CN208014697U - A kind of COB die set light sources and LED lamp - Google Patents
A kind of COB die set light sources and LED lamp Download PDFInfo
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- CN208014697U CN208014697U CN201820473336.3U CN201820473336U CN208014697U CN 208014697 U CN208014697 U CN 208014697U CN 201820473336 U CN201820473336 U CN 201820473336U CN 208014697 U CN208014697 U CN 208014697U
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Abstract
The utility model discloses a kind of COB die set light sources and LED lamps, the COB die set light sources include substrate, it is provided with crystal bonding area on the substrate, several infrared LED chips and blue-light LED chip are pasted in the crystal bonding area, and the infrared LED chip and blue-light LED chip are arranged alternately squarely structure or circular configuration；The both sides of the substrate are provided with the first positive terminal pad, the first negative terminal pad, the second positive terminal pad and the second negative terminal pad；The infrared LED chip by gold thread be sequentially connected in series or parallel connection after be electrically connected with the first positive terminal pad and the first negative terminal pad, the blue-light LED chip by gold thread be sequentially connected in series or parallel connection after be electrically connected with the second positive terminal pad and the second negative terminal pad, it is encapsulated by integrated form, so that LED lamp has illumination and monitoring function and can promote the imaging definition and monitoring distance of LED lamp simultaneously, while improving the processing efficiency and processing yield of LED lamp.
Description
Technical field
The utility model is related to LED encapsulation technologies field, more particularly to a kind of COB die set light sources and LED lamp.
Background technology
The LED lamp with monitoring function gradually increases on the market, but the image sharpness of its imaging is inadequate, the distance of irradiation
In 5-8 meters of ranges, main cause, which is LED lamp, will consider that volume cannot exceed the volume of existing product, so tying
There was only LED light source for illuminating on structure；Camera is mounted in the top of lamps and lanterns, on daytime or indoor because there is the illumination white light LEDs to be
The photosensory assembly of camera provides secondary light source so imaging clearly, but closes after power supply and take the photograph to night or illumination white light
As the sensor devices of head do not have secondary light source carry out light filling, in Imaging for Monitoring, image sharpness is inadequate, cannot identify face.
Thus the prior art could be improved and improve.
Utility model content
Place in view of above-mentioned deficiencies of the prior art, the purpose of this utility model is to provide a kind of COB die set light sources and
LED lamp ensures LED lamp by the way that infrared LED chip and blue-light LED chip are arranged simultaneously in the crystal bonding area of COB die set light sources
In the case where not changing original volume while there is illumination and monitoring function, and promoted LED lamp imaging definition and
Distance is monitored, while improving the processing efficiency and processing yield of LED lamp.
In order to achieve the above object, the utility model takes following technical scheme：
A kind of COB die set light sources, including substrate are provided with crystal bonding area on the substrate, if being pasted in the crystal bonding area
The outer LED chip of extra dry red wine and blue-light LED chip, and the infrared LED chip and blue-light LED chip be arranged alternately squarely structure or
Circular configuration；The both sides of the substrate are provided with the first positive terminal pad, the first negative terminal pad, the second positive terminal pad and the second cathode
Pad；The infrared LED chip by gold thread be sequentially connected in series or parallel connection after be electrically connected with the first positive terminal pad and the first negative terminal pad
Connect, the blue-light LED chip by gold thread be sequentially connected in series or parallel connection after be electrically connected with the second positive terminal pad and the second negative terminal pad.
In the COB die set light sources, the infrared LED chip and blue-light LED chip are square Structural assignments, wherein institute
State infrared LED chip and blue-light LED chip connected respectively by gold thread after be arranged alternately at equal intervals in crystal bonding area.
In the COB die set light sources, the infrared LED chip and the rounded Structural assignments of blue-light LED chip, wherein institute
The inner ring that infrared LED chip is equidistantly arranged in circular configuration is stated, and the blue-light LED chip is equidistantly arranged in circular configuration
Outer ring.
In the COB die set light sources, the infrared LED chip and the rounded Structural assignments of blue-light LED chip, and it is described
Infrared LED chip is equidistantly arranged alternately with blue-light LED chip.
In the COB die set light sources, the wave-length coverage of the infrared LED chip is 700nm ~ 960nm, the blue light
The wave-length coverage of LED chip is 440nm ~ 480nm.
