CN208157845U - A kind of laser heat dissipation cold plate structure - Google Patents
A kind of laser heat dissipation cold plate structure Download PDFInfo
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- CN208157845U CN208157845U CN201820738982.8U CN201820738982U CN208157845U CN 208157845 U CN208157845 U CN 208157845U CN 201820738982 U CN201820738982 U CN 201820738982U CN 208157845 U CN208157845 U CN 208157845U
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- cooling fin
- heat dissipation
- cold plate
- plate structure
- substrate
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Abstract
The utility model discloses a kind of laser heat dissipation cold plate structure, including upper substrate and lower substrate, it is characterized in that, it is provided between the upper substrate and lower substrate several along direction of ventilation and the cooling fin that is intervally arranged, region between upper substrate and lower substrate is separated into several heat dissipation channels by cooling fin, and the cooling fin is integrally wavy along direction of ventilation.Laser heat dissipation cold plate structure described in the utility model effectively increases heat exchange area using along wavy cooling fin, to effectively improve heat dissipation performance, the area of upper substrate and lower substrate is greatly reduced in the case where realizing identical heat radiation power, the volume size and weight for reducing heat dissipation cold plate meet laser densification, miniaturization, light-weighted growth requirement.
Description
Technical field
The utility model relates to the technical field of radiator more particularly to a kind of laser heat dissipation cold plate structures.
Background technique
In Optical Maser System, the Excited state as caused by the photoelectric conversion of pumping source, wavelength convert, pump light leakage
And circuit power pipe loss etc. can all generate a large amount of heat, if heat is unable to disperse in time, device temperature can be made excessively high, led
LD output power is caused to reduce, the reduction of optical device performance influences laser entirety service performance, or even occur more than limiting temperature
The phenomenon that, lead to system crash, it is therefore necessary to by radiator by heat distribute could safeguards system it is long-acting stable
Work, Optical Maser System is usually using the heat dissipation cold plate of radiator as pumping source, circuit device, gain fibre and optical element
Installation carrier, therefore construction for heat radiating device determines the size of laser, also rises to the steady operation performance of laser
To decisive action.
Wind-cooling heat dissipating mode is with its technology maturation, structure is reliable, the advantages such as low in cost, and it is portable to be widely used in low-power
Formula field of lasers, air-cooled radiating device mainly include heat dissipation cold plate and fan, existing heat dissipation cold plate mainly use upper substrate,
The fabricated structure of lower substrate, the outer surface installation optical device and processing optical fiber runway of upper substrate, the outer surface peace of lower substrate
Optical element and drive circuit board are filled, the cooling fin being intervally arranged, fan are set in the region between upper substrate and lower substrate
Cooling air is provided, forced-convection heat transfer is carried out with fin surface, takes away waste heat, guarantee system performance.Existing heat dissipation is cold
For plate using linear cooling fin, fluid flows between two cooling fins belongs to internal flow process, and fluid is flowed in wall surface
When, due to viscous effect, practically equals to zero in the fluid velocity for being attached at wall surface, belong to typically without slip boundary effect；
Fluid there are two apparent flowing sections, and flowing inlet section and flowing fully developed zone section, entrance thermal boundary layer compared with
Thin, Local Heat Transfer Coefficient is higher than fully developed section, and fluid velocity distributed pole is uneven.And the heat-sinking capability of heat dissipation cold plate
Depend entirely on heat exchange surface area, that is to say, that the heat exchange area that the heat radiation power for needing to double just needs to double,
To need quantity, the size of increase cooling fin at double, become large-sized so as to cause heat dissipation cold plate overall structure, weight becomes
Greatly, increase the structure size and weight of entire laser, it is difficult to meet laser densification, miniaturization, light-weighted development need
It asks.
Utility model content
Technical problem to be solved in the utility model and the technical assignment of proposition are improved to the prior art, are provided
A kind of laser heat dissipation cold plate structure solves the laser heat dissipation cold plate structure in current technology and needs biggish volume that could expire
Sufficient heat radiation power, the problem of increasing the structure size and weight of entire laser.
