CN208045529U - Full-color light-emitting diode - Google Patents
Full-color light-emitting diode Download PDFInfo
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- CN208045529U CN208045529U CN201820215925.1U CN201820215925U CN208045529U CN 208045529 U CN208045529 U CN 208045529U CN 201820215925 U CN201820215925 U CN 201820215925U CN 208045529 U CN208045529 U CN 208045529U
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- emitting diode
- color light
- basal plane
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Abstract
The utility model provides a kind of full-color light-emitting diode, the full-color light-emitting diode includes insulating base and chip, the insulating base forms a package cavity, the bottom surface of the package cavity forms at least two basal planes, each basal plane is mutually isolated and each basal plane draws a conductive pin, the quantity of the chip is at least two, and the chip is mounted on different basal planes.The structure of the utility model can reduce the volume of full-color light-emitting diode.
Description
Technical field
The utility model is related to LED technology fields, and in particular to a kind of full-color light-emitting diode.
Background technology
Outdoor LED display screen generally use full-color SMD light emitting diode is as its pixel unit, full-color SMD light-emitting diodes
The volume of pipe decides the resolution ratio of outdoor LED display screen.Existing technology is usually by Full color SMD light emitting diode support
Metal pins bent to reduce its volume, but due to the limitation of the factors such as bending technique so that the bending of metal pins
Degree is inadequate, so that the volume of Full color SMD light emitting diode support is comparatively still very big, so that limiting display screen
Resolution ratio.
Invention content
Utility model aims to solve the deficiencies in the prior art, to provide a kind of two pole of full-color light-emitting
Pipe, a kind of volume smaller of full-color light-emitting diode.
According to technical solution provided by the utility model, a kind of full-color light-emitting diode, the full-color light-emitting diode packet
Insulating base and chip are included, the insulating base forms a package cavity, and the bottom surface of the package cavity forms at least two basal planes, each
Basal plane is mutually isolated and each basal plane draws a conductive pin, and the quantity of the chip is at least two, the chip installation
On different basal planes.
Further, the groove that the basal plane is equipped with, the chip installation is in a groove.
Further, the quantity of the chip is less than the quantity of basal plane, and each chip is mounted on different basal planes.
A kind of full-color light-emitting diode provided by the utility model is can be seen that from the above, compared with prior art
Has following advantages：Compared with multiple chips are mounted in identical basal plane, multiple chips are mounted in different basal planes so that envelope
It behave affectedly the smaller that can be done, to reduce the volume of the present invention.
Description of the drawings
Fig. 1 is the vertical view of the utility model.
Fig. 2 is the front view of the utility model.
Fig. 3 is the main sectional view of the utility model.
1. insulating base, 110. package cavities, 2. grooves, 3. chips, 310. red wafers, 320. green wafers, 330. blue lights
330,4. basal plane of chip, 410. first basal planes, 420. second basal planes, 430. third basal planes, 5. conductive pins.
Specific implementation mode
To make the purpose of this utility model, technical solution and advantage be more clearly understood, below in conjunction with specific embodiment, and
With reference to attached drawing, the utility model is further described.Wherein identical parts are presented with like reference characters.It needs
Illustrate, word "front", "rear" used in the following description, "left", "right", "up" and "down" refer to the side in attached drawing
To.The word "inner" used and "outside" refer respectively to the direction towards or away from geometric center of specific component.
As shown in Fig. 1 ~ 3, a kind of full-color light-emitting diode, including insulating base 1 and chip 3, the insulating base 1 form an envelope
Behave affectedly 110, the bottom surface of the package cavity 110 forms at least two basal planes 4, each basal plane 4 is mutually isolated and each basal plane 4
A conductive pin 5 is drawn, the quantity of the chip 3 is at least two, and the chip 3 is mounted on different basal planes 4.In order to enable
Chip 3 can be securely mounted on the insulating base 1 of smaller size smaller, and the groove 2 that the basal plane 4 is equipped with, the chip 3 is installed
In groove 2.The groove 2 can prevent chip 3 from falling off.
In order to enable the volume of the present invention can further reduce, the quantity of the chip 3 is less than the quantity of basal plane 4,
Each chip 3 is mounted on different basal planes 4.
In a particular embodiment, the chip 3 includes red wafer 310, green wafer 320 and blue light chip 330, described
Basal plane includes the first basal plane 410, the second basal plane 420, third basal plane 430 and the 4th basal plane 440, and the red wafer 310 is installed
In the first basal plane 410, blue light chip 330 is mounted in the second basal plane 420, and green wafer 320 is mounted on third basal plane 430
In, compared with multiple chips 3 are mounted in identical basal plane 4, multiple chips 3 are mounted in different basal planes 4 so that package cavity 110
The smaller that can be done, to reduce the volume of the present invention.
Those of ordinary skills in the art should understand that：The foregoing is merely specific embodiment of the utility model
, it is not intended to limit the utility model, all any modifications within the purport of the utility model, made, change equivalent replacement
Into etc., it should be included within the scope of protection of this utility model.
Claims (3)
1. a kind of full-color light-emitting diode, which is characterized in that the full-color light-emitting diode includes insulating base（1）And chip（3）,
The insulating base（1）Form a package cavity（110）, the package cavity（110）Bottom surface formed at least two basal planes（4）, often
A basal plane（4）Mutually isolated and each basal plane（4）Draw a conductive pin（5）, the chip（3）Quantity be at least two
It is a, the chip（3）Mounted on different basal planes（4）On.
2. full-color light-emitting diode as described in claim 1, which is characterized in that the basal plane（4）The groove being equipped with（2）,
The chip（3）Mounted on groove（2）In.
3. full-color light-emitting diode as described in claim 1, which is characterized in that the chip（3）Quantity be less than basal plane（4）
Quantity, each chip（3）All it is mounted on different basal planes（4）On.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820215925.1U CN208045529U (en) | 2018-02-07 | 2018-02-07 | Full-color light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820215925.1U CN208045529U (en) | 2018-02-07 | 2018-02-07 | Full-color light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208045529U true CN208045529U (en) | 2018-11-02 |
Family
ID=63952278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820215925.1U Active CN208045529U (en) | 2018-02-07 | 2018-02-07 | Full-color light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208045529U (en) |
-
2018
- 2018-02-07 CN CN201820215925.1U patent/CN208045529U/en active Active
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |