CN208157366U - Silicon wafer sorting machine - Google Patents
Silicon wafer sorting machine Download PDFInfo
- Publication number
- CN208157366U CN208157366U CN201820587035.3U CN201820587035U CN208157366U CN 208157366 U CN208157366 U CN 208157366U CN 201820587035 U CN201820587035 U CN 201820587035U CN 208157366 U CN208157366 U CN 208157366U
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- light source
- pipeline
- camera
- detection device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model discloses a kind of silicon wafer sorting machines, belong to solar battery sheet technical field.The silicon wafer sorting machine further includes outer dimension detection device, subfissure detection device, dirty detection device, thickness detection apparatus, at least two in P/N type detection device, wherein：Whether the outer dimension detection device, the outer dimension for detecting the silicon wafer conveyed on the pipeline are qualified；The subfissure detection device, for detecting on the silicon wafer with the presence or absence of crack；The dirty detection device, with the presence or absence of dirty on the surface for detecting the silicon wafer；Whether the thickness detection apparatus, the thickness for detecting the silicon wafer are qualified；The P/N type detection device is p-type or N-type for detecting the silicon wafer.The utility model solve the problems, such as in the related technology silicon wafer sorting machine be typically only capable to complete individual event detection cause production efficiency low, achieved the effect that improve solar battery sheet production efficiency.
Description
Technical field
The utility model relates to solar battery sheet technical field, in particular to a kind of silicon wafer sorting machine.
Background technique
It in the production process of solar battery sheet, needs that silicon rod is first cut into silicon wafer, then to Wafer Cleaning, cleaning
It needs to carry out multinomial detection to silicon wafer after the completion, such as may include the detection of dirty surface, thickness, size and crack.
Traditional silicon wafer sorting machine is typically only capable to complete individual event detection, automatic without being formed between conveying and detection
It works continuously, causes production efficiency low.
Utility model content
In order to solve the problems, such as in the prior art silicon wafer sorting machine be typically only capable to complete individual event detection cause production efficiency low,
The utility model embodiment provides a kind of silicon wafer sorting machine, which further includes outer dimension detection device, crack
Detection device, dirty detection device, thickness detection apparatus, at least two in P/N type detection device, wherein：
Whether the outer dimension detection device, the outer dimension for detecting the silicon wafer conveyed on the pipeline close
Lattice；
The subfissure detection device, for detecting on the silicon wafer with the presence or absence of crack；
The dirty detection device, with the presence or absence of dirty on the surface for detecting the silicon wafer；
Whether the thickness detection apparatus, the thickness for detecting the silicon wafer are qualified；
The P/N type detection device is p-type or N-type for detecting the silicon wafer.
By providing a kind of silicon wafer sorting machine, which further includes outer dimension detection device, crack detection dress
Set, at least two in dirty detection device, thickness detection apparatus, P/N type detection device, solve silicon wafer point in the prior art
It selects machine to be typically only capable to complete the problem that individual event detection causes production efficiency low, has reached the production efficiency for improving solar battery sheet
Effect.
Optionally, the outer dimension detection device includes first camera, first light source, first light source cover and first camera
Cover, wherein：
The interior bottom portion of the first light source cover is arranged in the first light source, and the two sides of the first light source cover offer
The opening that the pipeline can be made to pass through above the first light source；
The first camera cover is located at the top of the first light source cover, and the first camera is set to the first camera
The inside of cover；
The first camera for taking pictures to by the silicon wafer above the first light source, take pictures by the first camera
Obtained image is for determining whether the outer dimension of the silicon wafer is qualified.
The first camera cover that first camera is surrounded by configuring to first camera configures to first light source and surrounds first light source
First light source cover, to improve the quality of taking pictures of first camera.
Optionally, the dirty detection device includes second camera, second light source, second light source cover, third camera, third
Light source and third light source cover, wherein：
The interior bottom portion of the second light source cover is arranged in the second light source, and the second light source cover is located at the conveying
The lower section of line, the second camera are located at the top of the second light source cover, the pipeline, and the second camera is used for logical
The upper surface for the silicon wafer crossed above the second light source is taken pictures, and the image that the second camera is taken pictures is for determining institute
Upper surface is stated with the presence or absence of dirty；
The interior bottom portion of the third light source cover is arranged in the third light source, and the third light source cover is located at the conveying
The top of line, the third camera are located at the lower section of the third light source cover, the pipeline, and the third camera is used for logical
The lower surface for the silicon wafer crossed below the third light source is taken pictures, and the image that the third camera is taken pictures is for determining institute
Lower surface is stated with the presence or absence of dirty.
