CN209608932U - Heat dissipation for circuit board device and electronic device - Google Patents

Heat dissipation for circuit board device and electronic device Download PDF

Info

Publication number
CN209608932U
CN209608932U CN201821906888.5U CN201821906888U CN209608932U CN 209608932 U CN209608932 U CN 209608932U CN 201821906888 U CN201821906888 U CN 201821906888U CN 209608932 U CN209608932 U CN 209608932U
Authority
CN
China
Prior art keywords
circuit board
heat dissipation
plate
plate face
board device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201821906888.5U
Other languages
Chinese (zh)
Inventor
张国琛
张瑞臻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing DAHAO industrial sewing Intelligent Control Technology Co., Ltd
Zhuji Xingdahao Science & Technology Development Co., Ltd.
Beijing Dahao Technology Co Ltd
Original Assignee
BEIJING XINGDAHAO INFORMATION TECHNOLOGY Co Ltd
Zhuji Xingdahao Science & Technology Development Co Ltd
Beijing Dahao Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BEIJING XINGDAHAO INFORMATION TECHNOLOGY Co Ltd, Zhuji Xingdahao Science & Technology Development Co Ltd, Beijing Dahao Technology Co Ltd filed Critical BEIJING XINGDAHAO INFORMATION TECHNOLOGY Co Ltd
Priority to CN201821906888.5U priority Critical patent/CN209608932U/en
Application granted granted Critical
Publication of CN209608932U publication Critical patent/CN209608932U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model provides a kind of heat dissipation for circuit board device and electronic device, for for heat dissipation for circuit board, including plate-like body, at least one avoid holes is provided in plate-like body, plate-like body has opposite the first plate face and the second plate face, when heat dissipation for circuit board device is arranged on circuit boards, the first plate face is bonded the plate face of circuit board, and the electronic component on circuit board passes through avoid holes.The utility model can be improved the compactness between heat dissipation for circuit board device and circuit board, to increase the heat dissipation effect to circuit board, guarantee the normal work of circuit board and electronic device.

