CN103594835A - An anti-collapse elastic sheet mounted on the surface of a circuit board - Google Patents
An anti-collapse elastic sheet mounted on the surface of a circuit board Download PDFInfo
- Publication number
- CN103594835A CN103594835A CN201210287094.6A CN201210287094A CN103594835A CN 103594835 A CN103594835 A CN 103594835A CN 201210287094 A CN201210287094 A CN 201210287094A CN 103594835 A CN103594835 A CN 103594835A
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- shell fragment
- circuit board
- welding substrate
- bending
- guide channel
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Abstract
The invention discloses an anti-collapse elastic sheet mounted on the surface of a circuit board. The anti-collapse elastic sheet comprises a welding substrate, a side blocking plate which is formed by bending upwards from one end of the welding substrate, a U-shaped bending portion which is formed by bending upwards from the other end of the welding substrate, an adsorption flat plate, an arc contact portion and an extension portion. A protrusion block which protrudes towards the side blocking plate is formed at the tail end of the extension portion. The elastic sheet further comprises a guide groove and an elastic finger. The guide groove is formed on the side blocking plate and extends downwards to the welding substrate; and the protrusion block stretches into and is positioned in the guide groove, so that the strength of the adsorption flat plate of the elastic sheet can be reinforced, and the elastic sheet can be prevented from being upwarpped during adsorption. The elastic finger which is formed by bending upwards from the bottom of the guide groove is positioned between the welding substrate and the arc contact portion, so that the arc contact portion can be prevented from being excessively pressed down, and the elastic sheet is prevent from being crushed.
Description
Technical field
The present invention relates to a kind of shell fragment, particularly relevant for a kind of circuit board surface install against pressure across shell fragment.
Background technology
At present, in electronics industry, often have and shell fragment need to be installed on printed circuit board (PCB), in order to effects such as battery electric connection, antenna electric connection, anti-electromagnetic interference ground connection or bufferings.Conventionally shell fragment is to utilize surface mount technology (Surface Mount Technology is called for short SMT) to be welded on the contact of printed circuit board surface, makes the circuit on shell fragment and printed circuit board (PCB) be in electrical contact.During use; conventionally can be coated with last layer tin cream by the first solid welding contact at printed circuit board (PCB); the suction nozzle of recycling SMT board adsorbs shell fragment; and shell fragment is positioned on the solid welding contact of printed circuit board (PCB); thereby the processing through Overwelding and rewelding furnace makes tin cream thawing that shell fragment is attached on printed circuit board (PCB); after tin cream condensation, shell fragment will be fixed on printed circuit board (PCB) and form conducting in electrical contact.
The familiar elastic piece structure of the public generally all has: welding plane, from welding plane, make progress bending and the U-shaped bending part that forms, from U-shaped bending part, extend the absorption plane that forms and make progress bending and the Elastic Contact face that forms from absorption plane.Wherein welding plane is for sticking together and be fixed on printed circuit board (PCB) for this shell fragment.U-shaped bending part is for for shell fragment provides elastic force, with guarantee Elastic Contact face can with dock components and parts and form reliable electric connection.Absorption plane must keep the state close to level, to be conducive to the suction nozzle absorption of SMT board.Elastic Contact face is used for contacting with docking components and parts, makes to dock between components and parts and circuit board, to form electric connection, ground connection or buffering.
In conjunction with above-mentioned elastic piece structure and occupation mode thereof, we are not difficult to find, existing elastic piece structure can have following drawback conventionally:
First, because the absorption plane of shell fragment is connecting U-shaped bending part, therefore adsorbing plane is subject to external force impact and teetertotters, especially when SMT board suction nozzle is in this absorption plane of absorption, suction nozzle is to be difficult to accurately adsorb this absorption plane, even also can cause because suction is excessive this absorption plane to deform with respect to U-shaped bending part.In addition, when rear this shell fragment of translation of suction nozzle absorption, be also easy to because teetertottering of plane of absorption causes this shell fragment to drop on suction nozzle.These factors all can affect the service efficiency of shell fragment, thereby affect whole production efficiency.
