CN208044625U - Antistatic bio-identification module - Google Patents
Antistatic bio-identification module Download PDFInfo
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- CN208044625U CN208044625U CN201820269070.0U CN201820269070U CN208044625U CN 208044625 U CN208044625 U CN 208044625U CN 201820269070 U CN201820269070 U CN 201820269070U CN 208044625 U CN208044625 U CN 208044625U
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- becket
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Abstract
The utility model discloses a kind of antistatic bio-identification module, including substrate, cover board, fingerprint recognition chip, becket, FPC circuit boards and reinforcement steel disc, substrate has an installation through-hole, this installation through-hole inner surface bottom has one to extend stage portion, one end of FPC circuit boards is electrically connected with fingerprint recognition chip lower surface, becket is set in the extension stage portion of the installation through-hole of substrate, and in the through-hole of the fingerprint recognition chip insertion becket and it is installed in the extension stage portion of installation through-hole；Left ear and auris dextra portion are respectively provided at left and right sides of reinforcement steel disc, the extension stage portion left and right sides of the substrate has left gap slot, right gap slot, and the left ear and auris dextra portion of the reinforcement steel disc below becket be respectively embedded into the left gap slot for extending stage portion, in right gap slot and extends support portions with 2 and connect.The utility model antistatic bio-identification module greatly reduces the thickness of fingerprint module, is conducive to the utilization rate for improving interior of mobile phone space, and effectively prevent complete machine ESD risk problems, fingerprint module becket reaches earthing effect.
Description
Technical field
The utility model is related to a kind of antistatic bio-identification modules, belong to technical field of biometric identification.
Background technology
Touch screen is widely used to the electronic products industry such as mobile phone/laptop, referring to Fig.1, conventional fingerprint at present
Module package structure includes：Fingerprint chip 101, surface layer protection 102, becket 103, substrate 104.Surface layer protection is covered in
Fingerprint chip surface, fingerprint chip pass through glue and substrate connection by conductive material and substrate connection, becket.
Existing touch screen product structure, technical process are as follows：Step 1: first semi-finished product are fixed on turn the support plate got ready or
On jig；Step 2: by becket（RING）It is assembled on semi-finished product；Step 3: then putting support plate into ready pressure again
It closes inside jig and presses fixation；Step 4: then putting pressing clamp tool into oven cooking cycle（About 0.50-1H）；Step 5:
It then takes out jig and takes out support plate after cooling, carry out subsequent handling.Existing fingerprint module：（1）Thickness is thicker, is unfavorable for product
It is thinned, it is low with smart mobile phone Touch Screen finish space utilization rate；（2）There are ESD risk problems for complete machine.
Invention content
The utility model aim is to provide a kind of antistatic bio-identification module, which drops significantly
The low thickness of fingerprint module improves overall performance, and effectively keep away to be conducive to improve the utilization rate in interior of mobile phone space
Complete machine ESD risk problems are exempted from, fingerprint module becket reaches earthing effect.
In order to achieve the above objectives, the technical solution adopted in the utility model is：A kind of antistatic bio-identification module, including
Substrate, cover board, fingerprint recognition chip, becket, FPC circuit boards and reinforcement steel disc, the substrate have an installation through-hole, this peace
Filling through-hole inner surface bottom has one to extend stage portion, and the cover board is located at the surface of fingerprint recognition chip, the FPC electricity
One end of road plate is electrically connected with fingerprint recognition chip lower surface, and the reinforcement steel disc is located at the underface of one end of FPC circuit boards,
There is at least two to extend support portion for becket inner surface bottom, and the length for extending stage portion is more than metal ring wall
The sum of thick and extension support portion length, the becket is set in the extension stage portion of the installation through-hole of substrate, the finger
In the through-hole of line identification chip insertion becket and it is installed in the extension stage portion of installation through-hole；
It is respectively provided with left ear and auris dextra portion, the extension stage portion of the substrate or so at left and right sides of the reinforcement steel disc
Side has left gap slot, right gap slot, and 2 on becket extend support portion and are located at the left side for extending stage portion
Right over gap slot, right gap slot, the left ear and auris dextra portion of the reinforcement steel disc below becket are respectively embedded into extension table
In the left gap slot in rank portion, right gap slot and extend support portions with 2 to connect.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in said program, passing through hot-setting adhesive between the extension support portion and the extension stage portion of substrate of the becket
Layer connection.
