CN207968436U - A kind of LTCC lamination sheet types duplexer - Google Patents
A kind of LTCC lamination sheet types duplexer Download PDFInfo
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- CN207968436U CN207968436U CN201820398625.1U CN201820398625U CN207968436U CN 207968436 U CN207968436 U CN 207968436U CN 201820398625 U CN201820398625 U CN 201820398625U CN 207968436 U CN207968436 U CN 207968436U
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Abstract
A kind of LTCC lamination sheet types duplexer, it is related to the LTCC lamination sheet type duplexers of miniaturization, it is big to solve existing LTCC lamination sheet types duplexer volume, it is big to there is loss in the division function of low frequency signal and high-frequency signal, the energy force difference of suppression common mode signal, the technical deficiencies such as of high cost, include ceramic matrix, and the lateral wall of ceramic matrix is equipped with the first grounding ports（P1）, public port（P2）, third grounding ports（P3）, high-frequency band pass output port（P4）, the 5th grounding ports（P5）And low-frequency range output port（P6）；Between public port inside the ceramic matrix（P2）With low-frequency range output port（P6）Between be equipped with low-pass filter for isolating low-band signal；Between public port inside the ceramic matrix（P2）With high-frequency band pass output port（P4）Between be equipped with bandpass filter for isolating high band bandpass signal；Include 11 layers of ceramic dielectric circuit layer in laminated construction in the ceramic matrix, the division function for effectively realizing low frequency signal and high-frequency signal has many advantages, such as that low-loss, high-isolation, high inhibition, high reliability, low cost, consistency is excellent and is suitable for producing on a large scale.
Description
Technical field
The present invention relates to the LTCC lamination sheet type duplexers of miniaturization, can be used for 4G mobile communcations systems, tablet computer
And in other various communication apparatus.
Background technology
Low-temperature co-fired ceramics（Low Temperature Co-fired Ceramic, LTCC）Technology is exactly by low-temperature sintering
The accurate and fine and close green band of thickness is made in ceramic powder, and as circuit base material, laser boring, micro- is utilized on green band
The techniques such as hole slip casting, accurate conductor paste printing make required circuitous pattern, and wherein by multiple passive original paper embedments, so
After overlap together, at 900 DEG C be sintered, the passive integration component of three-dimensional circuit network is made.It is designed based on LTCC technology
Frequency microwave element with production includes filter, duplexer, antenna, coupler, balun, receiving front-end module, duplexer
Module etc..Because it has many advantages, such as good high frequency characteristics, high-speed transfer, high integration, as modern electronic equipment is to small
Type, high frequency direction continue to develop, they largely apply to miniaturized electronic devices, especially mobile phone, tablet computer,
The consumer-elcetronics devices such as digital camera, electronic reader.
Information technology continue to develop, need the frequency spectrum resource used more, in Cell Phone Design, filter become can not or
Scarce device, may be used the input signal of duplexer processing frequency range, or duplexer is integrated in antenna and is opened the light module（ASM）
Or mobile phone front end（FEM）In.The duplexer that LTCC technology makes has high reliability, filter with low insertion loss, highly selective, volume
It is small, light-weight, be easily integrated, low cost the advantages that, be suitble to large-scale production.Market prospects are also considerable.
Invention content
In conclusion big it is an object of the invention to solve existing LTCC lamination sheet types duplexer volume, low frequency signal and
There is loss greatly in the division function of high-frequency signal, the energy force difference of suppression common mode signal, the technical deficiencies such as of high cost, and propose a kind of
LTCC lamination sheet type duplexers.
To solve technical problem proposed by the invention, the technical solution used for：
A kind of LTCC lamination sheet types duplexer, it is characterised in that the duplexer includes ceramic matrix, ceramic matrix
Lateral wall is equipped with the first grounding ports（P1）, public port（P2）, third grounding ports（P3）, high-frequency band pass output port
（P4）, the 5th grounding ports（P5）And low-frequency range output port（P6）；Between public port inside the ceramic matrix（P2）
With low-frequency range output port（P6）Between be equipped with low-pass filter for isolating low-band signal；In the ceramic matrix
Portion is between public port（P2）With high-frequency band pass output port（P4）Between be equipped with band for isolating high band bandpass signal
Bandpass filter；Include 11 layers of ceramic dielectric circuit layer in laminated construction in the ceramic matrix, wherein：
First layer is printed with three pieces of mutually insulated metal flat conductors, first piece of planar conductor on ceramic dielectric substrate
By first layer the first capacitance substrate（1-C1）, connect first layer the first capacitance substrate（1-C1）With the first grounding ports（P1）
One layer of first inner terminal（1A）, and connection first layer the first capacitance substrate（1-C1）With the 5th grounding ports（P5）First layer
4th inner terminal（1D）It constitutes；Second piece of planar conductor is by first layer the second capacitance substrate（1-C2）, connect first layer second
Capacitance substrate（1-C2）First layer third capacitance substrate（1-C3）, and connection first layer the second capacitance substrate（1-C2）With it is public
Port（P2）The second inner terminal of first layer（1B）；Third block planar conductor is by connection third grounding ports（P3）First layer
False exit（1C）It constitutes；
The second layer is printed with four pieces of mutually insulated metal flat conductors, first piece of planar conductor on ceramic dielectric substrate
By the second layer the first capacitance substrate（2-C1）It constitutes, the second layer the first capacitance substrate（2-C1）It is also associated at the ten eight point
Column（18）；Second piece of planar conductor is by the second layer the second capacitance substrate（2-C2）It constitutes, the second layer the second capacitance substrate（2-C2）
It is also associated with the 21st column（21）；Third block planar conductor is by second layer third capacitance substrate（2-C3）It constitutes, the second layer
Third capacitance substrate（2-C3）It is also associated with the 22nd column（22）；4th piece of planar conductor is by connection high-frequency band pass output end
Mouthful（P4）Second layer vacation exit（2A）It constitutes；
Third layer, is printed with the metal flat conductor of eight pieces of mutually insulateds on ceramic dielectric substrate, and first piece of plane is led
Body is by third layer the first capacitance substrate（3-C1）With the 5th inner terminal of third layer（3E）It constitutes, the 5th inner terminal of third layer
（3E）Connect low-frequency range output port（P6）；Second piece of planar conductor is by third layer the second capacitance substrate（3-C2）With third layer
One inner terminal（3A）It constitutes, the first inner terminal of third layer（3A）Connect the first grounding ports（P1）；Third block planar conductor
By third layer third capacitance substrate（3-C3）With the second inner terminal of third layer（3B）It constitutes, the second inner terminal of third layer（3B）
Connect public port（P2）；4th piece of planar conductor is by the 4th capacitance substrate of third layer（3-C4）It constitutes, the 4th capacitance of third layer
Substrate（3-C4）It is also connected with the 21st column（21）；Five, the six, seven and eight pieces of planar conductors are drawn by the first vacation of third layer respectively
Outlet（3C）, the false exit of third layer second（3D）, third layer the first printing points column（18-1）With third layer the second printing points column
（22-1）It constitutes；The false exit of third layer first（3C）Connect third grounding ports（P3）, the false exit of third layer second（3D）
Connect high-frequency band pass output port（P4）；Third layer the first printing points column（18-1）For the ten eight column（18）Composition portion
Point, third layer the second printing points column（22-1）For the 22nd column（22）Component part；
4th layer, four pieces of mutually insulated metal flat conductors, first piece of planar conductor are printed on ceramic dielectric substrate
By the 4th layer of first capacitance substrate（4-C1）With the 4th layer of the first inner terminal（4A）It constitutes, the 4th layer of the first inner terminal（4A）
Connect the 5th grounding ports（P5）；Second and third and four pieces of planar conductors are respectively by the 4th layer of first printing points column（18-2）, the 4th
The second printing points column of layer（21-1）, the 4th layer of third printing points column（22-2）It constitutes；4th layer of first printing points column（18-2）For
Ten eight column（18）Component part, the 4th layer of second printing points column（21-1）For the 21st column（21）'s
Component part, the 4th layer of third printing points column（22-2）For the 22nd column（22）Component part；
Layer 5 is printed with three pieces of mutually insulated metal flat conductors, first piece of planar conductor on ceramic dielectric substrate
By the first inductance coil of layer 5（5-L1）, and it is respectively arranged on the first inductance coil of layer 5（5-L1）The layer 5 at both ends
One inner terminal（5A）With the second inner terminal of layer 5（5B）It constitutes；Second and three pieces of planar conductors respectively by layer 5 first
Printing points column（21-3）, layer 5 the second printing points column（22-4）It constitutes；The first inner terminal of layer 5（5A）With layer 5
Two inner terminals（5B）It is separately connected the ten eight column（18）With the ten nine column（19）；Layer 5 the first printing points column（21-3）
For the 21st column（21）Component part, layer 5 the second printing points column（22-4）For the 22nd column
（22）Component part；
Layer 6 is printed with four pieces of mutually insulated metal flat conductors, first piece of planar conductor on ceramic dielectric substrate
By the first inductance coil of layer 6（6-L1）And it is respectively arranged on the first inductance coil of layer 6（6-L1）The layer 6 at both ends
One inner terminal（6A）With the second inner terminal of layer 6（6B）It constitutes；The first inner terminal of layer 6（6A）Connect at the ten seven point
Column（17）, the second inner terminal of layer 6（6B）Connect the ten nine column（19）；Second piece of planar conductor is by the second electricity of layer 6
Feel coil（6-L2）, and it is respectively arranged on the second inductance coil of layer 6（6-L2）The layer 6 third inner terminal at both ends（6C）
With the 4th inner terminal of layer 6（6D）It constitutes；Layer 6 third inner terminal（6C）With the 4th inner terminal of layer 6（6D）Point
It Lian Jie not the 20th column（20）With the 22nd column（22）；Third and four pieces of planar conductors are respectively by printing points column（18-5）
With printing points column（21-5）It constitutes；Printing points column（18-5）For the ten eight column（18）Component part, printing points column
（21-5）For the 21st column（21）Component part；
