can eliminate as far as possible substrate 1 and high-temperaure coating 13 it
Between degree of thermal expansion larger difference brought by influence.
Preferably, the antistatic backing 3 is acrylic acid and modified acrylic acid, and/or type siloxane and modified siloxane
Class macromolecule antistatic agent coating, coating layer thickness are 0.02~2um.
More specifically, the periphery of the circuit board 2 is equipped with heat absorption strip 4, and the surface of the heat absorption strip 4 can be coated with black chromium
Coating, with preferable weatherability and corrosion resistance.
Preferably, the surface of the high-temperaure coating 12 and the lower surface of the substrate 1 form the smooth table of smooth transition
The flat surface in face, this smooth transition can have good equal thermal effect to avoid localized hyperthermia's point is formed on the surface.
More specifically, the aluminium sheet 14 is equipped with hollow-out parts, carbon-coating is filled in the hollow-out parts, using such knot
Structure setting, its working principle is that: carbon-coating has good thermal conductivity, and the heating conduction of aluminium sheet 14 can be improved.
More specifically, the bottom of the substrate 1 is provided with foam-rubber cushion 6, and then can reduce abrasion and make to the service life of substrate 1
At influence.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (7)
1. high temperature resistant circuit board, including substrate (1) and circuit board (2), it is characterised in that: the substrate (1) is from top to bottom successively
It is provided with heat dissipating layer (16), aluminium sheet (14) and insulating layer (15), the both ends of the circuit board (2) are provided with multiple groups radiating fin
(7), and the radiating fin (7) is placed in the upper surface of the substrate (1), the upper surface of the circuit board (2) be covered with prevent it is quiet
Electric layer (3), the two sides of the substrate (1) are symmetrically arranged with two groups of mounting holes (5), and the bottom of the substrate (1) is discrete to be provided with
Multiple groups transverse concave groove (8) and longitudinal groove (9), and the transverse concave groove (8) and the longitudinal groove (9) are interlaced, in institute
State the multiple boss (10) formed on the substrate (1) between transverse concave groove (8) and the longitudinal groove (9), the boss
(10) heat release hole (11) through the substrate (1) is disposed on, in the transverse concave groove (8) and the longitudinal groove (9)
It is disposed with high-temperaure coating (12) and adhesive layer (13), and the high-temperaure coating (12) is attached to by the adhesive layer (13)
On the substrate (1), and the transverse concave groove (8), the longitudinal groove (9), the boss (10), the high-temperaure coating
(12) it is arranged on the heat dissipating layer (16) with the adhesive layer (13).
2. high temperature resistant circuit board according to claim 1, it is characterised in that: the antistatic backing (3) is acrylic acid and changes
Property acrylic compounds, and/or type siloxane and modified siloxane class macromolecule antistatic agent coating, coating layer thickness be 0.02~2um.
3. high temperature resistant circuit board according to claim 1, it is characterised in that: the periphery of the circuit board (2) is equipped with suction
Hot item (4).
4. high temperature resistant circuit board according to claim 1, it is characterised in that: the surface of the high-temperaure coating (12) and institute
The lower surface for stating substrate (1) forms the flat surface of smooth transition.
5. high temperature resistant circuit board according to claim 1, it is characterised in that: the thermal expansion coefficient of the adhesive layer (13) is situated between
Between the substrate (1) and the thermal expansion coefficient of the high-temperaure coating (12).
6. high temperature resistant circuit board according to claim 1, it is characterised in that: the aluminium sheet (14) is equipped with hollow-out parts, institute
It states in hollow-out parts filled with carbon-coating.
7. high temperature resistant circuit board according to claim 1, it is characterised in that: the bottom of the substrate (1) is provided with sponge
It pads (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820804540.9U CN208227427U (en) | 2018-05-28 | 2018-05-28 | High temperature resistant circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820804540.9U CN208227427U (en) | 2018-05-28 | 2018-05-28 | High temperature resistant circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208227427U true CN208227427U (en) | 2018-12-11 |
Family
ID=64506390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820804540.9U Active CN208227427U (en) | 2018-05-28 | 2018-05-28 | High temperature resistant circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208227427U (en) |
-
2018
- 2018-05-28 CN CN201820804540.9U patent/CN208227427U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200421 Address after: 343100 No. 281 Jingjiu Avenue, Jinggangshan Economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee after: RED BOARD (JIANGXI) Co.,Ltd. Address before: 343600 No. 281 Beijing Kowloon Road, Jinggangshan national economic and Technological Development Zone, Ji'an, Jiangxi Patentee before: JI'AN JUNTU TECHNOLOGY Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100 Patentee after: Jiangxi hongban Technology Co.,Ltd. Address before: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100 Patentee before: RED BOARD (JIANGXI) Co.,Ltd. |