2. in said program, being connected by thermosetting glue-line between the fingerprint recognition chip and the extension stage portion of substrate.
3. in said program, the length of the extension support portion length for extending step minister degree and becket of the substrate
Than being 10：（2~6）.
4. in said program, the becket height is 10 with the height ratio for extending support portion height：（6~8）.
5. in said program, a bending part is all had between the reinforcement steel disc and left ear and auris dextra portion.
Since above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
1. the utility model antistatic bio-identification module, base is directly mounted in by becket and fingerprint recognition chip
In the extension stage portion of plate, the thickness of fingerprint module is greatly reduced, also reduces FPC circuit boards and the respective ruler of reinforcement steel disc
It is very little, the size of module is advantageously reduced, to be conducive to improve the utilization rate in interior of mobile phone space, improves overall performance；Its
It is secondary, connected by thermosetting glue-line between the extension support portion and the extension stage portion of substrate of becket, fingerprint recognition chip with
It is connected by thermosetting glue-line between the extension stage portion of substrate, waterproof and dustproof can be played the role of, reduce failure, effectively
Equipment is protected, to extend service life.
2. the utility model antistatic bio-identification module, be respectively provided at left and right sides of reinforcement steel disc left ear and
The extension stage portion left and right sides in auris dextra portion, substrate has left gap slot, right gap slot, 2 extensions being located on becket
Support portion is located at the left gap slot for extending stage portion, right gap slot surface, is located at the reinforcement steel disc below becket
Left ear and auris dextra portion, which are respectively embedded into, to be extended the left gap slot of stage portion, in right gap slot and extends support portions with 2 and connect, and is had
Effect avoids complete machine ESD risk problems, and fingerprint module becket reaches earthing effect, i.e. Ring rings need to be with the reinforcement at the backs FPC
Steel disc conducting ground connection.It is locally stretched out by the backs FPC reinforcement steel disc both ends, improve the reliability of fingerprint module and uses the longevity
Life；Secondly, a bending part is all had between reinforcement steel disc and left ear and auris dextra portion, the two is welded by laser spot welding, is subtracted
The segment difference of few steel disc and becket bottom.
Description of the drawings
Attached drawing 1 is existing fingerprint modular structure schematic diagram；
Attached drawing 2 is the utility model antistatic bio-identification module exploded structural schematic diagram one；
Attached drawing 3 is the utility model antistatic bio-identification module exploded structural schematic diagram two；
Attached drawing 4 is the utility model antistatic bio-identification module exploded structural schematic diagram three；
Attached drawing 5 is the utility model antistatic bio-identification module section partial structural diagram.
In the figures above：1, substrate；2, cover board；3, fingerprint recognition chip；4, becket；5, FPC circuit boards；6, reinforcement steel
Piece；7, installation through-hole；8, extend stage portion；9, extend support portion；10, thermosetting glue-line；11, left ear；12, auris dextra portion；13, left
Gap slot；14, right gap slot；15, bending part.
Specific implementation mode
The utility model is further described with reference to embodiment：
Embodiment 1：A kind of antistatic bio-identification module, including substrate 1, cover board 2, fingerprint recognition chip 3, becket 4,
There is an installation through-hole 7, this 7 inner surface bottom of installation through-hole to have one for FPC circuit boards 5 and reinforcement steel disc 6, the substrate 1
Extend stage portion 8, the cover board 2 is located at the surface of fingerprint recognition chip 3, one end of the FPC circuit boards 5 and fingerprint recognition
3 lower surface of chip is electrically connected, and the reinforcement steel disc 6 is located at the underface of one end of FPC circuit boards 5,4 inside table of the becket
There is at least two to extend support portion 9 for face bottom, and the length for extending stage portion 8 is more than 4 wall thickness of becket and extends support portion
The sum of 9 length, the becket 4 is set in the extension stage portion 8 of the installation through-hole 7 of substrate 1, the fingerprint recognition chip
In the through-hole of 3 insertion beckets and it is installed in the extension stage portion of installation through-hole；
The left and right sides of the reinforcement steel disc 6 is respectively provided with left ear 11 and auris dextra portion 12, the extension step of the substrate 1
8 left and right sides of portion has left gap slot 13, right gap slot 14, and 2 on becket 4 extend support portion 9 and are located at
Left gap slot 13,14 surface of right gap slot for extending stage portion 8, are located at the left ear 11 of the reinforcement steel disc 6 of 4 lower section of becket
It is respectively embedded into auris dextra portion 12 and extends the left gap slot 13 of stage portion 8, in right gap slot 14 and extends support portions 9 with 2 and connect.
