CN208047153U - A kind of uniform-temperature radiator with partition board - Google Patents
A kind of uniform-temperature radiator with partition board Download PDFInfo
- Publication number
- CN208047153U CN208047153U CN201820670235.5U CN201820670235U CN208047153U CN 208047153 U CN208047153 U CN 208047153U CN 201820670235 U CN201820670235 U CN 201820670235U CN 208047153 U CN208047153 U CN 208047153U
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- China
- Prior art keywords
- partition board
- cavity
- cooling fin
- uniform
- temperature radiator
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of uniform-temperature radiator with partition board, including cover board, partition board and cooling fin, the cover board, partition board and cooling fin are fixedly mounted successively, the partition board is equipped with hollow cavity, the partition board is equipped with the first seal groove in the periphery of cavity, and position corresponding with the first seal groove is equipped with the second seal groove on the cooling fin；The cover board and cooling fin are equipped with capillary structure layer on position corresponding with cavity, and the cavity is filled with volatile liquid, has many advantages, such as that high thermal conductivity, good isothermal, thermal response are fast, simple in structure, at low cost.
Description
Technical field
The utility model is related to heat sink technology fields, more particularly, to a kind of uniform-temperature radiator with partition board.
Background technology
Existing uniform-temperature radiator is that temperature-uniforming plate and cooling fin are formed by welding or riveting process combination, due to generating interface
Thermal resistance problem, and interface thermal resistance size determines the heat-sinking capability of integrated radiator, therefore technique is welded or riveted to thermal conductivity
There can be larger impact, fail to reach ideal heat-conducting effect.The radiator for filling heat conducting pipe is also to be influenced by a variety of heat-conducting mediums
To heat conductivility.
Uniform-temperature radiator uses full copper material, cost higher.According to unlike material, such as aluminum material and copper, aluminum material
Electronickelling is wanted before being combined with copper or aluminium soldering, and cooling fin cavity is generally formed using numerical control milling, high processing costs, and heat conduction
Limited capacity.
Utility model content
The main purpose of the utility model is to overcome above-mentioned shortcomings, provide a kind of uniform-temperature radiator with partition board.
The technical solution of the utility model is：A kind of uniform-temperature radiator with partition board, including cover board, partition board and cooling fin,
The cover board, partition board and cooling fin are fixedly mounted successively, and the partition board is equipped with hollow cavity, and the partition board is in the outer of cavity
It is equipped with the first seal groove week, position corresponding with the first seal groove is equipped with the second seal groove on the cooling fin；The cover board
Capillary structure layer is equipped on position corresponding with cavity with cooling fin, and the cavity is filled with volatile liquid.
Further, first seal groove, be equipped with fluid sealant in the second seal groove, for bond successively cover board, every
Plate and cooling fin.
Further, the cavity is " king " font inner cavity.
Further, several fins arranged in parallel are equipped with below the cooling fin, increase heat dissipation area.
Further, the partition board side wall is equipped with exhaust tube, and exhaust tube connects the cavity.
Further, the capillary structure layer is sintering generating structure.
Compared with prior art, the utility model has the following advantages that：
Uniform-temperature radiator provided by the utility model with partition board, cover board, partition board and cooling fin are fixedly mounted successively, lid
Plate and cooling fin are equipped with capillary structure layer on position corresponding with cavity, and the cavity is filled with volatile liquid.This
It is volatile in cavity after sample one, this uniform-temperature radiator can not only be radiated by cooling fin, but also its cover board is heated
Heat is quickly taken away heat source position by liquid, can be converted into steam state by liquid and be passed to low-temperature space rapidly, and being condensed into liquid can lead to again
It crosses its capillary structure laminar flow and is back to heat source position, then heat is converted into steam state, gas-liquid two-phase cycle is realized, so as to improving heat transfer
Efficiency, can temperature uniforming heat radiation, heat dissipation effect is more preferable.
Description of the drawings
Fig. 1 is the overall diagram of the uniform-temperature radiator with partition board in the present embodiment 1；
Fig. 2 is the explosive view of the uniform-temperature radiator with partition board in the present embodiment 1；
Reference sign：1 is cover board, and 2 be partition board, and 3 be cooling fin, and 21 be cavity, and 22 be exhaust tube, and 211 be first
Seal groove, 311 be the second seal groove, and 31 be fin.
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific implementation mode
The preferred embodiment of the utility model is described in detail below in conjunction with the accompanying drawings, so that the advantages of the utility model
It is more easy to be readily appreciated by one skilled in the art with feature, to make apparent define to the scope of protection of the utility model.
Embodiment 1
As shown in Figs. 1-2, a kind of uniform-temperature radiator with partition board, including cover board 1, partition board 2 and cooling fin 3, wherein cover board
1, partition board 2 and cooling fin 3 are fixedly mounted successively, and partition board 2 is equipped with hollow cavity 21, and partition board 2 is equipped in the periphery of cavity 21
First seal groove 211, position corresponding with the first seal groove 21 is equipped with the second seal groove 311, the first seal groove on cooling fin 3
211, it is equipped with fluid sealant in the second seal groove 311, for bonding cover board 1, partition board 2 and cooling fin 3 successively；Fluid sealant is by ring
Oxygen resin and curing agent are formulated in 10: 1 ratio, wherein and epoxy resin is polyurethane prepolymer modified epoxy, Gu
The composition of agent has diamine, imidazoles, KH570, KH590, Nano carbon, nano-aluminium oxide, sodium hydroxide etc., in use,
Epoxide-resin glue presses 10 with curing agent：1 ratio stirs evenly（Usage amount in 2 hours）, using automatic dispensing machine toward inserting in seal groove
Fluid sealant, by cover plate lid on fluid sealant, pressing solidification.Cover board, partition board and cooling fin mutually bond, and avoid interface
Thermal resistance problem greatly improves the capacity of heat transmission of uniform-temperature radiator.