In addition, in the course of work of this shell fragment, for example, when docking components and parts (another circuit board or shielding case) press down this shell fragment and form electric connection with the circuit board that this shell fragment is installed, original elastic piece structure cannot limit the situation of docking components and parts generation overvoltage, and once this shell fragment is excessively oppressed, be easy to cause this shell fragment that irreversible distortion occurs, even likely can cause this shell fragment normally to use, electric connection between impact docking components and parts and circuit board, ground connection, or buffering effect, the quality of the electronic installation of this shell fragment is used in impact more even.
Therefore, be necessary to provide a kind of new shell fragment, it not only can limit shaking amplitude along the vertical direction of absorption plane, can also prevent from being docked components and parts press across, thereby effectively solve the problem of above prior art.
Summary of the invention
Main purpose of the present invention be to provide a kind of circuit board surface install against pressure across shell fragment; its have against pressure across structure; can effectively limit docking components and parts and excessively press down this shell fragment; and can improve this shell fragment and the forward contact force of docking between components and parts; thereby protect the safety in utilization of this shell fragment, also improve the result of use of this shell fragment simultaneously.
Another object of the present invention is to provide a kind of circuit board surface install against pressure across shell fragment, it can strengthen the intensity of the absorption flat board of this shell fragment, prevent that this shell fragment is upturned, make board suction nozzle can more easily adsorb this shell fragment, thereby enhance productivity.
Other object of the present invention and advantage can be further understood from the disclosed technical characterictic of the present invention.
For reaching above-mentioned purpose, the present invention adopts following technical scheme:
Circuit board surface install against pressure across a shell fragment, include a welding substrate, from one end of this welding substrate, make progress bending and the side board that forms, from the other end of this welding substrate make progress bending and the U-shaped bending part that forms, the absorption that extends to form towards this side board from one end of this U-shaped bending part are dull and stereotyped, from dull and stereotyped bending downward bending and the arc-shaped contact part that forms and certainly the end bending of this arc-shaped contact part the extension extending to form towards this side board again of making progress of this absorption.End at this extension is formed with a projection protruding out towards this side board.This shell fragment also comprises a guide channel and a jerk-finger.Wherein, this guide channel is formed on this side board and extends downward on this welding substrate, and this projection stretches into and is arranged in this guide channel; This jerk-finger is upwards to bend and form from the bottom of this guide channel, one end of this jerk-finger connects the bottom of this guide channel, the other end of this jerk-finger is upwards to bend and extend and become a free end from this guide channel bottom, and this jerk-finger is between this welding substrate and this arc-shaped contact part.
In an embodiment, this guide channel is L-shaped therein, and a part for this guide channel is positioned on this side board, and another part is positioned on this welding substrate.
In an embodiment, this jerk-finger is U-shaped structure therein.
In an embodiment, this side board is the bending that is inclined upwardly from one end of this welding substrate therein, and the angle forming between this side board and this welding substrate is an obtuse angle.In another embodiment, this side board is to make progress vertical bending and form vertical shape from one end of welding substrate.
In an embodiment, this absorption is dull and stereotyped to be parallel to each other and to keep at a certain distance away with this welding substrate therein.
In an embodiment, this arc-shaped contact part is dull and stereotyped and this side board higher than this absorption therein.
In an embodiment, the width of this arc-shaped contact part is less than this and adsorbs dull and stereotyped width therein, and this absorption is dull and stereotyped is to rely on two hypotenuses to be connected with this arc-shaped contact part.
Therein in an embodiment, the bilateral symmetry of this welding substrate upwards bending form the clamping plate of two vertical shapes, the height of two clamping plate adsorbs dull and stereotyped height lower than this.