Description

Heat dissipation for circuit board device and electronic device
Technical field
The utility model relates to field of home appliance technology more particularly to a kind of heat dissipation for circuit board devices and electronic device.
Background technique
Currently, the performance of electronic circuit is increasingly promoted with the high speed development of electronic semi-conductor.The power consumption of electronic circuit and Heating problem also highlights therewith, and maintenance electronics generates the important foundation of normal operation when the heat dissipation of electronic circuit.
For the normal work for guaranteeing circuit board, traditional solution is to install various patterns and size on circuit boards Radiator, in electronic device functions, for shifting and distributing heat caused by the electronic component on circuit board.Radiator Usually there is the radiating surface of setting on circuit boards, radiating surface is fitted in the plate face of circuit board, utilizes heat transfer and/or hot spoke The mode penetrated is transferred to what the heat on circuit board can be measured to the greatest extent on radiator, to reduce the operating temperature of circuit board itself.
However there are many electronic components, radiator can not fit closely circuit board, cause to dissipate for setting on existing circuit board The heat dissipation effect of hot device is poor.
Utility model content
In order to solve the problems, such as at least one mentioned in background technique, the utility model provide a kind of heat dissipation for circuit board device and Electronic device can be improved the compactness between heat dissipation for circuit board device and circuit board, thus increase the heat dissipation effect to circuit board, Guarantee the normal work of circuit board and electronic device.
To achieve the goals above, on the one hand, the utility model provides a kind of heat dissipation for circuit board device, for dissipating for circuit board Heat, which includes plate-like body, at least one avoid holes, the plate-like body are provided in the plate-like body With opposite the first plate face and the second plate face, when the heat dissipation for circuit board device is arranged on the circuit board, described first Plate face is bonded the plate face of the circuit board, and the electronic component on the circuit board passes through the avoid holes.
In above-mentioned heat dissipation for circuit board device, optionally, cooling fan can be set in second plate face, described Two plate faces are provided with multiple radiating fins, air-out direction of multiple radiating fin air inlets towards the cooling fan, phase Heat dissipation channel is formed between the adjacent radiating fin.
In above-mentioned heat dissipation for circuit board device, optionally, the center of second plate face is arranged in the cooling fan Position, the radiating fin are disposed around the periphery of the cooling fan.
In above-mentioned heat dissipation for circuit board device, optionally, multiple radiating fins are arranged in parallel;
Or, multiple radiating fins are disposed around the periphery of the cooling fan, and multiple radiating fins are described in The spaced radial of cooling fan is arranged.
In above-mentioned heat dissipation for circuit board device, optionally, multiple spaced peaces are provided in second plate face Dress protrusion, the installation protrusion are located at the cooling fan in the view field of second plate face, the installation protrusion End extends towards the cooling fan, and is connected to the cooling fan close to the surface of second one side of the board.
In above-mentioned heat dissipation for circuit board device, optionally, the end of the radiating fin is directed away from second plate The direction in face extends, and the end of the radiating fin is higher than or is flush to the cooling fan far from second one side of the board Surface.
In above-mentioned heat dissipation for circuit board device, optionally, installation supporting plate, institute are provided on the lateral margin of the plate-like body The middle part for stating installation supporting plate is connect with the lateral margin of the plate-like body, and the both ends of the installation supporting plate are respectively facing first plate Face and second plate face extend;
When the heat dissipation for circuit board device is arranged on the circuit board, the plate face of the installation supporting plate is connected to the electricity The lateral margin of road plate.
In above-mentioned heat dissipation for circuit board device, optionally, the radiating fin and the plate-like body are integrally formed, institute Plane is vertical with plane where the plate-like body where stating radiating fin or is obliquely installed.
In above-mentioned heat dissipation for circuit board device, optionally, multiple retention beads are arranged at intervals in first plate face, The end of the retention bead extends far from second plate face, when the heat dissipation for circuit board device is arranged on the circuit board When, the end abutment of the retention bead is in the plate face of the circuit board.
On the other hand, the utility model also provides a kind of electronic device, including shell, circuit board and above-mentioned radiator.
The radiator and the circuit board are located at the inside of the shell, and multiple electronics members are provided on the circuit board Part, the radiator are fitted in the surface of the circuit board, and the electronic component is passed through from the avoid holes of the radiator.