In order to solve the above technical problems, the technical solution of the utility model is：
A kind of laser heat dissipation cold plate structure, including upper substrate and lower substrate, which is characterized in that the upper substrate is under
It is provided with several along direction of ventilation and the cooling fin that is intervally arranged between substrate, cooling fin is by the area between upper substrate and lower substrate
Domain is separated into several heat dissipation channels, and the cooling fin is integrally wavy along direction of ventilation.The utility model institute
The laser heat dissipation cold plate structure stated using along direction of ventilation integrally wavy cooling fin come it is effective in a limited space
Increase heat exchange area, effectively increases heat dissipation area in the case where guaranteeing cooling fin straight length, spacing and height unanimous circumstances, thus
It is effective to improve heat dissipation performance, meet the needs of heat radiation power, in the case where realizing identical heat radiation power with traditional heat dissipation
Cold plate compares the area for greatly reducing upper substrate and lower substrate, reduces the volume size and weight of heat dissipation cold plate, meets and swashs
Light device densification, miniaturization, light-weighted growth requirement.And air enter wavy cooling fin bending part when,
It will form the secondary flow perpendicular to flow direction due to the effect of centrifugal force, to reinforce the disturbance of air, weaken fluid
Wall boundary layer effect increases the convection transfer rate of air and cooling fin, improves integral heat sink ability.
Further, the cooling fin is in the straightway along direction of ventilation in the inlet and outlet of direction of ventilation, is protected
Barrier air can smoothly enter in heat dissipation channel from import, and then air is transitioned into wavy channel from straightway, is avoided
Air occurs rebound in entrance and causes heat dissipation channel sluggish in air circulation, ensures long-acting stable heat dissipation performance.
Further, under the cooling fin includes the upper cooling fin being connected on upper substrate and is connected on lower substrate
Cooling fin, and upper cooling fin and lower cooling fin misplace arrangement in the transverse direction of direction of ventilation, structure is simple, and it is easy to make, on
Cooling fin elder generation assembly and connection is on upper substrate, and lower cooling fin elder generation assembly and connection is on lower substrate, then by upper substrate and lower substrate
Using welding, the modes such as rivets and be bolted and assemble, easy to loading and unloading, maintenance efficiency is high,.
Further, between the lower end and lower substrate of the upper cooling fin have spacing, the upper end of lower cooling fin with it is upper
There is spacing between substrate, be interconnected by the heat dissipation channel that cooling fin is separated out, improve the circulation of air, improve heat exchange
Efficiency, to improve heat dissipation performance.
Further, the length of the upper cooling fin and lower cooling fin on the direction from upper substrate to lower substrate has
Overlay region, so that being in the path S in the transverse direction of direction of ventilation between upper substrate and lower substrate, while increasing heat exchange area
It ensures the circulation of air, improves heat dissipation performance.
Further, the cooling fin is in straight panel shape in the transverse direction of direction of ventilation, and structure is simple, easy to process, system
Make at low cost.
Further, the cooling fin is wavy in the transverse direction of direction of ventilation, further increases heat-exchange surface
Product improves heat dissipation performance, reduces the volume size and weight of heat dissipation cold plate, meets laser densification, miniaturization, light-weighted
Growth requirement.
