CN210199455U - Backlight module and display module - Google Patents
Backlight module and display module Download PDFInfo
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- CN210199455U CN210199455U CN201921477006.2U CN201921477006U CN210199455U CN 210199455 U CN210199455 U CN 210199455U CN 201921477006 U CN201921477006 U CN 201921477006U CN 210199455 U CN210199455 U CN 210199455U
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Abstract
The utility model relates to a backlight module, which comprises a back plate and a plurality of chip-scale packaged LEDs arranged on the back plate; and the optical element covers the outside of at least one chip scale package LED and is used for converging the light emitted by the light source so as to enable the light-emitting angle of the light emitted by the light source to be within a preset range value. The utility model discloses still relate to a display module assembly.
Description
Technical Field
The utility model relates to a show product preparation technical field, especially relate to a backlight unit and display module assembly.
Background
The AR-HUD is an enhanced head-up display technology, is rapidly developed in the aspect of vehicle-mounted display in recent years, can reasonably display some driving information in a superimposed manner in a sight line area of a driver, and is combined with actual traffic road conditions. Compared with the characteristics that the visual angle of the HUD (head-up display) is small, the information display is not clear, the visual distance is too close, the fatigue of a driver is easily caused, and the like, the AR-HUD combines the whole front windshield as a reflection carrier, the display range is larger, the distance is farther, and the AR (enhanced display) function needs to be deeply integrated with an auxiliary driving system so as to realize higher effects and functions. However, the AR-HUD technology requires a module with higher brightness due to the larger display range and the longer distance, so that the postcard development is likely to occur during the night display, and also imposes a more severe requirement on the heat dissipation.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problem, the present invention provides a backlight module and a display module, which solve the problems of light emitting angle, brightness and contrast (reducing L)0Black screen brightness), etc., which do not meet the AR-HUD technical requirements.
In order to achieve the above purpose, the utility model discloses a technical scheme is: a backlight module comprises a back plate and a plurality of chip scale package LEDs arranged on the back plate;
and the optical element covers the outside of at least one chip scale package LED and is used for converging the light emitted by the chip scale package LED so as to enable the light-emitting angle of the light emitted by the chip scale package LED to be within a preset range value.
Optionally, the optical element includes a substrate, a plurality of through holes penetrating along a thickness direction of the substrate are formed in the substrate, each through hole is sleeved outside each chip scale package LED, an inner surface of each through hole is a reflection surface, and the reflection surface is used for reflecting light emitted by the chip scale package LEDs out of the corresponding through hole.
Optionally, the inner surface of the through hole is a paraboloid, and the center of the light emitting surface of the chip scale package LED is located on a straight line where a symmetry axis of the paraboloid is located.
Optionally, the inner surface of the through hole is a compound paraboloid formed by combining 4 same paraboloids, and openings at two ends of the through hole are both square.
Optionally, a coordinate system is established with a direction parallel to a plane where the port of the through hole is located as an X axis and a direction perpendicular to the plane where the port of the through hole is located as a Y axis, and an equation of a parabola corresponding to the paraboloid is that Y is 0.25X2。
Optionally, the inner surface of the through hole is plated with a metal reflecting layer.
Optionally, the system further comprises a brightness adjusting unit for independently controlling brightness of the corresponding chip-scale packaged LED through a plurality of brightness adjusting channels, and each brightness adjusting channel is correspondingly connected to at least one chip-scale packaged LED.
Optionally, the brightness adjusting unit includes a sequential control circuit structure, and is configured to transmit a control signal for controlling brightness of the chip-scale packaged LED to the plurality of brightness adjusting channels at the same time.
Optionally, a diffusion plate is disposed on one side of the chip scale package LED away from the back plate.
Optionally, the back plate is made of an aluminum substrate.
Optionally, a plurality of cooling fins are arranged on the back plate, one ends of the cooling fins are fixedly connected to the back plate, and the other ends of the cooling fins extend and protrude in a direction away from the back plate.
Optionally, a fan is disposed on the back plate.
The utility model provides a display module assembly, including display panel and foretell backlight unit.