Heat dissipation for circuit board device and electronic device provided by the utility model are avoided by being arranged on heat dissipation for circuit board device Hole, when guaranteeing the installation of heat dissipation for circuit board device on circuit boards, the biggish electronic component of circuit board upper volume can pass through the evacuation Hole avoids the electronic component from influencing the compactness of heat dissipation for circuit board device and circuit board, to improve heat transfer effect between the two Fruit enhances the heat dissipation effect of circuit board.By the way that radiating fin is arranged in plate face of the heat dissipation for circuit board device far from circuit board side, And radiating fin is disposed around to the periphery of cooling fan, to guarantee to be conducted by circuit board to the heat energy on heat dissipation for circuit board device It is enough that outside is transmitted to by radiating fin as early as possible, to guarantee the steady and sustained heat dissipation effect of heat dissipation for circuit board device.By in circuit board The installation site of radiator and cooling fan setting installation protrusion enhances wind so that having certain installation gap between the two The wind effect of fan is conducive to heat and transmits to outside, to ensure that the work of circuit board and electronic device normal table.
The construction of the utility model and its other purpose of utility model and beneficial effect will be in conjunction with the accompanying drawings Description of preferred embodiments and it is more obvious and easy to understand.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is made simply to introduce, it should be apparent that, the accompanying drawings in the following description is Some embodiments of the utility model, for those of ordinary skill in the art, without creative efforts, It is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram for the heat dissipation for circuit board device that the utility model embodiment one provides;
Fig. 2 is the structural schematic diagram of the first plate face of the heat dissipation for circuit board device that the utility model embodiment one provides;
Fig. 3 is the structural schematic diagram of the second plate face of the heat dissipation for circuit board device that the utility model embodiment one provides;
Fig. 4 is the bottom view for the heat dissipation for circuit board device that the utility model embodiment one provides;
Fig. 5 is the left view for the heat dissipation for circuit board device that the utility model embodiment one provides;
Fig. 6 is the right view for the heat dissipation for circuit board device that the utility model embodiment one provides.
Description of symbols:
100-plate-like bodies;
10-the first plate face;
11-retention beads;
20-the second plate face;
21-radiating fins;
22-installation protrusions;
30-avoid holes;
40-installation supporting plates;
50-mounting holes;
60-connection shafts.
Specific embodiment
To keep the purpose of this utility model, technical solution and advantage clearer, below in conjunction with the excellent of the utility model The attached drawing in embodiment is selected, the technical scheme in the embodiment of the utility model is further described in more detail.In the accompanying drawings, certainly Begin to indicate same or similar component or component with the same or similar functions to same or similar label eventually.It is described Embodiment is the utility model a part of the embodiment, instead of all the embodiments.Below with reference to the implementation of attached drawing description Example is exemplary, it is intended to for explaining the utility model, and should not be understood as limiting the present invention.It is practical based on this Embodiment in novel, every other reality obtained by those of ordinary skill in the art without making creative efforts Example is applied, is fallen within the protection scope of the utility model.The embodiments of the present invention are described in detail with reference to the accompanying drawing.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified Dress ", " connected ", " connection " should broadly understood, for example, can make to be fixedly connected, be also possible to through the indirect phase of intermediary Even, the connection inside two elements or the interaction relationship of two elements be can be.For the ordinary skill people of this field For member, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
Embodiment one
Fig. 1 is the structural schematic diagram for the heat dissipation for circuit board device that the utility model embodiment one provides.Fig. 2 is the utility model The structural schematic diagram of first plate face of the heat dissipation for circuit board device that embodiment one provides.Fig. 3 is that the utility model embodiment one provides Heat dissipation for circuit board device the second plate face structural schematic diagram.Fig. 4 is the heat dissipation for circuit board that the utility model embodiment one provides The bottom view of device.Fig. 5 is the left view for the heat dissipation for circuit board device that the utility model embodiment one provides.Fig. 6 is the utility model The right view for the heat dissipation for circuit board device that embodiment one provides.
Heat dissipation for circuit board device provided in this embodiment is mainly used for the heat dissipation of circuit board.Generally it is arranged on current circuit board There are various electronic components, such as resistance, capacitor, inductance, potentiometer, transformer, diode and triode etc., it is different Electronic component has different external structure and volume, and the volume of certain electronic components is larger, setting on circuit boards when, can be to Outside protrusion, and the height protruded is determined by the volume of electronic component.Current circuit board in use, Ge Ge electricity Subcomponent internal circulation electric current, can generate a large amount of heat, when heat is assembled on circuit boards, can seriously affect electronic component Steady operation, therefore circuit board needs to be equipped with corresponding radiator when in use.For guarantee radiator heat dissipation effect, generally It can be by radiator fitting setting on circuit boards, to guarantee good heat transfer and heat radiation.However, due to circuit board upper volume The influence of biggish electronic component causes radiator that can not fit closely circuit board, and the gap generated between the two can shadow significantly Pilot's thermal effect, to reduce the heat dissipation effect of radiator.
