CN109597254A - The structure and display panel in chip bonding region - Google Patents
The structure and display panel in chip bonding region Download PDFInfo
- Publication number
- CN109597254A CN109597254A CN201910015383.2A CN201910015383A CN109597254A CN 109597254 A CN109597254 A CN 109597254A CN 201910015383 A CN201910015383 A CN 201910015383A CN 109597254 A CN109597254 A CN 109597254A
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- CN
- China
- Prior art keywords
- opening portion
- organic film
- channel
- chip bonding
- bonding region
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
Abstract
A kind of structure in chip bonding region, for binding the driving chip of display panel.The structure in chip bonding region includes glass substrate and the organic film on glass substrate.Organic film has an opening portion, is used to accommodate driving chip.It is equipped with an at least channel around organic film adjacent apertures portion, extends into organic film and is connected to the opening portion.
Description
[technical field]
The present invention relates to field of display technology, more particularly to the structure and display panel in a kind of chip bonding region.
[background technique]
As display technology develops, FPD is early had become used in main flow display part instantly.In panel display apparatus
In, either liquid crystal display panel or organic LED display panel, in order to control each pixel, usually in battle array
Thin film transistor (TFT) (Thin Film Transistor, abbreviation TFT) is provided on column substrate, for controlling and driving film crystal
The driving chip and route template die group of pipe.
Wiring board module group procedure include by chip bonding on the glass substrate of display panel, or will be with driving circuit
Flexible circuitry such as is bonded on display panel at the techniques.In the prior art, display panel and flexible circuit board, chip module etc. assemble
It is pressed and is fixed using conducting resinl, wherein display panel can be given in manufacturing process according to the preparatory slot milling in chip bonding position
Chip bonding is used.Specifically, film layer of the meeting inside display panel excavates one close to chip shape according to the shape of chip
Region, later, chip can be bound in the region excavated.However, the chip bonding position of conventional display panels is rectangle
Frame-shaped, it is interior to be used for applying conductive glue.It can be spread toward surrounding when passing through chip pressing due to conducting resinl, but traditional die is bound
For the configuration of position, chip pressing sticks together process, bubble is easy to produce between conducting resinl and glass substrate, and can not effectively arrange
Chip bonding position is released, causes bubble to lodge in conducting resinl, influences the binding effect of chip, be more likely to have chip can not
Effect running, the problem for causing the display of display device abnormal.
[summary of the invention]
The purpose of the present invention is to provide a kind of structures in chip bonding region, can effectively reduce chip bonding in substrate
Binding reserved area process when, cause conductive adhesive film and bind reserved area between bubble occur and remain.
To achieve the above object, the structure in chip bonding region of the invention, for binding the driving chip of display panel.
The structure in the chip bonding region includes: glass substrate；And organic film, it is set on the glass substrate, and described organic
Film layer has an opening portion, is used to accommodate the driving chip；Wherein around the adjacent opening portion of the organic film
Equipped with an at least channel, an at least channel extends into the organic film and is connected to the opening portion.
A preferred embodiment according to the present invention, the opening portion include four ends, and the organic film is adjacent described
Four ends are respectively equipped with the channel.
Another preferred embodiment according to the present invention is respectively equipped between wantonly two ends of the opening portion at least another
One channel.
Another preferred embodiment according to the present invention, the channel of four ends is respectively by the corresponding sloped-end
Ground extends a preset distance.
Another preferred embodiment according to the present invention, the opening portion have a rectangular configuration, and the organic film is adjacent
The every of the opening portion is equipped at least one channel on one side.
Another preferred embodiment according to the present invention, the organic film is made for polyimides, and the driving chip
It is bound on the glass substrate by conductive adhesive film, in the opening portion relative to the organic film.
The present invention additionally provides a kind of display panel, the structure including chip bonding region, the chip bonding region
Structure includes: glass substrate；And organic film, it is set on the glass substrate, and the organic film has an opening portion,
For accommodating the driving chip；An at least channel is wherein equipped with around the adjacent opening portion of the organic film, it is described
An at least channel extends into the organic film and is connected to the opening portion.
A preferred embodiment according to the present invention, the opening portion include four ends, and the organic film is adjacent described
Four ends are respectively equipped with the channel.
