CN113056171A - Sequential control circuit board and display device - Google Patents
Sequential control circuit board and display device Download PDFInfo
- Publication number
- CN113056171A CN113056171A CN202110262819.5A CN202110262819A CN113056171A CN 113056171 A CN113056171 A CN 113056171A CN 202110262819 A CN202110262819 A CN 202110262819A CN 113056171 A CN113056171 A CN 113056171A
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- China
- Prior art keywords
- circuit board
- control circuit
- heat
- fin
- timing control
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Links
- 230000017525 heat dissipation Effects 0.000 claims description 32
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 16
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000002349 favourable effect Effects 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000004907 flux Effects 0.000 abstract description 4
- 238000012546 transfer Methods 0.000 abstract description 4
- 230000000149 penetrating effect Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 9
- 230000009286 beneficial effect Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000003190 augmentative effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application provides a sequential control circuit board and display device, sequential control circuit board package rubbing board body, include on the plate body: the fin that the interval set up and a plurality of components that generate heat, a plurality of components that generate heat include time schedule controller, power and power manager, the fin time schedule controller the power and dislocation set between the power manager. This application is through setting up the fin on the plate body, and will the fin sets up with components and parts that generate heat respectively dislocation such as time schedule controller, power manager, the overall arrangement mode of fin and components and parts dislocation set that generate heat is favorable to holding more heat flux density, and under the penetrating circumstances of air convection, the air convection is favorable to accelerating the air heat transfer to the realization is in order to improve the radiating efficiency of circuit board under the prerequisite that does not increase too much fin, is favorable to prolonging the life of circuit board, is favorable to practicing thrift manufacturing cost simultaneously.
Description
Technical Field
The application relates to the technical field of display devices, in particular to a sequential control circuit board and a display device.
Background
At present, with the development of the panel industry, the development trend of panels such as liquid crystal display panels, OLED display panels, etc. gradually develops towards large size, high resolution, and high refresh rate, and along with the development of these trends, new related display problems also occur to be solved.
The heat dissipation of the corresponding circuit board of the large-sized display panel is a difficult problem, and if the heat dissipation of the display panel is not good, the panel product is unqualified, and the mass production cannot be realized or the service life of the display panel is reduced. If the number of the heat dissipation fins is mechanically increased in order to improve the heat dissipation efficiency of the circuit board, the manufacturing cost of the circuit board and the weight of the corresponding display panel mechanism are increased.
Disclosure of Invention
The application provides a sequential control circuit board and a display device, which aim to solve the problem of low heat dissipation efficiency of the conventional sequential control circuit board.
The utility model provides a sequential control circuit board, includes the plate body, include on the plate body:
the fin that the interval set up and a plurality of components that generate heat, a plurality of components that generate heat include time schedule controller, power manager, the fin time schedule controller the power and dislocation set between the power manager.
In a possible implementation manner of the present application, the plurality of heat generating components include a ground terminal, and the distance between the heat sink and the ground terminal is greater than or equal to 3 mm.
In this application a possible implementation, the quantity of fin is a plurality of, a plurality of fin parallel arrangement, a plurality of fin with the plate body is the right angle setting or is the inclination setting.
In one possible implementation manner of the present application, the heat dissipation fins are arranged in a staggered manner in a height direction of the heat dissipation fins.
In one possible implementation manner of the present application, the heat dissipation fins are disposed in a staggered manner along a horizontal direction and/or a vertical direction of the plate body.
In a possible implementation manner of the present application, the plurality of heat generating components are arranged in a staggered manner along a horizontal direction and/or a vertical direction of the plate body.
In one possible implementation of the present application, the heat sink is made of at least one of silver, copper, aluminum, or iron pieces.
In one possible implementation manner of the present application, the timing controller includes a master timing controller and at least two slave timing controllers, and each slave timing controller is connected to the master timing controller.
In a possible implementation manner of the present application, the master timing controller includes a plurality of first transmitting terminals, the slave timing controller includes a plurality of second transmitting terminals, and the first transmitting terminals and the second transmitting terminals are arranged in a staggered manner.
On the other hand, this application still provides a display device, including display panel and the sequential control circuit board, display panel connects the sequential control circuit board.