In order to solve the above technical problems, referring to figs. 1 to shown in Fig. 6, the utility model embodiment provides heat dissipation for circuit board Device, including plate-like body 100 and cooling fan are provided at least one avoid holes 30, plate-like body 100 in plate-like body 100 With opposite the first plate face 10 and the second plate face 20, when heat dissipation for circuit board device is arranged on circuit boards, the first plate face 10 patch The plate face of circuit board is closed, the electronic component on circuit board passes through avoid holes 30.
It should be noted that the shape of the plate-like body 100 of heat dissipation for circuit board device provided in this embodiment can be according to electricity The shape of road plate is arranged, such as can be set to square plate, circular slab or irregular polygonal panel in actual use can To be set as needed, the present embodiment to this and it is without restriction, be also not limited to above-mentioned example.
Plate-like body 100 has the first plate face 10 and the second plate face 20 being oppositely arranged, the first plate face 10 and the second plate face 20 surface can be plane, inclined-plane or male and fomale(M&F), and the structure of surface both can be according to required radiating circuit plate surface shape Shape setting, to guarantee that there is maximum compactness between plate-like body 100 and circuit board.
Wherein, it is to be bonded the plate face of circuit board side that the present embodiment, which limits the first plate face 10, and the second plate face 20 is far from electricity The surface of road plate side.
It is more smooth structure in the first plate face 10 referring to shown in Fig. 2, and is not provided for the structure of heat dissipation, thus It can be closely adhered to and the joint place of the two is avoided to generate biggish gap on circuit boards, to prevent interstitial site from influencing electricity Heat transfer process between road plate and heat dissipation for circuit board device.
It is important to note that being additionally provided with avoid holes 30 in plate-like body 100, the quantity of the avoid holes 30 can root According to needing to set, a kind of achievable embodiment is only shown in Fig. 1-Fig. 3, i.e. avoid holes 30 are provided only with one, and position In one end of plate-like body 100.In actual use, 30 quantity of avoid holes can be according to the biggish electronics member of circuit board upper volume The quantity of part is arranged, and can be set to multiple, and the installation site of multiple avoid holes 30 can correspond to the position of electronic component.And The shape of avoid holes 30 is adapted to the external structure of electronic component, such as can be set to circular hole, square hole or irregular Polygonal hole.The present embodiment is arranged position and shape and is not limited, be also not limited to above-mentioned to the quantity of avoid holes 30 Example.
When heat dissipation for circuit board device is installed on circuit boards, electronic component is passed through by the position of avoid holes 30, to avoid The installation of heat dissipation for circuit board device influences the normal use of electronic element on circuit board, while electronic component is passed through by the avoid holes 30 When, it is ensured that remaining position of plate-like body 100 fits closely the influence plate-like body for preventing electronic component on circuit boards 100 with the fit-state of circuit board, avoid the joint place of circuit board and heat dissipation for circuit board device from generating biggish gap, to prevent Interstitial site influences heat transfer process between the two.
It further, is the heat dissipation effect for improving heat dissipation for circuit board device, it is described referring to Fig.1, it can be set in the second plate face 20 Set cooling fan, the second plate face 20 is provided with multiple radiating fins 21, and multiple 21 air inlets of radiating fin are towards cooling fan Air-out direction forms heat dissipation channel between adjacent heat radiation fin 21.
It should be noted that radiating fin 21 provided in this embodiment can be plane tabular structure, radiating fin 21 End can be directed away from the extension of circuit board side, and the height of extension can be set according to the installation space inside electronic device, The present embodiment to this and it is without restriction.
Radiating fin 21 can be set in the second plate face 20, to increase the heat dissipation area of heat dissipation for circuit board device, increased Heat dissipation for circuit board device carries out the intensity of heat radiation outward, to effectively improve heat dissipation effect.Further, the air inlet of radiating fin 21 Mouth is directed towards the air-out direction of cooling fan, convenient for the region for extremely needing the distinguished and admirable guidance of cooling fan, such as can pass through The specific extension angle of 21 end of radiating fin is adjusted, thus by distinguished and admirable guidance to electronic device inner ventilation region, in order to Distinguished and admirable entrained circuit board heat is more quickly transmitted to outside.
Wherein, cooling fan can be set in the second plate face 20, which can increase circuit board and circuit board The speed air flow of spreader surface carries heat to the position far from circuit board, to improve circuit board conducive to air The heat dissipation effect of radiator.Wherein, cooling fan can also be not provided with radiation air independently of radiator on radiator Machine, user can according to need setting.The radiator of cooling fan and the present embodiment independently can be used and be sold.
Cooling fan can be set in the center of the second plate face 20, and radiating fin 21 is disposed around the outer of cooling fan Week.
It should be noted that cooling fan provided in this embodiment can be located at the second plate face shown in referring to Figure 1 and Figure 3 20 center, to guarantee the uniformity to heat dissipation for circuit board.Based on around cooling fan and not set any keeping out the wind Structure, therefore its air-out direction is the circumferential direction positioned at cooling fan, and radiating fin 21 is disposed around to the periphery of cooling fan, can be with Guarantee the distinguished and admirable of cooling fan flowed out as far as possible by radiating fin 21, and it is distinguished and admirable be evenly distributed in radiating fin 21, protect Heat on card radiating fin 21 is transmitted to outside in time, to guarantee the stabilization of radiating fin 21 and efficient heat dissipation effect.
As achievable embodiment, shown referring to Figure 1 and Figure 3, multiple radiating fins 21 are arranged in parallel;Or, Multiple radiating fins 21 are disposed around the periphery of cooling fan, and (not shown) is arranged along the spaced radial of cooling fan, It is arranged herein along the spaced radial of cooling fan it is to be understood that multiple radiating fins 21 are radially arranged in cooling fan Around, distance can be set as needed between adjacent heat radiation fin 21.And in actual use, radiating fin 21 is specifically set The mode of setting can according to need to choose any one kind of them in above two mode and be set, the present embodiment to this and it is without restriction.
Specifically, being provided with multiple spaced installation protrusions 22 in the second plate face 20, installation protrusion 22 is located at heat dissipation In the view field of the second plate face 20, the end of installation protrusion 22 extends blower towards cooling fan, and is connected to radiation air Surface of the machine close to 20 side of the second plate face.
It should be noted that referring to Fig.1, shown in Fig. 3 and Fig. 4, heat dissipation is located in the second plate face 20 provided in this embodiment Installation protrusion 22 is provided in the view field of blower, the effect of installation protrusion 22 mainly obstructs cooling fan and the second plate face 20 contacts, and extend since the end for installing protrusion 22 is directed towards cooling fan, there is certain extended height, therefore when scattered When the bottom of air-heater is connected in installation protrusion 22, on the one hand, installation protrusion 22 can support cooling fan, to guarantee to radiate The mounting stability of blower.On the other hand, the gap of certain altitude, the gap be will form between cooling fan and the second plate face 20 Be conducive to heat to transmit to outside, improve heat transmission to external speed, to enhance heat dissipation effect.
Wherein, the direction that the end of radiating fin 21 is directed away from the second plate face 20 extends, and the end of radiating fin 21 It is higher than or is flush to surface of the cooling fan far from 20 side of the second plate face.
It should be noted that the end of radiating fin 21 is set above or is flush to the surface of cooling fan, in this way It can guarantee that the distinguished and admirable of cooling fan is flowed out by the channel between radiating fin 21 as far as possible, to improve 21 surface of radiating fin Speed air flow, the heat on 21 surface of radiating fin is taken away rapidly, to reduce the temperature of radiating fin 21, guarantees heat dissipation The subsequent stabilization of fin 21 and efficient heat dissipation effect.
To guarantee the stability installed, it is provided with installation supporting plate 40 on the lateral margin of plate-like body 100, installs in supporting plate 40 Portion is connect with the lateral margin of plate-like body 100, and the both ends of installation supporting plate 40 are respectively facing the first plate face 10 and the second plate face 20 extends;
When heat dissipation for circuit board device is arranged on circuit boards, the plate face of installation supporting plate 40 is connected to the lateral margin of circuit board.
It should be noted that referring to Fig.1, shown in Fig. 4 and Fig. 5, installation supporting plate is provided on the side of plate-like body 100 40, installation supporting plate 40 can be vertically arranged with plate-like body 100, can also be obliquely installed, opposite position of the present embodiment to the two Set state and without restriction.The installation supporting plate 40 can play a protective role to plate-like body 100, while work as plate-like body 100 installation on circuit boards when, installation supporting plate 40 plate face abut circuit board lateral margin, circuit board can also be played protection make With to avoid the breakage of the electronic component on circuit board.
As a kind of achievable embodiment, radiating fin 21 and plate-like body 100 are integrally formed, 21 institute of radiating fin It is vertical with 100 place plane of plate-like body or be obliquely installed in plane.
It should be noted that improve the heat-conducting effect of heat dissipation for circuit board device provided in this embodiment, the plate-like body 100 Metal material can be selected to prepare with radiating fin 21, can be dissipated in the preparation by the method for integrally casting shaping with improving The connective stability of hot fin 21 and plate-like body 100.Radiating fin 21 and the angle of plate-like body 100 can according to need and set Set, the present embodiment to this and it is without restriction.
Further, multiple retention beads 11 are arranged at intervals in the first plate face 10, the end of retention bead 11 is far from Two plate faces 20 extend, when the setting of heat dissipation for circuit board device on circuit boards when, the plate of the end abutment of retention bead 11 in circuit board On face.
It should be noted that be provided with multiple retention beads 11 in the first plate face 10, the end of the retention bead 11 can be with Be connected in the plate face of circuit board, retention bead 11 has certain extended height, with circuit board and heat dissipation for circuit board device it Between formed have certain altitude gap, the gap can to avoid heat dissipation for circuit board device squeeze circuit board surface, prevent circuit board The electronic component on surface is squeezed and damages, and ensure that the steady operation of circuit board.
Specifically, being provided with multiple mounting holes 50 on installation supporting plate 40 and plate-like body 100, pass through 60 He of mounting hole Circuit board and heat dissipation for circuit board device are fixed fastener, or the shell of heat dissipation for circuit board device and electronic device is consolidated It is fixed, to improve the mounting stability of heat dissipation for circuit board device.