Optionally, the plurality of chip-scale packaged LEDs are divided into a plurality of chip-scale packaged LED groups, the backlight module further includes a brightness adjusting unit for independently controlling brightness of the corresponding chip-scale packaged LEDs through a plurality of brightness adjusting channels, each brightness adjusting channel is correspondingly connected to one chip-scale packaged LED group, the display panel includes a plurality of pixel units, and each chip-scale packaged LED group corresponds to at least one pixel unit on the display panel;
the display module comprises a pixel driving circuit structure and a control module, wherein the control module is electrically connected with the pixel driving circuit structure and the brightness adjusting unit respectively, and the control module is used for transmitting synchronous signals to the brightness adjusting unit and the pixel driving circuit structure so that image display on the display panel is synchronous with the brightness state display of the chip-scale packaged LED.
The utility model has the advantages that: the overall brightness of the backlight module is improved by adopting the chip scale packaged LED, and the light-emitting angle of light rays emitted by the chip scale packaged LED is converged to a preset range value by matching with the arrangement of the optical element, so that the high-brightness backlight module is more effectively realized.
Drawings
FIG. 1 shows a schematic diagram of a chip scale packaged LED;
FIG. 2 is a schematic view of a single chip scale package LED mated with a corresponding through hole of a portion of an optical element;
FIG. 3 is a schematic view showing a partial structure of an optical element;
FIG. 4 is a schematic diagram showing a mold split structure according to an embodiment of the present invention;
fig. 5 is a schematic diagram illustrating a regional dimming principle according to an embodiment of the present invention;
fig. 6 shows a schematic diagram of a back plate structure in an embodiment of the present invention.
Detailed Description
In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined below to clearly and completely describe the technical solution of the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived from the description of the embodiments of the present invention by a person skilled in the art, are within the scope of the present invention.
The current AR-HUD technology is larger in display range and farther in distance, the brightness of the display module cannot meet the requirement, postcard development is easy to occur in night display, and meanwhile, more severe requirements are provided for the heat dissipation aspect.
In view of the above technical problems, the present embodiment provides a backlight module, referring to fig. 2 to 4, including a back plate 30 and a plurality of chip scale package LEDs 1 disposed on the back plate 30, where fig. 1 shows a schematic structural diagram of the chip scale package LEDs;
and the optical element 10 covers at least one chip scale package LED 1 and is used for converging light emitted by the chip scale package LED so as to enable the light-emitting angle of the light emitted by the chip scale package LED to be within a preset range value.
The basic requirement of the AR-HUD backlight is directional collimation, and on the basis of the collimation, the light emitting direction is directed to a certain angle according to the requirement of the imaging system. Therefore, a large number of special designs are required in the design of LED type selection, arrangement and reflecting structure. The present embodiment adopts a CSP (Chip Scale Package, LED), and has the following advantages: the Light emitting area of the CSP LED is smaller than that of the traditional packaged LED, the CSP LED is closer to an ideal Light source, the size of the CSP LED is between that of a conventional LED and that of a Mini LED, more LEDs can be used in a limited Light bar (Light bar) space by adopting the CSP LED to improve the overall brightness, and the cost is greatly reduced compared with the implementation scheme of the Mini LED.
The CSP LED also has advantages in energy saving and heat dissipation, and further includes a circuit board (PCB) (, the CSP LED is electrically connected to the circuit board, the conventional LED package is in contact with the circuit board through a wire (gold wire, copper wire or silver wire), the circuit board is in contact with the external environment for heat dissipation, the CSP LED is in contact with the circuit board through a metal medium, the contact area with the circuit board is large, the heat dissipation is better, the CSP LED can work under higher driving current, and has higher reliability, it is to be noted that the CSP LED generally includes a chip 1, a fluorescent glue layer 2 wrapping the chip 1, and an electrode 3 disposed on one side of the chip 1 exposed on the fluorescent glue layer 2, as shown in fig. 1, the electrode 3 is a metal medium connected to the circuit board, the electrode 3 is in surface contact with the circuit board, compared with the conventional LED in line contact with the circuit board, the contact area is increased, namely the heat dissipation area is increased, and the heat dissipation performance is improved.
It should be noted that, in this embodiment, the number of the plurality of chip scale package LEDs is at least one, and in actual use, the number of the chip scale package LEDs may be set according to actual needs.
In this embodiment, the optical element 10 is further provided for converging light emitted by the chip scale packaged LEDs so that the light emitting angle of the light emitted by the chip scale packaged LEDs is within a preset range, and by utilizing the characteristics of small size, thinness and thinness of the chip scale packaged LEDs, more chip scale packaged LEDs can be arranged in a limited space, and by matching with the optical element 10, the light emitted by the chip scale packaged LEDs is converged so that the light emitted by the chip scale packaged LEDs is emitted in a concentrated manner, thereby more effectively improving the overall brightness of the backlight module.