Compared to prior art, circuit board surface of the present invention install against pressure across shell fragment by jerk-finger being set between this welding substrate and this arc-shaped contact part, can limit this arc-shaped contact part and excessively be pressed down, thereby protect shell fragment irreversible distortion can not occur.Meanwhile, jerk-finger can also improve this shell fragment and the forward contact force of docking between components and parts, to improve this shell fragment and the electric connection effect of docking components and parts.In addition, circuit board surface of the present invention install against pressure across the shell fragment projection that is also provided with guide channel and matches with this guide channel, thereby can strengthen the intensity of the absorption flat board of this shell fragment, prevent that this shell fragment is upturned when absorption, make board suction nozzle can more easily adsorb this shell fragment, thereby enhance productivity.
Accompanying drawing explanation
Fig. 1 be circuit board surface of the present invention install against pressure across the perspective view of shell fragment.
Fig. 2 be circuit board surface of the present invention shown in Fig. 1 install against pressure across the front view of shell fragment, wherein utilize dotted line to show circuit board and docking components and parts with respect to the position relationship schematic diagram of this shell fragment.
Fig. 3 be circuit board surface of the present invention shown in Fig. 1 install against pressure across the plane plan structure schematic diagram of shell fragment.
Fig. 4 be circuit board surface of the present invention install against pressure across the shell fragment perspective view of watching from bottom.
description of reference numerals in above-mentioned accompanying drawing is as follows:
Shell fragment 1 welding substrate 10
Clamping plate 12 side boards 20
Jerk-finger 40 one end 42
The U-shaped bending part 50 of the other end 44
Adsorb dull and stereotyped 60 arc-shaped contact part 70
Printed circuit board (PCB) 100 docking components and parts 200
Embodiment
The explanation of following examples is graphic with reference to what add, can be in order to the specific embodiment of implementing in order to illustration the present invention.The direction term that the present invention mentions, such as " on ", D score, 'fornt', 'back', " left side ", " right side ", " top ", " end " etc., be only the direction with reference to annexed drawings.Therefore, the direction term of use is in order to illustrate and to understand the present invention, but not in order to limit the present invention.
Please refer to shown in Fig. 1 to Fig. 4, wherein Fig. 1 be circuit board surface of the present invention install against pressure across the perspective view of shell fragment 1, Fig. 2 be circuit board surface of the present invention shown in Fig. 1 install against pressure across the front view of shell fragment 1, wherein utilize dotted line to show circuit board and docking components and parts 200 with respect to the position relationship schematic diagram of this shell fragment 1, Fig. 3 be circuit board surface of the present invention shown in Fig. 1 install against pressure across the plane plan structure schematic diagram of shell fragment 1, and Fig. 4 be circuit board surface of the present invention install against pressure across shell fragment 1 perspective view of watching from bottom, circuit board surface of the present invention install against pressure across shell fragment 1 comprise welding substrate 10, the side board 20 that makes progress bending from one end of this welding substrate 10 and form, be formed on this side board 20 and extend to the guide channel 30 of this welding substrate 10, the jerk-finger 40 being upwards bent to form from the bottom of this guide channel 30, from the other end of this welding substrate 10, make progress bending and the U-shaped bending part 50 that forms, the absorption flat board 60 of formation is extended and extends in parallel with respect to this welding substrate 10 in one end from this U-shaped bending part 50 towards this side board 20, from this absorption dull and stereotyped 60 bending downward bending and arc-shaped contact part 70 of forming again upwards, and the end bending of this arc-shaped contact part 70 extension 80 extending to form towards this side board 20 certainly.
Above-mentioned welding substrate 10 is used for sticking together and is fixed to printed circuit board (PCB) 100(as Fig. 2) upper, shell fragment 1 can be welded on printed circuit board (PCB) 100.Therein in an embodiment, the bilateral symmetry of this welding substrate 10 upwards bending form the clamping plate 12 of two vertical shapes, clamping plate 12 height are lower than the height of this absorption dull and stereotyped 60.Owing to being provided with clamping plate 12, can guarantee the intensity of this welding substrate 10, can guarantee that welding substrate 10 can be because not being out of shape by external force.