Compared with prior art, the utility model advantage is：
Laser heat dissipation cold plate structure described in the utility model is changed using along wavy cooling fin to effectively increase
Heat area greatly reduces upper substrate in the case where realizing identical heat radiation power under to effectively improve heat dissipation performance
The area of substrate reduces the volume size and weight of heat dissipation cold plate, meets laser densification, miniaturization, light-weighted hair
Exhibition demand, and ensure the good air circulation of heat dissipation channel, to ensure long-acting stable heat-sinking capability, ensure laser
Stable operation.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the laser heat dissipation cold plate structure in the transverse direction of direction of ventilation；
Fig. 2 is the A-A the schematic diagram of the section structure in Fig. 1；
Fig. 3 is the structural schematic diagram of another embodiment of laser heat dissipation cold plate structure；
Fig. 4 is the air flow schematic diagram of wave shaped radiator；
Fig. 5 is the analog temperature distribution schematic diagram of the heat dissipation cold plate structure of linear cooling fin；
Fig. 6 is the analog temperature distribution schematic diagram of the heat dissipation cold plate structure of wave shaped radiator.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
A kind of laser heat dissipation cold plate structure disclosed in the utility model embodiment, using the cooling fin of wavy shaped configuration,
Effectively increase heat exchange area in limited volume, weaken the wall boundary layer effect of fluid using the curvilinear surface of cooling fin,
Increase the convection transfer rate of air and cooling fin, improves integral heat sink ability, effectively reduce the overall volume, again of heat dissipation cold plate
Amount, meets laser densification, miniaturization, light-weighted growth requirement.
As depicted in figs. 1 and 2, a kind of laser heat dissipation cold plate structure, including upper substrate 1 and lower substrate 2,1 He of upper substrate
Lower substrate 2 is arranged in parallel, and is provided between upper substrate 1 and lower substrate 2 several along direction of ventilation and the cooling fin that is intervally arranged
3, the region between upper substrate 1 and lower substrate 2 is divided into several heat dissipation channels by cooling fin 3, and cooling fin 3 is along ventilation side
To whole wavy, in order to ensure that air can smoothly enter into heat dissipation channel, by cooling fin 3 direction of ventilation inlet and outlet
Straightway 33 along direction of ventilation is set, and air is directly entered after straightway 33 and is transitioned into waveform channel again, ensures air
Along the flowing smoothness of heat dissipation channel.
As shown in figure 4, using the circular arc undaform cooling fin of R=14, heat dissipation area relative rectilinear in the present embodiment
Formula cooling fin increases by 10.7%, and air, due to the effect of centrifugal force can shape when entering the bending part of wavy cooling fin
At the secondary flow perpendicular to flow direction, to reinforce the disturbance of air, weaken the wall boundary layer effect of fluid, increases empty
The convection transfer rate of gas and cooling fin is (multiplied by correction factor C in linear type cooling fin calculated resultR=1+1.77 (s/R)
2%) ≈ 1.02, the i.e. coefficient of heat transfer increase, improve integral heat sink ability.
In the present embodiment, using upper and lower base plate fabricated structure, cooling fin 3 includes upper cooling fin 31 and lower cooling fin
32, upper cooling fin 31 is first connected on the lower surface of upper substrate 1, the upper surface installation optical device and processing optical fiber of upper substrate 1
Runway；Lower cooling fin 32 is now connected on 2 upper surface of lower substrate, the lower surface installation optical element and driving circuit of lower substrate 2
Plate, upper and lower substrates using welding, the modes such as rivet and be bolted and assemble.Also, the lower end of upper cooling fin 31 and lower base
There is spacing between plate 2, there is spacing, and upper cooling fin 31 and lower heat dissipation between the upper end and upper substrate 1 of lower cooling fin 32
Piece 32 misplaces arrangement, upper cooling fin 31 and lower cooling fin 32 from upper substrate 1 to the side of lower substrate 2 in the transverse direction of direction of ventilation
Upward length has overlay region, so that being in the path S in the transverse direction of direction of ventilation between upper substrate and lower substrate, improves
Air flow property improves heat dissipation performance.
Fig. 5 and Fig. 6 be analogue simulation go out hot cold plate structure Temperature Distribution schematic diagram, thermal boundary condition be pumping LD,
Electrical components and all pyrotoxins of optical element are added being weighted and averaged in a manner of thermal power on the surface LD, such as Fig. 5 institute
Show, the maximum temperature of the heat dissipation cold plate structure of linear cooling fin is 40.7 DEG C, and minimum temperature is 36.3 DEG C；As shown in fig. 6, wave
The maximum temperature of the heat dissipation cold plate structure of shape wave cooling fin is 38.8 DEG C, and minimum temperature is 34.2 DEG C, and wave shaped radiator dissipates
The mean temperature of hot cold plate structure is than linear low 2 DEG C.