Shown in referring to Fig.1, connection shaft 60 is additionally provided on the lateral margin of plate-like body 100, plate-like body 100 passes through the company Switching through axis 60 can connect with circuit board protective cover (not shown), on circuit boards in order to the installation of heat dissipation for circuit board device When, circuit board protective cover can be rotated relative to circuit board, to improve the flexibility of electronic device construction.
The heat dissipation for circuit board device that the utility model embodiment one provides, by the way that avoid holes are arranged on heat dissipation for circuit board device, When guaranteeing the installation of heat dissipation for circuit board device on circuit boards, the biggish electronic component of circuit board upper volume can pass through the avoid holes, The electronic component is avoided to influence the compactness of heat dissipation for circuit board device and circuit board, so that thermal conduction effect between the two is improved, Enhance the heat dissipation effect of circuit board.By the way that radiating fin is arranged in plate face of the heat dissipation for circuit board device far from circuit board side, and And radiating fin is disposed around to the periphery of cooling fan, being conducted with guarantee by circuit board can to the heat on heat dissipation for circuit board device Outside is transmitted to by radiating fin as early as possible, to guarantee the steady and sustained heat dissipation effect of heat dissipation for circuit board device.By being dissipated in circuit board The installation site of hot device and cooling fan setting installation protrusion enhances fan so that having certain installation gap between the two Wind effect, be conducive to heat to outside transmit, to ensure that the work of circuit board normal table.
Embodiment two
On the basis of the above embodiment 1, the utility model embodiment two also provides a kind of electronic device, including shell, Circuit board and above-mentioned radiator.
Radiator and circuit board are located at the inside of shell, are provided with multiple electronic components on circuit board, radiator is fitted in The surface of circuit board, electronic component are passed through from the avoid holes 30 of radiator.
It should be noted that electronic device provided by the utility model can be include board structure of circuit any one Electronic product, such as television set, refrigerator, mobile phone, computer and display etc., the present embodiment to the type of electronic device not It limits, is also not limited to above-mentioned example.
Other technical characteristics are the same as example 1, and can reach identical technical effect, and this is no longer going to repeat them.
The electronic device that the utility model embodiment two provides, is provided with heat dissipation for circuit board device, by heat dissipation for circuit board Avoid holes are set on device, when guaranteeing the installation of heat dissipation for circuit board device on circuit boards, the biggish electronic component energy of circuit board upper volume Enough across the avoid holes, the electronic component is avoided to influence the compactness of heat dissipation for circuit board device and circuit board, to improve the two Between thermal conduction effect, enhance the heat dissipation effect of circuit board.By in plate face of the heat dissipation for circuit board device far from circuit board side Radiating fin is set, and radiating fin is disposed around to the periphery of cooling fan, to guarantee to be conducted by circuit board to circuit board to dissipate Heat on hot device can be transmitted to outside by radiating fin as early as possible, to guarantee the steady and sustained heat dissipation effect of heat dissipation for circuit board device Fruit.By the installation site setting installation protrusion in heat dissipation for circuit board device and cooling fan, so that having between the two centainly Gap is installed, the wind effect of fan is enhanced, is conducive to heat and is transmitted to outside, to ensure that the work of electronic device normal table Make.
In the description of the present invention, it should be understood that term " on ", "lower", "front", "rear", "vertical", " water It is flat ", "top", "bottom", "inner", the orientation of the instructions such as "outside" or positional relationship be that orientation based on the figure or position are closed System, is merely for convenience of describing the present invention and simplifying the description, rather than indicates or imply signified device or element It must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.In In the description of the utility model, the meaning of " plurality " is two or more, accurately specifically provide unless otherwise.
The description and claims of this application and term " first ", " second ", " third ", " in above-mentioned attached drawing The (if present)s such as four " are to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should manage The data that solution uses in this way are interchangeable under appropriate circumstances, so that embodiments herein described herein for example can be to remove Sequence other than those of illustrating or describe herein is implemented.In addition, term " includes " and " having " and theirs is any Deformation, it is intended that cover it is non-exclusive include, for example, containing the process, method of a series of steps or units, system, production Product or equipment those of are not necessarily limited to be clearly listed step or unit, but may include be not clearly listed or for this A little process, methods, the other step or units of product or equipment inherently.
Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the utility model, rather than it is limited System;Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should Understand: it is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of Technical characteristic is equivalently replaced;And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new The range of each embodiment technical solution of type.