Another preferred embodiment according to the present invention, the channel of four ends is respectively by the corresponding sloped-end
Ground extends a preset distance.
Another preferred embodiment according to the present invention, the opening portion have a rectangular configuration, and the organic film is adjacent
The every of the opening portion is equipped at least one channel on one side.
The structure in chip bonding region of the invention is designed using the channel around the opening portion, makes the conducting resinl
Bubble in film can be discharged by the channel, effectively reduce gas bubbles left in the conductive adhesive film, it is ensured that the driving core
The reliability and firm binding that piece electrically conducts.The structure in chip bonding region of the invention effectively solves traditional die binding
When, it be easy to cause in conductive adhesive film and remains bubble, and then influence the firm of reliability that chip electrically conducts and chip bonding
Problem.
[Detailed description of the invention]
Fig. 1 is the sectional schematic diagram of the structure in the chip bonding region of a preferred embodiment according to the present invention.
Fig. 2 is the floor map of the structure in the chip bonding region of a preferred embodiment according to the present invention.
Fig. 3 is the structure in chip bonding region according to the present invention and standing for chip bonding
Body decomposition diagram.
Fig. 4 is the floor map of the structure in the chip bonding region of another preferred embodiment according to the present invention.
Fig. 5 is the floor map of the structure in the chip bonding region of another preferred embodiment according to the present invention.
Fig. 6 is the floor map of the display panel of a preferred embodiment according to the present invention.
[specific embodiment]
The explanation of following embodiment is to can be used to the particular implementation of implementation to illustrate the present invention with reference to additional schema
Example.The direction term that the present invention is previously mentioned, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outside", " side "
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand the present invention, rather than to
The limitation present invention.
The present invention is a kind of structure in chip bonding region, is used to bind the driving chip of display panel, wherein described
Driving chip is for controlling and providing the signal for stating the pixel unit of display panel.In this preferred embodiment, the driving core
Interface between piece and the display panel, which is connected, can be used chip and is directly bound COG technique (Chip On on the glass substrate
Glass, COG) or chip be directly bound the COB technique (ChipOn Board, COB) on flexible circuit board.It is identical to routine
Technology, the display panel advance for the region of chip bonding in manufacturing process.In addition, display panel of the present invention
It can be general liquid crystal display panel or organic LED display panel comprising underlay substrate, array substrate, or shine
Mold layer etc. (not shown), detailed film layer structure are no longer illustrated in this.
Fig. 1 is the sectional schematic diagram of the structure in the chip bonding region of a preferred embodiment according to the present invention.Such as Fig. 1 institute
It states, the structure in chip bonding region of the invention includes glass substrate 1 and the organic film 2 on the glass substrate 1,
Described in organic film 2 be polyimides (polyimide, PI) it is made, be only not limited thereto.The organic film 2 has
One opening portion 20, is used to accommodate driving chip 3.The driving chip 3 is bound to the glass substrate 1 by conductive adhesive film 31
On in opening portion 20 relative to the organic film 2, wherein the conductive adhesive film 31 is anisotropic conductive adhesive paste
(Anisotropic Conductive Film, ACF), and corresponding chip electrode is equipped at the corresponding binding of the glass substrate 1
Metal contacts (not shown).
Fig. 2 is the floor map of the structure in the chip bonding region of a preferred embodiment according to the present invention.Such as Fig. 2 institute
Show, depending on profile of the form and dimension of the opening portion 20 according to the driving chip 3, and the area of the opening portion 20 is
Equal to or more than the area of the driving chip 3.Specifically, being set around the adjacent opening portion 20 of the organic film 2
There is an at least channel 21, extend into the organic film 2 and is connected to the opening portion 20.Preferably, the opening portion 20
Including four ends 201, adjacent four ends 201 of the organic film 2 are respectively equipped with the channel 21, and each described
Channel 21 obliquely extends a preset distance by the corresponding end 201 respectively.In this preferred embodiment, four ends
The channel 21 in portion 201 is inclined outwardly respectively, and structure is in angle of 45 degrees between horizontal line.