In the COB die set light sources, yellow fluorescent glue is all covered on the infrared LED chip and blue-light LED chip.
In the COB die set light sources, the ratio of the infrared LED chip and blue-light LED chip quantity is 1:1.
In the COB die set light sources, the ratio of the infrared LED chip and blue-light LED chip quantity is 1:3.
In the COB die set light sources, the ratio of the infrared LED chip and blue-light LED chip quantity is 5:3.
A kind of LED lamp, which is characterized in that including COB die set light sources as described above.
It is compared to the prior art, provided by the utility model that the utility model discloses a kind of COB die set light sources and LED light
Tool, the COB die set light sources include substrate, and crystal bonding area is provided on the substrate, are pasted in the crystal bonding area several infrared
LED chip and blue-light LED chip, and the infrared LED chip and blue-light LED chip are arranged alternately squarely structure or round knot
Structure；The both sides of the substrate are provided with the first positive terminal pad, the first negative terminal pad, the second positive terminal pad and the second negative terminal pad；
The infrared LED chip by gold thread be sequentially connected in series or parallel connection after be electrically connected with the first positive terminal pad and the first negative terminal pad, institute
State blue-light LED chip by gold thread be sequentially connected in series or parallel connection after be electrically connected with the second positive terminal pad and the second negative terminal pad, pass through
Integrated form encapsulates so that LED lamp has illumination and monitoring function and can promote the imaging definition and prison of LED lamp simultaneously
Distance is controlled, while improving the processing efficiency and processing yield of LED lamp.
Description of the drawings
Fig. 1 is the die bond schematic diagram of COB die set light sources first embodiment provided by the utility model；
Fig. 2 is the die bond schematic diagram of COB die set light sources second embodiment provided by the utility model；
Fig. 3 is the encapsulation schematic diagram of COB die set light sources first embodiment provided by the utility model；
Fig. 4 is the die bond schematic diagram of COB die set light sources 3rd embodiment provided by the utility model；
Fig. 5 is the encapsulation schematic diagram of COB die set light sources second embodiment provided by the utility model；
Fig. 6 is the encapsulation schematic diagram of COB die set light sources 3rd embodiment provided by the utility model.
Specific implementation mode
A kind of COB die set light sources provided by the utility model and LED lamp, by same in the crystal bonding area of COB die set light sources
When setting infrared LED chip and blue-light LED chip, ensure that LED lamp in the case where not changing original volume while having photograph
Bright and monitoring function, and the imaging definition and monitoring distance of LED lamp are promoted, LED is also improved by integrated form encapsulation
The processing efficiency and processing yield of lamps and lanterns.
To keep the purpose of this utility model, technical solution and effect clearer, clear, develop simultaneously implementation referring to the drawings
The utility model is further described in example.It should be appreciated that specific embodiment described herein is only explaining this practicality
It is novel, it is not used to limit the utility model.
It please refers to Fig.1 and Fig. 2, COB die set light sources provided by the utility model, including substrate 1, is arranged on the substrate 1
There is crystal bonding area 11, several infrared LED chips 12 and blue-light LED chip 13, and the infrared LED are pasted in the crystal bonding area 11
Chip 12 and blue-light LED chip 13 are arranged alternately squarely structure or circular configuration；The both sides of the substrate 1 are being provided with first just
Pole pad 14, the first negative terminal pad 15, the second positive terminal pad 16 and the second negative terminal pad 17；The infrared LED chip 12 passes through
Gold thread be sequentially connected in series or parallel connection after be electrically connected with the first positive terminal pad 14 and the first negative terminal pad 15, the blue-light LED chip 13
By gold thread be sequentially connected in series or parallel connection after be electrically connected with the second positive terminal pad 16 and the second negative terminal pad 17, by crystal bonding area 11
Simultaneously infrared LED chip 12 and blue-light LED chip 13 are set so that LED lamp in the case where not changing original volume simultaneously
With illumination and monitoring function, and it can effectively promote the imaging definition and monitoring distance of LED lamp；Meanwhile it using
Integrated form encapsulates, and further optimizes the structure of LED lamp and promotes the yield of processing efficiency and processing.
When it is implemented, referring again to Fig. 1, in the utility model first embodiment, the infrared LED chip 12 and blue light
LED chip 13 is square Structural assignments, wherein the infrared LED chip 12 and blue-light LED chip 13 are connected by gold thread respectively
It is arranged alternately at equal intervals afterwards in crystal bonding area 11, and the ratio of 13 quantity of the infrared LED chip 12 and blue-light LED chip is 1:
1, since LED light source has the function of infrared LED, secondary light source can be provided for the sensor devices of monitor at night, promotes lamp
The imaging definition of tool simultaneously coordinates the camera lens of monitoring to promote the monitoring distance of lamps and lanterns, is promoted to 20 meters or more by current 5-8 rice.
Further, referring to Fig. 3, after infrared LED chip 12 and blue-light LED chip 13 are welded, entire rectangular
Crystal bonding area 11 covers one layer of yellow fluorescent glue 18, i.e., is all covered with yellow on the described infrared LED chip 12 and blue-light LED chip 13
Fluorescent glue 18, blue-light LED chip 13 emit white light after being excited with yellow fluorescent powder, and infrared LED chip 12 does not have with yellow fluorescent glue 18
There are stimulation effect, the light that infrared LED chip 12 generates that will pass through yellow fluorescent glue 18 so that LED light source can be completed at the same time photograph
Bright and infrared monitoring function, and the nighttime imaging clarity of lamps and lanterns is promoted by infrared LED chip 12 and monitors distance.
When it is implemented, referring again to Fig. 2, in the utility model second embodiment, the infrared LED chip 12 and blue light
13 rounded Structural assignments of LED chip, wherein the infrared LED chip 12 is equidistantly arranged in the inner ring of circular configuration, and institute
State the outer ring that blue-light LED chip 13 is equidistantly arranged in circular configuration, while along the diametric(al) of circle where LED chip,
The spacing of each circle is equal；Preferably, the infrared LED chip 12 in the present embodiment and blue-light LED chip 13 arrange two circle,
Wherein, the ratio of 13 quantity of the infrared LED chip 12 and blue-light LED chip is 1:3；In addition, in order to realize better illumination
Blue-light LED chip 13, can also be arranged in the inner ring of circular configuration by effect, and infrared LED chip 12 is equidistantly arranged in circle
The outer ring of shape structure, the utility model are not construed as limiting this.
Further, referring to Fig. 4, in the utility model 3rd embodiment, the infrared LED chip 12 and blue-ray LED
13 rounded Structural assignments of chip, and the infrared LED chip 12 is equidistantly arranged alternately with blue-light LED chip 13；Specifically,
By the center of the blue-light LED chip 13 arrangement and circular configuration, the LED chip of two adjacent rings is different, equally along LED core
The diametric(al) of circle, the spacing of each circle are equal where piece；Preferably, the infrared LED chip 12 and indigo plant in the present embodiment
Light LED chip 13 is equidistantly arranged alternately two circles successively；Wherein, the infrared LED chip 12 and blue-light LED chip 13 quantity
Ratio is 5:3；In addition, in order to realize better lighting effect, infrared LED chip 12 can also be arranged in circular configuration
The heart, the utility model are not construed as limiting this.
Further, Fig. 5 and Fig. 6 are please referred to, infrared LED chip 12 and 13 rounded structure of blue-light LED chip are arranged
After cloth is welded, one layer of yellow fluorescent glue 18 is encapsulated in crystal bonding area 11, since crystal bonding area 11 is in circular configuration arrangement form
Circle carries out sealing one by one so that sealing product can do any angle between 60 ~ 120 degree, root to each LED chip
Therefore the change of angle is carried out according to the molding height of glue and width can further change the light emitting region of LED light source,
To reach better illumination effect.
Preferably, the wave-length coverage of the infrared LED chip is 700nm ~ 960nm, the wavelength model of the blue-light LED chip
It encloses for 440nm ~ 480nm.
The utility model further correspondingly provides a kind of COB lamps and lanterns, including COB die set light sources, and the COB lamps and lanterns illuminate simultaneously
And monitoring function, and the white LED light source of the lamps and lanterns has infrared function so that and the concealment of lamps and lanterns is stronger so that lamps and lanterns
Monitoring function further optimized, it is no longer superfluous herein since the COB die set light sources being described in detail above
It states.
