CN205004352U - Spotlight type emitting diode - Google Patents
Spotlight type emitting diode Download PDFInfo
- Publication number
- CN205004352U CN205004352U CN201520794950.6U CN201520794950U CN205004352U CN 205004352 U CN205004352 U CN 205004352U CN 201520794950 U CN201520794950 U CN 201520794950U CN 205004352 U CN205004352 U CN 205004352U
- Authority
- CN
- China
- Prior art keywords
- light
- concave surface
- condenser groove
- emitting diode
- bowl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520794950.6U CN205004352U (en) | 2015-10-15 | 2015-10-15 | Spotlight type emitting diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520794950.6U CN205004352U (en) | 2015-10-15 | 2015-10-15 | Spotlight type emitting diode |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205004352U true CN205004352U (en) | 2016-01-27 |
Family
ID=55161224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520794950.6U Active CN205004352U (en) | 2015-10-15 | 2015-10-15 | Spotlight type emitting diode |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN205004352U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106601888A (en) * | 2015-10-15 | 2017-04-26 | 德阳九鼎智远知识产权运营有限公司 | Concentrating type light emitting diode |
-
2015
- 2015-10-15 CN CN201520794950.6U patent/CN205004352U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106601888A (en) * | 2015-10-15 | 2017-04-26 | 德阳九鼎智远知识产权运营有限公司 | Concentrating type light emitting diode |
CN106601888B (en) * | 2015-10-15 | 2019-06-18 | 德阳九鼎智远知识产权运营有限公司 | Light-focusing type light emitting diode |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170607 Address after: 528437, three, 3, 4, Torch Road 17, Torch Development Zone, Guangdong, Zhongshan Patentee after: Guangdong XinDa Photoelectric Technology Co., Ltd. Address before: 618000 Deyang City, Sichuan province Jingyang Minjiang Road No. 136 fulimingcheng A No. 1-16-5 Patentee before: DEYANG JIUDINGZHIYUAN INTELLECTUAL PROPERTY OPERATION CO., LTD. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201026 Address after: No.4 and No.12, Hongxi South Road, Xiangan Industrial Zone, torch hi tech Zone, Xiamen City, Fujian Province Patentee after: Xiamen Xinda Semiconductor Technology Co., Ltd Address before: 528437, three, 3, 4, Torch Road 17, Torch Development Zone, Guangdong, Zhongshan Patentee before: GUANGDONG XINDA PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |