CN208109883U - A kind of fixture for chip radio frequency performance test - Google Patents
A kind of fixture for chip radio frequency performance test Download PDFInfo
- Publication number
- CN208109883U CN208109883U CN201820584323.3U CN201820584323U CN208109883U CN 208109883 U CN208109883 U CN 208109883U CN 201820584323 U CN201820584323 U CN 201820584323U CN 208109883 U CN208109883 U CN 208109883U
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- chip
- radio frequency
- circuit board
- fixture
- test circuit
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Abstract
The utility model discloses a kind of fixtures for chip radio frequency performance test, including pedestal, it is equipped with test circuit board assemblies on the base, and the chip power cable being connected with the test circuit board assemblies, radio-frequency input signals cable and radio frequency output signal cable, the pressure head component that can be moved up and down is equipped with right above the test circuit board assemblies, the test circuit board assemblies are equipped with the chip positioning bracket for installing chip to be measured, the pressure head component includes multiple independent pressure heads, all pressure heads are uniformly arranged along the surrounding contour line of the chip to be measured.The quantity of pressure head is determined according to the size of chip to be measured, principle is to ensure that the pressure being applied on chip to be measured is uniform, so as to avoid because the pressure on chip it is uneven, lead to the undesirable situation of chip part pins contact, reduce because pressure it is uneven caused by test False Rate.
Description
Technical field
The utility model relates to chip manufacturing field, especially a kind of fixture for chip radio frequency performance test.
Background technique
There are two types of common connection types in currently used chip radio frequency performance test, the first is to utilize POGO PIN
The spring probe is placed between chip pin to be measured and test circuit board pin, brings pressure to bear on by (a kind of spring probe)
Chip to be measured compresses spring probe, to realize chip pin to be measured and test the connection of circuit board pin, completes electric current and leads
The transmission of logical and signal.
Second is to utilize a kind of anisotropic conductive film (silica gel thin film of the inside containing conducting particles, by applying pressure
Can be realized the electric performance conducting in film thickness direction, and keep insulating in thin film planar direction), which is placed in be measured
Between chip pin and test circuit board pin, chip to be measured is brought pressure to bear on, to realize chip pin to be measured and test electricity
Current lead-through and signal transmission are completed in the connection of road plate pin.
But in actual test, have the following problems：1, using the connection type of POGO PIN, it is not suitable for test chip
High frequency signals performance, be normally only used for chip for electrical connection and low-frequency test.2, using the connection of anisotropic conductive film
Mode, suitable for testing the high frequency signals performance of chip, but due to the very thin thickness of anisotropic conductive film, compressible sky
Between it is small, when testing the chip of larger package dimension, be easy because the pressure being applied on chip it is uneven, lead to chip part pin
Poor contact.In addition, anisotropic conductive film is easy to be contaminated by dust, using degradation is contacted after certain number, need periodically more
It changes, when replacement need to remove the positioning mechanism of chip, and the testing time is caused to extend.
Utility model content
The goal of the invention of the utility model is：Exist when for the connection of the existing technology using anisotropic conductive film
It is easy because the pressure being applied on chip is uneven, cause chip part pins contact bad and anisotropic conductive film more
Complicated for operation, the problem of causing the testing time to extend is changed, a kind of fixture for chip radio frequency performance test is provided, using different side
The connection type of property conductive film, to realize the test to the radio-frequency performance of chip.
To achieve the goals above, the technical solution adopted in the utility model is：
A kind of fixture for chip radio frequency performance test, including pedestal are equipped with test circuit board group on the base
Part, and the chip power cable, radio-frequency input signals cable and the radio frequency output that are connected with the test circuit board assemblies are believed
Number cable is equipped with the pressure head component that can be moved up and down, the test circuit board assemblies right above the test circuit board assemblies
It is equipped with the chip positioning bracket for installing chip to be measured, the pressure head component includes multiple independent pressure heads, all described
Pressure head is uniformly arranged along the surrounding contour line of the chip to be measured.
Radio frequency is exported radio-frequency input signals cable connecting signal source by chip power cable connection power supply when test
Signal cable connects oscillograph or Network Analyzer, and chip is put into the chip positioning bracket in test circuit board assemblies, allows pressure
Head assembly moves downward, and pressure head brings pressure to bear on chip to be measured, and the test can be started.