Above-mentioned side board 20 is that the bending that makes progress from one end of welding substrate 10 forms, therein in an embodiment, this side board 20 is the bendings (as Fig. 2) that are inclined upwardly from one end of welding substrate 10, and bending angle is less than 90 degree, thereby and between welding substrate 10, forms the angle that is greater than 90 degree.In other embodiments, this side board 20 can also be designed to vertical shape (not shown) according to actual needs, now this side board 20 vertical bending that just need to make progress from one end of welding substrate 10.
Above-mentioned guide channel 30 is be formed at the centre position of this side board 20 and extend downward on this welding substrate 10.In this enforcement, this guide channel 30 is L-shaped, and a part for this guide channel 30 is positioned on this side board 20, and another part is positioned on this welding substrate 10.
The bottom end 32(that one end 42 of above-mentioned jerk-finger 40 connects these guide channels 30 is as shown in Figure 4), and the other end 44 is that from these guide channel 30 bottom end 32, upwards to bend and extend into be a free end.As shown in the figure, whole jerk-finger 40 is U-shaped structure, and this jerk-finger 40 is positioned at the below of these welding substrate 10 tops and this arc-shaped contact part 70, thereby is conducive to opposing from the pressure of top arc-shaped contact part 70.
One end connecting welding substrate 10 of above-mentioned U-shaped bending part 50, the other end horizontal-extending forms the absorption flat board 60 that is similar to horizontal plane.U-shaped bending part 50 is for for shell fragment 1 provides elastic force, with guarantee arc contact surface can with dock components and parts 200(as Fig. 2) form reliably and be electrically connected.
Above-mentioned absorption dull and stereotyped 60 is parallel to each other and keeps at a certain distance away with welding substrate 10, can be for the suction nozzle absorption on SMT board.In the present embodiment, absorption dull and stereotyped 60 is parallel to each other with welding substrate 10.But in other embodiments, absorption dull and stereotyped 60 can also be with respect to welding substrate 10 certain angle that is slightly inclined upwardly, 1 to 5 degree that for example can tilt, to be conducive to suction nozzle absorption.Visible, absorption dull and stereotyped 60 is not really wanted strictly to set for and is parallel to welding substrate 10, in fact can make suitable adjustment according to the operability of board.
Above-mentioned arc-shaped contact part 70 is higher than absorption dull and stereotyped 60 and side board 20, can be at first with dock components and parts 200(as Fig. 2) Elastic Contact, thereby form electric connection.As shown in Figure 3, the width of arc-shaped contact part 70 is less than the width of absorption dull and stereotyped 60, and absorption dull and stereotyped 60 is that dependence two hypotenuses 72 are connected with arc-shaped contact part 70, to reduce the stress of junction.Certainly, in other embodiments, in arc-shaped contact part 70, can also be provided with one and raise up or to the reinforcement of lower recess, to improve the structural strength of this arc-shaped contact part 70.
Above-mentioned extension 80 is to extend and form towards the bending of this side board 20 from the end of this arc-shaped contact part 70, centre position at the end of this extension 80 is also formed with a projection 82 protruding out towards this side board 20, this projection 82 can stretch in the L shaped guide channel 30 being formed on this side board 20, thereby by coordinating of this projection 82 and this guide channel 30 providing the correcting function while pressing down for this shell fragment 1.In addition, this projection 82 is upturned when adsorbing with preventing this shell fragment 1 coordinating of this guide channel 30, thereby plays the effect of the intensity of the absorption flat board 60 of strengthening this shell fragment 1.
In fact, it will also be appreciated that, the preferred mode that this side board 20 adopts is inclination bending, because be formed with in the present embodiment two shoulder 84(between projection 82 and extension 80 as shown in Figure 1), and shell fragment 1 is when being pressed down, the horizontal length of shell fragment 1 can extend due to the elastic stretch of arc-shaped contact part 70, and now the end of shoulder 84 very easily with this side board 20, friction finally stuck occurs, cause shell fragment 1 to be continued to press down, thereby affect normal production work.If therefore after these side board 20 inclination bendings and the angle forming between welding substrate 10 be an obtuse angle, to coordinate the deformation tendency of this shell fragment 1, thereby avoid occurring stuck situation, thereby guarantee that shell fragment 1 can be by normal running.