Layer 7 is printed with four pieces of mutually insulated metal flat conductors, first piece of planar conductor on ceramic dielectric substrate
By the first inductance coil of layer 7（7-L1）And it is respectively arranged on the first inductance coil of layer 7（7-L1）The layer 7 at both ends
One inner terminal（7A）With the second inner terminal of layer 7（7B）It constitutes, the first inner terminal of layer 7（7A）It is defeated to connect low-frequency range
Exit port（P6）, the second inner terminal of layer 7（7B）Connect the ten seven column（17）；Second piece of planar conductor is by layer 7
Two inductance coils（7-L2）And it is set to the second inductance coil of layer 7（7-L2）The 4th inner terminal of layer 7 of tail end
（7D）, the 4th inner terminal of layer 7（7D）Connect high-frequency band pass output port（P4）, the second inductance coil of layer 7（7-L2）
Head end connect the 20th column（20）；Third and four pieces of planar conductors are respectively by printing points column（18-7）With printing points column（21-
7）It constitutes；Printing points column（18-7）For the ten eight column（18）Component part, printing points column（21-7）It is described second
Ten one columns（21）Component part；
8th layer, two pieces of mutually insulated metal flat conductors, first piece of planar conductor are printed on ceramic dielectric substrate
By the 8th layer of the first inductance coil（8-L1）It constitutes, the 8th layer of the first inductance coil（8-L1）Both ends be separately connected at the ten eight point
Column（18）With the ten six column（16）；Second piece of planar conductor is by the 8th layer of the second inductance coil（8-L2）It constitutes, the 8th layer the
Two inductance coils（8-L2）Both ends are separately connected the ten two column（12）With the 21st column（21）；
9th layer, two pieces of mutually insulated metal flat conductors, first piece of planar conductor are printed on ceramic dielectric substrate
By the 9th layer of the first inductance coil（9-L1）, and it is respectively arranged on the 9th layer of the first inductance coil（9-L1）The 9th layer of both ends
First inner terminal（9A）With the 9th layer of the second inner terminal（9B）It constitutes, the 9th layer of the first inner terminal（9A）With the 9th layer
Two inner terminals（9B）It is separately connected the ten six column（16）With the ten five column（15）；Second piece of planar conductor is by the 9th layer
Two inductance coils（9-L2）, and it is respectively arranged on the 9th layer of the second inductance coil（9-L2）Both ends the 9th layer of third inside end
Point（9C）With the 9th layer of the 4th inner terminal（9D）It constitutes, the 9th layer of third inner terminal（9C）With the 9th layer of the 4th inner terminal
（9D）It is separately connected the ten two column（12）With the 23rd column（23）；
Tenth layer, two pieces of mutually insulated metal flat conductors, first piece of planar conductor are printed on ceramic dielectric substrate
By the tenth layer of the first inductance coil（10-L1）, and it is respectively arranged on the tenth layer of the first inductance coil（10-L1）Both ends the tenth
The first inner terminal of layer（10A）With the tenth layer of the second inner terminal（10B）It constitutes, the tenth layer of the first inner terminal（10A）With
Ten layer of second inner terminal（10B）It is separately connected the ten three column（13）With the ten five column（15）；Second piece of planar conductor by
Tenth layer of the second inductance coil（10-L2）, and it is respectively arranged on the tenth layer of the second inductance coil（10-L2）The tenth layer of both ends
Third inner terminal（10C）With the tenth layer of the 4th inner terminal（10D）It constitutes, the tenth layer of third inner terminal（10C）With the tenth
The 4th inner terminal of layer（10D）It is separately connected the ten four column（14）With the 23rd column（23）；
Eleventh floor, is printed with two pieces of mutually insulated metal flat conductors on ceramic dielectric substrate, and first piece of plane is led
Body is by the first inductance coil of eleventh floor（11-L1）, and it is respectively arranged on the first inductance coil of eleventh floor（11-L1）Both ends
The first inner terminal of eleventh floor（11A）With eleventh floor third inner terminal（11C）It constitutes, the first inside end of eleventh floor
Point（11A）Connect public port（P2）, eleventh floor third inner terminal（11C）Connect the ten three column（13）；Second piece flat
Face conductor is by the second inductance coil of eleventh floor（11-L2）, and it is respectively arranged on the second inductance coil of eleventh floor（11-L2）'s
Second inner terminal of eleventh floor at both ends（11B）With the 4th inner terminal of eleventh floor（11D）It constitutes, in eleventh floor second
Portion's endpoint（11B）Connect the ten four column（14）, the 4th inner terminal of eleventh floor（11D）Connect the 5th grounding ports（P5）.
First grounding ports（P1）, public port（P2）With third grounding ports（P3）Before ceramic matrix
On lateral wall；High-frequency band pass output port（P4）, the 5th grounding ports（P5）And low-frequency range output port（P6）Set on ceramic base
On the rear lateral wall of body.
Beneficial effects of the present invention are：The present invention is with LTCC（Low-temperature co-fired ceramics）Based on technology, using lumped parameter
A kind of particular electrical requirement of novel LTCC lamination sheet types duplexer is realized in modelling.The present invention effectively realizes low frequency letter
Number and high-frequency signal division function, have low-loss, high-isolation, high inhibition, high reliability, low cost, consistency excellent
The advantages that with being suitable for producing on a large scale, be in addition also adapted to new electronic component integration, miniaturization development trend.
