CN208189538U - 基板处理装置 - Google Patents

基板处理装置 Download PDF

Info

Publication number
CN208189538U
CN208189538U CN201820610174.3U CN201820610174U CN208189538U CN 208189538 U CN208189538 U CN 208189538U CN 201820610174 U CN201820610174 U CN 201820610174U CN 208189538 U CN208189538 U CN 208189538U
Authority
CN
China
Prior art keywords
medical fluid
board treatment
substrate board
treatment according
module housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201820610174.3U
Other languages
English (en)
Chinese (zh)
Inventor
赵康
赵康一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Case Polytron Technologies Inc
Original Assignee
Case Polytron Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Case Polytron Technologies Inc filed Critical Case Polytron Technologies Inc
Application granted granted Critical
Publication of CN208189538U publication Critical patent/CN208189538U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN201820610174.3U 2018-03-26 2018-04-26 基板处理装置 Active CN208189538U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0034263 2018-03-26
KR1020180034263A KR102452090B1 (ko) 2018-03-26 2018-03-26 기판 처리 장치

Publications (1)

Publication Number Publication Date
CN208189538U true CN208189538U (zh) 2018-12-04

Family

ID=64431356

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820610174.3U Active CN208189538U (zh) 2018-03-26 2018-04-26 基板处理装置

Country Status (2)

Country Link
KR (1) KR102452090B1 (ko)
CN (1) CN208189538U (ko)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002096021A (ja) * 2000-09-22 2002-04-02 Matsushita Electric Ind Co Ltd 粘性材料の吐出方法及び液晶表示装置の製造方法
JP4608876B2 (ja) * 2002-12-10 2011-01-12 株式会社ニコン 露光装置及びデバイス製造方法
JP4975790B2 (ja) * 2009-08-20 2012-07-11 東京エレクトロン株式会社 レジスト液供給装置、レジスト液供給方法、プログラム及びコンピュータ記憶媒体
JP6107690B2 (ja) * 2013-09-27 2017-04-05 東京エレクトロン株式会社 フィルタユニットの前処理方法、処理液供給装置、フィルタユニットの加熱装置
KR101923388B1 (ko) * 2016-07-05 2018-11-29 주식회사 케이씨텍 약액 공급 성능이 향상된 기판 처리 장치

Also Published As

Publication number Publication date
KR20190112370A (ko) 2019-10-07
KR102452090B1 (ko) 2022-10-07

Similar Documents

Publication Publication Date Title
CN101528182B (zh) 密封胶囊的方法和设备
US20210265181A1 (en) Substrate treatment apparatus and substrate treatment method
CN103447256B (zh) 清洁基板的设备和方法
CN101581885B (zh) 涂敷装置和方法
CN108604547B (zh) 基板处理装置和基板处理方法
CN107833852A (zh) 液处理装置
CN102193342B (zh) 涂覆-显影装置和显影方法
TWI775948B (zh) 基板處理裝置
CN110114859A (zh) 基板处理装置及基板处理方法
CN107251191A (zh) 基板处理装置及基板处理装置的控制方法
CN208189538U (zh) 基板处理装置
CN206255626U (zh) 基板移送装置及包含其的基板处理系统
CN211182165U (zh) 基板处理装置
CN208189537U (zh) 基板处理装置
CN208093524U (zh) 基板处理装置及用于其的过滤单元
JP3500315B2 (ja) 脱気装置及び脱気方法
JP6050091B2 (ja) 基板処理装置
JP3667164B2 (ja) 処理液吐出ノズル、液処理装置および液処理方法
JP4020741B2 (ja) 液処理装置における気液分離回収装置
TW201140665A (en) Laminar flow tank
JP2001252604A (ja) 処理液吐出ノズルおよび液処理装置
US20090320942A1 (en) Single substrate processing head for particle removal using low viscosity fluid
CN108883637A (zh) 喷墨头及喷墨记录装置
CN107362695B (zh) 一种中空纤维Silicalite‑1分子筛膜的合成装置及合成方法
CN206610792U (zh) 单片式清洗装置

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant