CN111525227A - Customer premises equipment - Google Patents

Customer premises equipment Download PDF

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Publication number
CN111525227A
CN111525227A CN202010491371.XA CN202010491371A CN111525227A CN 111525227 A CN111525227 A CN 111525227A CN 202010491371 A CN202010491371 A CN 202010491371A CN 111525227 A CN111525227 A CN 111525227A
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CN
China
Prior art keywords
radiator
heat sink
customer premises
circuit board
radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010491371.XA
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Chinese (zh)
Other versions
CN111525227B (en
Inventor
揭骏仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN202210265857.0A priority Critical patent/CN114498005B/en
Priority to CN202010491371.XA priority patent/CN111525227B/en
Publication of CN111525227A publication Critical patent/CN111525227A/en
Priority to PCT/CN2021/087413 priority patent/WO2021244153A1/en
Application granted granted Critical
Publication of CN111525227B publication Critical patent/CN111525227B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/02Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

Abstract

The embodiment of the application provides a client front-end device, which comprises a radiator, wherein the radiator comprises a metal substrate and a plurality of radiating fins, and the plurality of radiating fins are arranged on the substrate at intervals; and the radiator is electrically connected with the radiating fin and is used for radiating radio frequency signals together with the radiating fin. Because the radiator is the radiator of antenna, through multiplexing as a part of antenna with the fin, can shorten the length of radiator to can realize the design of miniaturized antenna, save the required space of extra setting antenna, and then, can reduce the volume of customer premises equipment on the basis of satisfying customer premises equipment's communication performance.

Description

Customer premises equipment
Technical Field
The application relates to the technical field of electronics, in particular to customer premises equipment.
Background
A CPE (Customer Premise Equipment) is a mobile signal access device that receives a mobile signal and forwards the mobile signal by using a wireless WIFI signal, and is also a device that converts a high-speed 4G or 5G signal into a WIFI signal, and the number of mobile terminals capable of accessing the internet at the same time is also large. The CPE can be widely applied to wireless network access in rural areas, towns, hospitals, units, factories, cells and the like, and the cost for laying a wire network can be saved.
When the distance is relatively long or there are many obstacles, signal blind spots are likely to occur in the coverage of the base station signal. In these blind spot corners, the terminal device, such as a smartphone, cannot receive the base station signal. The CPE can relay the base station signals for the second time, and the base station signals are changed into Wi-Fi signals to be provided for the equipment nearby. Compared with terminal equipment such as a smart phone and a notebook computer, the CPE antenna has stronger gain and higher power, and the signal transceiving capacity of the CPE antenna is stronger than that of the smart phone. So, there are places where the smartphone has no signal and the CPE may have a signal. The CPE can change network signals of an operator into Wi-Fi signals, and more devices such as a smart phone, an ipad and a notebook computer can surf the internet by means of the CPE.
The CPE has a limited internal space and there is often a certain requirement on the volume of the CPE in order to improve its portability. However, the volume of the CPE is limited, which affects the space for installing the antenna inside the CPE, thereby affecting the performance of the CPE.
Disclosure of Invention
The embodiment of the application provides a customer premises equipment, can reduce the occupation space of antenna at customer premises equipment to and reduce the volume of customer premises equipment.
The embodiment of the application discloses customer premises equipment includes:
the radiator comprises a metal substrate and a plurality of radiating fins, and the radiating fins are arranged on the substrate at intervals; and
the radiator is electrically connected with the radiating fin and is used for radiating radio frequency signals together with the radiating fin.
In the embodiment of the application, the radiator is used as the radiator of the antenna, and the radiator is multiplexed as a part of the antenna, so that the length of the extra radiator can be shortened, the design of a miniaturized antenna can be realized, the space required by the extra radiator of the antenna can be saved, and further, the size of the customer premises equipment can be reduced on the basis of meeting the communication performance of the customer premises equipment.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic structural diagram of a client front-end device according to an embodiment of the present application.