The application provides a pair of sequential control circuit board and display device, through set up the fin on the plate body, and will the fin sets up with components and parts that generate heat respectively dislocation with sequential controller, power manager etc. the fin and the overall arrangement mode that generates heat components and parts dislocation set are favorable to holding more heat flux density, under the penetrating circumstances of air convection, especially when under the circumstances of air along the not equidirectional convection current, the air convection current is favorable to accelerating the air heat transfer to the realization is in order to improve the radiating efficiency of circuit board under the prerequisite that does not increase too much fin, is favorable to prolonging the life of circuit board, is favorable to practicing thrift manufacturing cost simultaneously.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a timing control circuit board according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a timing control circuit board according to another embodiment of the present application.
Fig. 3 is a schematic structural diagram of a timing control circuit board according to another embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
In one aspect, referring to fig. 1, an embodiment of the present application provides a timing control circuit board, including a board body 100, where the board body 100 includes:
the heat sink 110 and the plurality of heat dissipation components are arranged at intervals, the plurality of heat dissipation components include a timing controller 120, a power supply 150 and a power manager 140(PMIC), and the heat sink 110, the timing controller 120, the power supply 150 and the power manager 140 are arranged in a staggered manner. The timing controller 120 is used for the display panel to implement functions of conversion of the power supply 150, setting of the timing circuit, design of the trigger circuit, and the like, the power supply 150 is used for providing working power for the circuit board, and the power manager 140 is used for adjusting an output power mode according to the signal and outputting a driving current to the display panel. The number of the power supplies 150 may be set to be plural because the power manager 140 outputs limited power, and thus the load capacity of the circuit board is improved by increasing the number of the power supplies 150.
The sequential control circuit board of this application embodiment is through setting up fin 110 on plate body 100, and will fin 110 and sequential controller 120, power 150, power manager 140 etc. generate heat components and parts dislocation set respectively, the layout mode of fin 110 and generate heat components and parts dislocation set is favorable to holding more heat flux density, and under the penetrating condition of air convection, the air convection is favorable to accelerating the air heat transfer to the realization is in order to improve the radiating efficiency of circuit board under the prerequisite of not increasing too much fin 110, is favorable to prolonging the life of circuit board, is favorable to practicing thrift manufacturing cost simultaneously.
It is understood that the heat sink 110 may be rectangular, square, triangular, etc. according to practical needs, and the embodiment is not particularly limited herein.
Specifically, in some embodiments, the heat dissipation fins 110 are disposed in a staggered manner along the horizontal direction a or the vertical direction B of the plate body 100. The air convection direction may be along the horizontal direction a, i.e. left-right convection, or along the vertical direction B, i.e. up-down convection, as shown in fig. 1, the heat dissipation fins 110 are arranged along the horizontal direction a of the plate body 100 in a staggered manner, so that when the air flows in the horizontal direction a, the heat exchange with the air in the horizontal direction a is accelerated, and the heat dissipation effect is further improved. It can be understood that, when the heat dissipation fins 110 are disposed along the vertical direction B of the plate 100 in a staggered manner, when air flows in the horizontal direction a, the heat exchange with air in the horizontal direction a is accelerated, which is beneficial to further improving the heat dissipation effect.
In some embodiments, the plurality of heat generating components are disposed in a staggered manner along a horizontal direction a and/or a vertical direction B of the board body 100. As shown in fig. 1, the timing controller 120, the power manager 140, and the power source 150 are not disposed on the same horizontal line or vertical line, so as to prevent the heat from flowing when air is convected, prevent the temperature of each heating component from increasing, and further improve the heat dissipation effect of the circuit board.
In some embodiments, the plurality of heat generating components include a ground terminal, wherein the ground terminal is used for grounding, and the arrangement of the heat sink 110 close to the ground terminal is beneficial to improve the heat dissipation effect of the circuit board because the ground terminal is high. Specifically, as shown in fig. 2, the timing controller 120 has a first ground 101, the power manager 140 has a second ground 102, the power source 150 has a third ground 103, the plurality of heat sinks 110 are respectively disposed near the first ground 101, the second ground 102, and the third ground 103, and a distance between the heat sinks 110 and the first ground 101, the second ground 102, and the third ground 103 is greater than or equal to 3 mm. The radiating fins 110 are arranged close to the grounding end of the heating element, so that the radiating effect is improved, the distance between the radiating fins 110 and the grounding end is larger than or equal to 3mm, the radiating fins 110 are prevented from damaging the structure or the circuit of the heating element, and the service life of the circuit board is prolonged.
