CN208062046U - Chip bonding wiring board, display panel and display - Google Patents
Chip bonding wiring board, display panel and display Download PDFInfo
- Publication number
- CN208062046U CN208062046U CN201820447503.7U CN201820447503U CN208062046U CN 208062046 U CN208062046 U CN 208062046U CN 201820447503 U CN201820447503 U CN 201820447503U CN 208062046 U CN208062046 U CN 208062046U
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- output electrode
- vertical pivot
- wiring board
- pin
- chip bonding
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Abstract
The utility model is related to a kind of chip bonding wiring boards, including：Substrate, is equipped with multiple output electrodes, and the output electrode is arranged with a matrix type on the substrate；In the adjacent two sides of the two neighboring output electrode, at least one side extends to the vertical pivot of output electrode where the side and forms angle.The chip bonding wiring board, including substrate and output electrode.Output electrode on substrate, in the adjacent two sides of two neighboring output electrode, at least one side extends to the vertical pivot of output electrode where side and forms angle, to increase the distance between two neighboring output electrode, therefore, the possibility that the micro-short circuit caused by conducting particles aggregation squeezes between two neighboring output electrode can be reduced, improves the quality of chip bonding wiring board.
Description
Technical field
The utility model is related to display technology fields, more particularly to chip bonding wiring board, display panel and display.
Background technology
COG (Chip On Glass, chip are directly bound on glass) technology, COF technologies (Chip On Flex, or,
Chip On Film, chip on film) it is between display panel and driving IC (integrated circuit, integrated circuit) system
The interface engagement technique being connected.
Existing COG, COF technology, (Anisotropic Conductive Film, anisotropy are conductive by generally use ACF
Glued membrane) glue bonds together display panel and IC chip, to make drawing on display panel using the conducting particles in ACF glue
The output electrode of foot and IC chip electrode conduction between the two.
In the prior art, adjacent on display panel or IC chip when using ACF glue stickings display panel with IC chip
Short circuit can occur between two electrodes, cause poor contact.
Utility model content
Based on this, it is necessary in the prior art, can be sent out between two adjacent electrodes on display panel or IC chip
The problem of raw short circuit provides a kind of chip bonding wiring board, display panel and display.
A kind of chip bonding wiring board, including：Substrate is equipped with multiple output electrodes, and the output electrode is in the substrate
On arrange with a matrix type；In the adjacent two sides of the two neighboring output electrode, at least one side is to the side
The vertical pivot of output electrode extends and forms angle between the vertical pivot where side.
Said chip binds wiring board, including substrate and output electrode.Output electrode on substrate, two neighboring output electricity
In the adjacent two sides of pole, at least one side extends to the vertical pivot of output electrode where side and the shape between the vertical pivot
At angle, to increase the distance between two neighboring output electrode, therefore, it is possible to reduce between two neighboring output electrode
The possibility of micro-short circuit, improves the quality of chip bonding wiring board caused by conducting particles aggregation squeezes.
The chip bonding wiring board in one of the embodiments, the vertical pivot is perpendicular to two neighboring described defeated
Go out the line of centres of electrode.
The chip bonding wiring board in one of the embodiments, it is described defeated in the extending direction along the vertical pivot
It is up-narrow and down-wide trapezoidal to go out electrode.
The chip bonding wiring board in one of the embodiments, it is described defeated in the extending direction along the vertical pivot
It is wide at the top and narrow at the bottom trapezoidal to go out electrode.
The chip bonding wiring board in one of the embodiments, it is described defeated in the extending direction along the vertical pivot
The centre for going out electrode is narrow, and both ends are wide.
The chip bonding wiring board in one of the embodiments, the adjacent output electrode of any two, institute
The shape for stating output electrode is identical or different.
The chip bonding wiring board in one of the embodiments, the substrate includes glass, flexible circuit board
It is at least one.
A kind of display panel, including：Non-display area is equipped with multiple second pins, and the second pin is described non-aobvious
Show and arrange with a matrix type on region, in the adjacent two sides of the two neighboring second pin, at least one side to
The vertical pivot of second pin extends and forms angle between the vertical pivot where the side.
Above-mentioned display panel is equipped with second pin in non-display area.In the adjacent two sides of two neighboring second pin,
At least one side extends to the vertical pivot of second pin where side and forms angle between the vertical pivot, to increase
The distance between two neighboring second pin.Therefore, it is possible to reduce between two neighboring second pin because conducting particles aggregation is squeezed
Pressure causes the possibility of micro-short circuit, improves the quality of display panel.