Fig. 2 is a schematic view of a first structure of a radiator, a circuit board, and a radiator in a customer premises equipment according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a heat sink and a circuit board in a customer premises equipment according to an embodiment of the present application.
Fig. 4 is an exploded view of the circuit board and the heat sink shown in fig. 3.
Fig. 5 is a schematic diagram of a second structure in which a radiator, a circuit board, and a radiator in a customer premises equipment according to an embodiment of the present application are matched.
Fig. 6 is a schematic structural diagram of a metal component and a connecting component in a customer premises equipment according to an embodiment of the present application.
Fig. 7 is a schematic structural diagram of the radiator in fig. 5.
Fig. 8 is a schematic view of a third structure of the front-end client device in which a radiator, a circuit board, and a radiator are engaged according to the embodiment of the present application.
Fig. 9 is a schematic diagram of a fourth structure in which a radiator, a circuit board, and a radiator in a customer premises equipment according to an embodiment of the present application are matched.
Fig. 10 is a schematic diagram of a fifth structure of a radiator, a circuit board, and a radiator in a customer premises equipment according to an embodiment of the present application.
Fig. 11 is a schematic diagram of a sixth structure in which a radiator, a circuit board, and a radiator in a customer premises equipment are matched according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
An embodiment of the present application provides a client front-end device, please refer to fig. 1 and fig. 2, where fig. 1 is a schematic structural diagram of the client front-end device provided in the embodiment of the present application, and fig. 2 is a first schematic structural diagram of a radiator, a circuit board, and a radiator in the client front-end device provided in the embodiment of the present application; the client front-end device 100 includes: the heat sink includes a case 10, a heat sink 20, a circuit board 30, and a radiator 40, wherein the heat sink 20, the circuit board 30, and the radiator 40 are disposed in the case 10.
The housing 10 includes a first surface 11 and a second surface 12 disposed opposite to each other, wherein the area of the second surface 12 is larger than the area of the first surface 11, and when the second surface 12 of the housing 10 is fixed to a supporting object, the contact area between the housing 10 and the supporting object can be increased, which is helpful to improve the stability of the fixing of the housing 10 and the supporting object.
The housing 10 may be made of a non-metal material, such as glass, plastic, etc., and since the housing 10 is made of the non-metal material, the performance of the antenna inside the housing 10 is not affected.
The shape of the housing 10 may be a circular truncated cone, and the shape of the housing 10 may also be a square or a cylinder, and the shape of the housing 10 is not limited in the embodiments of the present application.
As shown in fig. 2, the heat sink 20 is disposed on the circuit board 30, and the heat sink 20 abuts against the circuit board 30 to dissipate heat generated by the circuit board 30 of the customer premises equipment 100.
The heat sink 20 may be connected to the circuit board 30 by screws, and the heat sink 20 may also be connected to the circuit board 30 by clamping, adhering, and the like, and the connection manner between the heat sink 20 and the circuit board 30 is not limited in the embodiments of the present application.
The heat sink 20 is made of metal material, such as copper, silver, aluminum, etc., and the heat sink 20 is made of metal material, on one hand, the heat conductivity coefficient of the metal material is high, so that the heat dissipation function of the heat sink 20 can be improved; on the other hand, the metallic heat sink 20 may be multiplexed as a part of the antenna, and may radiate a radio frequency signal. The embodiment of the application adopts the metal aluminum, so that the weight of the radiator 20 can be reduced, and a good radiating effect can be achieved.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a heat sink and a circuit board according to an embodiment of the present disclosure. The heat sink 20 includes a base plate 21 and a plurality of fins 22, and the plurality of fins 22 are provided on the base plate 21 at intervals.
The plurality of heat sinks 22 may be disposed at intervals on the same side of the substrate 21, or may be disposed at intervals on different sides of the substrate 21. When the plurality of heat sinks 22 are disposed at intervals on the same side of the substrate 21, the side of the substrate 21 not provided with the heat sinks 22 is in contact with the circuit board 30. The heat of the circuit board 30 can be transferred to the base plate 21, and the base plate 21 can transfer the heat to the plurality of heat sinks 22, so that the purpose of heat dissipation can be achieved by the plurality of heat sinks 22.