It is connected by thermosetting glue-line 10 between extension support portion 9 and the extension stage portion 8 of substrate 1 of above-mentioned becket 4.
It is connected by thermosetting glue-line 10 between above-mentioned fingerprint recognition chip 3 and the extension stage portion 8 of substrate 1.
Extend the step minister degree and the length ratio of extension 9 length of support portion of becket 4 of aforesaid substrate 1 are 10：3.5.
4 height of above-mentioned becket is 10 with the height ratio for extending 9 height of support portion：7.2.
Embodiment 2：A kind of antistatic bio-identification module, including substrate 1, cover board 2, fingerprint recognition chip 3, becket 4,
There is an installation through-hole 7, this 7 inner surface bottom of installation through-hole to have one for FPC circuit boards 5 and reinforcement steel disc 6, the substrate 1
Extend stage portion 8, the cover board 2 is located at the surface of fingerprint recognition chip 3, one end of the FPC circuit boards 5 and fingerprint recognition
3 lower surface of chip is electrically connected, and the reinforcement steel disc 6 is located at the underface of one end of FPC circuit boards 5,4 inside table of the becket
There is at least two to extend support portion 9 for face bottom, and the length for extending stage portion 8 is more than 4 wall thickness of becket and extends support portion
The sum of 9 length, the becket 4 is set in the extension stage portion 8 of the installation through-hole 7 of substrate 1, the fingerprint recognition chip
In the through-hole of 3 insertion beckets and it is installed in the extension stage portion of installation through-hole；
The left and right sides of the reinforcement steel disc 6 is respectively provided with left ear 11 and auris dextra portion 12, the extension step of the substrate 1
8 left and right sides of portion has left gap slot 13, right gap slot 14, and 2 on becket 4 extend support portion 9 and are located at
Left gap slot 13,14 surface of right gap slot for extending stage portion 8, are located at the left ear 11 of the reinforcement steel disc 6 of 4 lower section of becket
It is respectively embedded into auris dextra portion 12 and extends the left gap slot 13 of stage portion 8, in right gap slot 14 and extends support portions 9 with 2 and connect.
It is connected by thermosetting glue-line 10 between extension support portion 9 and the extension stage portion 8 of substrate 1 of above-mentioned becket 4.
It is connected by thermosetting glue-line 10 between above-mentioned fingerprint recognition chip 3 and the extension stage portion 8 of substrate 1.
Extend the step minister degree and the length ratio of extension 9 length of support portion of becket 4 of aforesaid substrate 1 are 10：4.2.
4 height of above-mentioned becket is 10 with the height ratio for extending 9 height of support portion：6.5.
A bending part 15 is all had between above-mentioned reinforcement steel disc 6 and left ear 11 and auris dextra portion 12.
When using above-mentioned antistatic bio-identification module, becket and fingerprint recognition chip are directly mounted in substrate
Extend in stage portion, greatly reduce the thickness of fingerprint module, also reduce FPC circuit boards and the respective size of reinforcement steel disc,
The size for advantageously reducing module improves overall performance to be conducive to improve the utilization rate in interior of mobile phone space；Secondly,
It is connected by thermosetting glue-line between the extension support portion and the extension stage portion of substrate of its becket, fingerprint recognition chip and substrate
Extension stage portion between connected by thermosetting glue-line, waterproof and dustproof can be played the role of, reduce failure, effective protection
Equipment, to extend service life；Secondly, complete machine ESD risk problems are effectively prevented, fingerprint module becket, which reaches, to be connect
Ground connection need to be connected with the reinforcement steel disc at the backs FPC in ground effect, i.e. Ring rings.It is locally stretched out by the backs FPC reinforcement steel disc both ends,
Improve the reliability and service life of fingerprint module；Again, both is welded by laser spot welding, reduces steel disc and becket
The segment difference of bottom.
Above-described embodiment is only the technical concepts and features for illustrating the utility model, and its object is to allow be familiar with technique
Personage can understand the content of the utility model and implement according to this, the scope of protection of the utility model can not be limited with this.
It is all according to equivalent change or modification made by the spirit of the present invention essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (6)
1. a kind of antistatic bio-identification module, it is characterised in that：Including substrate（1）, cover board（2）, fingerprint recognition chip（3）,
Becket（4）, FPC circuit boards（5）With reinforcement steel disc（6）, the substrate（1）With an installation through-hole（7）, this installation through-hole
（7）Inner surface bottom has one to extend stage portion（8）, the cover board（2）Positioned at fingerprint recognition chip（3）Surface, institute
State FPC circuit boards（5）One end and fingerprint recognition chip（3）Lower surface is electrically connected, the reinforcement steel disc（6）Positioned at FPC circuits
Plate（5）One end underface, the becket（4）There is at least two to extend support portion for inner surface bottom（9）, described to prolong
Stretch stage portion（8）Length be more than becket（4）Wall thickness and extension support portion（9）The sum of length, the becket（4）Setting
In substrate（1）Installation through-hole（7）Extension stage portion（8）On, the fingerprint recognition chip（3）Embedded becket（4）Peace
Fill through-hole（7）It is interior and it is installed on installation through-hole（7）Extension stage portion（8）On；
The reinforcement steel disc（6）The left and right sides be respectively provided with left ear（11）With auris dextra portion（12）, the substrate（1）Extension
Stage portion（8）Left and right sides has left gap slot（13）, right gap slot（14）, it is located at becket（4）On 2 extend support
Portion（9）It is located at extension stage portion（8）Left gap slot（13）, right gap slot（14）Surface is located at becket（4）Lower section
Reinforcement steel disc（6）Left ear（11）With auris dextra portion（12）It is respectively embedded into extension stage portion（8）Left gap slot（13）, right lack
Mouth slot（14）It is interior and with 2 extension support portions（9）Connection.
2. antistatic bio-identification module according to claim 1, it is characterised in that：The becket（4）Extension branch
Support part（9）With substrate（1）Extension stage portion（8）Between pass through thermosetting glue-line（10）Connection.
3. antistatic bio-identification module according to claim 1, it is characterised in that：The fingerprint recognition chip（3）With
Substrate（1）Extension stage portion（8）Between pass through thermosetting glue-line（10）Connection.
4. antistatic bio-identification module according to claim 1, it is characterised in that：The substrate（1）Extension step
Minister's degree and becket（4）Extension support portion（9）The length ratio of length is 10：（2~6）.
5. antistatic bio-identification module according to claim 1, it is characterised in that：The becket（4）Height with prolong
Stretch support portion（9）The height ratio of height is 10：（6~8）.
6. antistatic bio-identification module according to claim 1, it is characterised in that：The reinforcement steel disc（6）With left ear
Portion（11）With auris dextra portion（12）Between all have a bending part（15）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820269070.0U CN208044625U (en) | 2018-02-26 | 2018-02-26 | Antistatic bio-identification module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820269070.0U CN208044625U (en) | 2018-02-26 | 2018-02-26 | Antistatic bio-identification module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208044625U true CN208044625U (en) | 2018-11-02 |
Family
ID=63949883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820269070.0U Active CN208044625U (en) | 2018-02-26 | 2018-02-26 | Antistatic bio-identification module |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111126351A (en) * | 2020-01-21 | 2020-05-08 | 北京京东方光电科技有限公司 | Fingerprint identification module |
| CN113114816A (en) * | 2021-04-12 | 2021-07-13 | 维沃移动通信有限公司 | Decorative ring assembly and electronic equipment |
-
2018
- 2018-02-26 CN CN201820269070.0U patent/CN208044625U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111126351A (en) * | 2020-01-21 | 2020-05-08 | 北京京东方光电科技有限公司 | Fingerprint identification module |
| CN111126351B (en) * | 2020-01-21 | 2024-02-09 | 北京京东方光电科技有限公司 | Fingerprint identification module |
| CN113114816A (en) * | 2021-04-12 | 2021-07-13 | 维沃移动通信有限公司 | Decorative ring assembly and electronic equipment |
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