CN208047112U - A kind of EMI heat dissipations screening arrangement - Google Patents
A kind of EMI heat dissipations screening arrangement Download PDFInfo
- Publication number
- CN208047112U CN208047112U CN201820158209.4U CN201820158209U CN208047112U CN 208047112 U CN208047112 U CN 208047112U CN 201820158209 U CN201820158209 U CN 201820158209U CN 208047112 U CN208047112 U CN 208047112U
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- China
- Prior art keywords
- emi
- heat
- heat dissipation
- shield
- shell
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 38
- 238000012216 screening Methods 0.000 title abstract 3
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 108090000565 Capsid Proteins Proteins 0.000 abstract 2
- 238000000034 method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 208000032365 Electromagnetic interference Diseases 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of EMI heat dissipation screening arrangements, including shielding case, are made of procapsid and back casing, form an accommodating chamber between the procapsid and back casing；EMI radiators are assembled in the accommodating chamber；Heat conducting pipe is distributed in the accommodating chamber, and is contacted with the EMI radiators；Heat exchanger, the outlet end of the heat conducting pipe are connected to the air inlet of the heat exchanger by a conducting tube, and the input end of the heat conducting pipe is connected to the air outlet of the heat exchanger by a conducting tube.The EMI heat dissipation screening arrangements of the utility model, effectively shield electronic equipment, the electromagnetic wave generated when being operated such as server effectively further increases heat dissipation effect by the cooperation of heat exchanger and heat conducting pipe by radiator structure.
Description
Technical Field
The utility model relates to an electronic component electromagnetic shielding, fields such as heat dissipation specifically are an EMI heat dissipation shield assembly.
Background
Emi (electro Magnetic interference) electromagnetic interference, which refers to any electromagnetic phenomenon that can degrade the performance of a device or system. The electromagnetic interference refers to performance degradation of a device or system caused by electromagnetic interference.
In the operation process of the electronic equipment, because the equipment can generate heat in the operation process, the electromagnetic wave interference can also generate heat. If the heat is too much in the operation process of the equipment, but the heat cannot be effectively dissipated, the temperature of the equipment during operation is too high, and the equipment cannot normally operate.
Therefore, how to effectively shield electromagnetic waves and increase the heat dissipation effect is a problem that needs to be solved.
SUMMERY OF THE UTILITY MODEL
The utility model aims at: the EMI heat dissipation shielding device is provided to solve the problems that the existing electronic equipment cannot effectively shield electromagnetic waves and increase the heat dissipation effect.
The technical scheme for realizing the purpose is as follows: an EMI heat dissipation shielding device comprises a shielding case, a heat dissipation shielding case and a heat dissipation shielding device, wherein the shielding case consists of a front case and a rear case, and a containing cavity is formed between the front case and the rear case; an EMI radiator assembled in the accommodating cavity; the heat conduction pipe is distributed in the accommodating cavity and is in contact with the EMI radiator; the outlet end of the heat conduction pipe is connected to the air inlet of the heat exchanger through a conduction pipe, and the inlet end of the heat conduction pipe is connected to the air outlet of the heat exchanger through a conduction pipe.
In a preferred embodiment of the present invention, the front housing includes a first housing portion; the first connecting part is vertically connected with the periphery of the first shell part; the rear housing includes a second housing portion; the second connecting part is vertically connected with the periphery of the second shell part; the first shell part and the second shell part are arranged oppositely, and the second connecting part and the first shell part are connected with each other. Screw holes are formed in corresponding positions of the second connecting portion and the first connecting portion, and the second connecting portion and the first connecting portion are fixed through screws.
In a preferred embodiment of the present invention, a plurality of electromagnetic interference shielding heat dissipation structures are distributed on the first housing portion and/or the second housing portion.
In a preferred embodiment of the present invention, the heat dissipation structure is a regular hexagon structure or a partial regular hexagon structure.
In a preferred embodiment of the present invention, each of the heat dissipation structures includes a shielding layer and a heat dissipation hole, which are formed by intersecting and combining linear metal.