Claims (10)

1. a kind of heat dissipation for circuit board device, for being heat dissipation for circuit board, which is characterized in that including plate-like body, the plate-like body On be provided at least one avoid holes, the plate-like body has opposite the first plate face and the second plate face, when the circuit board Radiator is arranged when on the circuit board, and first plate face is bonded the plate face of the circuit board, the electricity on the circuit board Subcomponent passes through the avoid holes.
2. heat dissipation for circuit board device according to claim 1, which is characterized in that radiation air can be arranged in second plate face Machine, is provided with multiple radiating fins in second plate face, and multiple radiating fin air inlets are towards the cooling fan Air-out direction forms heat dissipation channel between the adjacent radiating fin.
3. heat dissipation for circuit board device according to claim 2, which is characterized in that the cooling fan is arranged in second plate The center in face, the radiating fin are disposed around the periphery of the cooling fan.
4. heat dissipation for circuit board device according to claim 3, which is characterized in that multiple radiating fins, which are parallel to each other, to be set It sets;
Or, multiple radiating fins are disposed around the periphery of the cooling fan, and multiple radiating fins are along the heat dissipation The spaced radial of blower is arranged.
5. the heat dissipation for circuit board device according to any one of claim 2-4, which is characterized in that be arranged in second plate face There are multiple spaced installation protrusions, the installation protrusion is located at the cooling fan in the view field of second plate face Interior, the end of the installation protrusion extends towards the cooling fan, and is connected to the cooling fan close to second plate The surface of face side.
6. the heat dissipation for circuit board device according to any one of claim 2-4, which is characterized in that the end of the radiating fin The direction for being directed away from second plate face extends, and the end of the radiating fin is higher than or to be flush to the cooling fan remote Surface from second one side of the board.
7. heat dissipation for circuit board device described in any one of -4 according to claim 1, which is characterized in that on the lateral margin of the plate-like body It is provided with installation supporting plate, the middle part of the installation supporting plate is connect with the lateral margin of the plate-like body, the both ends of the installation supporting plate It is respectively facing first plate face and second plate face extends;
When the heat dissipation for circuit board device is arranged on the circuit board, the plate face of the installation supporting plate is connected to the circuit board Lateral margin.
8. the heat dissipation for circuit board device according to any one of claim 2-4, which is characterized in that the radiating fin with it is described Plate-like body is integrally formed, and plane is vertical with plane where the plate-like body where the radiating fin or is obliquely installed.
9. heat dissipation for circuit board device described in any one of -4 according to claim 1, which is characterized in that be spaced in first plate face Multiple retention beads are provided with, the end of the retention bead extends far from second plate face, when the heat dissipation for circuit board device It is arranged when on the circuit board, the end abutment of the retention bead is in the plate face of the circuit board.
10. a kind of electronic device, which is characterized in that including shell, circuit board and circuit of any of claims 1-9 Plate radiator;
The heat dissipation for circuit board device and the circuit board are located at the inside of the shell, are provided with multiple electronics on the circuit board Element, the heat dissipation for circuit board device are fitted in the surface of the circuit board, and the electronic component is from the heat dissipation for circuit board device Avoid holes pass through.
CN201821906888.5U 2018-11-20 2018-11-20 Heat dissipation for circuit board device and electronic device Active CN209608932U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821906888.5U CN209608932U (en) 2018-11-20 2018-11-20 Heat dissipation for circuit board device and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821906888.5U CN209608932U (en) 2018-11-20 2018-11-20 Heat dissipation for circuit board device and electronic device

Publications (1)

Publication Number Publication Date
CN209608932U true CN209608932U (en) 2019-11-08

Family

ID=68394551

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821906888.5U Active CN209608932U (en) 2018-11-20 2018-11-20 Heat dissipation for circuit board device and electronic device

Country Status (1)

Country Link
CN (1) CN209608932U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111010856A (en) * 2019-12-31 2020-04-14 广东美的厨房电器制造有限公司 PCB heat radiation structure and have its cooking utensil
WO2021244153A1 (en) * 2020-06-02 2021-12-09 Oppo广东移动通信有限公司 Customer premise equipment
CN114576739A (en) * 2022-03-02 2022-06-03 宁波奥克斯电气股份有限公司 Automatically controlled subassembly, automatically controlled box subassembly and air conditioner of air condensing units
WO2024083242A1 (en) * 2022-10-20 2024-04-25 北京嘉楠捷思信息技术有限公司 Working assembly and electronic device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111010856A (en) * 2019-12-31 2020-04-14 广东美的厨房电器制造有限公司 PCB heat radiation structure and have its cooking utensil
WO2021244153A1 (en) * 2020-06-02 2021-12-09 Oppo广东移动通信有限公司 Customer premise equipment
CN114576739A (en) * 2022-03-02 2022-06-03 宁波奥克斯电气股份有限公司 Automatically controlled subassembly, automatically controlled box subassembly and air conditioner of air condensing units
CN114576739B (en) * 2022-03-02 2023-09-01 宁波奥克斯电气股份有限公司 Electric control assembly, electric control box assembly of air conditioner outdoor unit and air conditioner
WO2024083242A1 (en) * 2022-10-20 2024-04-25 北京嘉楠捷思信息技术有限公司 Working assembly and electronic device

Similar Documents

Publication Publication Date Title
CN209608932U (en) Heat dissipation for circuit board device and electronic device
CN202085437U (en) Variable-frequency air conditioner heat radiator
CN102221189B (en) Vertical convector radiator and vertical convector radiating down lamp
CN205825143U (en) The base of microwave oven and microwave oven
CN104251522B (en) Air conditioner electrical box assembly and air conditioner outdoor unit thereof
CN103906410A (en) Heat-dissipation module
CN203442985U (en) Heat-dissipating device for controller of variable-frequency air conditioner
CN201336012Y (en) Combined type heat-radiating shell and embedded computer
CN204631764U (en) Adjustable computer cooling cabinet
CN207604110U (en) Radiator structure and cabinet
CN207066183U (en) A kind of tower heat sink
CN207218458U (en) A kind of intelligent electric pump of good heat dissipation effect
CN201690717U (en) Radiator
CN203024199U (en) Efficient heat dissipation induction cooker
CN209877013U (en) Radiator and cooking utensil
CN202178247U (en) Radiating structure for insulated gate bipolar transistor (IGBT) and bridge rectifier of induction cooker
CN209246155U (en) Electromagnetic oven
CN207264295U (en) Radiator for laptop
CN207279721U (en) A kind of electromagnetic oven of high efficiency and heat radiation
CN206755269U (en) Electromagnetic oven
CN205669852U (en) Refrigeration plant and air condensing units thereof
CN206790877U (en) A kind of radiator structure of gateway apparatus
CN209246156U (en) Electromagnetic oven
CN216166865U (en) Heat radiator that intelligence cooking machine was used
CN209588120U (en) Electromagnetic oven

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District

Co-patentee after: Zhuji Xingdahao Science & Technology Development Co., Ltd.

Patentee after: Beijing Dahao Technology Co., Ltd.

Co-patentee after: Beijing DAHAO industrial sewing Intelligent Control Technology Co., Ltd

Address before: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District

Co-patentee before: Zhuji Xingdahao Science & Technology Development Co., Ltd.

Patentee before: Beijing Dahao Technology Co., Ltd.

Co-patentee before: BEIJING XINGDAHAO INFORMATION TECHNOLOGY CO., LTD.