A kind of display, including：Chip bonding wiring board；The chip bonding wiring board includes：Substrate is equipped with multiple defeated
Go out electrode, the output electrode is arranged with a matrix type on the substrate；Adjacent the two of the two neighboring output electrode
In side, at least one side extends to the vertical pivot of output electrode where the side and forms folder between the vertical pivot
Angle；Display panel；The display panel includes：Non-display area is equipped with multiple second pins, and the second pin is described non-
It arranges with a matrix type on display area, in the adjacent two sides of the two neighboring second pin, at least one side
The vertical pivot of second pin extends and forms angle between the vertical pivot where to the side；The chip bonding wiring board with
The display panel binding, the output electrode is bonded completely with the second pin or part is bonded.
Aforementioned display device, including aforementioned chip bonding wiring board and display panel pass through therebetween output electrode and
Two pins are electrically connected.For output electrode, due in the adjacent two sides of two neighboring output electrode, at least one side
The vertical pivot of output electrode extends and forms angle between the vertical pivot where to side, to increase two neighboring output electricity
The distance between pole, while second pin similarly increases the distance between two neighboring second pin, second pin with
During being electrically connected between output electrode, just it is not easy because being connected between two adjacent output electrodes or two adjacent second pins
And short circuit is caused, to improve the display quality of display.
The display in one of the embodiments, passes through ACF between the output electrode and the second pin
Glue sticking.
Description of the drawings
Fig. 1 is the electrode structure and distribution schematic diagram of driving chip in the prior art.
Fig. 2 is the enlarged diagram of two adjacent output electrodes in Fig. 1.
Fig. 3 is the electrode structure and distribution schematic diagram that one embodiment chips bind wiring board.
Fig. 4 is the electrode structure and distribution schematic diagram that one embodiment chips bind wiring board.
Fig. 5 is the electrode structure and distribution schematic diagram that one embodiment chips bind wiring board.
Fig. 6 is the electrode structure and distribution schematic diagram that one embodiment chips bind wiring board.
Fig. 7 is the electrode structure and distribution schematic diagram that one embodiment chips bind wiring board.
Fig. 8 is the electrode structure and distribution schematic diagram that one embodiment chips bind wiring board.
Fig. 9 is the electrode structure and distribution schematic diagram that one embodiment chips bind wiring board.
Figure 10 is the electrode structure and distribution schematic diagram that one embodiment chips bind wiring board.
Figure 11 is the structural schematic diagram of second pin in one embodiment.
Figure 12 is the connection relationship diagram of display in one embodiment.
Wherein, the meaning representated by each drawing reference numeral is：
100 substrate, 200 display panel
110 input electrode, 120 output electrode
210 second pin, 300 conducting particles
400 output electrode vertical pivots
Specific implementation mode
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, below in conjunction with the accompanying drawings to this
The specific implementation mode of utility model is described in detail.Elaborate many details in order to abundant in the following description
Understand the utility model.But the utility model can be much to implement different from other manner described here, this field
Technical staff can do similar improvement without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific embodiment opened.
In existing display technology, ACF glue stickings display panel and driving chip are usually utilized, so as to so that display surface
It is connected together by ACF gluings between the pin of plate and the output electrode of driving chip, so that output electrode and driving core
It is electrically conducted by the conducting particles in ACF glue between the pin of piece.However display panel is being connected using the conducting particles of ACF glue
Pin and driving chip output electrode when, may be due to conductive particle between two neighboring output electrode or two neighboring pin
Son extruding and cause micro-short circuit.
Based on problem above, a kind of chip bonding wiring board of the application offer, i.e., above-mentioned driving chip, including：Substrate
100。
Substrate 100 is equipped with input electrode and output electrode 120, and input electrode 110 is set to substrate with output electrode 120
100 opposite sides side.Output electrode 120 is used to be electrically connected with display panel so that output electrode 120 and display panel it
Between be connected.Wherein, input electrode 110 can be arranged in the form of rectangular array on the substrate 100, and output electrode 120 is in substrate
It is also arranged in the form of rectangular array on 100.In the adjacent two sides of two neighboring output electrode 120, at least one side to
The vertical pivot of output electrode extends and forms angle where the side.
In the present embodiment, it is not related to the change of input electrode 110, therefore repeats no more.
Specifically, as shown in Figure 1, being the electrode structure and distribution schematic diagram of driving chip in the prior art.It can from Fig. 1
To find out, the two neighboring output electrode 120 on substrate 100 is set to apart from relatively closely, is using ACF glue stickings output electrode 120
When with the second pin of display panel, it may be squeezed due to the conducting particles in ACF glue, and cause two neighboring output electrode
It is short-circuit between 120.Input electrode 110 is not related to the technical solution of the application in Fig. 1, repeats no more.