It can be understood that, when the plurality of heat sinks 22 are disposed on different sides of the substrate 21 at intervals, the circuit board 30 can be electrically connected to the heat sink 22 on one side of the substrate 21, so that the circuit board 30 can directly transfer the generated heat to the plurality of heat sinks 22 connected to the circuit board 30, and the plurality of heat sinks 22 connected to the circuit board 30 can sequentially transfer the heat to the substrate 21 and the heat sink 22 on the side far from the circuit board 30, thereby achieving the purpose of heat dissipation.
When the plurality of heat sinks 22 are disposed at different intervals on different sides of the substrate 21, the lengths of the heat sinks 22 on two sides of the substrate 21 may be the same or different, for example, the length of the heat sink 22 close to the circuit board 30 is smaller than the length of the heat sink 22 away from the circuit board 30.
The substrate 21 and the heat sink 22 are both made of a metal material, for example, metal copper, metal silver, metal aluminum, or the like.
Referring to fig. 4, fig. 4 is an exploded view of the heat sink and the circuit board shown in fig. 3. The surface of the substrate 21 facing the circuit board 30 is provided with a plurality of bumps 211, the bumps 211 are arranged on the substrate 21 at intervals, the substrate 21 is abutted against the circuit board 30 through the bumps 211, so that a gap can be formed between the substrate 21 and the circuit board 30, the circuit board 30 can dissipate heat through the heat sink 20, and the heat of the circuit board 30 can also be dissipated through the gap, so that the heat dissipation effect of the circuit board 30 can be improved.
Furthermore, the substrate 21 abuts against the circuit board 30 through the bumps 211, so that the contact area between the substrate 21 and the circuit board 30 can be reduced, the clearance area of the circuit board 30 can be increased, and the space required for arranging electronic components is increased.
The bump 211 may be integrally formed with the substrate 21, and the bump 211 may also be connected to the substrate 21 by means of clamping, welding, or screws, and the fixing manner of the bump 211 and the substrate 21 is not limited in this embodiment, and other manners that can realize the connection of the bump 211 and the substrate 21 are all within the protection scope of this embodiment.
Referring to fig. 3 and 4 again, the plurality of heat dissipation fins 22 may be in a strip structure, and the heat dissipation fins 22 may also be in a plate structure. The height of each fin 22 may be the same or different. For example, the number of the fins 22 may be 9, the two fins 22 located at the outermost sides of all the fins 22 are arranged at the same height, the height of two fins 22 adjacent to the outermost two fins 22 among all the fins 22 is greater than the height of the outermost fins 22, the remaining five fins 22 are located at the middle positions of all the fins 22, the five fins 22 are arranged at the same height, and the five fins 22 may be defined as a middle fin group, and the height of the middle fin group is greater than the height of two fins 22 adjacent to the middle fin group.
It will be appreciated that the length of each fin 22 may be the same or different, such as the outermost two fins 22 having a length less than the length of the remaining fins 22.
It will be appreciated that at least one fin 22 is in the same row, for example two fins 22 are in the same row, and that the two fins 22 are spaced apart.
The plurality of heat sinks 22 are parallel to each other, for example, each heat sink 22 has the same angle with the substrate 21, which may be greater than 0 degree and less than 180 degrees, and in the embodiment of the present invention, each heat sink 22 is perpendicular to the substrate 21, so that the occupied space of the plurality of heat sinks 22 can be reduced, which is beneficial to reducing the volume of the customer premises equipment 100.
As shown in fig. 4, the circuit board 30 may be a flexible circuit board, the circuit board 30 is a motherboard of the customer premises equipment 100, and electronic components such as a radio frequency module, a control circuit, and the like are disposed on the circuit board 30, for example, a ground point 31 and a feed point 32 are disposed on the circuit board 30, the ground point 31 is used for being electrically connected to the radiator 40 to achieve grounding of the radiator 40, and the feed point 32 is used for being electrically connected to the radiator 40 to achieve feeding of the radio frequency module of the circuit board 30 to the radiator 40 to achieve transmission of different radio frequency signals, for example, transmission of 4G radio frequency signals, 5G radio frequency signals.