By taking pictures using second camera to the upper surface by the silicon wafer above second light source, third camera is utilized
It takes pictures to the lower surface of the silicon wafer below third light source, to complete the dirty detection of the upper and lower surfaces of a silicon wafer.
Optionally, the thickness detection apparatus include light source on first, the first lower light source, the first side light source, the 4th camera,
First prism and the second prism, wherein：
Light source is located above the side of the pipeline on described first, and the described first lower light source is located under the side
Side, the 4th camera are located at the side of the 4th camera towards the side, first side light source；
First prism is located on described first between light source, the pipeline, and second prism is located at described the
Once between light source, the pipeline,
Light source, the first lower light source and first side light source are used to provide light for the first silicon wafer on described first
According to first silicon wafer is the silicon wafer of the 4th camera direction on the pipeline；The upper surface of first silicon wafer is reflected
Light out passes through the light that on first prismatic reflection to the 4th camera, the lower surface of first silicon wafer is reflected
Line passes through on second prismatic reflection to the 4th camera.
Optionally, the silicon wafer sorting machine further includes feeding device, and the feeding device includes to be sorted for loading
The material basket of silicon wafer and mobile mechanism, wherein：
It is described during the mobile mechanism drives the material basket decline above the conveying starting point for being located at the pipeline
The conveying of the lower surface and the pipeline of expecting the silicon wafer that basket loads originates end in contact, and the pipeline drives the material basket to load
Silicon wafer be detached from the material basket to the pipeline and conveyed, to complete the automatic charging of silicon wafer.
Optionally, the pipeline includes two the first conveyor belts of Synchronous Transmission, and the silicon wafer sorting machine further includes
Rotating mechanism below the pipeline, the rotating mechanism include for carrying the rotating platform of silicon wafer, the first lifting
Motor and rotating electric machine, wherein：
During first lifting motor drives the rotating platform to rise, the rotating platform passes through described two
Between first conveyor belt and the second silicon wafer is driven to be detached from the pipeline, second silicon wafer is positioned at the rotating platform
The silicon wafer of top；
After second silicon wafer is detached from the pipeline, the rotating electric machine drives the rotating platform to rotate predetermined angular
Make predetermined angular described in second silicon slice rotating, first lifting motor drives the rotating platform decline to make described second
Silicon wafer is detached from the rotating platform and falls on the pipeline.
Since one group of thickness detection apparatus can only carry out Thickness sensitivity with two sides of conveying direction on silicon wafer.In order to
To the Thickness sensitivity of two other side, rotating mechanism is set between this two groups of thickness detection apparatus, and rotating mechanism is used for will
Silicon slice rotating degree on pipeline.
Optionally, be provided at least one adsorption hole on the rotating platform, the adsorption hole and the air-flow of lower section one
Chamber is connected, and the lower end of the air flow chamber is provided with air inlet and air outlet, and the bore of the air inlet is greater than the air inlet
Bore, the air inlet is connected with inflatable body, wherein：
During the rotating electric machine drives the rotating platform rotation predetermined angular, the inflatable body to it is described into
Port is persistently blown, and the rotating platform is enable to adsorb second silicon wafer.
Optionally, the upper surface of the rotating platform is provided with silicagel pad, the shape of the silicagel pad and rotating platform
The shape of upper surface is identical, avoids rotating platform from drawing and splits silicon wafer；The upper surface of the silicagel pad is provided with non-slip texture, to improve
The adsorption capacity of rotating platform.
Optionally, the P/N type detection device includes telescopic first detector and telescopic second detector, institute
The lower section that the first detector is located at the pipeline is stated, second detector is located at the top of first detector.
Optionally, the silicon wafer sorting machine further includes at least one stepping mechanism and at least one rewinding box, the stepping
Mechanism is located at the lower section of the pipeline, and the rewinding box is located at the side of the pipeline, wherein：
The stepping mechanism includes, stepper motor and the second lifting motor, the conveying direction of second conveyor belt with
The conveying direction of the pipeline is vertical；
For second lifting motor for driving second conveyor belt to rise or fall, the stepper motor drives institute
The second conveyor belt is stated for being driven；
It is described when second lifting motor drives second conveyor belt to rise the following table face contact with third silicon wafer
Stepper motor drives the second conveyor belt transmission, is transported to the third silicon wafer in the rewinding box, the third
Silicon wafer is the silicon wafer above second conveyor belt.
Optionally, the stepping mechanism further includes eccentric wheel and connecting rod, wherein：
Second lifting motor and the eccentric wheel are mechanically connected, and the one of the turning end of the eccentric wheel and the connecting rod
End is fixedly connected, and the other end of the connecting rod is fixedly connected with the mounting base of second conveyor belt.