In some embodiments, the number of the heat dissipation fins 110 is multiple, the heat dissipation fins 110 are arranged in parallel, and the heat dissipation fins 110 are arranged at a right angle or an oblique angle with respect to the plate body 100. The plurality of heat dissipation fins 110 are disposed at right angles to the plate body 100, and certainly, the heat dissipation fins 110 and the plate body 100 are disposed at an inclined angle, which may be, for example, 45 ° to 135 °, such as 45 ° between the heat dissipation fins 110 and the plate body 100.
In some embodiments, the heat dissipation fins 110 are offset in the height direction of the heat dissipation fins 110. For example, referring to fig. 3, when the heat sink 110 is disposed in a staggered manner in the height direction, the heat sink 110 and the plate body 100 may be disposed perpendicular to each other. Through designing fin 110 into the setting mode that forms the height dislocation in the direction of height to be favorable to at the increase heat radiating area of direction of height, short fin 110 is used for holding more heat flux density simultaneously and accelerates the air heat transfer, and the air is with flowing in addition, thereby further realizes realizing the best radiating project organization with minimum material, is favorable to prolonging the life of circuit board, thereby is favorable to further postponing display panel's life.
In some embodiments, the heat sink 110 is made of at least one of silver, copper, aluminum or iron pieces, which can be adapted to different manufacturing requirements. The heat sink 110 is made of metal with good thermal conductivity, which is beneficial to further improving the heat dissipation effect. Illustratively, the heat sink 110 may be a heat-dissipating iron plate made of an iron plate, which has a good heat-dissipating effect, and of course, the heat sink 110 may be a heat-dissipating aluminum plate made of an aluminum plate, which has a good heat-dissipating effect, and is light and thin, and has a low cost.
Specifically, when there are a plurality of heat sinks 110, the heat sinks 110 may be made of the same metal material, or made of different metal materials, for example, when the number of the heat sinks 110 is 3, 3 heat sinks 110 may be all made of iron sheets; or one of the two radiating iron sheets can be made of iron sheets, and the other two radiating aluminum sheets can be made of aluminum sheets, and the like.
In some embodiments, the timing controller 120 includes a master timing controller 121 and at least two slave timing controllers 122, and each slave timing controller 122 is connected to the master timing controller 121. The master timing controller 121 is configured to send the image information corresponding to each slave timing controller 122 to the corresponding slave timing controller 122, and send the pixel data to the corresponding sub-display region. It is to be understood that the number of the slave timing controllers 122 is not limited thereto, and the number of the slave timing controllers 122 may be changed according to the resolution of the display panel, the control capability of the timing controllers, the number of the data drivers, and the like. For example, the number of the slave timing controllers 122 may also be 4, wherein the display panel may include four sub-display regions, each sub-display region corresponds to one slave timing controller 122, the master timing controller 121 corresponds to each sub-display region, and the master timing controller 121 and the slave timing controller 122 are respectively configured to input pixel data to the corresponding sub-display region, that is, the master timing controller 121 and the slave timing controller 122 respectively drive the corresponding sub-display region.
In some embodiments, the master timing controller 121 includes a plurality of first transmitters 211, the slave timing controller 122 includes a plurality of second transmitters 221, and the first transmitters 211 and the second transmitters 221 are arranged in a staggered manner. The timing controller generally includes a transmitting terminal (Tx terminal) and a receiving terminal, wherein, as shown in fig. 1, the master timing controller 121 includes a first transmitting terminal 211, and the slave timing controller 122 includes a second transmitting terminal 221, because the highest temperature of the timing controller is mainly concentrated near the transmitting terminal, because the transmitting terminal is always working, the heat generation is high, and by arranging the first transmitting terminal 211 and the second transmitting terminal 221 in a staggered manner, the first transmitting terminal 211 and the second transmitting terminal 221 are not arranged on the same straight line, thereby being beneficial to preventing the flow of heat caused by air convection, preventing the temperature of each heating element from increasing, and being beneficial to further improving the heat dissipation effect of the circuit board.
On the other hand, the embodiment of the application also provides a display device, which comprises a display panel and the sequential control circuit board, wherein the display panel is connected with the sequential control circuit board.