The preset range value may be set according to actual needs, and in this embodiment, the preset range value is-10 degrees to +10 degrees, but is not limited thereto.
In this embodiment, as shown in fig. 2 and 3, the optical element 10 includes a substrate, a plurality of through holes 2 penetrating through the substrate in a thickness direction are formed in the substrate, each through hole 2 is sleeved outside each chip scale package LED 1, an inner surface 21 of each through hole 2 is a reflection surface, and the reflection surface is used for reflecting light emitted by the chip scale package LED 1 out of the corresponding through hole 2.
Even light and collimation's effect has been realized in optical element 10's setting, the light that chip level encapsulation LED sent passes through correspondingly behind the plane of reflection of through-hole 2, follow correspondingly through-hole 2 jets out, every corresponding every is located to 2 covers of through-hole chip level LED 1 outside, every the light that chip level LED 1 sent passes through correspondingly through-hole 2 behind the plane of reflection, in order to predetermine the angle outgoing, should predetermine the angle and be less than the angle of emergence of the light that chip level encapsulation LED 1 sent.
In this embodiment, the through hole 2 includes a first end 22 disposed far away from the chip scale package LED 1 and a second end 23 disposed close to the chip scale package LED 1, in order to enable all light emitted by the chip scale package LED 1 to be reflected by the reflection surface and then emitted, an area of a port of the second end 23 of the through hole 2 is slightly larger than an area of the chip scale package LED 1, theoretically, the second end 23 of the through hole 2 just contacts with a side edge of the chip scale package LED 1 to reduce the area of the second end 23 to the maximum extent, in actual use, a difference between the area of the port of the second end 23 of the through hole 2 and the area of the chip scale package LED 1 is a preset value, and the preset value is set to be a preset value to prevent the through hole and the chip scale package LED from interfering with each other.
The inner surface of the through hole 2 is a paraboloid, and the center of the light emitting surface of the chip scale package LED 1 is positioned on the straight line where the symmetry axis of the paraboloid is positioned.
The parabola rotates around the symmetry axis to form a paraboloid, and has the following characteristics: the light emitted from the focus is reflected to generate a light beam parallel to the symmetry axis, and this embodiment utilizes this characteristic to realize the effect of collimating the light emitted from the chip scale package LED 1.
According to the parabolic reflection principle, the chip scale package LED 1 is located at the focus of the paraboloid, in order to obtain a better collimation effect, the center of the light emitting surface of the chip scale package LED 1 is located at the focus of the paraboloid, in practical use, if the light emitted by the chip scale package LED is parallel light, two adjacent chip scale package LEDs generate a dark space, so that in order to enable the light emitting angle of the light emitted by the chip scale package LED 1 to be within a preset range value, the light emitting uniformity is realized, the center of the light emitting surface of the chip scale package LED can be out of the focus of the paraboloid, in a specific implementation mode of the embodiment, the luminous flux of a single chip scale package LED is 6lm, and the light emitting area is 0.76 x 0.76mm2The thickness is 0.32mm, in order to achieve the goal that the brightness uniformity of the light-emitting surface of the backlight module is more than 80%, the viewing angle is about +/-10 degrees, and the backlight brightness is 100 ten thousand nit, the uniformity of the overall viewing angle brightness is simulated through an optical system modeling software Lightools, a coordinate system is established by taking the direction parallel to the plane where the port of the through hole is located as an X axis and the direction perpendicular to the plane where the port of the through hole is located as a Y axis, and the equation of the parabola corresponding to the paraboloid is obtained by taking the Y axis as 0.25X2(the reflectivity of the reflecting surface of the through hole is set to be 100%), the focus of the parabola is (0,1mm), the vertex of the parabola is located at a position 1.5mm under a circuit board connected with the chip scale package LED 1, the chip scale package LED is located above the focus of the parabola, and the depth of the single through hole 2 is 2.1mm (but not limited to the above).
In this embodiment, in order to reduce the size of the dark area formed between two adjacent through holes 2 and effectively achieve the uniformity of the light output of the backlight module, the inner surfaces of the through holes are compound paraboloids formed by combining 4 identical paraboloids, and the openings at the two ends of each through hole 2 are both square, as shown in fig. 2.