The detailed operation principle of shell fragment 1 of the present invention is as described below:
When docking components and parts 200 are pressed this shell fragment 1 downwards; the arc-shaped contact part 70 of this shell fragment 1 can be forced to decline; and this arc-shaped contact part 70 also can drive this extension 80 also together to move down simultaneously; once but this shell fragment 1 is excessively pressed down; the bottom of this arc-shaped contact part 70 this jerk-finger 40 of will conflicting; rely on the elastic force of this jerk-finger 40 can limit this arc-shaped contact part 70 and further pressed down, thereby prevent that this shell fragment 1 from irreversible distortion occurring, protect this shell fragment 1 do not pressed across.In addition, the elastic force making progress providing by this jerk-finger 40, can also strengthen this shell fragment 1 and the electric connection effect of docking between components and parts 200.
In sum; circuit board surface of the present invention install against pressure across shell fragment 1 by jerk-finger 40 being set between this welding substrate 10 and this arc-shaped contact part 70; can limit this arc-shaped contact part 70 and excessively be pressed down, thereby irreversible distortion can be there is not in protection shell fragment 1.Meanwhile, jerk-finger 40 can also improve this shell fragment 1 and the forward contact force of docking between components and parts 200, to improve this shell fragment 1 and the electric connection effect of docking components and parts 200.In addition, circuit board surface of the present invention install against pressure across shell fragment 1 projection 82 that is also provided with guide channel 30 and matches with this guide channel 30, thereby can strengthen the intensity of the absorption flat board 60 of this shell fragment 1, prevent that this shell fragment 1 is upturned when absorption, make board suction nozzle can more easily adsorb this shell fragment 1, thereby enhance productivity.
Claims (9)
- Circuit board surface install against pressure across a shell fragment, include a welding substrate, from one end of this welding substrate, make progress bending and the side board that forms, from the other end of this welding substrate make progress bending and the U-shaped bending part that forms, the absorption that extends to form towards this side board from one end of this U-shaped bending part are dull and stereotyped, from dull and stereotyped bending downward bending and the arc-shaped contact part that forms and certainly the end bending of this arc-shaped contact part the extension extending to form towards this side board again of making progress of this absorption; It is characterized in that:End at this extension is formed with a projection protruding out towards this side board;This shell fragment also comprises a guide channel and a jerk-finger; WhereinThis guide channel is formed on this side board and extends downward on this welding substrate, and this projection stretches into and is arranged in this guide channel;This jerk-finger is upwards to bend and form from the bottom of this guide channel, one end of this jerk-finger connects the bottom of this guide channel, the other end of this jerk-finger is upwards to bend and extend and become a free end from this guide channel bottom, and this jerk-finger is between this welding substrate and this arc-shaped contact part.
- Circuit board surface as claimed in claim 1 install against pressure across shell fragment, it is characterized in that: this guide channel is L-shaped, a part for this guide channel is positioned on this side board, another part is positioned on this welding substrate.
- Circuit board surface as claimed in claim 2 install against pressure across shell fragment, it is characterized in that: this jerk-finger is U-shaped structure.
- Circuit board surface as claimed in claim 1 install against pressure across shell fragment, it is characterized in that: this side board is the bending that is inclined upwardly from one end of this welding substrate, and the angle forming between this side board and this welding substrate is an obtuse angle.
- Circuit board surface as claimed in claim 1 install against pressure across shell fragment, it is characterized in that: this side board is to make progress vertical bending and form vertical shape from one end of welding substrate.
- Circuit board surface as claimed in claim 1 install against pressure across shell fragment, it is characterized in that: dull and stereotyped and this welding substrate of this absorption is parallel to each other and keeps at a certain distance away.
- Circuit board surface as claimed in claim 6 install against pressure across shell fragment, it is characterized in that: this arc-shaped contact part is dull and stereotyped and this side board higher than this absorption.