In order to better implement the time sequence control circuit board of the application, the application also provides a display device, and the display device comprises the time sequence control circuit board. Since the display device has the timing control circuit board, all the same beneficial effects are achieved, and the description of the invention is omitted.
The embodiment of the application is not specifically limited to the application of the display device, and the display device can be any product or part with a display function, such as a television, a notebook computer, a tablet computer, wearable display equipment (such as an intelligent bracelet, an intelligent watch and the like), a mobile phone, virtual reality equipment, augmented reality equipment, vehicle-mounted display, an advertising lamp box and the like.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The timing control circuit board and the display device provided by the embodiment of the present application are described in detail above, a specific example is applied in the description to explain the principle and the implementation of the present application, and the description of the above embodiment is only used to help understand the technical scheme and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. The utility model provides a sequential control circuit board which characterized in that, includes the plate body, include on the plate body:
the fin that the interval set up and a plurality of components that generate heat, a plurality of components that generate heat include time schedule controller, power and power manager, the fin time schedule controller the power and dislocation set between the power manager.
2. The timing control circuit board of claim 1, wherein the plurality of heat generating components comprise a ground terminal, and a distance between the heat sink and the ground terminal is greater than or equal to 3 mm.
3. The sequential control circuit board according to claim 1, wherein the number of the heat dissipation fins is plural, the plural heat dissipation fins are arranged in parallel, and the plural heat dissipation fins are arranged at a right angle or an oblique angle with respect to the board body.
4. The timing control circuit board according to claim 3, wherein the heat dissipation fins are arranged offset in a height direction of the heat dissipation fins.
5. The timing control circuit board according to claim 3, wherein the heat sinks are disposed in a staggered manner along a horizontal direction and/or a vertical direction of the board body.
6. The timing control circuit board according to claim 1, wherein the plurality of heat generating components are arranged in a staggered manner along a horizontal direction and/or a vertical direction of the board body.
7. The timing control circuit board according to claim 1, wherein the heat sink is made of at least one of silver, copper, aluminum, or iron.
8. The timing control circuit board according to any one of claims 1 to 7, wherein the timing controller comprises a master timing controller and at least two slave timing controllers, each slave timing controller being connected to the master timing controller.
9. The timing control circuit board of claim 8, wherein the master timing controller comprises a plurality of first transmitters, and the slave timing controller comprises a plurality of second transmitters, and the first transmitters and the second transmitters are arranged in a staggered manner.
10. A display device, comprising a display panel and a timing control circuit board, wherein the display panel is connected to the timing control circuit board, and the timing control circuit board is the timing control circuit board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110262819.5A CN113056171A (en) | 2021-03-11 | 2021-03-11 | Sequential control circuit board and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110262819.5A CN113056171A (en) | 2021-03-11 | 2021-03-11 | Sequential control circuit board and display device |
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| Publication Number | Publication Date |
|---|---|
| CN113056171A true CN113056171A (en) | 2021-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110262819.5A Pending CN113056171A (en) | 2021-03-11 | 2021-03-11 | Sequential control circuit board and display device |
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| CN (1) | CN113056171A (en) |
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| CN209857721U (en) * | 2019-02-26 | 2019-12-27 | 东莞市远鑫电子科技有限公司 | Efficient radiator based on graphene coating |
| CN210462595U (en) * | 2019-11-06 | 2020-05-05 | 康新（中国）设计工程股份有限公司 | Waterproof heat dissipation type LED lamp strip |
| CN111525227A (en) * | 2020-06-02 | 2020-08-11 | Oppo广东移动通信有限公司 | Customer premises equipment |
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2021
- 2021-03-11 CN CN202110262819.5A patent/CN113056171A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM258331U (en) * | 2004-05-04 | 2005-03-01 | Power Band Technology Co Ltd | Fanless cooling structure of power supply |
| CN208024588U (en) * | 2018-02-01 | 2018-10-30 | 东莞溙奕电子有限公司 | CPU radiator fans |
| CN208157845U (en) * | 2018-05-18 | 2018-11-27 | 四川思创优光科技有限公司 | A kind of laser heat dissipation cold plate structure |
| CN208256654U (en) * | 2018-05-31 | 2018-12-18 | 特变电工西安电气科技有限公司 | A kind of electrical device radiator |
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| CN111525227A (en) * | 2020-06-02 | 2020-08-11 | Oppo广东移动通信有限公司 | Customer premises equipment |
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