Cooling fin 3 can be in straight panel shape in the transverse direction of direction of ventilation, and structure is simple, easy to process；As shown in figure 3, dissipating
Backing 3 can further increase heat exchange area in the transverse direction of direction of ventilation with wavy, improve integral heat sink ability,
Overall volume, the weight of heat dissipation cold plate are effectively reduced in the case where meeting heat radiation power.
Above are merely preferred embodiments of the utility model, it is noted that above-mentioned preferred embodiment should not regard
For limitations of the present invention, the protection scope of the utility model should be defined by the scope defined by the claims..For
For those skilled in the art, without departing from the spirit and scope of the utility model, it can also make several
Improvements and modifications, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (7)
1. a kind of laser heat dissipation cold plate structure, including upper substrate (1) and lower substrate (2), which is characterized in that the upper substrate
(1) it is provided between lower substrate (2) several along direction of ventilation and the cooling fin (3) that is intervally arranged, cooling fin (3) is by upper substrate
(1) region between lower substrate (2) is separated into several heat dissipation channels, and the cooling fin (3) is along direction of ventilation
It is whole wavy.
2. laser heat dissipation cold plate structure according to claim 1, which is characterized in that the cooling fin (3) is being divulged information
The inlet and outlet in direction is in the straightway (33) along direction of ventilation.
3. laser heat dissipation cold plate structure according to claim 1, which is characterized in that the cooling fin (3) includes connecting
It connects in the upper cooling fin (31) on upper substrate (1) and the lower cooling fin (32) being connected on lower substrate (2), and upper cooling fin
(31) it misplaces in the transverse direction of direction of ventilation arrangement with lower cooling fin (32).
4. laser heat dissipation cold plate structure according to claim 3, which is characterized in that under the upper cooling fin (31)
There is spacing between end and lower substrate (2), there is spacing between the upper end and upper substrate (1) of lower cooling fin (32).
5. laser heat dissipation cold plate structure according to claim 4, which is characterized in that the upper cooling fin (31) and under
Length of the cooling fin (32) on the direction from upper substrate (1) to lower substrate (2) has overlay region.
6. laser heat dissipation cold plate structure according to claim 1, which is characterized in that the cooling fin (3) is being divulged information
It is in straight panel shape in the transverse direction in direction.
7. laser heat dissipation cold plate structure according to claim 1, which is characterized in that the cooling fin (3) is being divulged information
It is wavy in the transverse direction in direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820738982.8U CN208157845U (en) | 2018-05-18 | 2018-05-18 | A kind of laser heat dissipation cold plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820738982.8U CN208157845U (en) | 2018-05-18 | 2018-05-18 | A kind of laser heat dissipation cold plate structure |
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| Publication Number | Publication Date |
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| CN208157845U true CN208157845U (en) | 2018-11-27 |
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| CN201820738982.8U Active CN208157845U (en) | 2018-05-18 | 2018-05-18 | A kind of laser heat dissipation cold plate structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056171A (en) * | 2021-03-11 | 2021-06-29 | Tcl华星光电技术有限公司 | Sequential control circuit board and display device |
-
2018
- 2018-05-18 CN CN201820738982.8U patent/CN208157845U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056171A (en) * | 2021-03-11 | 2021-06-29 | Tcl华星光电技术有限公司 | Sequential control circuit board and display device |
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| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 610000 904, floor 9, zone a, building 1, No. 200, Tianfu Fifth Street, high tech Zone, Chengdu, Sichuan Patentee after: Sichuan Sichuang Laser Technology Co.,Ltd. Address before: 610000 904, floor 9, zone a, building 1, No. 200, Tianfu Fifth Street, high tech Zone, Chengdu, Sichuan Patentee before: SICHUAN STRONG & BEST LIGHT TECHNOLOGY CO.,LTD. |
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| CP01 | Change in the name or title of a patent holder |