Wherein, cavity 21 is " king " font inner cavity；Cover board 1 and cooling fin 3 are equipped on position corresponding with cavity 21
Capillary structure layer, and cavity 21 is filled with volatile liquid.Wherein, volatile liquid is pure water, and capillary structure layer uses metal
Powder metallurgy is sintered to form porous capillary structure, and concrete mode is：By metal powder and a certain proportion of combustible species (example
Such as rubber, plastics powder) mixing, be then sintered by mold, in sintering process, combustible species are burned out, thus at
Porous capillary structure is left in the product of type.For example aluminium powder sintering or copper powder are sintered generating structure, specifically, jig is for example arranged
It is filled into cavity, aluminum particle and potassium chlorate, the mixture of manganese dioxide is filled between jig and cavity, heating burning can
Obtain capillary structure layer；Have the advantages that the entire uniform-temperature radiator of support, and can with direct sintering on cover board and cooling fin,
Structural strength is high, situations such as being not susceptible to deform, collapse.
Wherein, 2 side wall of partition board is equipped with exhaust tube 22, and 22 connection cavity 21 of exhaust tube, before installing uniform-temperature radiator, toward chamber
Injection volatile liquid such as pure water etc., seals nozzle after the air in cavity 21 is released using exhaust tube 22 in body 21
It is stifled.
Specifically, copper coin may be used in cover board, aluminium may be used in partition board, and cooling fin uses aluminium extruded type cooling fin, cooling fin
Lower section is equipped with several fins arranged in parallel, to increase heat dissipation area.Cooling fin cavity is generally formed using numerical control milling, production
Waste material is more in the process, and amount product rate is low so that high processing costs, and partition board is individually set up, it is formed using punch press process, on partition board
Cavity and seal groove are also disposably to be punched, easy to operate, and productivity is high, reduces processing cost.
The uniform-temperature radiator of the present embodiment is placed on euthermic chip, can not only be radiated by cooling fin, but also
After its cover board is heated, heat is quickly taken away heat source position by the volatile liquid of partition board inner chamber body, can be converted into steam state by liquid
Low-temperature space is passed to rapidly, heat source position can be back to by its capillary structure laminar flow again by being condensed into liquid, then heat is converted into steam state,
Realize gas-liquid two-phase cycle, so as to improving heat conduction efficiency, can temperature uniforming heat radiation, heat dissipation effect is more preferable.Such structure has height
The advantages that thermal conductivity, good isothermal, thermal response fast, simple in structure, at low cost, becomes current high fever density chip heat conduction, dissipates
The ideal element of heat.
It these are only the preferred embodiment of the utility model, it does not limit the scope of the patent of the present invention, every
Equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, is applied directly or indirectly in
Other related technical areas are equally included in the patent within the scope of the utility model.
Claims (6)
1. a kind of uniform-temperature radiator with partition board, which is characterized in that including cover board（1）, partition board（2）And cooling fin（3）, the lid
Plate（1）, partition board（2）And cooling fin（3）It is fixedly mounted successively, the partition board（2）It is equipped with hollow cavity（21）, the partition board
（2）In cavity（21）Periphery be equipped with the first seal groove（211）, the cooling fin（3）Upper and the first seal groove（211）It is corresponding
Position be equipped with the second seal groove（311）；The cover board（1）And cooling fin（3）With cavity（21）It is all provided on corresponding position
There are capillary organized layer, and the cavity（21）Filled with volatile liquid.
2. the uniform-temperature radiator according to claim 1 with partition board, which is characterized in that first seal groove（211）,
Two seal grooves（311）It is inside equipped with fluid sealant, for bonding cover board, partition board and cooling fin successively.
3. the uniform-temperature radiator according to claim 1 with partition board, which is characterized in that the cavity（21）For " king " word
Shape inner cavity.
4. the uniform-temperature radiator according to claim 1 with partition board, which is characterized in that the cooling fin（3）Lower section is equipped with
Several fins arranged in parallel（31）.
5. the uniform-temperature radiator according to claim 1 with partition board, which is characterized in that the partition board（2）Side wall, which is equipped with, to be taken out
Tracheae（22）, and exhaust tube（22）Connect the cavity（21）.
6. the uniform-temperature radiator according to claim 5 with partition board, which is characterized in that the capillary structure layer is that sintering is given birth to
At structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820670235.5U CN208047153U (en) | 2018-05-07 | 2018-05-07 | A kind of uniform-temperature radiator with partition board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820670235.5U CN208047153U (en) | 2018-05-07 | 2018-05-07 | A kind of uniform-temperature radiator with partition board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208047153U true CN208047153U (en) | 2018-11-02 |
Family
ID=63928767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820670235.5U Expired - Fee Related CN208047153U (en) | 2018-05-07 | 2018-05-07 | A kind of uniform-temperature radiator with partition board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208047153U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114510135A (en) * | 2022-02-16 | 2022-05-17 | 苏州生益兴热传科技有限公司 | Temperature-uniforming plate with good heat conduction and heat dissipation effects |
-
2018
- 2018-05-07 CN CN201820670235.5U patent/CN208047153U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114510135A (en) * | 2022-02-16 | 2022-05-17 | 苏州生益兴热传科技有限公司 | Temperature-uniforming plate with good heat conduction and heat dissipation effects |
| CN114510135B (en) * | 2022-02-16 | 2024-04-05 | 苏州生益兴热传科技有限公司 | Uniform temperature plate with good heat conduction and heat dissipation effects |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181102 Termination date: 20190507 |
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| CF01 | Termination of patent right due to non-payment of annual fee |