The pressure head component of the utility model includes multiple independent pressure heads, all pressure heads along the chip to be measured four
All contour lines are uniformly arranged, and the quantity of pressure head determines that principle, which is to ensure that, to be applied on chip to be measured according to the size of chip to be measured
Pressure it is uniform, so as to avoid because the pressure on chip it is uneven, lead to the undesirable situation of chip part pins contact, reduce
Because pressure it is uneven caused by test False Rate.
As a preferred embodiment of the present invention, the pressure head component is connected with lifting device, and the lifting device drives
Pressure head moves up and down, and brings pressure to bear on chip to be measured, thus realize chip pin to be measured and test the connection of circuit board pin, it is complete
It is transmitted at current lead-through and signal.
As a preferred embodiment of the present invention, the pressure head component includes sleeve and guide plate, is set in the sleeve
There are multiple independent pressure heads, and each pressure head is equipped with independent spring.The guide plate is used to fix the direction of each pressure head,
The pressure head be pressurized after can between sleeve and guide plate interior independent slide, while spring is compressed.
As a preferred embodiment of the present invention, the test circuit board assemblies include test circuit board and chip positioning branch
The anisotropic conductive film component being equipped between frame and the test circuit board and chip positioning bracket.The test circuit
Plate is connected with chip power cable, radio-frequency input signals cable, radio frequency output signal cable, and chip positioning bracket is for installing
Chip to be measured, to be aligned chip pin to be measured and test the respective pin of circuit board, anisotropic conductive film component is then used to be connected
Corresponding pin.
As a preferred embodiment of the present invention, the chip positioning bracket is being equipped with cunning close to test circuit board side
Slot, the sliding slot are adapted with anisotropic conductive film component.Anisotropic conductive film component can slide in sliding slot, more transversion side
Property conduction membrane module when, i.e., using the sliding slot plug anisotropic conductive film component, realize anisotropic conductive film component it is quick
Replacement.
As a preferred embodiment of the present invention, the anisotropic conductive film component includes rigid plastic piece and is adhered to
The anisotropic conductive film of the rigid plastic on piece.Rigid plastic piece provides rigid support for anisotropic conductive film, then by different side
Property conductive film is adhered to rigid plastic on piece by double-sided adhesive and is assembled into anisotropic conductive film component.Rigid plastic piece can increase different
The rigidity of side's property conduction membrane module, enables anisotropic conductive film component to slide in the sliding slot on chip positioning bracket, convenient
Quick-replaceable anisotropic conductive film component.
As a preferred embodiment of the present invention, the chip positioning mid-stent is equipped with and is adapted with the chip to be measured
Chip mounting hole, be aligned chip pin to be measured and test circuit board respective pin.
As a preferred embodiment of the present invention, detachable company between the test circuit board and chip positioning bracket
It connects, facilitates installation and replacement.
As a preferred embodiment of the present invention, the test circuit board assemblies and pedestal detachable connection, facilitate peace
Dress replacement.
As a preferred embodiment of the present invention, the quantity of the pressure head is at least four.
In conclusion by adopting the above-described technical solution, the utility model has the beneficial effects that：
1, pressure head component includes multiple independent pressure heads, and all pressure heads are equal along the surrounding contour line of the chip to be measured
The quantity of even arrangement, pressure head determines that principle is to ensure that the pressure being applied on chip to be measured is uniform according to the size of chip to be measured,
So as to avoid because the pressure on chip it is uneven, lead to the undesirable situation of chip part pins contact, reduce because of pressure not
False Rate is tested caused by.
2, chip positioning bracket is being equipped with sliding slot, the sliding slot and anisotropic conductive film component close to test circuit board side
It is adapted, anisotropic conductive film component can slide in sliding slot, when replacing anisotropic conductive film component, i.e., using the sliding slot
Anisotropic conductive film component is plugged, realizes the quick-replaceable of anisotropic conductive film component.
3, anisotropic conductive film component includes rigid plastic piece, and rigid plastic piece provides rigid branch for anisotropic conductive film
Support, enables anisotropic conductive film component to slide in the sliding slot on chip positioning bracket, and it is conductive that fast and easy replaces anisotropy
Membrane module.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram (pressure head of fixture for chip radio frequency performance test described in the utility model
It lifts).
Fig. 2 is a kind of structural schematic diagram (pressure head of fixture for chip radio frequency performance test described in the utility model
It pushes).
Fig. 3 is the part explosive view of pressure head component described in the utility model.
Fig. 4 is the assembling figure of test circuit board assemblies and chip to be measured described in the utility model.
Fig. 5 is the part explosive view of test circuit board assemblies described in the utility model.
Fig. 6 is the structural schematic diagram of chip positioning bracket described in the utility model.
Fig. 7 is the part explosive view of anisotropic conductive film component described in the utility model.
It is marked in figure：1- pedestal, 2- lifting device, 3- chip power cable, 4- radio-frequency input signals cable, 5- radio frequency are defeated
Signal cable out, 6- chip to be measured；
7- pressure head component, 71- pressure head, 72- spring, 73- sleeve, 74- guide plate；
8- tests circuit board assemblies, and 81- tests circuit board, 82- chip positioning bracket, 821- sliding slot, the installation of 822- chip
Hole, 83- anisotropic conductive film component, 831- anisotropic conductive film, 832- rigid plastic piece, 833- double-sided adhesive.
Specific embodiment
With reference to the accompanying drawing, the utility model is described in detail.
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only to explain this
Utility model is not used to limit the utility model.
As Figure 1-Figure 2, a kind of fixture for chip radio frequency performance test, including pedestal 1, on the pedestal 1
The test circuit board assemblies 8 being detachably equipped with, and with it is described test circuit board assemblies 8 be connected chip power cable 3,
Radio-frequency input signals cable 4 and radio frequency output signal cable 5, it is described test circuit board assemblies 8 right above be equipped with can be upper and lower
The pressure head component 7 of movement.
As shown in fig. 4-5, the test circuit board assemblies 8 include testing circuit board 81 and chip positioning bracket 82, with
And the anisotropic conductive film component 83 being equipped between the test circuit board 81 and chip positioning bracket 82, the test circuit
Detachable connection between plate 81 and chip positioning bracket 82.
The test circuit board 81 and chip power cable 3, radio-frequency input signals cable 4,5 phase of radio frequency output signal cable
Connection is used for chip testing.
As shown in fig. 6, being equipped with chip mounting hole compatible with the chip 6 to be measured in the middle part of the chip positioning bracket 82
822, to install chip 6 to be measured.The chip positioning bracket 82 is being equipped with sliding slot 821, institute close to test 81 side of circuit board
It states sliding slot 821 to be adapted with anisotropic conductive film component 83, anisotropic conductive film component 83 can slide in sliding slot 821, can
Anisotropic conductive film component 83 is plugged using the sliding slot 821, realizes the quick-replaceable of anisotropic conductive film component 83.
As shown in fig. 7, the anisotropic conductive film component 83 includes rigid plastic piece 832 and is glued by double-sided adhesive 833
Anisotropic conductive film 831 on the rigid plastic piece 832.Rigid plastic piece 832 is that anisotropic conductive film 831 provides rigid branch
Support, enables anisotropic conductive film component 83 to slide in the sliding slot 821 on chip positioning bracket 82, fast and easy more transversion side
Property conduction membrane module 83.
As shown in figure 3, the pressure head component 7 includes sleeve 73 and guide plate 74, ten are equipped in the sleeve 73 solely
Vertical pressure head 71, and each pressure head 71 is equipped with independent spring 72, surrounding of all pressure heads 71 along the chip 6 to be measured
Contour line is uniformly arranged, it is ensured that the pressure being applied on chip 6 to be measured is uniform.The pressure head component 7 is connected with lifting device 2,
The lifting device 2 drives pressure head component 7 to move up and down (lift or pushes), brings pressure to bear on chip 6 to be measured, thus realization to
It surveys 6 pin of chip and tests the connection of 8 pin of circuit board assemblies, complete current lead-through and signal transmission.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (10)
1. a kind of fixture for chip radio frequency performance test, which is characterized in that including pedestal (1), set on the pedestal (1)
Have test circuit board assemblies (8), and the chip power cable (3), the radio frequency that are connected with test circuit board assemblies (8) are defeated
Enter signal cable (4) and radio frequency output signal cable (5), be equipped with right above the test circuit board assemblies (8) to transport up and down
Dynamic pressure head component (7), test circuit board assemblies (8) are equipped with the chip positioning bracket for installing chip to be measured (6)
(82), the pressure head component (7) includes multiple independent pressure heads (71), and all pressure heads (71) are along the chip (6) to be measured
Surrounding contour line uniformly arrange.
2. a kind of fixture for chip radio frequency performance test according to claim 1, which is characterized in that the press head group
Part (7) is connected with lifting device (2).
3. a kind of fixture for chip radio frequency performance test according to claim 1, which is characterized in that the press head group
Part (7) includes sleeve (73) and guide plate (74), and multiple independent pressure heads (71), and each pressure are equipped in the sleeve (73)
Head (71) is equipped with independent spring (72).
4. a kind of fixture for chip radio frequency performance test according to claim 1, which is characterized in that the test electricity
Road board group part (8) includes test circuit board (81) and chip positioning bracket (82) and the test circuit board (81) and chip
The anisotropic conductive film component (83) being equipped between locating support (82).
5. a kind of fixture for chip radio frequency performance test according to claim 4, which is characterized in that the chip is fixed
Position bracket (82) is being equipped with sliding slot (821) close to test circuit board (81) side, the sliding slot (821) and anisotropic conductive film group
Part (83) is adapted.
6. a kind of fixture for chip radio frequency performance test according to claim 5, which is characterized in that the anisotropy
Conductive membrane module (83) includes that rigid plastic piece (832) and the anisotropy being adhered on the rigid plastic piece (832) are conductive
Film (831).
7. a kind of fixture for chip radio frequency performance test according to claim 4, which is characterized in that the chip is fixed
The compatible chip mounting hole (822) with the chip (6) to be measured is equipped in the middle part of position bracket (82).
8. a kind of fixture for chip radio frequency performance test according to claim 4, which is characterized in that the test electricity
Detachable connection between road plate (81) and chip positioning bracket (82).
9. -8 any a kind of fixture for chip radio frequency performance test according to claim 1, which is characterized in that described
Test circuit board assemblies (8) and pedestal (1) detachable connection.
10. -8 any a kind of fixture for chip radio frequency performance test according to claim 1, which is characterized in that institute
The quantity for stating pressure head (71) is at least four.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820584323.3U CN208109883U (en) | 2018-04-23 | 2018-04-23 | A kind of fixture for chip radio frequency performance test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820584323.3U CN208109883U (en) | 2018-04-23 | 2018-04-23 | A kind of fixture for chip radio frequency performance test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208109883U true CN208109883U (en) | 2018-11-16 |
Family
ID=64116490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820584323.3U Active CN208109883U (en) | 2018-04-23 | 2018-04-23 | A kind of fixture for chip radio frequency performance test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208109883U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110108907A (en) * | 2019-04-26 | 2019-08-09 | 中国电子科技集团公司第二十九研究所 | A kind of BGA package product radio frequency performance test fixture |
| CN113390588A (en) * | 2021-07-06 | 2021-09-14 | 上海应用技术大学 | Air tightness detection device and method for sealing bag |
| CN113770068A (en) * | 2021-11-11 | 2021-12-10 | 成都英思嘉半导体技术有限公司 | Automatic testing device and method for high-speed radio frequency chip |
| CN114400042A (en) * | 2022-03-22 | 2022-04-26 | 合肥悦芯半导体科技有限公司 | Memory test system |
| CN116840646A (en) * | 2023-07-05 | 2023-10-03 | 苏州联讯仪器股份有限公司 | Reliability test fixture |
-
2018
- 2018-04-23 CN CN201820584323.3U patent/CN208109883U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110108907A (en) * | 2019-04-26 | 2019-08-09 | 中国电子科技集团公司第二十九研究所 | A kind of BGA package product radio frequency performance test fixture |
| CN110108907B (en) * | 2019-04-26 | 2021-10-22 | 中国电子科技集团公司第二十九研究所 | Radio frequency performance test fixture for BGA (ball grid array) packaged product |
| CN113390588A (en) * | 2021-07-06 | 2021-09-14 | 上海应用技术大学 | Air tightness detection device and method for sealing bag |
| CN113770068A (en) * | 2021-11-11 | 2021-12-10 | 成都英思嘉半导体技术有限公司 | Automatic testing device and method for high-speed radio frequency chip |
| CN113770068B (en) * | 2021-11-11 | 2022-01-25 | 成都英思嘉半导体技术有限公司 | Automatic testing device and method for high-speed radio frequency chip |
| CN114400042A (en) * | 2022-03-22 | 2022-04-26 | 合肥悦芯半导体科技有限公司 | Memory test system |
| CN114400042B (en) * | 2022-03-22 | 2022-06-10 | 合肥悦芯半导体科技有限公司 | Memory test system |
| CN116840646A (en) * | 2023-07-05 | 2023-10-03 | 苏州联讯仪器股份有限公司 | Reliability test fixture |
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