- Circuit board surface as claimed in claim 1 install against pressure across shell fragment, it is characterized in that: the width of this arc-shaped contact part is less than this and adsorbs dull and stereotyped width, this absorption is dull and stereotyped is that dependence two hypotenuses are connected with this arc-shaped contact part.
- Circuit board surface as claimed in claim 1 install against pressure across shell fragment, it is characterized in that: the bilateral symmetry of this welding substrate upwards bending form the clamping plate of two vertical shapes, the height of two clamping plate adsorbs dull and stereotyped height lower than this.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210287094.6A CN103594835A (en) | 2012-08-14 | 2012-08-14 | An anti-collapse elastic sheet mounted on the surface of a circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210287094.6A CN103594835A (en) | 2012-08-14 | 2012-08-14 | An anti-collapse elastic sheet mounted on the surface of a circuit board |
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| CN103594835A true CN103594835A (en) | 2014-02-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210287094.6A Pending CN103594835A (en) | 2012-08-14 | 2012-08-14 | An anti-collapse elastic sheet mounted on the surface of a circuit board |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183934A (en) * | 2014-02-28 | 2014-12-03 | 深圳市长盈精密技术股份有限公司 | Lateral-pressure-type antenna spring piece |
| CN104183951A (en) * | 2014-04-15 | 2014-12-03 | 深圳市长盈精密技术股份有限公司 | Low-height antenna connector |
| CN104617417A (en) * | 2014-12-19 | 2015-05-13 | 东莞联基电业有限公司 | Elastic terminal |
| CN104183951B (en) * | 2014-04-15 | 2016-11-30 | 深圳市长盈精密技术股份有限公司 | Low clearance antenna connector |
| WO2018099104A1 (en) * | 2016-11-29 | 2018-06-07 | 歌尔股份有限公司 | Conductive elastic piece and electronic device comprising the conductive elastic piece |
| CN112534652A (en) * | 2018-07-31 | 2021-03-19 | 株式会社Tps创作 | Spring contact and method for forming spring contact |
| CN112702870A (en) * | 2021-03-24 | 2021-04-23 | 荣耀终端有限公司 | Elastic sheet connecting structure and electronic equipment |
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| CN201656076U (en) * | 2009-11-19 | 2010-11-24 | 歌尔声学股份有限公司 | Elastic terminal and miniature moving coil type electroacoustic coverter |
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| CN202817285U (en) * | 2012-08-14 | 2013-03-20 | 昆山信创电子有限公司 | Circuit board surface mounting anti-collapse elastic sheet |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183934A (en) * | 2014-02-28 | 2014-12-03 | 深圳市长盈精密技术股份有限公司 | Lateral-pressure-type antenna spring piece |
| CN104183934B (en) * | 2014-02-28 | 2016-06-29 | 深圳市长盈精密技术股份有限公司 | Side compression type antenna shrapnel |
| CN104183951A (en) * | 2014-04-15 | 2014-12-03 | 深圳市长盈精密技术股份有限公司 | Low-height antenna connector |
| CN104183951B (en) * | 2014-04-15 | 2016-11-30 | 深圳市长盈精密技术股份有限公司 | Low clearance antenna connector |
| CN104617417A (en) * | 2014-12-19 | 2015-05-13 | 东莞联基电业有限公司 | Elastic terminal |
| CN104617417B (en) * | 2014-12-19 | 2018-06-15 | 东莞联基电业有限公司 | Flexible terminal |
| WO2018099104A1 (en) * | 2016-11-29 | 2018-06-07 | 歌尔股份有限公司 | Conductive elastic piece and electronic device comprising the conductive elastic piece |
| CN112534652A (en) * | 2018-07-31 | 2021-03-19 | 株式会社Tps创作 | Spring contact and method for forming spring contact |
| CN112534652B (en) * | 2018-07-31 | 2022-11-29 | 株式会社Tps创作 | Spring contact and method for forming spring contact |
| CN112702870A (en) * | 2021-03-24 | 2021-04-23 | 荣耀终端有限公司 | Elastic sheet connecting structure and electronic equipment |
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Application publication date: 20140219 |