Fig. 3 is the structure in chip bonding region according to the present invention and the perspective exploded view of chip bonding.The drive
Dynamic chip 3 is sticked together by the conductive adhesive film 31 to be bound in the opening portion 20.Since conductive adhesive film will receive solidification temperature
It is different and influence curing degree, it more or less will cause the generation of bubble.When the conductive adhesive film is attached on the glass substrate 1
At the corresponding opening portion 20, since the shape size of the opening portion 20 is coincident with the driving chip 3, the bubble is natural
It is discharged around opening portion 20 described in no normal direction, and the reliability that image chip electrically conducts.As shown in figure 3, of the present invention
The channel 21 of four ends 201 can effectively provide the bubble by being discharged in institute's conductive adhesive film 31.In particular, the driving
Chip 3 is bound in the opening portion 20 by appropriate pressure, and the pressure will cause the bubble and squeeze outside toward surrounding, and described
The setting in the channel 21 of four ends 201 can play maximum effect discharge bubble, it is ensured that between firm and chip and the ACF of binding
It is reliable to be electrically connected.
Fig. 4 is the floor map of the structure in the chip bonding region of another preferred embodiment according to the present invention.It is described
Opening portion 20 according to driving chip configuration and have a rectangular configuration.The adjacent opening portion 20 of the organic film 2 it is every
One short side is equipped with a channel 21, and each long side of the adjacent opening portion 20 is equipped with two channels 21, the channel
21 extend outwardly to enter the organic film 2 by the opening portion 20.
Fig. 5 is the floor map of the structure in the chip bonding region of another preferred embodiment according to the present invention.It is described
Organic film 2 is respectively equipped at least another channel 21 between adjacent wantonly two end 201, and the channel 21 is by described
Opening portion 20 extends outwardly to enter the organic film 2.Earlier figures 4 and the channel 21 shown in fig. 5, effect and Fig. 2 institute
Show that the channel of embodiment is identical, that is, is to be discharged ACF because of bubble caused by chip bonding.
The structure in chip bonding region of the invention is designed using the channel 21 around the opening portion 20, makes described lead
Bubble in electric glue film 31 can be discharged by the channel 21, effectively reduce gas bubbles left in the conductive adhesive film 31, it is ensured that
The reliability and firm binding that the driving chip 3 electrically conducts.The structure in chip bonding region of the invention effectively solves
It when traditional die is bound, be easy to cause in conductive adhesive film and remains bubble, and then influence reliability and chip that chip electrically conducts
The firm problem of binding.
The present invention additionally provides a kind of display panels.As described in Figure 6, display panel 10 of the invention, including chip bonding
The structure in region.The display panel 10 includes positioned at the effective display area domain 101 at frame position and around effective display
The noneffective display area domain 102 in region 101, wherein the chip bonding region is located in the noneffective display area domain 102.Institute
The structure for stating the chip bonding region of display panel 10 has been specified in previous embodiment, is no longer repeated in this.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (10)
1. a kind of structure in chip bonding region, for binding the driving chip of display panel, which is characterized in that the chip is tied up
The structure for determining region includes:
Glass substrate；And
Organic film is set on the glass substrate, and the organic film has an opening portion, is used to accommodate the driving
Chip；
An at least channel is wherein equipped with around the adjacent opening portion of the organic film, an at least channel extends into
The organic film is simultaneously connected to the opening portion.
2. the structure in chip bonding region as claimed in claim 1, which is characterized in that the opening portion includes four ends, described
Adjacent four ends of organic film are respectively equipped with the channel.
3. the structure in chip bonding region as claimed in claim 2, which is characterized in that between wantonly two ends of the opening portion
It is respectively equipped at least another channel.
4. the structure in chip bonding region as claimed in claim 2, which is characterized in that the channel of four ends is respectively by corresponding
The sloped-end extend a preset distance.
5. the structure in chip bonding region as claimed in claim 1, which is characterized in that the opening portion has a rectangular configuration, institute
It states the every of the adjacent opening portion of organic film and is equipped at least one channel on one side.
6. the structure in chip bonding region as claimed in claim 1, which is characterized in that the organic film is that polyimides is made,
And the driving chip is bound on the glass substrate by conductive adhesive film, in the opening portion relative to the organic film.
7. a kind of display panel, the structure including chip bonding region, which is characterized in that the structure packet in the chip bonding region
It includes:
Glass substrate；And
Organic film is set on the glass substrate, and the organic film has an opening portion, is used to accommodate the driving
Chip；
An at least channel is wherein equipped with around the adjacent opening portion of the organic film, an at least channel extends into
The organic film is simultaneously connected to the opening portion.
8. display panel as claimed in claim 7, which is characterized in that the opening portion includes four ends, the organic film phase
Adjacent four ends are respectively equipped with the channel.
9. display panel as claimed in claim 8, which is characterized in that the channel of four ends is respectively by the corresponding end
Obliquely extend a preset distance.
10. display panel as claimed in claim 7, which is characterized in that the opening portion has a rectangular configuration, the organic film
The every of the adjacent opening portion is equipped at least one channel on one side.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910015383.2A CN109597254A (en) | 2019-01-08 | 2019-01-08 | The structure and display panel in chip bonding region |
| PCT/CN2019/082857 WO2020143127A1 (en) | 2019-01-08 | 2019-04-16 | Structure of chip binding region, and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910015383.2A CN109597254A (en) | 2019-01-08 | 2019-01-08 | The structure and display panel in chip bonding region |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109597254A true CN109597254A (en) | 2019-04-09 |
Family
ID=65965121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910015383.2A Pending CN109597254A (en) | 2019-01-08 | 2019-01-08 | The structure and display panel in chip bonding region |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109597254A (en) |
| WO (1) | WO2020143127A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020143127A1 (en) * | 2019-01-08 | 2020-07-16 | 深圳市华星光电半导体显示技术有限公司 | Structure of chip binding region, and display panel |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10335776A (en) * | 1997-05-28 | 1998-12-18 | Sony Corp | Printed circuit board |
| JP2002076059A (en) * | 2000-09-01 | 2002-03-15 | Misuzu Kogyo:Kk | Circuit board |
| CN103295937A (en) * | 2013-05-21 | 2013-09-11 | 北京京东方光电科技有限公司 | Binding equipment and binding method of chip |
| CN103367947A (en) * | 2012-04-10 | 2013-10-23 | 宸鸿科技(厦门)有限公司 | Connection structure |
| CN106793495A (en) * | 2016-12-13 | 2017-05-31 | 中国电子科技集团公司第二十研究所 | A kind of groove pcb board structure and its manufacture method for bare chip test |
| CN208062046U (en) * | 2018-03-30 | 2018-11-06 | 昆山国显光电有限公司 | Chip bonding wiring board, display panel and display |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206805089U (en) * | 2017-04-20 | 2017-12-26 | 深圳市屏柔科技有限公司 | It is a kind of using conductive fabric connection PCB and the attachment structure of liquid crystal display |
| CN109597254A (en) * | 2019-01-08 | 2019-04-09 | 深圳市华星光电半导体显示技术有限公司 | The structure and display panel in chip bonding region |
-
2019
- 2019-01-08 CN CN201910015383.2A patent/CN109597254A/en active Pending
- 2019-04-16 WO PCT/CN2019/082857 patent/WO2020143127A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10335776A (en) * | 1997-05-28 | 1998-12-18 | Sony Corp | Printed circuit board |
| JP2002076059A (en) * | 2000-09-01 | 2002-03-15 | Misuzu Kogyo:Kk | Circuit board |
| CN103367947A (en) * | 2012-04-10 | 2013-10-23 | 宸鸿科技(厦门)有限公司 | Connection structure |
| CN103295937A (en) * | 2013-05-21 | 2013-09-11 | 北京京东方光电科技有限公司 | Binding equipment and binding method of chip |
| CN106793495A (en) * | 2016-12-13 | 2017-05-31 | 中国电子科技集团公司第二十研究所 | A kind of groove pcb board structure and its manufacture method for bare chip test |
| CN208062046U (en) * | 2018-03-30 | 2018-11-06 | 昆山国显光电有限公司 | Chip bonding wiring board, display panel and display |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020143127A1 (en) * | 2019-01-08 | 2020-07-16 | 深圳市华星光电半导体显示技术有限公司 | Structure of chip binding region, and display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020143127A1 (en) | 2020-07-16 |
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| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190409 |
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| RJ01 | Rejection of invention patent application after publication |