In a preferred embodiment of the present invention, the material of the linear metal is one of copper, copper-tin alloy, and stainless steel.
In a preferred embodiment of the present invention, the heat conducting pipe has a wavy curved structure.
In a preferred embodiment of the present invention, the heat pipe is disposed between the EMI radiator and the front housing or between the EMI radiator and the rear housing.
In a preferred embodiment of the present invention, the EMI heat sink includes a plurality of fins arranged side by side.
The utility model has the advantages that: the utility model discloses a EMI heat dissipation shield assembly has effectually shielded electronic equipment through heat radiation structure, and the electromagnetic wave that produces when the server function through the cooperation of heat exchanger and heat pipe, the effectual radiating effect that has further increased.
Drawings
The invention is further explained below with reference to the figures and examples.
Fig. 1 is an overall structure diagram of the EMI heat dissipation and shielding apparatus according to the embodiment of the present invention.
Fig. 2 is an exploded view of a part of the structure of the EMI heat dissipation shielding apparatus according to the embodiment of the present invention.
Fig. 3 is an enlarged view of a partial structure of the shield according to the embodiment of the present invention.
Wherein,
1, a shielding case; 2 an EMI heat sink;
3, a heat conduction pipe; 4, a conduction pipe;
5 a heat exchanger; 11 a front case;
12 a rear housing;
111 a first shell portion; 112 a first connection portion;
121 a second shell portion; 122 a second connecting portion;
131 a shielding layer; 132 heat dissipation holes.
Detailed Description
The following description of the embodiments refers to the accompanying drawings for illustrating the specific embodiments in which the invention may be practiced. In the present invention, directional terms such as "up", "down", "front", "back", "left", "right", "top", "bottom", etc. refer to directions of the attached drawings only. Accordingly, the directional terms used are used for describing and understanding the present invention, and are not used for limiting the present invention.
In an embodiment, as shown in fig. 1 and 2, an EMI heat dissipation shielding apparatus includes a shielding can 1, an EMI heat sink 2, a heat pipe 3, a heat pipe 4, and a heat exchanger 5.
The shielding case 1 is composed of a front case 11 and a rear case 12, and a containing cavity is formed between the front case 11 and the rear case 12; the front case 11 includes a first case portion 111 and a first connecting portion 112, the first case portion 111 is rectangular, and the first connecting portion 112 is perpendicularly connected to the periphery of the first case portion 111; the rear housing 12 includes a second housing portion 121 and a second connecting portion 122, the second connecting portion 122 is perpendicularly connected to the periphery of the second housing portion 121, and the second housing portion 121 is also rectangular; the first shell portion 111 is disposed opposite to the second shell portion 121, and the second connecting portion 122 and the first shell portion 111 are connected to each other. Screw holes are formed in corresponding positions of the second connecting portion 122 and the first connecting portion 112, and the second connecting portion 122 and the first connecting portion 112 are fixed through screws.
As shown in fig. 3, a plurality of heat dissipation structures for preventing electromagnetic interference are distributed on the first shell portion 111 and/or the second shell portion 121. The heat dissipation structure is a regular hexagon structure or a regular hexagon partial structure. Each of the heat dissipation structures includes a shielding layer 131 and a heat dissipation hole 132 formed by intersecting and combining linear metals. The material of the linear metal is one of copper, copper-tin alloy and stainless steel.
The EMI radiator 2 is assembled in the accommodating cavity; the EMI heat sink 2 includes a plurality of heat radiating fins arranged side by side.
The heat conduction pipe 3 is distributed in the accommodating cavity and is in contact with the EMI radiator 2; the heat pipe 3 has a wavy curved structure. The heat conductive pipe 3 is disposed between the EMI heat sink 2 and the front case 11 or between the EMI heat sink 2 and the rear case 12.