Detailed description of the invention
It, below will be to required in embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing to be used is briefly described, it should be apparent that, the accompanying drawings in the following description is only some realities of the utility model
Example is applied, it for those of ordinary skill in the art, without creative efforts, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 is a kind of structural schematic diagram of silicon wafer sorting machine shown in one exemplary embodiment of the utility model；
Fig. 2 is a kind of structural schematic diagram of the feeding device provided in the utility model one embodiment；
Fig. 3 is a kind of structural schematic diagram of the outer dimension detection device provided in the utility model one embodiment；
Fig. 4 is a kind of structural schematic diagram of the subfissure detection device provided in the utility model one embodiment；
Fig. 5 is a kind of structural schematic diagram of the dirty detection device provided in the utility model one embodiment；
Fig. 6-1 is a kind of structural schematic diagram of the thickness detection apparatus provided in the utility model one embodiment；
Fig. 6-2 is the third prism provided in the utility model one embodiment, the schematic diagram of the 4th prism；
Fig. 7 is a kind of structural schematic diagram of the rotating mechanism provided in the utility model one embodiment；
Fig. 8 is a kind of structural schematic diagram of the P/N type detection device provided in the utility model one embodiment；
Fig. 9 is a kind of structural schematic diagram of the stepping mechanism provided in the utility model one embodiment；
Figure 10 is the schematic diagram of eccentric wheel and connecting rod in a kind of stepping mechanism provided in the utility model one embodiment.
Specific embodiment
It is practical new to this below in conjunction with attached drawing to keep the purpose of this utility model, technical solution and advantage clearer
Type embodiment is described in further detail.
The utility model embodiment provides a kind of silicon wafer sorting machine, which includes pipeline, the silicon wafer point
Selecting machine further includes outer dimension detection device, subfissure detection device, dirty detection device, thickness detection apparatus, P/N type detection dress
At least two in setting, wherein：
Whether outer dimension detection device, the outer dimension for detecting the silicon wafer conveyed on pipeline are qualified；
Subfissure detection device, for detecting on silicon wafer with the presence or absence of crack；
Dirty detection device, with the presence or absence of dirty on the surface for detecting silicon wafer；
Whether thickness detection apparatus, the thickness for detecting silicon wafer are qualified；
P/N type detection device is p-type or N-type for detecting silicon wafer.
By utility model embodiment by providing a kind of silicon wafer sorting machine, which further includes outer dimension inspection
Device, subfissure detection device, dirty detection device, thickness detection apparatus, at least two in P/N type detection device are surveyed, are solved
Silicon wafer sorting machine is typically only capable to complete individual event to detect the problem for causing production efficiency low in the prior art, has reached the raising sun
The effect of the production efficiency of energy cell piece.
For example, as shown in Figure 1, Fig. 1 is a kind of silicon wafer sorting machine shown in one exemplary embodiment of the utility model
Structural schematic diagram.As shown in Figure 1, the silicon wafer sorting machine includes pipeline 10, outer dimension detection device 20, crack detection dress
Set 30, dirty detection device 40 and thickness detection apparatus 50.
Optionally, pipeline 10 includes two the first conveyor belts of Synchronous Transmission, this two the first conveyor belt difference
For carrying two conveying starting points of a silicon wafer.
Optionally, as shown in Figure 1, the silicon wafer sorting machine further includes feeding device 11, feeding device 11 is for removing silicon wafer
It is transported on pipeline 10 and completes feeding.
As shown in Fig. 2, feeding device 11 includes for loading silicon wafer to be sorted in a kind of possible embodiment
Expect basket 111 and mobile mechanism 112, the bottom end of material basket 111 is connected with the bracket 113 of mobile mechanism 112；112 energy of mobile mechanism
It is enough that material basket 111 is driven to rise or fall.
If fruit basket 111 is located at the top of the conveying starting point of pipeline 10, then mobile mechanism 112 drives under material basket 111
The conveying starting end in contact for making the lower surface for expecting the silicon wafer loaded on basket 111 and pipeline 10 during drop, thus pipeline
10, which drive the silicon wafer loaded on material basket 111 to be detached from the material basket 111 to pipeline 10, is conveyed, after being transported to the silicon wafer
Continuous process is detected.Subsequent handling said here may include outer dimension detection, crack detection, dirty detection, thickness
At least one of detection, the detection of P/N type etc..
It should be noted is that being greater than on material basket 111 for loading the distance between two load-bearing parts of a silicon wafer
The width of pipeline 10, the two load-bearing parts are respectively used to carry the both ends of the silicon wafer.