Description of the drawings
Fig. 1 is LTCC lamination sheet types duplexer schematic equivalent circuit of the present invention；
Fig. 2 is LTCC lamination sheet types duplexer dimensional structure diagram of the present invention；
Fig. 3 is LTCC lamination sheet types duplexer internal structure schematic diagram of the present invention；
Fig. 4 is first layer circuit layer planar structure schematic diagram of the present invention；
Fig. 5 is second layer circuit planes structural schematic diagram of the present invention；
Fig. 6 is third layer circuit planes structural schematic diagram of the present invention
Fig. 7 is the 4th layer of circuit planes structural schematic diagram of the invention；
Fig. 8 is layer 5 circuit planes structural schematic diagram of the present invention
Fig. 9 is layer 6 circuit planes structural schematic diagram of the present invention；
Figure 10 is layer 7 circuit planes structural schematic diagram of the present invention；
Figure 11 is the 8th layer of circuit planes structural schematic diagram of the invention；
Figure 12 is the 9th layer of circuit planes structural schematic diagram of the invention；
Figure 13 is the tenth layer of circuit planes structural schematic diagram of the invention；
Figure 14 is eleventh floor circuit planes structural schematic diagram of the invention.
Specific implementation mode
The structure of the present invention is further described below in conjunction with attached drawing and currently preferred specific embodiment.
Shown in Fig. 3, LTCC lamination sheet type duplexers of the invention, include ceramic matrix, ceramic matrix
Lateral wall be equipped with the first grounding ports P1, public port P2, third grounding ports P3, high-frequency band pass output port P4, the
Five grounding ports P5 and low-frequency range output port P6；Preferred embodiment is the first grounding ports P1, public port P2 and third ground connection
Port P3 is set on the preceding lateral wall of ceramic matrix；High-frequency band pass output port P4, the 5th grounding ports P5 and low-frequency range output
Port P6 is set on the rear lateral wall of ceramic matrix.
It is equipped between public port P2 and low-frequency range output port P6 for isolating inside the ceramic matrix
The low-pass filter of low-band signal；Inside the ceramic matrix between public port P2 and high-frequency band pass output port P4 it
Between be equipped with bandpass filter for isolating high band bandpass signal.It is defeated from public port P2 with signal shown in referring to Fig.1
Illustrate for entering：Signal is exported from the ports tremendously low frequency section output port P6 after public port P2 inputs, this link is low pass filtered
Wave device, separates low-band signal；Signal exports after public port P2 inputs to high-frequency band pass output port P4, this link is
Bandpass filter separates high frequency band signal.The high band bandpass filter is made of one inductance of a high-pass filtering and series connection,
Wherein high-pass filter is made of inductance L1 and capacitance C1, capacitance C2, capacitance C3, and capacitance C3 is flying capcitor, is effectively improved
Stopband attenuation of the high band bandpass filter in low-frequency range, series inductance are then inductance L2, effectively increase high band band logical
Stopband attenuation of the filter in high band.Low-band signal is then divided by low-pass filter, and low-pass filter is by inductance
L3, inductance L4 and capacitance C4, capacitance C5, capacitance C6 are constituted, and inductance L4 forms a transmission zero with capacitance C5 parallel resonances,
Effectively increase low-frequency range low-pass filter low-frequency range stopband attenuation.
Include 11 layers of ceramics in laminated construction in ceramic matrix of the present invention with reference to shown in Fig. 3 to Figure 14
Each layer structure of dielectric circuit layer, 11 layers of ceramic dielectric circuit layer in laminated construction is as follows：
First layer is printed with three pieces of mutually insulated metal flat conductors, first piece of planar conductor on ceramic dielectric substrate
By first layer the first capacitance substrate 1-C1, the first layer the of first layer the first capacitance substrate 1-C1 and the first grounding ports P1 is connected
One inner terminal 1A, and connect the 4th inner terminal of first layer of first layer the first capacitance substrate 1-C1 and the 5th grounding ports P5
1D is constituted；Second piece of planar conductor is by first layer the second capacitance substrate 1-C2, and the of connection first layer the second capacitance substrate 1-C2
Inside one layer of third capacitance substrate 1-C3, and the first layer second of connection first layer the second capacitance substrate 1-C2 and public port P2
Endpoint 1B；Third block planar conductor is made of the first layer vacation exit 1C of connection third grounding ports P3；
The second layer is printed with four pieces of mutually insulated metal flat conductors, first piece of planar conductor on ceramic dielectric substrate
It is made of the second layer the first capacitance substrate 2-C1, the second layer the first capacitance substrate 2-C1 is also associated with the ten eight column
18；Second piece of planar conductor is made of the second layer the second capacitance substrate 2-C2, and the second layer the second capacitance substrate 2-C2 is also associated with
21st column 21；Third block planar conductor is made of second layer third capacitance substrate 2-C3, second layer third capacitance substrate
2-C3 is also associated with the 22nd column 22；4th piece of planar conductor is drawn by the second layer vacation of connection high-frequency band pass output port P4
Outlet 2A is constituted；
Third layer, is printed with the metal flat conductor of eight pieces of mutually insulateds on ceramic dielectric substrate, and first piece of plane is led
Body is made of third layer the first capacitance substrate 3-C1 and the 5th inner terminal 3E of third layer, the 5th inner terminal 3E connections of third layer
Low-frequency range output port P6；Second piece of planar conductor is by third layer the second capacitance substrate 3-C2 and the first inner terminal of third layer 3A
It constitutes, third layer the first inner terminal 3A the first grounding ports of connection P1；Third block planar conductor is by third layer third capacitance base
Piece 3-C3 and the second inner terminal of third layer 3B are constituted, third layer the second inner terminal 3B connection public ports P2；4th piece flat
Face conductor is made of the 4th capacitance substrate 3-C4 of third layer, and the 4th capacitance substrate 3-C4 of third layer is also connected with the 21st column
21；Five, the six, seven and eight pieces of planar conductors are respectively by the false exit 3C of third layer first, the false exit 3D of third layer second, the
Three layer of first printing points column 18-1 and third layer the second printing points column 22-1 are constituted；The false exit 3C connection thirds of third layer first
Grounding ports P3, the false exit 3D connection high-frequency band pass output ports P4 of third layer second；Third layer the first printing points column 18-1
For the component part of the ten eight column 18, third layer the second printing points column 22-1 is the composition of the 22nd column 22
Part；
4th layer, four pieces of mutually insulated metal flat conductors, first piece of planar conductor are printed on ceramic dielectric substrate
It is made of the 4th layer of first capacitance substrate 4-C1 and the 4th layer of first inner terminal 4A, the 4th layer of first inner terminal 4A connection
Five grounding ports P5；Second and third and four pieces of planar conductors are respectively by the 4th layer of first printing points column 18-2, the 4th layer of second printing
Point column 21-1, the 4th layer of third printing points column 22-2 are constituted；4th layer of first printing points column 18-2 is the ten eight column 18
Component part, the 4th layer of second printing points column 21-1 is the component part of the 21st column 21, the 4th layer of third print
Brush point column 22-2 is the component part of the 22nd column 22；
Layer 5 is printed with three pieces of mutually insulated metal flat conductors, first piece of planar conductor on ceramic dielectric substrate
By layer 5 the first inductance coil 5-L1, and it is respectively arranged in the layer 5 first at the both ends layer 5 the first inductance coil 5-L1
Portion endpoint 5A and the second inner terminal of layer 5 5B are constituted；Second and three pieces of planar conductors respectively by layer 5 the first printing points column
21-3, layer 5 the second printing points column 22-4 are constituted；5B points of layer 5 the first inner terminal 5A and the second inner terminal of layer 5
It Lian Jie not the ten eight column 18 and the ten nine column 19；Layer 5 the first printing points column 21-3 is the 21st column 21
Component part, layer 5 the second printing points column 22-4 are the component part of the 22nd column 22；
Layer 6 is printed with four pieces of mutually insulated metal flat conductors, first piece of planar conductor on ceramic dielectric substrate
By layer 6 the first inductance coil 6-L1 and it is respectively arranged in the layer 6 first at the both ends layer 6 the first inductance coil 6-L1
Portion endpoint 6A and the second inner terminal of layer 6 6B are constituted；Layer 6 the first inner terminal 6A the ten seven column 17 of connection, the 6th
Second inner terminal 6B the ten nine columns 19 of connection of layer；Second piece of planar conductor by layer 6 the second inductance coil 6-L2, and
It is respectively arranged on the 4th inner terminal of layer 6 third inner terminal 6C and layer 6 at the both ends layer 6 the second inductance coil 6-L2
6D is constituted；Layer 6 third inner terminal 6C and the 4th inner terminal 6D of layer 6 are separately connected the 20th column 20 and the 20th
2 columns 22；Third and four pieces of planar conductors are made of printing points column 18-5 and printing points column 21-5 respectively；Printing points column 18-5
For the component part of the ten eight column 18, printing points column 21-5 is the component part of the 21st column 21；
Layer 7 is printed with four pieces of mutually insulated metal flat conductors, first piece of planar conductor on ceramic dielectric substrate
By layer 7 the first inductance coil 7-L1 and it is respectively arranged in the layer 7 first at the both ends layer 7 the first inductance coil 7-L1
Portion endpoint 7A and the second inner terminal of layer 7 7B are constituted, layer 7 the first inner terminal 7A connection low-frequency range output port P6,
Layer 7 the second inner terminal 7B the ten seven column 17 of connection；Second piece of planar conductor by the second inductance coil of layer 7 7-L2,
And the 4th inner terminal 7D of layer 7 set on layer 7 the second inductance coil 7-L2 tail ends, the 4th inner terminal 7D of layer 7
High-frequency band pass output port P4 is connected, the head end of the second inductance coil of layer 7 7-L2 connects the 20th column 20；Third and four
Block planar conductor is made of printing points column 18-7 and printing points column 21-7 respectively；Printing points column 18-7 is the ten eight column 18
Component part, printing points column 21-7 be the 21st column 21 component part；
8th layer, two pieces of mutually insulated metal flat conductors, first piece of planar conductor are printed on ceramic dielectric substrate