Heat exchanger 5 the outlet end of the heat pipe 3 is connected to the air inlet of the heat exchanger 5 through a conducting pipe 4, and the inlet end of the heat pipe 3 is connected to the air outlet of the heat exchanger 5 through a conducting pipe 4.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. An EMI heat dissipation shielding device, comprising
The shielding case consists of a front case and a rear case, and an accommodating cavity is formed between the front case and the rear case;
an EMI radiator assembled in the accommodating cavity;
the heat conduction pipe is distributed in the accommodating cavity and is in contact with the EMI radiator;
the outlet end of the heat conduction pipe is connected to the air inlet of the heat exchanger through a conduction pipe, and the inlet end of the heat conduction pipe is connected to the air outlet of the heat exchanger through a conduction pipe.
2. The EMI heat dissipating shield of claim 1,
the front case comprises
A first shell portion;
the first connecting part is vertically connected with the periphery of the first shell part;
the rear shell comprises
A second shell portion;
the second connecting part is vertically connected with the periphery of the second shell part;
the first shell part and the second shell part are arranged oppositely, and the second connecting part and the first shell part are connected with each other.
3. The EMI heat dissipation and shielding apparatus of claim 2, wherein the second connecting portion and the first connecting portion are provided with screw holes at corresponding positions, and the second connecting portion and the first connecting portion are fixed by screws.
4. The EMI heat dissipation and shielding apparatus of claim 2, wherein the first housing portion and/or the second housing portion have a plurality of EMI shielding structures distributed thereon.
5. The EMI heat dissipation shield of claim 4, wherein the heat dissipation structure is a regular hexagonal structure or a partial regular hexagonal structure.
6. The EMI heat dissipation shield assembly of claim 4, wherein each of the heat dissipation structures includes a shield layer and a heat dissipation aperture formed by intersecting combinations of linear metal.
7. The EMI heat dissipation shield of claim 6, wherein the wire-like metal is one of copper, copper-tin alloy, and stainless steel.
8. The EMI heat dissipation shield of claim 1, wherein the thermally conductive tubing is a corrugated bend structure.
9. The EMI heat dissipation shield of claim 1, wherein the heat pipe is disposed between the EMI heat sink and the front housing or between the EMI heat sink and the rear housing.
10. The EMI heat dissipation shield of claim 1, wherein the EMI heat sink comprises a plurality of fins arranged side-by-side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820158209.4U CN208047112U (en) | 2018-01-30 | 2018-01-30 | A kind of EMI heat dissipations screening arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820158209.4U CN208047112U (en) | 2018-01-30 | 2018-01-30 | A kind of EMI heat dissipations screening arrangement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208047112U true CN208047112U (en) | 2018-11-02 |
Family
ID=63954977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820158209.4U Active CN208047112U (en) | 2018-01-30 | 2018-01-30 | A kind of EMI heat dissipations screening arrangement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208047112U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116111946A (en) * | 2023-04-11 | 2023-05-12 | 赫里欧新能源有限公司 | Wind-solar-thermal storage straight-flexible energy-producing building system |
| CN118642578A (en) * | 2024-08-15 | 2024-09-13 | 湖南兴天电子科技股份有限公司 | Waveguide window structure, heat radiation assembly and server device |
| CN118642578B (en) * | 2024-08-15 | 2024-11-05 | 湖南兴天电子科技股份有限公司 | Radiating assembly and server device |
-
2018
- 2018-01-30 CN CN201820158209.4U patent/CN208047112U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116111946A (en) * | 2023-04-11 | 2023-05-12 | 赫里欧新能源有限公司 | Wind-solar-thermal storage straight-flexible energy-producing building system |
| CN118642578A (en) * | 2024-08-15 | 2024-09-13 | 湖南兴天电子科技股份有限公司 | Waveguide window structure, heat radiation assembly and server device |
| CN118642578B (en) * | 2024-08-15 | 2024-11-05 | 湖南兴天电子科技股份有限公司 | Radiating assembly and server device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215000 No. 789, Shanhu West Road, Wujiang Economic and Technological Development Zone, Suzhou, Jiangsu Patentee after: Suzhou Hexin Precision Technology Co.,Ltd. Address before: 215200 No. 789, Shanhu West Road, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee before: WELLTRUST PRECISION TECHNOLOGY (WUJIANG) Co.,Ltd. |