Further, at least one bracket 113 is provided in mobile mechanism 112, the bottom end of material basket 111 may be mounted to that this
On bracket 113.Optionally, at least two brackets 113 are provided in mobile mechanism 112, mobile mechanism 112 is able to drive bracket
Material basket 111 on 113 moves in the horizontal direction.Moving structure 112 drives the material above the conveying starting point for being located at pipeline 10
After the silicon wafer that the decline of basket 111 loads the material basket 111 is all transferred on pipeline 10, its all 113 feeding of bracket is driven
The material basket 111 that drive is mounted with silicon wafer after basket 111 rises is moved horizontally to the top of the conveying starting point of pipeline 10, then
It is complete to repeat the silicon wafer for driving the decline of the material basket 111 above the conveying starting point for being located at pipeline 10 to load the material basket 111
Portion is transferred to the step on pipeline 10, constantly to 10 feeding of pipeline (that is, silicon wafer).
As shown in figure 3, in a kind of possible embodiment, outer dimension detection device 20 includes first camera 21, the
One light source 22, first light source cover 23 and first camera cover 24, wherein：The inner bottom of first light source cover 23 is arranged in first light source 22
Portion, the two sides of first light source cover 23 offer the opening that pipeline 10 can be made to pass through above first light source 22；First camera
21 covers are located at the top of first light source cover 23, and first camera 21 is set to the inside of the cover of first camera 21.First camera 21 is used for
It takes pictures to the silicon wafer by 22 top of first light source, the image that first camera 21 is taken pictures is used to determine the outer of the silicon wafer
Whether shape size is qualified.
By surrounding the first camera cover 24 of first camera 21 to the configuration of first camera 21, surrounded to the configuration of first light source 22
The first light source cover 23 of first light source 22, to improve the quality of taking pictures of first camera 21.Silicon wafer sorting machine can be according to the first phase
The image that machine 21 is shot determines the size of the silicon wafer shot in the image.
As shown in figure 4, subfissure detection device 30 includes infrared camera 31 and infrared light in a kind of possible embodiment
Source 32, infrared camera position 31 is in the top of pipeline 10.The silicon wafer that infrared camera 31 is used to irradiate infrared light supply 32 is clapped
According to silicon wafer sorting machine can be determined in the silicon wafer according to the infrared image that infrared camera 31 is shot with the presence or absence of crack.
The present embodiment is not especially limited the installation site of infrared light supply 32.Optionally, infrared light supply 32 can be located at
The lower section of pipeline 10.Optionally, infrared light supply 32 is located at the top of pipeline 10, then the image that infrared camera 31 is shot is should
The infrared image of silicon wafer reflection infrared ray.
As shown in figure 5, dirty detection device 40 includes second camera 41, the second light in a kind of possible embodiment
Source (not shown), second light source cover 42, third camera 43, third light source (not shown) and third light source cover 44,
Wherein：
The interior bottom portion of second light source cover 42 is arranged in second light source, and second light source cover 42 is located at the lower section of pipeline 10,
Second camera 41 is located at the top of second light source cover 42, pipeline 10, and second camera 41 is used for by above second light source
It takes pictures the upper surface of silicon wafer；Silicon wafer sorting machine can determine the upper surface of the silicon wafer according to the image that second camera 41 is shot
With the presence or absence of dirty, and determine stain type.
The interior bottom portion of third light source cover 44 is arranged in third light source, and third light source cover 44 is located at the top of pipeline 10,
Third camera 43 is located at the lower section of third light source cover 44, pipeline 10, and third camera 43 is used for by below third light source
It takes pictures the lower surface of silicon wafer.Silicon wafer sorting machine can determine the lower surface of the silicon wafer according to the image that third camera 43 is shot
With the presence or absence of dirty, and determine stain type.
As in Figure 6-1, in a kind of possible embodiment, thickness detection apparatus 50 includes light source 51a, the on first
Once light source 52a, the first side light source 53a, the 4th camera 54a, the first prism (not shown) and the second prism (do not show in figure
Out), wherein：
Light source 51a is located above the side of pipeline 10 on first, and the first lower light source 52a is located at the lower section of side, and the 4th
Camera 54a is located at the side of the 4th camera 54a towards side, the first side light source 53a；
As in fig. 6-2, the first prism 55a is located on first between light source 51a, pipeline 10, and the second prism 56a is located at
Between first lower light source 52a, pipeline 10,
Light source 51a, the first lower light source 52a and the first side light source 53a are used to provide illumination for the first silicon wafer on first,
First silicon wafer is the silicon wafer of the 4th camera 54a direction on pipeline 10；The light that the upper surface of first silicon wafer reflects passes through
On first prismatic reflection to the 4th camera 54a, light that the lower surface of the first silicon wafer reflects passes through the second prismatic reflection to the
On four camera 54a.