Referring to fig. 5 and fig. 6, fig. 5 is a second structural diagram of a radiator, a circuit board and a radiator in a customer premises equipment according to an embodiment of the present disclosure, and fig. 6 is a structural diagram of a metal component and a connecting component in the customer premises equipment according to an embodiment of the present disclosure. The radiator 40 is disposed on the heat sink 20, the radiator 40 is electrically connected to the heat sink 22, and the radiator 40 and the heat sink 22 are used together for radiating a radio frequency signal, wherein the radiator 40 is used as a radiator of an antenna, and the length of the radiator 40 additionally disposed can be shortened by multiplexing the heat sink 22 as a part of the antenna, so that a design of a small antenna can be implemented, a space required by additionally disposing the antenna is saved, and further, the size of the customer premises equipment can be reduced on the basis of meeting the communication performance of the customer premises equipment.
The radiator 40 is disposed on the heat sink 22, that is, the radiator 40 is electrically connected to one heat sink 22, and the radiator 40 is connected to one end of the heat sink 22 away from the substrate 21, so that the radiator 40 is located above the heat sink 22, which can increase the distance between the radiator 40 and the circuit board 30, reduce the influence of the electronic components of the circuit board 30 on the radiator 40, and help to improve the communication performance of the customer premises equipment 100.
It can be understood that the radiator 40 may also be electrically connected to two adjacent heat dissipation fins 22, and the two adjacent heat dissipation fins 22 of the heat sink 20 are both used as a part of the radiator 40, so as to further shorten the size of the additionally disposed radiator 40, further, the design of the small antenna may be implemented, and the space occupied by the additionally disposed antenna in the customer premises equipment 100 may be further reduced, which is beneficial to reducing the volume of the customer premises equipment 100.
When two adjacent heat sinks 22 are used as a part of the radiator 40, the radiator 40 may be disposed at an end of the heat sink 22 away from the substrate, and two ends of the radiator 40 are respectively connected to one heat sink 22. The radiator 40 is disposed between two adjacent radiating fins 22, so that not only the occupied space of the radiator 40 can be saved, but also the influence of the radiating fins 22 on the radiator 40 can be avoided, and the antenna performance can be improved.
It is understood that, in order to facilitate the connection of the radiator 40 and the heat sink 22, the customer premises equipment 100 further includes a metal member 50, and the radiator 40 is connected to the heat sink 22 through the metal member 50. The metal piece 50 may be a metal strip or a metal sheet. The metal member 50 is disposed to prevent the radiator 40 from being damaged, and the metal member 50 may also function to increase the length of the antenna, thereby reducing the length of the radiator 40 additionally disposed.
One end of the metal member 50 is welded to the radiator 40, and the other end of the metal member 50 is fixed to the heat sink 22 by a screw. It is understood that the metal element 50 may also be connected to the heat sink 22 by clamping, welding, etc., and the connection manner of the metal element 50 to the heat sink 22 and the radiator 40 is not limited in the embodiments of the present application.
It is understood that, for better fixing the metal member 50, the customer premises equipment 100 further includes a connector 60, one end of the connector 60 is connected with the metal member 50, and the other end of the connector 60 is connected with the heat sink 22.
As shown in fig. 6, the connecting member 60 includes a first portion 61, a second portion 62 and a third portion 63, one end of the second portion 62 is connected to the first portion 61, the other end is connected to the third portion 63, a first included angle is formed between the first portion 61 and the second portion 62, a second included angle is formed between the second portion 62 and the third portion 63, wherein the first included angle is greater than or equal to 90 degrees and smaller than 180 degrees, and the second included angle is greater than 0 degree and smaller than or equal to 90 degrees.
In the embodiment of the present application, it is preferable that the first included angle is 120 degrees and the second included angle is 90 degrees, and since the radiator 40 is connected to the heat sink 22 through the first portion 61, the second portion 62 and the third portion 63 of the connector 60, the length of the antenna can be increased, the length of the radiator 40 additionally disposed can be further shortened, and the space required for additionally disposing the radiator 40 is saved. Moreover, since the connecting member 60 is not in the shape of a straight bar, the connecting member 60 can be compactly arranged, so that the occupied space of the connecting member 60 can be saved, and the volume of the customer premises equipment 100 can be further reduced.
Wherein, the end of the first part 61 far away from the second part 62 is connected with the metal piece 50, and the end of the third part 63 far away from the second part 62 is connected with the heat sink 22. The second portion 62 is perpendicular to the substrate 21, and one end of the second portion 62 away from the third portion 63 protrudes from all the heat sinks 22, so that the radiator 40 is located above all the heat sinks 22, the distance between the radiator 40 and the circuit board 30 can be further increased, and thus, the interference of electronic components on the circuit board 30 to the radiator 40 can be further reduced.
Third portion 63 of connector 60 is provided with mounting holes 631, and mounting holes 631 are configured to cooperate with positioning holes of heat sink 22, described below, to fixedly couple third portion 63 of connector 60 to heat sink 22.
The mounting holes 631 may be threaded holes, and the third portion 63 of the connecting element 60 may be matched with the mounting holes 631 by screws, so as to fixedly connect the connecting element 60 to the heat sink 22.
The metal piece 50 may be fixed to the first portion 61 by welding, and it can be understood that the metal piece 50 may also be fixed to the first portion 61 by screws, clamping, and the like, and the fixing manner of the metal piece 50 and the first portion 61 is not limited in the embodiments of the present application.
The third portion 63 of the connecting member 60 is fixed to the heat sink 22 by screws, and it can be understood that the third portion 63 of the connecting member 60 can also be fixed to the heat sink 22 by welding, clamping, and the like, and the fixing manner of the connecting member 60 and the third portion 63 is not limited in the embodiments of the present application.
The connecting member 60 is made of a metal material, such as copper, silver, or aluminum.
As shown in fig. 5, it can be understood that, for better fixing the radiator 40, the heat sink 22 is further provided with a fixing portion 221, and the fixing portion 221 protrudes from an end portion of the heat sink 22 far from the substrate 21, wherein the fixing portion 221 is provided with a positioning hole (not shown), and the positioning hole (not shown) is matched with the mounting hole 631, so that the third portion 63 of the connector 60 can be firmly fixed to the end portion of the heat sink 22, and thus, the radiator 40 can be firmly fixed to the heat sink 22.
Referring to fig. 7, fig. 7 is a schematic structural diagram of the radiator in fig. 5; the radiator 40 comprises a first radiation element 41 and a second radiation element 42, the second radiation element 42 being arranged opposite to the first radiation element 41, wherein the heat sink 22 can be connected to the first radiation element 41 or the second radiation element 42.
The radiator 40 includes a ground terminal 43 and a feeding terminal 44, the ground terminal 43 is electrically connected to the ground point 31 of the circuit board 30 to achieve grounding of the radiator 40, and the feeding terminal 44 is electrically connected to the feeding point 32 of the circuit board 30 to achieve feeding of the circuit board 30 to the radiator 40.
The ground terminal 43 of the radiator 40 can be disposed on the first radiating element 41 or the second radiating element 42. For example, the ground terminal 43 may be disposed on the first radiating element 41 of the radiator 40, the feeding terminal 44 may be disposed on the second radiating element 42 of the radiator 40, the ground terminal 43 may be electrically connected to the ground point 31 of the circuit board 30 through a cable, and the feeding terminal 44 may also be electrically connected to the feeding point 32 of the circuit board 30 through a cable.
The first radiating element 41 can be connected to the heat sink 22 through the metal element 50, and it can be understood that the second radiating element 42 can also be connected to the heat sink 22 through the metal element 50.