In order to improve the reflectivity of the light emitted by the chip-scale LED 1 reflected by the reflecting surface and avoid light loss, in this embodiment, a metal reflecting layer is plated on the surface of the curved surface.
In a specific embodiment of this embodiment, the metal reflective layer is made of metal silver, but not limited thereto.
In order to solve the problem that the image generation unit PGU of the high-brightness backlight LCD is accompanied by the postcard effect at night, in this embodiment, the backlight module further includes a brightness adjustment unit that independently controls the brightness of the corresponding chip-scale packaged LED through a plurality of brightness adjustment channels, and each of the brightness adjustment channels is correspondingly connected to at least one chip-scale packaged LED.
By adopting the technical scheme, Local Dimming (namely multiple chip scale packaged LEDs) are independently controlled in groups according to a preset rule, so that high contrast can be realized through Local control of backlight, and L is solved0Gray scale light leakage problem, i.e. the backlight module corresponding to the display panel is positioned at L0The brightness of the gray scale display area is reduced, the reflection of a display screen at night is reduced, the postcard effect is eliminated, and the driving safety is improved.
It should be noted that, in this embodiment, the chip-scale packaged LEDs are adopted, and the characteristics of small size and thinness are utilized to greatly assist in the lightness and thinness of the backlight module set for local dimming and the optimization of the dimming partition of the backlight module (i.e., the backlight module is dimmed and partitioned by connecting at least one chip-scale packaged LED through a plurality of brightness adjusting channels).
In this embodiment, the brightness adjusting unit includes a sequential control circuit structure, and is configured to transmit a corresponding control signal for controlling the brightness of the chip-scale packaged LEDs to the plurality of brightness adjusting channels simultaneously, so as to achieve simultaneous control of the brightness of the plurality of chip-scale packaged LEDs, and transmit different or the same control signal including brightness information to each of the chip-scale packaged LEDs, for example, so that a part of the chip-scale packaged LEDs can be turned on simultaneously, and a part of the chip-scale packaged LEDs can be turned off simultaneously.
The brightness adjusting unit realizes independent control of at least one chip-scale packaged LED correspondingly connected with each brightness adjusting channel through a plurality of brightness adjusting channels, namely different or same control signals are transmitted through different brightness adjusting channels, but the control of the plurality of chip-scale packaged LEDs is synchronous, only the brightness of each chip-scale packaged LED is the same or different, specifically, the brightness adjusting unit can simultaneously transmit corresponding control signals to the plurality of brightness adjusting channels through the time sequence control circuit structure so as to realize synchronous control of the plurality of chip-scale packaged LEDs.
In this embodiment, as shown in fig. 4, a diffusion plate 40 is disposed on a side of the chip scale package LED away from the back plate 30.
The diffusion plate 40 has the function of improving the uniformity of light emitted by the backlight module, eliminates the lamp shadow effect and realizes backlight brightness uniformity of more than 80%.
In this embodiment, the back plate 30 is an aluminum substrate.
The aluminum substrate has a thermal conductivity of 236W/(m.K) and a good heat dissipation performance, and in the embodiment, the heat dissipation performance of the backlight module is improved by using the good heat dissipation performance of the aluminum substrate.
In this embodiment, as shown in fig. 6, a plurality of heat dissipation fins 301 are disposed on the back plate 30, one end of each heat dissipation fin 301 is fixedly connected to the back plate 30, and the other end of each heat dissipation fin 301 extends and protrudes away from the back plate 30.
By adopting the technical scheme, the heat dissipation area of the back plate 30 is enlarged, and the heat dissipation performance of the backlight module is further improved.
In a specific implementation manner of this embodiment, the heat sink 301 is a heat sink, the height of the heat sink in a direction perpendicular to the back plate 30 is 5mm, the length of the heat sink in a first direction is 1mm, and the width of the heat sink in a second direction is 0.6mm, where the first direction and the second direction are two mutually perpendicular directions parallel to the surface of the back plate 30, and the distance between two adjacent heat sinks is 0.5 mm.
In order to effectively realize heat dissipation, in this embodiment, the back plate 30 is provided with a fan 302.
In this embodiment, the active heat dissipation coefficient of the fan 302 may be 25W/(m)2DEG C.), but not limited thereto.
In a specific implementation manner of this embodiment, the back plate 30 is an aluminum substrate, and the aluminum substrate includes a first area and a second area, the heat dissipation fins are uniformly distributed on the first area, and the fan 302 is disposed on the second area, so that heat dissipation can be more effectively achieved, the maximum temperature of the thermal simulation of the LED can be 42.4 ℃, and the temperature requirement of the vehicle-mounted product can be met.
The back plate 30 is made of an aluminum substrate with good heat dissipation performance, and the fan 302 and the heat dissipation fins 301 are arranged on the aluminum substrate, so that the heat dissipation performance is enhanced, and the arrangement position of the fan 302 and the distribution density of the heat dissipation fins are specifically set according to the actual heat dissipation requirement, so as to meet different heat dissipation requirements of the backlight module.
It should be noted that the specific installation position of the fan 302, that is, the specific installation positions of the second area and the first area, may be set according to actual needs, for example, the overall heat of the backlight module is not uniform, and the fan 302 may be installed in an area with relatively high heat or an area with relatively low temperature requirement, so as to achieve the required heat dissipation standard.
The utility model provides a display module assembly, as shown in FIG. 4, including display panel 50 and foretell backlight unit.
Due to the arrangement of the chip-scale packaged LED 1, more LEDs can be used in a limited Light bar space to improve the overall brightness, the high-brightness backlight module is arranged, and the cost is greatly reduced compared with the implementation scheme of a Mini LED; and the setting of the backlight module of the regional dimming setting is facilitated; and the chip scale package LED 1 is connected with the circuit board 20 through the planar electrode, so that the contact area with the circuit board 20 is increased, and the heat dissipation performance is improved.
The optical element 10 cooperates with the chip scale package LED 1 to converge the light emitted by the chip scale package LED 1, so that the light-emitting angle is between-10 degrees and +10 degrees, the brightness of the backlight module is improved, and the directional collimation of the backlight module is facilitated.
Through setting up the brightness control unit, just the brightness control unit independently controls the luminance of corresponding at least one chip level encapsulation LED through a plurality of brightness control passageways, is about to at least one chip level encapsulation LED independent control of grouping promptly, also is exactly carrying out the subregion with backlight unit is whole, realizes regional dimming, realizes high contrast, solves L0Gray scale light leakage problem, i.e. the backlight module corresponding to the display panel is positioned at L0The brightness of the gray scale display area is reduced, the reflection of a display screen at night is reduced, the postcard effect is eliminated, and the driving safety is improved.
In this embodiment, the plurality of chip-scale packaged LEDs are divided into a plurality of chip-scale packaged LED groups, each chip-scale packaged LED group includes at least one chip-scale packaged LED, the backlight module further includes a brightness adjusting unit for independently controlling brightness of the corresponding chip-scale packaged LED through a plurality of brightness adjusting channels, each brightness adjusting channel is correspondingly connected to one chip-scale packaged LED group, the display panel includes a plurality of pixel units, and each chip-scale packaged LED group corresponds to at least one pixel unit on the display panel;
the display module comprises a pixel driving circuit structure and a control module, wherein the control module is electrically connected with the pixel driving circuit structure and the brightness adjusting unit respectively, and the control module is used for transmitting synchronous signals to the brightness adjusting unit and the pixel driving circuit structure so that image display on the display panel is synchronous with the brightness state display of the chip-scale packaged LED.
As shown in fig. 5, the timing control circuit structure includes driving parts connected to the plurality of brightness adjustment channels in a one-to-one correspondence manner, each driving part controls the chip-scale packaged LEDs connected to the brightness adjustment channels, the control module transmits a synchronization signal to the timing control circuit structure and the pixel driving circuit structure, a display area of the display panel is divided into a first area for displaying an image and a second area for not displaying an image, the chip-scale packaged LED lamps in the chip-scale packaged LED group corresponding to the first area are turned on (or in a high brightness state), and the chip-scale packaged LED lamps in the chip-scale packaged LED group corresponding to the second area are turned off (or in a low brightness state). Thereby realizing regional dimming and eliminating the postcard effect.
In one embodiment of this embodiment, the size of the effective display area on the display panel is 41.04 × 20.52mm2The size of the pixel unit thereon is 85.5 × 85.5 μm2. In this embodiment, a direct backlight is adopted, the number of the chip scale packaged LEDs is 200, and a single chip scale packaged LED is connected to one of the brightness adjusting channels, that is, the single chip scale packaged LED forms an independently controlled minimum dimming partition with a size of 2.052 × 2.052mm2The total dimming partition number of the whole backlight module is 20 × 10, and the number of the pixel units in the display area of the display panel corresponding to each dimming partition is 24 × 24.
The display device comprising the display module can be as follows: the display device comprises any product or component with a display function, such as a liquid crystal television, a liquid crystal display, a digital photo frame, a mobile phone, a tablet personal computer and the like, wherein the display device further comprises a flexible circuit board, a printed circuit board and a back plate.
The above is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should be considered as the protection scope of the present invention.
Claims (14)
1. A backlight module is characterized by comprising a back plate and a plurality of chip scale package LEDs arranged on the back plate;
and the optical element covers the outside of at least one chip scale package LED and is used for converging the light emitted by the chip scale package LED so as to enable the light-emitting angle of the light emitted by the chip scale package LED to be within a preset range value.
2. The backlight module as claimed in claim 1, wherein the optical element comprises a substrate, the substrate is provided with a plurality of through holes penetrating along a thickness direction of the substrate, each through hole is sleeved outside each chip scale package LED, an inner surface of each through hole is a reflective surface, and the reflective surface is used for reflecting light emitted by the chip scale package LED out of the corresponding through hole.
3. The backlight module as claimed in claim 2, wherein the inner surface of the through hole is a paraboloid, and the center of the light emitting surface of the chip scale package LED is located on a straight line of the symmetry axis of the paraboloid.
4. The backlight module according to claim 3, wherein a coordinate system is established with a direction parallel to a plane of the through hole and a direction perpendicular to the plane of the through hole as an X axis and a Y axis, and an equation of a parabola corresponding to the paraboloid is that Y is 0.25X2。
5. The backlight module as claimed in claim 2, wherein the inner surface of the through hole is a compound paraboloid formed by combining 4 identical paraboloids, and the openings at both ends of the through hole are square.
6. The backlight module as claimed in claim 2, wherein the inner surface of the through hole is plated with a metal reflective layer.
7. The backlight module as claimed in claim 1, further comprising a brightness adjusting unit for independently controlling brightness of the corresponding chip scale packaged LEDs through a plurality of brightness adjusting channels, each of the brightness adjusting channels being connected to at least one of the chip scale packaged LEDs.
8. The backlight module as claimed in claim 7, wherein the brightness adjustment unit comprises a timing control circuit structure for simultaneously transmitting control signals for controlling the brightness of the chip scale package LEDs to the plurality of brightness adjustment channels.
9. The backlight module as claimed in claim 1, wherein a diffusion plate is disposed on a side of the chip scale packaged LEDs away from the back plate.
10. The backlight module as claimed in claim 1, wherein the back plate is made of aluminum substrate.
11. The backlight module as claimed in claim 1, wherein the back plate has a plurality of heat dissipation fins, one end of the heat dissipation fins is fixedly connected to the back plate, and the other end of the heat dissipation fins extends and protrudes away from the back plate.
12. The backlight module as claimed in claim 1, wherein a fan is disposed on the back plate.
13. A display module comprising a display panel and the backlight module of any one of claims 1-12.
14. The display module of claim 13, wherein the plurality of chip scale packaged LEDs are divided into a plurality of chip scale packaged LED groups, the backlight module further comprises a brightness adjusting unit for independently controlling the brightness of the corresponding chip scale packaged LEDs through a plurality of brightness adjusting channels, each of the brightness adjusting channels is correspondingly connected to one of the chip scale packaged LED groups, the display panel comprises a plurality of pixel units, and each of the chip scale packaged LED groups corresponds to at least one of the pixel units on the display panel;
the display module comprises a pixel driving circuit structure and a control module, wherein the control module is electrically connected with the pixel driving circuit structure and the brightness adjusting unit respectively, and the control module is used for transmitting synchronous signals to the brightness adjusting unit and the pixel driving circuit structure so that image display on the display panel is synchronous with the brightness state display of the chip-scale packaged LED.
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| CN113990264A (en) * | 2021-10-28 | 2022-01-28 | 深圳创维－Rgb电子有限公司 | Power protection method and system for backlight drive, display device and storage medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113990264A (en) * | 2021-10-28 | 2022-01-28 | 深圳创维－Rgb电子有限公司 | Power protection method and system for backlight drive, display device and storage medium |
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