Optionally, the first prism 55a and the second prism 56a is right angle prism.
The first right-angle surface of first prism 55a is parallel to the plane where pipeline 10, the second right angle of the first prism 55a
Face is arranged close to the 4th camera 54a；The first right-angle surface of second prism 56a is parallel to the plane where pipeline 10, the second rib
The second right-angle surface of mirror 56a is arranged close to the 4th camera 54a.
The top of first prism 55 is lower than the top of the 4th camera 54a, and the bottom end of the second prism 56a is higher than the 4th camera
The bottom end of 54a.The image of 4th camera 54a shooting is used to determine the thickness of the first silicon wafer.
As in Figure 6-1, in a kind of possible embodiment, thickness detection apparatus 50 further include light source 51b on second,
Second lower light source 52b, the second side light source 53b, the 5th camera 54b, third prism (not shown) and the 4th prism are (in figure not
Show), wherein：
Light source 51b is located above another side of pipeline 10 on second, and the second lower light source 52b is located at another side
Lower section, the 5th camera 54b are located at the side of the 5th camera 54b towards another side, the second side light source 53b；
Third prism is located on second between light source 51b, pipeline 10, and the 4th prism is located at the second lower light source 52b, conveying
Between line 10,
Light source 51b, the second lower light source 52b and the second side light source 53b are used to provide illumination for the first silicon wafer on second；
The light that the upper surface of first silicon wafer reflects passes through on third prismatic reflection to the 5th camera 54b, the following table of the first silicon wafer
The light that face reflects is reflexed on the 5th camera 54b by the 4th prism.
Optionally, third prism and the 4th prism are right angle prism.
First right-angle surface of third prism is parallel to the plane where pipeline 10, and the second right-angle surface of third prism is close
5th camera 54b setting；First right-angle surface of the 4th prism is parallel to the plane where pipeline 10, and the second of the 4th prism is straight
Edged surface is arranged close to the 5th camera 54b.
The top of third prism is lower than the top of the 5th camera 54b, and the bottom end of the 4th prism is higher than the bottom of the 5th camera 54b
End.The image of 5th camera 54b shooting is used to determine the thickness of the first silicon wafer.
As shown in Figure 1, the silicon wafer sorting machine includes two groups of thickness detection apparatus 50 in a kind of possible embodiment
And/or two groups of subfissure detection devices 30, the silicon wafer sorting machine further include rotating mechanism 60, which is located at this two groups thickness
It spends between detection device 50 and/or between this two groups of subfissure detection devices 30, rotating mechanism 60 is located at 10 lower section of pipeline.
It should be noted is that one group of thickness detection apparatus 50 can only on silicon wafer with two sides of conveying direction into
Row Thickness sensitivity.For the Thickness sensitivity to two other side, whirler is set between this two groups of thickness detection apparatus 50
Structure 60, rotating mechanism 60 are used for 90 degree of silicon slice rotating on pipeline 10.
In addition, one group of subfissure detection device 30 can only detect silicon wafer whether there is crack in the conveying direction.In order to detect
Silicon wafer whether there is crack in the Y direction (direction vertical with conveying direction), be arranged between this two groups of subfissure detection devices 30
Rotating mechanism 60, rotating mechanism 60 are used for 90 degree of silicon slice rotating on pipeline 10.
As shown in fig. 7, rotating mechanism 60 includes the rotating platform for carrying silicon wafer in a kind of possible embodiment
61, the first lifting motor 62 and rotating electric machine 63, wherein：
First lifting motor 62 is able to drive rotating electric machine 63 and rotating platform 61 rises or falls；
During first lifting motor 62 drives rotating platform 61 to rise, rotating platform 61 pass through two conveyor belts it
Between and drive the second silicon wafer to be detached from pipeline 10, the second silicon wafer is silicon wafer above rotating platform 61.It needs to illustrate
Any is, during rotating platform 61 drives the second silicon wafer to be detached from pipeline 10, the upper surface of rotating platform 61 and silicon wafer
Following table face contact, rotating platform 61 hold the silicon wafer and rise to be detached from pipeline 10.
After second silicon wafer is detached from pipeline 10, rotating electric machine 63, which drives rotating platform 61 to rotate predetermined angular, makes the second silicon wafer
Predetermined angular is rotated, the first lifting motor 62 drives the decline of rotating platform 61 that the second silicon wafer is made to be detached from rotating platform 61 and falls in conveying
On line 10.Wherein, predetermined angular is usually 90 degree.
In a kind of possible embodiment, during rotating electric machine 63 drives rotating platform 61 to rotate predetermined angular,
Rotating platform 61 can adsorb the second silicon wafer.Specifically, it is provided at least one adsorption hole on 61 rotating platform 61 of rotating platform,
Each adsorption hole is connected with an air flow chamber of lower section, and the lower end of air flow chamber is provided with air inlet and air outlet, the air inlet
Bore be greater than the bore of the air inlet, air inlet is connected with inflatable body, wherein：
During rotating electric machine 63 drives rotating platform 61 to rotate predetermined angular, inflatable body is persistently blown to air inlet
Gas enables rotating platform 61 to adsorb the second silicon wafer.
Optionally, the upper surface of rotating platform 61 is provided with silicagel pad, edge shape and the rotating platform 61 of silicagel pad
The edge shape of upper surface is identical, draws to avoid rotating platform 61 and splits silicon wafer.
Optionally, at least one hollow out is provided in silicagel pad, which is connected to adsorption hole.The gas come out from adsorption hole
Stream can reverberate in the space fallen in that engraved structure is formed with absorption platform, enhance between air-flow and adsorbed silicon wafer
Adsorption area, to enhance adsorption capacity.The present embodiment is circular platform signal in rotating platform 61, but not to rotating platform 61
Shape be specifically limited.
In a kind of possible embodiment, rotating mechanism 60 further includes driving motor 64, and driving motor 64 is able to drive
Rotating platform 61, the first lifting motor 62 and rotating electric machine 63 move simultaneously along the direction where pipeline 10.
As shown in Figure 1, silicon wafer sorting machine includes P/N type detection device 70.As shown in figure 8, in a kind of possible embodiment party
In formula, including P/N type detection device 70 includes telescopic first detector 71 and telescopic second detector 72, the first inspection
Survey device 71 and be located at the lower section of pipeline 10, the second detector position 72 in the top of the first detector, wherein：
When silicon wafer on pipeline 10 is transported between the first detector 71, the second detector 72, silicon wafer sorting machine control
The decline of the second detector, the rising of the first detector 71 are made, the second detector 72 is made to compress the upper surface of the silicon wafer, the first detector
71 contact the upper surface of the silicon wafer, to complete the P/N type detection of the silicon wafer, determine that the silicon wafer belongs to p-type or N-type.
As shown in Figure 1, silicon wafer sorting machine includes discharging device 80.Discharging device 80 is including at least one stepping mechanism and extremely
A few rewinding box, each stepping mechanism are located at the lower section of pipeline 10, and each rewinding box is located at the side of the pipeline 10,
Wherein：
As shown in figure 9, stepping mechanism include the second conveyor belt 81, stepper motor 82 and the second lifting motor 83, second
The conveying direction of conveyor belt 81 is vertical with the conveying direction of pipeline 10；
Second lifting motor 83 is for driving the second conveyor belt 81 to rise or fall, and stepper motor 82 is for driving second
Conveyor belt 81 is driven；
When the second conveyor belt 81 and the following table face contact of third silicon wafer, stepper motor 82 drives the second conveyor belt 81 to pass
It is dynamic, it is transported to third silicon wafer in rewinding box, third silicon wafer is the silicon wafer of 81 top of the second conveyor belt；
After the third silicon wafer is transported in rewinding box, the second lifting motor 83 drives the decline of the second conveyor belt 81.
As shown in Figure 10, stepping mechanism includes eccentric wheel and connecting rod, wherein：Second lifting motor 83 and eccentric wheel 84 are mechanical
Connection, the turning end of eccentric wheel are fixedly connected with one end of connecting rod 85, the installation of the other end of connecting rod and the second conveyor belt 81
Seat is fixedly connected.
Term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or hidden
Quantity containing indicated technical characteristic.The feature of " first ", " second " that limit as a result, can express or implicitly include one
A or more this feature.In the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or two
More than.
Those skilled in the art will readily occur to the utility model after considering specification and practicing utility model here
Other embodiments.This application is intended to cover any variations, uses, or adaptations of the utility model, these modifications,
This technology neck that purposes or adaptive change follow the general principle of the utility model and be not directed to including the utility model
Common knowledge or conventional techniques in domain.The description and examples are only to be considered as illustrative, the utility model it is real
Scope and spirit are indicated by the following claims.
It should be understood that the utility model is not limited to the accurate knot for being described above and being shown in the accompanying drawings
Structure, and various modifications and changes may be made without departing from the scope thereof.The scope of the utility model is only wanted by appended right
It asks to limit.
Claims (10)
1. a kind of silicon wafer sorting machine, which is characterized in that the silicon wafer sorting machine includes pipeline, and the silicon wafer sorting machine further includes
Outer dimension detection device, subfissure detection device, dirty detection device, thickness detection apparatus, in P/N type detection device at least
Two kinds, wherein：
Whether the outer dimension detection device, the outer dimension for detecting the silicon wafer conveyed on the pipeline are qualified；
The subfissure detection device, for detecting on the silicon wafer with the presence or absence of crack；
The dirty detection device, with the presence or absence of dirty on the surface for detecting the silicon wafer；
Whether the thickness detection apparatus, the thickness for detecting the silicon wafer are qualified；
The P/N type detection device is p-type or N-type for detecting the silicon wafer.
2. silicon wafer sorting machine according to claim 1, which is characterized in that the outer dimension detection device includes the first phase
Machine, first light source, first light source cover and first camera cover, wherein：
The interior bottom portion of the first light source cover is arranged in the first light source, and the two sides of the first light source cover offer can
The opening for passing through the pipeline above the first light source；
The first camera cover is located at the top of the first light source cover, and the first camera is set to the first camera cover
It is internal；
The first camera for taking pictures to by the silicon wafer above the first light source, take pictures to obtain by the first camera
Image for determining whether the outer dimension of the silicon wafer qualified.
3. silicon wafer sorting machine according to claim 1, which is characterized in that the dirty detection device include second camera,
Second light source, second light source cover, third camera, third light source and third light source cover, wherein：
The interior bottom portion of the second light source cover is arranged in the second light source, and the second light source cover is located at the pipeline
Lower section, the second camera are located at the top of the second light source cover, the pipeline, and the second camera is used for passing through
The upper surface for stating the silicon wafer above second light source is taken pictures, and the image that the second camera is taken pictures is described for determining
Surface is with the presence or absence of dirty；
The interior bottom portion of the third light source cover is arranged in the third light source, and the third light source cover is located at the pipeline
Top, the third camera are located at the lower section of the third light source cover, the pipeline, and the third camera is used for passing through
The lower surface for stating the silicon wafer below third light source is taken pictures, the image that the third camera is taken pictures for determine it is described under
Surface is with the presence or absence of dirty.
4. silicon wafer sorting machine according to claim 1, which is characterized in that the thickness detection apparatus includes the first glazing
Source, the first lower light source, the first side light source, the 4th camera, the first prism and the second prism, wherein：
Light source is located above the side of the pipeline on described first, and the described first lower light source is located at the lower section of the side,
4th camera is located at the side of the 4th camera towards the side, first side light source；
First prism is located on described first between light source, the pipeline, and second prism is located under described first
Between light source, the pipeline,
Light source, the first lower light source and first side light source are used to provide illumination for the first silicon wafer on described first,
First silicon wafer is the silicon wafer of the 4th camera direction on the pipeline；The upper surface of first silicon wafer reflects
Light it is logical by the light that on first prismatic reflection to the 4th camera, the lower surface of first silicon wafer is reflected
It crosses on second prismatic reflection to the 4th camera.
5. silicon wafer sorting machine according to claim 1, which is characterized in that the silicon wafer sorting machine further includes feeding device,
The feeding device includes the material basket and mobile mechanism for loading silicon wafer to be sorted, wherein：
During the mobile mechanism drives the material basket decline above the conveying starting point for being located at the pipeline, the material basket
The conveying of the lower surface of the silicon wafer of loading and the pipeline originates end in contact, the silicon that the pipeline drives the material basket to load
Piece is detached from the material basket to the pipeline and is conveyed.
6. silicon wafer sorting machine according to claim 1, which is characterized in that the pipeline includes two article of Synchronous Transmission
One conveyor belt, the silicon wafer sorting machine further include the rotating mechanism below the pipeline, and the rotating mechanism includes
For carrying the rotating platform, the first lifting motor and rotating electric machine of silicon wafer, wherein：
During first lifting motor drives the rotating platform to rise, the rotating platform passes through described two first
Between conveyor belt and the second silicon wafer is driven to be detached from the pipeline, second silicon wafer is above the rotating platform
Silicon wafer；
After second silicon wafer is detached from the pipeline, the rotating electric machine drives the rotating platform rotation predetermined angular to make institute
Predetermined angular described in the second silicon slice rotating is stated, first lifting motor drives the rotating platform decline to make second silicon wafer
The rotating platform is detached to fall on the pipeline.
7. silicon wafer sorting machine according to claim 6, which is characterized in that be provided at least one suction on the rotating platform
Attached hole, the adsorption hole with the air flow chamber of lower section one be connected, the lower end of the air flow chamber is provided with air inlet and air outlet,
The bore of the air inlet is greater than the bore of the air inlet, and the air inlet is connected with inflatable body, wherein：
During the rotating electric machine drives the rotating platform rotation predetermined angular, the inflatable body is to the air inlet
It is lasting to blow, so that the rotating platform is adsorbed second silicon wafer.