As shown in Fig. 2, for the enlarged diagram of two neighboring output electrode 120.In fig. 2, laterally intermittent line is to pass through
The line of centres at two 120 centers of output electrode.Vertical line is output electrode vertical pivot 400.Output electrode vertical pivot 400 is perpendicular to transverse direction
Intermittent line.The line of centres of the output electrode vertical pivot 400 perpendicular to two neighboring output electrode 120.
In order to solve the above technical problems, in the present embodiment, the adjacent two sides of two neighboring output electrode 120 are used
In, at least one side extends to output electrode vertical pivot 400 where the side and forms the technology of angle between the vertical pivot
Means.In adjacent two sides, can only it extend to output electrode vertical pivot 400 where the side there are one side and and output electrode
Angle is formed between vertical pivot 400, it is possibility to have two sides are to 400 extension of output electrode vertical pivot where the side and electric with output
Angle is formed between pole vertical pivot 400.Specifically, can be two neighboring defeated with as shown in figure 3, in two neighboring output electrode 120
Go out in electrode 120, adjacent two sides all extend to output electrode vertical pivot 400 where the side and with output electrode vertical pivot 400 it
Between form angle.
Said chip binds wiring board, including substrate 100 and output electrode 120.Output electrode 120 on substrate 100, phase
In the adjacent two sides of adjacent two output electrodes 120, at least one side extends to the vertical pivot of output electrode 120 where side
And angle is formed, to increase the distance between two neighboring output electrode 120, therefore, it is possible to reduce two neighboring output
Between electrode 120 because conducting particles aggregation squeeze caused by micro-short circuit possibility, improve chip bonding wiring board quality.
Output electrode vertical pivot 400 in one embodiment, in the adjacent two sides of above-mentioned two neighboring output electrode 120,
At least one side extends to output electrode vertical pivot 400 where the side and forms angle, can be specifically, in prolonging along vertical pivot
Stretch direction, output electrode 120 be it is up-narrow and down-wide trapezoidal, as shown in Figure 3.
In one embodiment, in the adjacent two sides of above-mentioned two neighboring output electrode 120, at least one side to this
Output electrode vertical pivot 400 extends and forms angle where side, can be specifically, in the extending direction along vertical pivot, output electrode
120 is wide at the top and narrow at the bottom trapezoidal, as shown in Figure 4.
In one embodiment, said chip binds wiring board, the adjacent output electrode 120 of any two, shape
It can be the same or different, as shown in Figure 5.
In one embodiment, in the adjacent two sides of the two neighboring output electrode of said chip binding wiring board 120, until
A few side extends to output electrode vertical pivot 400 where the side and forms angle, can be specifically, in the extension along vertical pivot
The centre in direction, output electrode 120 is narrow, and both ends are wide, as shown in Figure 6.
It is to be appreciated that in this application, used technological means is adjacent the two of two neighboring output electrode 120
In side, at least one side extends to output electrode vertical pivot 400 where the side and forms angle.The technological means is by subtracting
The area of small output electrode 120 is to reduce the distance between two neighboring output electrode 120.Therefore, if there is other logical
The embodiment that the technological means reduces the distance between two neighboring output electrode 120 is crossed, it will be also be appreciated that the application's
Among protection domain.As shown in fig. 7, for narrow, two hem widths among output electrode 120, and two sides are respectively relative to the side institute
In a kind of symmetrical situation of output electrode vertical pivot 400.As shown in figure 8, a side for output electrode 120 is trapezoidal to output
The case where electrode vertical pivot 400 extends and forms angle, the trapezoidal short side is close to output electrode where the described side.Such as Fig. 9
It is shown, for output electrode 120 two sides it is trapezoidal respectively extend to output electrode vertical pivot 400 and the case where form angle,
Described two trapezoidal short sides are respectively close to output electrode where the described side.As shown in Figure 10, it is one of output electrode 120
Side is trapezoidal to be extended to output electrode vertical pivot 400 and forms angle, another side is arc-shaped to prolong to output electrode vertical pivot 400
The case where stretching and forming angle.Above-mentioned trapezoidal short side is close to output electrode where the side, two neighboring to increase
The distance between output electrode 120 squeezes therefore, it is possible to reduce because of conducting particles to assemble between two neighboring output electrode 120
The possibility of micro-short circuit is caused, the quality of chip bonding wiring board is improved.The application also provides a kind of display panel, including：It is non-
Display area is equipped with multiple second pins 210.Second pin 210 is arranged with a matrix type on non-display area.Adjacent two
In the adjacent two sides of a second pin 210, at least one side is prolonged to the vertical pivot of second pin 210 where the side
It stretches and forms angle.