Referring to fig. 8, fig. 8 is a schematic diagram illustrating a third structure of a radiator, a circuit board, and a radiator of a customer premises equipment according to an embodiment of the present application. The customer premises equipment 100 may include one radiator 40, or may include two radiators 40, where the two radiators 40 are, for example, a first radiator 40a and a second radiator 40b, the first radiator 40a and the second radiator 40b are respectively disposed on the two outermost fins 22 of the heat sink 20, and the first radiator 40a and the second radiator 40b may be disposed opposite to each other, or may not be disposed opposite to each other, for example, the first radiator 40a is disposed at the left end of the heat sink 20, the second radiator 40b is disposed at the right end of the heat sink 20, or both the first radiator 40a and the second radiator 40b are disposed at the left end or the right end of the heat sink 20.
One or two heat sinks 20 may be provided.
Referring to fig. 9, fig. 9 is a schematic diagram illustrating a fourth structure of a radiator, a circuit board, and a radiator of a customer premises equipment according to an embodiment of the present application. The heat sinks 20 are two, such as a first heat sink 20a and a second heat sink 20b, and the first heat sink 20a and the second heat sink 20b are respectively disposed on different sides of the circuit board 30 of the customer premises equipment. That is, the first heat sink 20a is disposed on one surface of the circuit board 30, and the second heat sink 20b is disposed on the other surface of the circuit board 30. The first and second heat sinks 20a and 20b may be disposed with respect to the circuit board 30, such as the first and second heat sinks 20a and 20b being symmetrically disposed with respect to the circuit board 30. The first heat sink 20a includes a first substrate 21a and a plurality of first heat dissipation fins 22a, the plurality of first heat dissipation fins 22a are disposed at intervals on the first substrate 21a, the second heat sink 20b includes a second substrate 21b and a plurality of second heat dissipation fins 22b, and the plurality of second heat dissipation fins 22b are disposed at intervals on the second substrate 21 b.
It can be understood that, the circuit board 30 is generally provided with circuit structures on both sides, and in the embodiment of the present application, the heat sinks 20 are provided on both sides of the circuit board 30, and the two heat sinks 20 can be respectively abutted to the two opposite surfaces of the circuit board 30, so that the purpose of heat dissipation can be achieved from the two surfaces of the circuit board 30, and the heat dissipation efficiency can be improved.
When the number of radiators 40 is two, such as the first radiator 40a and the second radiator 40b, the first radiator 40a and the second radiator 40b may be disposed on the same heat sink 20, i.e., two radiators 40 may be disposed on the first heat sink 20a or the second heat sink 20 b. The first radiator 40a and the second radiator 40b may be both disposed on the outermost heat sink 22.
The first radiator 40a and the second radiator 40b may be disposed oppositely, and certainly, the first radiator 40a and the second radiator 40b may not be disposed oppositely, for example, both the first radiator 40a and the second radiator 40b may be disposed at the left end of the first heat sink 20a or the second heat sink 20b, the first radiator 40a and the second radiator 40b may be disposed at the right end of the first heat sink 20a or the second heat sink 20b, or both the first radiator 40a and the second radiator 40b may be disposed at the middle of the first heat sink 20a or the second heat sink 20 b; alternatively, the first radiator 40a is disposed at the left end of the first heat sink 20a, and the second radiator 40b is disposed at the right end of the second heat sink 20 b.
Referring to fig. 10, fig. 10 is a schematic diagram illustrating a fifth structure of a radiator, a circuit board, and a radiator of a customer premises equipment according to an embodiment of the present application. It is understood that the two radiators 40 may also be disposed on different heat sinks 20, such as a first radiator 40a disposed on the first heat sink 20a and a second radiator 40b disposed on the second heat sink 20 b.
The two radiators 40 may be symmetrically disposed with respect to the circuit board 30, for example, the first radiator 40a may be disposed at the left end of the first heat sink 20a, and the second radiator 40b may be disposed at the left end of the second heat sink 20b, or the first radiator 40a may be disposed at the right end of the first heat sink 20a, and the second radiator 40b may be disposed at the right end of the second heat sink 20 b.