It is made of the 8th layer of first inductance coil 8-L1, the both ends of the 8th layer of first inductance coil 8-L1 are separately connected the ten eight column 18
With the ten six column 16；Second piece of planar conductor is made of the 8th layer of second inductance coil 8-L2, the 8th layer of the second inductance coil
The both ends 8-L2 are separately connected the ten two column 12 and the 21st column 21；
9th layer, two pieces of mutually insulated metal flat conductors, first piece of planar conductor are printed on ceramic dielectric substrate
By the 9th layer of first inductance coil 9-L1, and it is respectively arranged on the 9th layer first of both ends of the 9th layer of first inductance coil 9-L1
Inner terminal 9A and the 9th layer of second inner terminal 9B is constituted, the 9th layer of first inner terminal 9A and the 9th layer of second inner terminal
9B is separately connected the ten six column 16 and the ten five column 15；Second piece of planar conductor by the 9th layer of second inductance coil 9-L2,
And it is respectively arranged in the 9th layer third inner terminal 9C and the 9th layer the 4th of both ends of the 9th layer of second inductance coil 9-L2
Portion endpoint 9D is constituted, and the 9th layer of third inner terminal 9C and the 9th layer of the 4th inner terminal 9D is separately connected the ten two 12 He of column
23rd column 23；
Tenth layer, two pieces of mutually insulated metal flat conductors, first piece of planar conductor are printed on ceramic dielectric substrate
By the tenth layer of first inductance coil 10-L1, and it is respectively arranged on the tenth layer of both ends of the tenth layer of first inductance coil 10-L1
One inner terminal 10A and the tenth layer of second inner terminal 10B is constituted, in the tenth layer first inner terminal 10A and the tenth layer second
Portion endpoint 10B is separately connected the ten three column 13 and the ten five column 15；Second piece of planar conductor is by the tenth layer of the second inductor wire
10-L2 is enclosed, and is respectively arranged on the tenth layer of third inner terminal 10C and the at the both ends of the tenth layer of second inductance coil 10-L2
Ten layer of the 4th inner terminal 10D is constituted, and the tenth layer of third inner terminal 10C and the tenth layer of the 4th inner terminal 10D is separately connected
Ten four column 14 and the 23rd column 23；
Eleventh floor, is printed with two pieces of mutually insulated metal flat conductors on ceramic dielectric substrate, and first piece of plane is led
Body by eleventh floor the first inductance coil 11-L1, and be respectively arranged on the first inductance coil of eleventh floor 11-L1 both ends
Eleventh floor the first inner terminal 11A and eleventh floor third inner terminal 11C are constituted, and the first inner terminal of eleventh floor 11A connects
Connect public port P2, eleventh floor third inner terminal 11C the ten three column 13 of connection；Second piece of planar conductor is by eleventh floor
Second inductance coil 11-L2, and be respectively arranged in the eleventh floor second at both ends of the second inductance coil of eleventh floor 11-L2
Portion endpoint 11B and the 4th inner terminal 11D of eleventh floor are constituted, eleventh floor the second inner terminal 11B the ten four column of connection
14, the 5th grounding ports P5 of the 4th inner terminal 11D connections of eleventh floor.
The present invention uses the special construction of lumped parameter design, is composed of low-pass filter and bandpass filter, low
Bandpass filter mainly isolates low-band signal, and bandpass filter mainly isolates high band bandpass signal, such duplex utensil
There are the advantages such as low-loss, high inhibition, high-isolation.
Claims (2)
1. a kind of LTCC lamination sheet types duplexer, it is characterised in that the duplexer includes ceramic matrix, ceramic matrix it is outer
Side wall is equipped with the first grounding ports（P1）, public port（P2）, third grounding ports（P3）, high-frequency band pass output port
（P4）, the 5th grounding ports（P5）And low-frequency range output port（P6）；Between public port inside the ceramic matrix（P2）
With low-frequency range output port（P6）Between be equipped with low-pass filter for isolating low-band signal；In the ceramic matrix
Portion is between public port（P2）With high-frequency band pass output port（P4）Between be equipped with band for isolating high band bandpass signal
Bandpass filter；Include 11 layers of ceramic dielectric circuit layer in laminated construction in the ceramic matrix, wherein：
First layer is printed with three pieces of mutually insulated metal flat conductors on ceramic dielectric substrate, and first piece of planar conductor is by
One layer of first capacitance substrate（1-C1）, connect first layer the first capacitance substrate（1-C1）With the first grounding ports（P1）First layer
First inner terminal（1A）, and connection first layer the first capacitance substrate（1-C1）With the 5th grounding ports（P5）First layer the 4th
Inner terminal（1D）It constitutes；Second piece of planar conductor is by first layer the second capacitance substrate（1-C2）, connect the second capacitance of first layer
Substrate（1-C2）First layer third capacitance substrate（1-C3）, and connection first layer the second capacitance substrate（1-C2）With public port
（P2）The second inner terminal of first layer（1B）；Third block planar conductor is by connection third grounding ports（P3）First layer vacation draw
Outlet（1C）It constitutes；
The second layer is printed with four pieces of mutually insulated metal flat conductors on ceramic dielectric substrate, and first piece of planar conductor is by