In conclusion a kind of COB die set light sources provided by the utility model and LED lamp, the COB die set light sources include
Substrate is provided with crystal bonding area on the substrate, several infrared LED chips and blue-light LED chip is pasted in the crystal bonding area, and
The infrared LED chip and blue-light LED chip are arranged alternately squarely structure or circular configuration；The both sides of the substrate are provided with
First positive terminal pad, the first negative terminal pad, the second positive terminal pad and the second negative terminal pad；The infrared LED chip passes through gold thread
Be sequentially connected in series or parallel connection after be electrically connected with the first positive terminal pad and the first negative terminal pad, the blue-light LED chip by gold thread according to
It is electrically connected with the second positive terminal pad and the second negative terminal pad after secondary serial or parallel connection, is encapsulated by integrated form so that LED lamp is same
When with illumination and monitoring function and the imaging definition and monitoring distance of LED lamp can be promoted, while improving LED lamp
Processing efficiency and processing yield.
It is understood that for those of ordinary skills, can with technical solution according to the present utility model and
The design of its utility model is subject to equivalent substitution or change, and all these changes or replacement should all belong to appended by the utility model
Scope of the claims.
Claims (10)
1. a kind of COB die set light sources, which is characterized in that including substrate, crystal bonding area is provided on the substrate, in the crystal bonding area
It is pasted with several infrared LED chips and blue-light LED chip, and the infrared LED chip and blue-light LED chip are arranged alternately into side
Shape structure or circular configuration；The both sides of the substrate be provided with the first positive terminal pad, the first negative terminal pad, the second positive terminal pad and
Second negative terminal pad；The infrared LED chip by gold thread be sequentially connected in series or parallel connection after with the first positive terminal pad and the first cathode
Pad is electrically connected, the blue-light LED chip by gold thread be sequentially connected in series or parallel connection after weld with the second positive terminal pad and the second cathode
Disk is electrically connected.
2. COB die set light sources according to claim 1, which is characterized in that the infrared LED chip and blue-light LED chip
Be square Structural assignments, wherein the infrared LED chip and blue-light LED chip replace at equal intervals after being connected respectively by gold thread
It is arranged in crystal bonding area.
3. COB die set light sources according to claim 1, which is characterized in that the infrared LED chip and blue-light LED chip
Rounded Structural assignments, wherein the infrared LED chip is equidistantly arranged in the inner ring of circular configuration, and the blue-ray LED core
Piece is equidistantly arranged in the outer ring of circular configuration.
4. COB die set light sources according to claim 1, which is characterized in that the infrared LED chip and blue-light LED chip
Rounded Structural assignments, and the infrared LED chip is equidistantly arranged alternately with blue-light LED chip.
5. COB light source module according to claim 1, which is characterized in that the wave-length coverage of the infrared LED chip is
The wave-length coverage of 700nm ~ 960nm, the blue-light LED chip are 440nm ~ 480nm.
6. COB light source module according to claim 1, which is characterized in that the infrared LED chip and blue-light LED chip
On be all covered with yellow fluorescent glue.
7. COB die set light sources according to claim 2, which is characterized in that the infrared LED chip and blue-light LED chip
The ratio of quantity is 1:1.
8. COB die set light sources according to claim 3, which is characterized in that the infrared LED chip and blue-light LED chip
The ratio of quantity is 1:3.
9. COB die set light sources according to claim 4, which is characterized in that the infrared LED chip and blue-light LED chip
The ratio of quantity is 5:3.
10. a kind of LED lamp, which is characterized in that including COB die set light sources as described in any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820473336.3U CN208014697U (en) | 2018-04-04 | 2018-04-04 | A kind of COB die set light sources and LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820473336.3U CN208014697U (en) | 2018-04-04 | 2018-04-04 | A kind of COB die set light sources and LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208014697U true CN208014697U (en) | 2018-10-26 |
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ID=63891999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820473336.3U Active CN208014697U (en) | 2018-04-04 | 2018-04-04 | A kind of COB die set light sources and LED lamp |
Country Status (1)
| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109802027A (en) * | 2019-02-22 | 2019-05-24 | 佛山市国星光电股份有限公司 | A kind of light source module group and its manufacturing method and its die cutting die |
-
2018
- 2018-04-04 CN CN201820473336.3U patent/CN208014697U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109802027A (en) * | 2019-02-22 | 2019-05-24 | 佛山市国星光电股份有限公司 | A kind of light source module group and its manufacturing method and its die cutting die |
| CN109802027B (en) * | 2019-02-22 | 2024-04-09 | 佛山市国星光电股份有限公司 | Light source module, manufacturing method thereof and punching die thereof |
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