It is understood that the two radiators 40 may be asymmetrically disposed with respect to the circuit board 30, for example, the first radiator 40a is disposed at the left end of the first heat sink 20a, and the second radiator 40b is disposed at the right end of the second heat sink 20b, so that the isolation between the two radiators 40 can be improved, the interference between the antennas can be reduced, and the antenna performance can be improved.
Referring to fig. 11, fig. 11 is a schematic diagram illustrating a sixth structure of a radiator, a circuit board, and a radiator of a customer premises equipment according to an embodiment of the present application. Such as four radiators 40, four radiators 40 may be disposed on two heat sinks 20, wherein two radiators 40 are disposed on the same heat sink 20 and two radiators 40 are disposed on the other heat sink 20.
The four radiators 40 may be defined as a first radiator 40a, a second radiator 40b, a third radiator 40c and a fourth radiator 40d, wherein the first radiator 40a and the second radiator 40b may be located at both sides of the first heat sink 20a, and the third radiator 40b and the fourth radiator 40d may be located at both sides of the second heat sink 20 b. The first radiator 40a and the second radiator 40b may be located at the same end position of the first heat sink 20a, and the third radiator 40c and the fourth radiator 40d may be located at the same end position of the second heat sink 20 b. The two radiators 40 on the first heat sink 20a and the two radiators 40 on the second heat sink 20b may be symmetrically disposed with respect to the circuit board 30. Such as the first radiator 40a and the third radiator 40c are symmetrically disposed with respect to the circuit board 30, and the second radiator 40b and the fourth radiator 40d are symmetrically disposed with respect to the circuit board 30.
In the embodiment of the present application, the heat dissipation fins 22 of the heat sink 20 are directly reused as a part of the antenna, so that the size of the additional radiator 40 can be reduced, and the length of the radiator 40 can be one quarter of the wavelength of the radio frequency signal, for example, the length of the radiator 40 is less than 108 mm. Therefore, under the condition that the basic performance of the antenna is not large, the size of the radiating body 40 can be greatly reduced, the overall size of the customer front equipment is reduced, the isolation degree between the radiating bodies 40 can be improved, or more radiating bodies can be placed, and the radiation performance of the antenna is further improved.
The client front-end device provided by the embodiment of the present application is described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (10)

1. A client premises apparatus, comprising:
the radiator comprises a metal substrate and a plurality of radiating fins, and the radiating fins are arranged on the substrate at intervals; and
the radiator is electrically connected with the radiating fin and is used for radiating radio frequency signals together with the radiating fin.
2. The customer premises apparatus of claim 1, wherein the radiator comprises:
a first radiating array; and
the second radiation array is arranged opposite to the first radiation array; wherein the heat sink is electrically connected with the first radiating element or the second radiating element.
3. The customer premises equipment of claim 2, wherein the radiator further comprises a ground, the ground disposed at the first radiating element or the second radiating element.
4. The customer premises equipment of claim 3, wherein the radiator further comprises a feed terminal, the ground terminal is disposed at the first radiating array, and the feed terminal is disposed at the second radiating array.
5. The customer premises apparatus of claim 4, further comprising:
the circuit board is provided with a grounding point and a feeding point, the grounding point is electrically connected with the grounding end, and the feeding point is electrically connected with the feeding end.
6. The customer premises apparatus of claim 5, wherein the circuit board is coupled to the base plate, and the circuit board and the heat sink are disposed on different sides of the base plate.
7. The customer premises apparatus of claim 2, further comprising:
and the first radiating array or the second radiating array is electrically connected with the radiating fin through the metal piece.
8. The customer premises apparatus of claim 7, wherein said heat sink is provided with a securing portion protruding beyond an end of said heat sink remote from said base plate, said metallic member being connected to said securing portion.
9. The customer premises equipment of any one of claims 1-8, wherein the customer premises equipment comprises two radiators, and wherein one of the radiators is electrically connected to each of the outermost two fins of the radiator.
10. The customer premises apparatus of any of claims 5-8, wherein the heat sink comprises a first heat sink and a second heat sink, the first heat sink and the second heat sink being disposed on different sides of the circuit board, respectively; the first radiator and the second radiator are both provided with at least one radiator.
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