Two layer of first capacitance substrate（2-C1）It constitutes, the second layer the first capacitance substrate（2-C1）It is also associated with the ten eight column
（18）；Second piece of planar conductor is by the second layer the second capacitance substrate（2-C2）It constitutes, the second layer the second capacitance substrate（2-C2）Also
It is connected with the 21st column（21）；Third block planar conductor is by second layer third capacitance substrate（2-C3）It constitutes, the second layer the
Three capacitance substrates（2-C3）It is also associated with the 22nd column（22）；4th piece of planar conductor is by connection high-frequency band pass output port
（P4）Second layer vacation exit（2A）It constitutes；
Third layer, is printed with the metal flat conductor of eight pieces of mutually insulateds on ceramic dielectric substrate, first piece of planar conductor by
Third layer the first capacitance substrate（3-C1）With the 5th inner terminal of third layer（3E）It constitutes, the 5th inner terminal of third layer（3E）Even
Connect low-frequency range output port（P6）；Second piece of planar conductor is by third layer the second capacitance substrate（3-C2）Inside third layer first
Endpoint（3A）It constitutes, the first inner terminal of third layer（3A）Connect the first grounding ports（P1）；Third block planar conductor is by third
Layer third capacitance substrate（3-C3）With the second inner terminal of third layer（3B）It constitutes, the second inner terminal of third layer（3B）Connection is public
Port altogether（P2）；4th piece of planar conductor is by the 4th capacitance substrate of third layer（3-C4）It constitutes, the 4th capacitance substrate of third layer（3-
C4）It is also connected with the 21st column（21）；Five, the six, seven and eight pieces of planar conductors are respectively by the false exit of third layer first
（3C）, the false exit of third layer second（3D）, third layer the first printing points column（18-1）With third layer the second printing points column（22-
1）It constitutes；The false exit of third layer first（3C）Connect third grounding ports（P3）, the false exit of third layer second（3D）Connection
High-frequency band pass output port（P4）；Third layer the first printing points column（18-1）For the ten eight column（18）Component part,
Third layer the second printing points column（22-1）For the 22nd column（22）Component part；
4th layer, four pieces of mutually insulated metal flat conductors are printed on ceramic dielectric substrate, first piece of planar conductor is by
Four layer of first capacitance substrate（4-C1）With the 4th layer of the first inner terminal（4A）It constitutes, the 4th layer of the first inner terminal（4A）Connection
5th grounding ports（P5）；Second and third and four pieces of planar conductors are respectively by the 4th layer of first printing points column（18-2）, the 4th layer
Two printing points columns（21-1）, the 4th layer of third printing points column（22-2）It constitutes；4th layer of first printing points column（18-2）It is described
Ten eight column（18）Component part, the 4th layer of second printing points column（21-1）For the 21st column（21）Composition
Part, the 4th layer of third printing points column（22-2）For the 22nd column（22）Component part；
Layer 5 is printed with three pieces of mutually insulated metal flat conductors on ceramic dielectric substrate, and first piece of planar conductor is by
Five layer of first inductance coil（5-L1）, and it is respectively arranged on the first inductance coil of layer 5（5-L1）In the layer 5 first at both ends
Portion's endpoint（5A）With the second inner terminal of layer 5（5B）It constitutes；Second and three pieces of planar conductors printed respectively by layer 5 first
Point column（21-3）, layer 5 the second printing points column（22-4）It constitutes；The first inner terminal of layer 5（5A）In layer 5 second
Portion's endpoint（5B）It is separately connected the ten eight column（18）With the ten nine column（19）；Layer 5 the first printing points column（21-3）For institute
State the 21st column（21）Component part, layer 5 the second printing points column（22-4）For the 22nd column（22）'s
Component part；
Layer 6 is printed with four pieces of mutually insulated metal flat conductors on ceramic dielectric substrate, and first piece of planar conductor is by
Six layer of first inductance coil（6-L1）And it is respectively arranged on the first inductance coil of layer 6（6-L1）In the layer 6 first at both ends
Portion's endpoint（6A）With the second inner terminal of layer 6（6B）It constitutes；The first inner terminal of layer 6（6A）Connect the ten seven column
（17）, the second inner terminal of layer 6（6B）Connect the ten nine column（19）；Second piece of planar conductor is by the second inductance of layer 6
Coil（6-L2）, and it is respectively arranged on the second inductance coil of layer 6（6-L2）The layer 6 third inner terminal at both ends（6C）With
The 4th inner terminal of layer 6（6D）It constitutes；Layer 6 third inner terminal（6C）With the 4th inner terminal of layer 6（6D）Respectively
Connect the 20th column（20）With the 22nd column（22）；Third and four pieces of planar conductors are respectively by printing points column（18-5）With
Printing points column（21-5）It constitutes；Printing points column（18-5）For the ten eight column（18）Component part, printing points column（21-
5）For the 21st column（21）Component part；
Layer 7 is printed with four pieces of mutually insulated metal flat conductors on ceramic dielectric substrate, and first piece of planar conductor is by
Seven layer of first inductance coil（7-L1）And it is respectively arranged on the first inductance coil of layer 7（7-L1）In the layer 7 first at both ends
Portion's endpoint（7A）With the second inner terminal of layer 7（7B）It constitutes, the first inner terminal of layer 7（7A）Connect low-frequency range output end
Mouthful（P6）, the second inner terminal of layer 7（7B）Connect the ten seven column（17）；Second piece of planar conductor is by the second electricity of layer 7
Feel coil（7-L2）And it is set to the second inductance coil of layer 7（7-L2）The 4th inner terminal of layer 7 of tail end（7D）, the
Seven layer of the 4th inner terminal（7D）Connect high-frequency band pass output port（P4）, the second inductance coil of layer 7（7-L2）Head end connect
Connect the 20th column（20）；Third and four pieces of planar conductors are respectively by printing points column（18-7）With printing points column（21-7）It constitutes；
Printing points column（18-7）For the ten eight column（18）Component part, printing points column（21-7）For the 21st column
（21）Component part；
8th layer, two pieces of mutually insulated metal flat conductors are printed on ceramic dielectric substrate, first piece of planar conductor is by
Eight layer of first inductance coil（8-L1）It constitutes, the 8th layer of the first inductance coil（8-L1）Both ends be separately connected the ten eight column
（18）With the ten six column（16）；Second piece of planar conductor is by the 8th layer of the second inductance coil（8-L2）It constitutes, the 8th layer second
Inductance coil（8-L2）Both ends are separately connected the ten two column（12）With the 21st column（21）；
9th layer, two pieces of mutually insulated metal flat conductors are printed on ceramic dielectric substrate, first piece of planar conductor is by
Nine layer of first inductance coil（9-L1）, and it is respectively arranged on the 9th layer of the first inductance coil（9-L1）The 9th layer first of both ends
Inner terminal（9A）With the 9th layer of the second inner terminal（9B）It constitutes, the 9th layer of the first inner terminal（9A）In the 9th layer second
Portion's endpoint（9B）It is separately connected the ten six column（16）With the ten five column（15）；Second piece of planar conductor is by the 9th layer of second electricity
Feel coil（9-L2）, and it is respectively arranged on the 9th layer of the second inductance coil（9-L2）Both ends the 9th layer of third inner terminal
（9C）With the 9th layer of the 4th inner terminal（9D）It constitutes, the 9th layer of third inner terminal（9C）With the 9th layer of the 4th inner terminal
（9D）It is separately connected the ten two column（12）With the 23rd column（23）；
Tenth layer, two pieces of mutually insulated metal flat conductors are printed on ceramic dielectric substrate, first piece of planar conductor is by
Ten layer of first inductance coil（10-L1）, and it is respectively arranged on the tenth layer of the first inductance coil（10-L1）The tenth layer of both ends
One inner terminal（10A）With the tenth layer of the second inner terminal（10B）It constitutes, the tenth layer of the first inner terminal（10A）With the tenth layer
Second inner terminal（10B）It is separately connected the ten three column（13）With the ten five column（15）；Second piece of planar conductor is by the tenth
The second inductance coil of layer（10-L2）, and it is respectively arranged on the tenth layer of the second inductance coil（10-L2）Both ends the tenth layer of third
Inner terminal（10C）With the tenth layer of the 4th inner terminal（10D）It constitutes, the tenth layer of third inner terminal（10C）With the tenth layer
Four inner terminals（10D）It is separately connected the ten four column（14）With the 23rd column（23）；
Eleventh floor, is printed with two pieces of mutually insulated metal flat conductors on ceramic dielectric substrate, first piece of planar conductor by
The first inductance coil of eleventh floor（11-L1）, and it is respectively arranged on the first inductance coil of eleventh floor（11-L1）Both ends
The first inner terminal of eleventh floor（11A）With eleventh floor third inner terminal（11C）It constitutes, the first inner terminal of eleventh floor
（11A）Connect public port（P2）, eleventh floor third inner terminal（11C）Connect the ten three column（13）；Second piece of plane
Conductor is by the second inductance coil of eleventh floor（11-L2）, and it is respectively arranged on the second inductance coil of eleventh floor（11-L2）Two
Second inner terminal of eleventh floor at end（11B）With the 4th inner terminal of eleventh floor（11D）It constitutes, inside eleventh floor second
Endpoint（11B）Connect the ten four column（14）, the 4th inner terminal of eleventh floor（11D）Connect the 5th grounding ports（P5）.
2. a kind of LTCC lamination sheet types duplexer according to claim 1, it is characterised in that：First grounding ports
（P1）, public port（P2）With third grounding ports（P3）On the preceding lateral wall of ceramic matrix；High-frequency band pass output port
（P4）, the 5th grounding ports（P5）And low-frequency range output port（P6）On the rear lateral wall of ceramic matrix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820398625.1U CN207968436U (en) | 2018-03-23 | 2018-03-23 | A kind of LTCC lamination sheet types duplexer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820398625.1U CN207968436U (en) | 2018-03-23 | 2018-03-23 | A kind of LTCC lamination sheet types duplexer |
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| Publication Number | Publication Date |
|---|---|
| CN207968436U true CN207968436U (en) | 2018-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820398625.1U Withdrawn - After Issue CN207968436U (en) | 2018-03-23 | 2018-03-23 | A kind of LTCC lamination sheet types duplexer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108649914A (en) * | 2018-03-23 | 2018-10-12 | 深圳市麦捷微电子科技股份有限公司 | A kind of LTCC lamination sheet types duplexer |
-
2018
- 2018-03-23 CN CN201820398625.1U patent/CN207968436U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108649914A (en) * | 2018-03-23 | 2018-10-12 | 深圳市麦捷微电子科技股份有限公司 | A kind of LTCC lamination sheet types duplexer |
| CN108649914B (en) * | 2018-03-23 | 2020-04-28 | 深圳市麦捷微电子科技股份有限公司 | LTCC laminated sheet type duplexer |
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