Specifically, display panel matches with said chip binding wiring board.Second pin 210 on display panel is used for
It is electrically connected with the output electrode on chip bonding wiring board.Therefore, it is the above-mentioned short circuit problem of solution, second on display panel
Pin 210 may be used and the identical structure of the said chip binding output electrode of wiring board, i.e. two neighboring second pin 210
Adjacent two sides in, at least one side extends to the vertical pivot of second pin 210 where the side and forms angle.Such as figure
It is the structural schematic diagram of second pin 210 in one embodiment shown in 11.
It is to be appreciated that second pin 210 is identical as the technological means that above-mentioned output electrode uses, it is therefore, above-mentioned defeated
Go out each structural schematic diagram of electrode, it should also can be applied to the second pin 210 on display panel.
Above-mentioned display panel is equipped with second pin 210 in non-display area.Adjacent the two of two neighboring second pin 210
In side, at least one side extends and is formed angle to the vertical pivot of second pin 210 where the side, to increase phase
The distance between adjacent two second pins 210.Therefore, it is possible to reduce between two neighboring second pin 210 because conducting particles is poly-
Collection squeezes the possibility for causing micro-short circuit, improves the quality of display panel.
The application also provides a kind of display, including：Chip bonding wiring board and display panel 200.
Chip bonding wiring board includes substrate 100, and substrate 100 is equipped with input electrode (not shown) and output electrode
120, output electrode 120 is set on substrate 100, and is arranged with a matrix type.Output electrode 120 is used for and display panel
200 are electrically connected, so as to be connected between output electrode 120 and display panel 200.Wherein, input electrode on the substrate 100 can be with
It is arranged in the form of rectangular array, output electrode 120 is also arranged in the form of rectangular array on the substrate 100.It is two neighboring defeated
Go out in the adjacent two sides of electrode 120, at least one side extends to the vertical pivot of output electrode 120 where the side and forms folder
Angle.
Display panel 200, including：Non-display area is equipped with multiple second pins 210.Second pin 210 is in non-display area
It arranges with a matrix type on domain.In the two neighboring adjacent two sides for stating second pin 210, at least one side is to the side
The vertical pivot of second pin 210 extends and forms angle where side.Second pin 210 is used for and the output on chip bonding wiring board
Electrode 120 is electrically connected.In general, passing through ACF between output electrode 120 in second pin 210 and chip bonding wiring board
Glue sticking, to be electrically conducted output electrode 120 and second pin 210 using the conducting particles 300 in ACF glue.
After chip bonding wiring board and display panel 200 are bound, output electrode 120 be bonded completely with second pin 210 or
Part is bonded.
Therefore, to prevent between two neighboring output electrode 120 micro-short circuit caused by the aggregation of conducting particles 300 squeezes, or
Between two neighboring second pin 210 because conducting particles 300 aggregation squeeze caused by micro-short circuit, it is in the present embodiment, two neighboring
In the adjacent two sides of output electrode 120, at least one side extends and is formed to the vertical pivot of output electrode 120 where the side
Angle；And in the adjacent two sides of two neighboring second pin 210, at least one side is to second pin 210 where the side
Vertical pivot extend and form angle.
Aforementioned display device, including aforementioned chip bonding wiring board and display panel 200, pass through therebetween output electrode
120 and second pin 210 be electrically connected.For output electrode 120, due to the adjacent two sides of two neighboring output electrode 120
In, at least one side extends and is formed angle to the vertical pivot of output electrode 120 where the side, to increase adjacent two
The distance between a output electrode 120, while second pin 210 similarly increases between two neighboring second pin 210
Distance during electrical connection between second pin 210 and output electrode 120, is just not easy because of two adjacent output electrodes 120
Or be connected between two adjacent second pins 210 and cause short circuit, to improve the display quality of display.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of chip bonding wiring board, which is characterized in that including：
Substrate, is equipped with multiple output electrodes, and the output electrode is arranged with a matrix type on the substrate；Two neighboring institute
In the adjacent two sides for stating output electrode, at least one side extend to the vertical pivot of output electrode where the side and with institute
It states and forms angle between vertical pivot.
2. chip bonding wiring board according to claim 1, which is characterized in that the vertical pivot is perpendicular to two neighboring described
The line of centres of output electrode.
3. chip bonding wiring board according to claim 2, which is characterized in that in the extending direction along the vertical pivot, institute
It is up-narrow and down-wide trapezoidal to state output electrode.
4. chip bonding wiring board according to claim 2, which is characterized in that in the extending direction along the vertical pivot, institute
It is wide at the top and narrow at the bottom trapezoidal to state output electrode.
5. chip bonding wiring board according to claim 2, which is characterized in that in the extending direction along the vertical pivot, institute
The centre for stating output electrode is narrow, and both ends are wide.
6. the chip bonding wiring board according to claim 3 to 5 any one, which is characterized in that any two is adjacent
The shape of the output electrode, the output electrode is identical or different.
7. chip bonding wiring board according to claim 1, which is characterized in that the substrate includes glass, flexible circuitry
At least one of plate.
8. a kind of display panel, which is characterized in that including：
Non-display area, is equipped with multiple second pins, and the second pin is arranged with a matrix type on the non-display area
Cloth, in the adjacent two sides of the two neighboring second pin, at least one side is to second pin where the side
Vertical pivot extends and forms angle between the vertical pivot.
9. a kind of display, which is characterized in that including：
Chip bonding wiring board；The chip bonding wiring board includes：Substrate is equipped with multiple output electrodes, the output electrode
It arranges with a matrix type on the substrate；In the adjacent two sides of the two neighboring output electrode, at least one side
While extending to the vertical pivot of output electrode where the side and forming angle between the vertical pivot；
Display panel；The display panel includes：Non-display area is equipped with multiple second pins, and the second pin is described
It arranges with a matrix type on non-display area, in the adjacent two sides of the two neighboring second pin, at least one side
While extending to the vertical pivot of second pin where the side and forming angle between the vertical pivot；
The chip bonding wiring board and the display panel are bound, the output electrode be bonded completely with the second pin or
Part is bonded.
10. display according to claim 9, which is characterized in that lead between the output electrode and the second pin
Cross ACF glue stickings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820447503.7U CN208062046U (en) | 2018-03-30 | 2018-03-30 | Chip bonding wiring board, display panel and display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820447503.7U CN208062046U (en) | 2018-03-30 | 2018-03-30 | Chip bonding wiring board, display panel and display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208062046U true CN208062046U (en) | 2018-11-06 |
Family
ID=63986802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820447503.7U Active CN208062046U (en) | 2018-03-30 | 2018-03-30 | Chip bonding wiring board, display panel and display |
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| Country | Link |
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| CN (1) | CN208062046U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109597254A (en) * | 2019-01-08 | 2019-04-09 | 深圳市华星光电半导体显示技术有限公司 | The structure and display panel in chip bonding region |
| WO2020118822A1 (en) * | 2018-12-11 | 2020-06-18 | 武汉华星光电半导体显示技术有限公司 | Display apparatus |
| WO2021232529A1 (en) * | 2020-05-18 | 2021-11-25 | 武汉华星光电半导体显示技术有限公司 | Binding region circuit |
| WO2023216070A1 (en) * | 2022-05-09 | 2023-11-16 | 京东方科技集团股份有限公司 | Light-emitting substrate, backlight module, and display device |
-
2018
- 2018-03-30 CN CN201820447503.7U patent/CN208062046U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020118822A1 (en) * | 2018-12-11 | 2020-06-18 | 武汉华星光电半导体显示技术有限公司 | Display apparatus |
| CN109597254A (en) * | 2019-01-08 | 2019-04-09 | 深圳市华星光电半导体显示技术有限公司 | The structure and display panel in chip bonding region |
| WO2021232529A1 (en) * | 2020-05-18 | 2021-11-25 | 武汉华星光电半导体显示技术有限公司 | Binding region circuit |
| WO2023216070A1 (en) * | 2022-05-09 | 2023-11-16 | 京东方科技集团股份有限公司 | Light-emitting substrate, backlight module, and display device |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Yungu (Gu'an) Technology Co., Ltd.|Bazhou Yungu Electronic Technology Co., Ltd.|Kunshan Institute of technology new flat panel display technology center Co., Ltd Assignor: Kunshan Guo Xian Photoelectric Co., Ltd. Contract record no.: X2019990000156 Denomination of utility model: Circuit board, display panel and display are bound to chip Granted publication date: 20181106 License type: Common License Record date: 20191030 |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191216 Address after: No. 2 Xiangshan Avenue, Yongning Street, Zengcheng District, Guangzhou, Guangdong province (the core of Zengcheng economic and Technological Development Zone) Patentee after: Guangzhou Guoxian Technology Co., Ltd Address before: 215300, No. 1, Longteng Road, Kunshan Development Zone, Jiangsu, Suzhou, 4 Patentee before: Kunshan Guo Xian Photoelectric Co., Ltd. |