8. silicon wafer sorting machine according to claim 1, which is characterized in that the P/N type detection device includes telescopic
First detector and telescopic second detector, first detector are located at the lower section of the pipeline, second inspection
Survey the top that device is located at first detector.
9. silicon wafer sorting machine according to claim 1, which is characterized in that the silicon wafer sorting machine further includes at least one point
Gear mechanism and at least one rewinding box, the stepping mechanism are located at the lower section of the pipeline, and the rewinding box is located at described defeated
The side of line sending, wherein：
The stepping mechanism include the second conveyor belt, stepper motor and the second lifting motor, second conveyor belt it is defeated
Send direction vertical with the conveying direction of the pipeline；
For second lifting motor for driving second conveyor belt to rise or fall, the stepper motor drives described the
Two conveyor belts are for being driven；
When second lifting motor drives second conveyor belt to rise the following table face contact with third silicon wafer, the stepping
Motor drives the second conveyor belt transmission, is transported to the third silicon wafer in the rewinding box, the third silicon wafer
For the silicon wafer above second conveyor belt.
10. silicon wafer sorting machine according to claim 9, which is characterized in that the stepping mechanism further includes eccentric wheel and company
Bar, wherein：
Second lifting motor and the eccentric wheel are mechanically connected, and one end of the turning end of the eccentric wheel and the connecting rod is solid
Fixed connection, the other end of the connecting rod are fixedly connected with the mounting base of second conveyor belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820587035.3U CN208157366U (en) | 2018-04-23 | 2018-04-23 | Silicon wafer sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820587035.3U CN208157366U (en) | 2018-04-23 | 2018-04-23 | Silicon wafer sorting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208157366U true CN208157366U (en) | 2018-11-27 |
Family
ID=64374828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820587035.3U Active CN208157366U (en) | 2018-04-23 | 2018-04-23 | Silicon wafer sorting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208157366U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108389808A (en) * | 2018-04-23 | 2018-08-10 | 无锡奥特维科技股份有限公司 | Silicon chip sorting machine |
| CN116603754A (en) * | 2023-06-02 | 2023-08-18 | 曲靖阳光新能源股份有限公司 | High-speed silicon chip sorter |
-
2018
- 2018-04-23 CN CN201820587035.3U patent/CN208157366U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108389808A (en) * | 2018-04-23 | 2018-08-10 | 无锡奥特维科技股份有限公司 | Silicon chip sorting machine |
| CN108389808B (en) * | 2018-04-23 | 2024-03-01 | 无锡奥特维科技股份有限公司 | Silicon chip sorting machine |
| CN116603754A (en) * | 2023-06-02 | 2023-08-18 | 曲靖阳光新能源股份有限公司 | High-speed silicon chip sorter |
| CN116603754B (en) * | 2023-06-02 | 2023-12-08 | 曲靖阳光新能源股份有限公司 | High-speed silicon chip sorter |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108389808A (en) | Silicon chip sorting machine | |
| CN206269748U (en) | A kind of equipment of auto-measuring precise measure | |
| CN201653918U (en) | Chip appearance detection device | |
| CN208157366U (en) | Silicon wafer sorting machine | |
| CN110379736A (en) | Silicon wafer sorting machine | |
| CN205634157U (en) | Base plate is got and is put device | |
| CN108181325A (en) | Glass defect automatic detection device | |
| CN210847224U (en) | Novel workpiece dimension testing and classifying device | |
| KR100831368B1 (en) | Apparatus for preform inspection | |
| CN210325706U (en) | Silicon wafer sorting machine | |
| CN205966602U (en) | Dual driven multistage food letter sorting equipment | |
| TWI572858B (en) | Method and device for detecting the loading of electronic components | |
| CN110530317A (en) | A kind of detection device | |
| CN209280579U (en) | Jewelry appearance precision detection equipment | |
| CN209554338U (en) | A kind of detection system | |
| CN208728045U (en) | A kind of battery case sorting machine | |
| CN209601481U (en) | Detection device | |
| CN209139210U (en) | A kind of axis products detection device | |
| CN214516067U (en) | Spring optics autofilter machine | |
| CN210010209U (en) | Automatic feeding equipment | |
| CN205376635U (en) | Lithium cell multistation priming device | |
| JPH0834759B2 (en) | Conveyed object inspection method and apparatus | |
| CN208177899U (en) | A kind of silicon chip inserting machine silicon wafer defective products detection device | |
| CN113058868A (en) | Detection device and detection method for appearance defects of photovoltaic cell | |
| CN106018424A (en) | Device for detecting auto parts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |