CN207964153U - A kind of micro-pressure sensor component - Google Patents
A kind of micro-pressure sensor component Download PDFInfo
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- CN207964153U CN207964153U CN201820256365.4U CN201820256365U CN207964153U CN 207964153 U CN207964153 U CN 207964153U CN 201820256365 U CN201820256365 U CN 201820256365U CN 207964153 U CN207964153 U CN 207964153U
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- circuit board
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- pressure sensor
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- housing main
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Abstract
The utility model discloses a kind of micro-pressure sensor components, are related to sensor technical field, which includes：Sensor module, housing main body and cover plate of outer casing, sensor module includes circuit board, micro-pressure sensor chip and protective cover, protective cover is fixed on circuit boards and offers atmospheric equilibrium hole, micro-pressure sensor chip is arranged in protective cover and welds on circuit boards, circuit board offers air admission hole at the position of face micro-pressure sensor chip, circuit board is further opened with welding hole, sensor module is arranged in main cavity, the connectivity part in main cavity and venting cavity is arranged in circuit board and air admission hole is towards venting cavity, the inner wall sealing of circuit board and main cavity connects, cover plate of outer casing is arranged and is fixed at the placing port of housing main body, include setting line gap between cover plate of outer casing and housing main body；The application can introduce stress to micro-pressure sensor chip to avoid in assembling, therefore efficiently avoid influence of the stress to properties of product.
Description
Technical field
The utility model is related to sensor technical field, especially a kind of micro-pressure sensor component.
Background technology
Micro-pressure sensor is a kind of pressure sensor the most commonly used in industrial practice, and it is micro- to be widely used in pressure medium
The measurement and control of weak occasion, such as pressure measurement and control applied to industries such as vacuum, air pressure, liquid level, food and medical treatment
System.
It is typically that micro-pressure sensor chip welding is formed into a sensor module on circuit boards at present, then to entire
What sensor module was tested and was sold, user as needed from the sensor module assembly and connection is about in occasion to be measured,
Additional stress is often introduced in an assembling process, and stress acts on micro-pressure sensor chip by circuit board, this not only can
The performance of micro-pressure sensor is influenced, or even also results in circuit board and deforms, influences the normal use of entire sensor module.
Utility model content
The present inventor is regarding to the issue above and technical need, it is proposed that a kind of micro-pressure sensor component, the component pass through conjunction
The structure design of reason not having additional stress when in use in micro-pressure sensor chip, is answered so as to avoid the external world
Influence of the power to the performance of micro-pressure sensor chip.
The technical solution of the utility model is as follows：
A kind of micro-pressure sensor component, the micro-pressure sensor component include：Sensor module, housing main body and casing cover
Plate, sensor module include circuit board, micro-pressure sensor chip and protective cover, and protective cover is fixed on circuit boards, and minute-pressure passes
Sensor chip is arranged in protective cover and welds offers atmospheric equilibrium hole on circuit boards, on protective cover, and circuit board is in face
Air admission hole is offered at the position of micro-pressure sensor chip, the welding disking area of circuit board offers several welding holes；Shell master
Body includes interconnected main cavity and venting cavity, and the sectional dimension of main cavity is more than the sectional dimension of circuit board, venting cavity
Sectional dimension is less than the sectional dimension of circuit board, and the opening shape of venting cavity becomes the blow vent of housing main body, the opening of main cavity
Be formed as the placing port of housing main body；Sensor module is out of, main cavity inside placing port merging housing main body, sensor die
The air admission hole that is opened up on connectivity part and the circuit board in main cavity and venting cavity is arranged towards venting cavity, circuit in circuit board in group
The connection of the inner wall sealing of plate and main cavity makes to carry out airtight isolation between venting cavity and main cavity, and cover plate of outer casing is arranged in shell master
It is fixedly connected at the placing port of body and with housing main body, includes setting line gap between cover plate of outer casing and housing main body, circuit board
Connecting wire is welded on welding hole, the other end of connecting wire is extend out to by setting line gap outside housing main body；Shell master
The blow vent of body for connecting gas circuit to be measured, made after entering venting cavity from blow vent by air admission hole by the gas of gas circuit input to be measured
For an input terminal of micro-pressure sensor chip, outside air is entered after main cavity by setting line gap through atmospheric equilibrium hole
In into protective cover and another input terminal of micro-pressure sensor chip is acted on, the other end of connecting wire is measured for connecting
Host.
Its further technical solution is that the inner wall of circuit board and main cavity carries out adhering and sealing by flexible glue.
Its further technical solution is, the inner wall of main cavity, which corresponds at the welding disking area of circuit board, is provided with that keep away line recessed
When the inner wall sealing connection of slot, circuit board and main cavity, the welding disking area of circuit board be located at keep away in line groove and not with main cavity
Inner wall contact.
Its further technical solution is that the volt circuit harden structure of protrusion is provided on cover plate of outer casing, cover plate of outer casing with it is outer
When shell main body is fixedly connected, raised volt circuit harden structure is located inside main cavity and circuit board is pressed to shell on cover plate of outer casing
Main body.
Its further technical solution is that the inner wall at the placing port of housing main body is provided with the cover board buckle of protrusion, lid
Board fastener has limit strength, cover plate of outer casing to buckle by cover board and be fixedly connected with housing main body.
Its further technical solution be further include signal condition chip in sensor module, the setting of signal condition chip
It is electrical connected inside protective cover and with micro-pressure sensor chip.
Its further technical solution is that the welding hole that the welding disking area of circuit board opens up uses through-hole structure.
Its further technical solution is that the circuit board in sensor module is hard circuit board.
The advantageous effects of the utility model are：
1, component disclosed in the present application, will also sensing other than being arranged micro-pressure sensor chip in sensor module
Device module is placed in housing main body, and finally entire component is tested and sold as a whole, and housing main body and biography
Circuit board in sensor module can introduce stress to micro-pressure sensor by the structure of flexible glue adhering and sealing to avoid in assembling
The case where chip, therefore influence of the stress to properties of product is efficiently avoided, hard circuit board also avoids circuit board and is answering
The problem of damaging under force effect and influence micro-pressure sensor chip.
2, in structure disclosed in the present application, the plate face of circuit board can be caused uneven after conducting wire due to being welded to connect at welding hole
It is whole, it is difficult to achieve the effect that sealing after drawing glue, therefore the housing main body of the application is provided with and keeps away line groove structure, this structure
Design can make welding disking area avoid contacting with housing main body, it is ensured that the contact surface of circuit board and housing main body is burnishing surface, is had
Conducive to glue sealing is drawn, air-tightness is more preferable.
3, cover plate of outer casing is buckled by cover board and is fixed with housing main body, and assembling mode is simple and effective, and cover plate of outer casing is convex
The volt circuit harden structure risen can be used for fixing circuit board, on the one hand circuit board can be avoided to move during solid glue, it is ensured that
So that assembling mode is more simple while the air-tightness of product, on the other hand user can be avoided to draw during terminal block
The problem of pulling connecting wire and circuit board is made to shift further ensures that air-tightness.
4, in the sensor module in component disclosed in the present application, micro-pressure sensor chip can be only encapsulated as needed,
Or encapsulate micro-pressure sensor chip and signal condition integrated chip, product sensor is small, and accuracy is high.
Description of the drawings
Fig. 1 is the disassemblying structure schematic diagram of micro-pressure sensor component disclosed in the present application.
Fig. 2 is the structural schematic diagram of the sensor module in the application.
Fig. 3 is the structural schematic diagram of the housing main body in the application.
Fig. 4 is the front view of the assembly structure diagram of micro-pressure sensor component disclosed in the present application.
Fig. 5 is the side view of the assembly structure diagram of micro-pressure sensor component disclosed in the present application.
Specific implementation mode
Specific embodiment of the present utility model is described further below in conjunction with the accompanying drawings.
This application discloses a kind of micro-pressure sensor component, the disassemblying structure schematic diagram shown is please referred to Fig.1, which passes
Sensor component includes：Sensor module 10, housing main body 20 and cover plate of outer casing 30.Please refer to Fig.2 the sensor module shown
10 structural schematic diagram, Fig. 2 (a) are the front view of sensor module 10, and Fig. 2 (b) is the upward view of sensor module 10.Sensing
Device module 10 includes circuit board 11, micro-pressure sensor chip 12 and protective cover 13, and in this application, circuit board 11 is such as to make pottery
The hard circuit board of porcelain substrate etc, it is not easy to deform under stress, the shape of circuit board 11 can be according to reality
Need it is self-defined, the application by circuit board 11 be rectangular configuration for.Protective cover 13 is fixed on circuit board 11, micro-pressure sensor
The setting of chip 12 is in protective cover 13 and is welded on circuit board 11.Optionally, can also include signal in sensor module 10
Conditioning chip 14, signal condition chip 14 are arranged in protective cover 13, actually can signal condition chip 14 be adhesive in circuit
On plate 11, signal condition chip 14 integrates assembling with micro-pressure sensor chip 12 and is electrically connected with micro-pressure sensor chip 12,
The connection relation of micro-pressure sensor chip 12 and signal condition chip 14 is not shown in Fig. 2.Circuit board 11 is in face micro-pressure sensor
Air admission hole 15 is offered at the position of one input terminal of chip 12, gas enters from the air admission hole 15 and acts on minute-pressure sensing
One input terminal of device chip 12.Atmospheric equilibrium hole 16 is offered on protective cover 13, which protects for ensureing
Cover 13 inner air and outer airs connection balance.The welding disking area of circuit board 11 offers several welding holes 17 according to actual needs, welding
Hole 17 connects micro-pressure sensor chip 12 by the 11 preset circuit structure in inside of circuit board, as Fig. 2 is opened with circuit board 11
For 4 welding holes 17, welding hole 17 uses through-hole structure in the application, to ensure that wiring is solid and reliable.
The structural schematic diagram of the housing main body 20 shown is please referred to Fig.3, Fig. 3 (a) is the front view of housing main body 20, Fig. 3
(b) it is the side view of housing main body 20.20 generally use hard material of housing main body is made to be occurred to avoid under stress
Deformation, the application do not limit the face shaping and making material of housing main body 20.20 inside of housing main body includes mutual
The main cavity 21 and venting cavity 22 of connection, the sectional dimension of main cavity 21 are more than the sectional dimension of venting cavity 22, and the application is to cutting
Face shape does not limit, if Fig. 3 by main cavity 21 inside housing main body 20 to be connected to internus convex shape knot with venting cavity 22
For structure.The opening shape of venting cavity 22 becomes the blow vent of housing main body 20, and the opening shape of main cavity 21 becomes housing main body 20
Placing port, if the top of housing main body 20 in Fig. 3 is blow vent, lower part is placing port, blow vent for connecting gas circuit to be measured,
The gas of gas circuit input to be measured enters venting cavity 22 from blow vent, and practical is typically that the snorkel of gas circuit to be measured is filled in venting cavity
To input gas in 22, therefore the length of the venting cavity 22 in the application is more than preset length so that snorkel fills in venting cavity
It is not easy to skid off in 22 to fall off, which is usually empirical value.Sensor module 10 is placed in by placing port in main cavity 21,
Therefore can also include position limiting structure 23, shape and the circuit board in sensor module 10 of the position limiting structure 23 in main cavity 21
11 shape matching, for being limited to sensor module 10.Please refer to Fig.3 the side view that (b) is shown, main cavity 21 it is interior
Wall, which corresponds at the welding disking area of circuit board 11, to be provided with and keeps away line groove 24.Inner wall at the placing port of housing main body 20 is provided with
There is limit strength, cover board buckle 25 to be used for fixing shell cover board 30 for the cover board buckle 25 of protrusion, cover board buckle 25.
Referring to FIG. 1, being provided with the volt circuit harden structure 31 of protrusion, the protrusion of volt circuit harden structure 31 on cover plate of outer casing 30
Height is set according to actual needs, and also generally use hard material is made and avoids deforming cover plate of outer casing 30, and the application is to specific material
Material does not limit, and the shape of the shape of cover plate of outer casing 30 and the placing port of housing main body 20 matches and the size of cover plate of outer casing 30
Less than the size of the placing port of housing main body 20.
Please refer to Fig.4 the front view of the assembly structure diagram of the micro-pressure sensor component shown.Sensor module 10 from
Placing port is placed in the main cavity 21 inside housing main body 20, and the sectional dimension of main cavity 21 is more than the section ruler of circuit board 11
Very little, the sectional dimension of venting cavity 22 is less than the sectional dimension of circuit board 11 so that circuit board 11 can be arranged main cavity 21 with
For the air admission hole 15 opened up in the connectivity part and circuit board 11 of venting cavity 22 towards venting cavity 22, circuit board 11 is interior with main cavity 21
Wall, which is tightly connected, to carry out airtight isolation between venting cavity 22 and main cavity 21, optionally, circuit board 11 and main cavity 21
Inner wall carries out adhering and sealing by flexible glue 40, avoids introducing stress.Cover plate of outer casing 30 is arranged at the placing port of housing main body 20
And be fixedly connected with housing main body 20 by cover board buckle 25, while volt circuit harden structure 31 raised on cover plate of outer casing 30 is located at
Inside main cavity and pushes down circuit board 11 and be pressed to housing main body 20.Please refer to the group of the micro-pressure sensor component shown in Fig. 5
The side view of assembling structure schematic diagram, Fig. 5 (a) are schematic diagrames when not including connecting wire, and Fig. 5 (b) is when including connecting wire
Schematic diagram.When circuit board 11 is connect with the inner wall sealing of main cavity 21, the welding disking area of circuit board 11, which is located at, keeps away line groove 24
In and do not contacted with the inner wall of main cavity 21.Fig. 5 (a) is please referred to, since the size of cover plate of outer casing 30 is less than housing main body 20
The size of placing port, therefore cover plate of outer casing 30 is with housing main body 20 when being fixedly connected, cover plate of outer casing 30 and housing main body 20 it
Between can exist and set line gap 50, the width that the width of cover plate of outer casing 30 is slightly less than 20 placing port of housing main body forms this and sets line gap
50, connecting wire 60 is welded on the welding hole 17 of circuit board 11, please refers to Fig. 5 (b), the other end of connecting wire 60 is by setting
Line gap 50 is extend out to outside housing main body, and for being connected to measurement host.Meanwhile line gap 50 is set so that in main cavity 21
Outer air keeps connection balance, and outside air can be entered by setting line gap 50 in main cavity 21, then pass through atmospheric equilibrium hole
16 enter in protective cover 13.Blow vent only need to be connected gas circuit to be measured, for example snorkel is filled in by user when using the component
In venting cavity 22, then by the connection measurement host of connecting wire 60, the gas of gas circuit input to be measured enters ventilation from blow vent
An input terminal of micro-pressure sensor chip 12 is acted on after chamber 22 by air admission hole 15, outside air enters from line gap 50 is set
Protective cover 13 is entered by atmospheric equilibrium hole 16 again after main cavity 21 and acts on another input of micro-pressure sensor chip 12
End, micro-pressure sensor chip 12 measured according to the signal that two input terminals input and exported by connecting wire 60 as a result,
Connect and measurement process in, will not introduce stress on micro-pressure sensor chip 12, avoid stress give minute-pressure sensing
The performance that device chip 12 is brought influences.
Above-described is only the preferred embodiment of the application, and the utility model is not limited to above example.It can manage
Solution, those skilled in the art do not depart from the utility model spirit and design under the premise of directly export or associate other
It improves and changes, be considered as being included within the scope of protection of this utility model.
Claims (8)
1. a kind of micro-pressure sensor component, which is characterized in that the micro-pressure sensor component includes：Sensor module, shell master
Body and cover plate of outer casing, the sensor module include circuit board, micro-pressure sensor chip and protective cover, and the protective cover is solid
It is scheduled on the circuit board, the micro-pressure sensor chip is arranged in the protective cover and is welded on the circuit board, institute
State and offer atmospheric equilibrium hole on protective cover, offered at the position of circuit board micro-pressure sensor chip described in face into
The welding disking area of stomata, the circuit board offers several welding holes；The housing main body includes interconnected main cavity
And venting cavity, the sectional dimension of main chamber body are more than the sectional dimension of the circuit board, the sectional dimension of the venting cavity is small
In the sectional dimension of the circuit board, the opening shape of the venting cavity becomes the blow vent of the housing main body, main chamber body
Opening shape become the housing main body placing port；The sensor module is placed in from the placing port in the housing main body
In the main cavity in portion, connectivity part and institute in main chamber body and the venting cavity is arranged in the circuit board in the sensor module
The air admission hole opened up on circuit board is stated towards the venting cavity, the circuit board is connect with the inner wall sealing of main chamber body makes institute
It states and carries out airtight isolation between venting cavity and main chamber body, the cover plate of outer casing is arranged at the placing port of the housing main body
And be fixedly connected with the housing main body, include setting line gap, the circuit between the cover plate of outer casing and the housing main body
Connecting wire is welded on the welding hole of plate, the other end of the connecting wire sets line gap described in and extend out to the shell
Body exterior；The blow vent of the housing main body leads to for connecting gas circuit to be measured, the gas of the gas circuit input to be measured from described
Gas port acts on an input terminal of the micro-pressure sensor chip by the air admission hole after entering the venting cavity, extraneous empty
Gas by it is described set line gap and enter after main chamber body enter in the protective cover and act on by the atmospheric equilibrium hole
Another input terminal of the micro-pressure sensor chip, the other end of the connecting wire is for connecting measurement host.
2. component according to claim 1, which is characterized in that the inner wall of the circuit board and main chamber body passes through flexible glue
Carry out adhering and sealing.
3. component according to claim 1, which is characterized in that the inner wall of main chamber body corresponds to the weldering of the circuit board
It is provided at disk area and keeps away line groove, when the circuit board is connect with the inner wall sealing of main chamber body, the weldering of the circuit board
Disk area is located at described keep away and is contacted in line groove and not with the inner wall of main chamber body.
4. component according to claim 1, which is characterized in that the volt circuit for being provided with protrusion on the cover plate of outer casing is hardened
Structure, when the cover plate of outer casing is fixedly connected with the housing main body, raised volt circuit harden structure is located on the cover plate of outer casing
The housing main body is pressed to inside main chamber body and by the circuit board.
5. component according to claim 1, which is characterized in that the inner wall at the placing port of the housing main body is provided with convex
There is limit strength, the cover plate of outer casing to pass through cover board buckle and the shell for the cover board buckle risen, the cover board buckle
Main body is fixedly connected.
6. component according to claim 1, which is characterized in that further include signal condition chip in the sensor module,
The signal condition chip is arranged inside the protective cover and is electrical connected with the micro-pressure sensor chip.
7. component according to claim 1, which is characterized in that the welding hole that the welding disking area of the circuit board opens up uses
Through-hole structure.
8. component according to claim 1, which is characterized in that the circuit board in the sensor module is hard circuit
Plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820256365.4U CN207964153U (en) | 2018-02-12 | 2018-02-12 | A kind of micro-pressure sensor component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820256365.4U CN207964153U (en) | 2018-02-12 | 2018-02-12 | A kind of micro-pressure sensor component |
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| Publication Number | Publication Date |
|---|---|
| CN207964153U true CN207964153U (en) | 2018-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820256365.4U Active CN207964153U (en) | 2018-02-12 | 2018-02-12 | A kind of micro-pressure sensor component |
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| Country | Link |
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| CN (1) | CN207964153U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110530427A (en) * | 2019-09-11 | 2019-12-03 | 福建京科科技有限公司 | Motorcycle three-in-one sensor and its assembly method |
| CN110672133A (en) * | 2019-10-09 | 2020-01-10 | 福建京科科技有限公司 | Three-in-one sensor for motorcycle |
| CN110749394A (en) * | 2019-11-21 | 2020-02-04 | 龙微科技无锡有限公司 | High-reliability pressure sensor |
| CN112113699A (en) * | 2019-06-21 | 2020-12-22 | 霍尼韦尔国际公司 | Micro-molded fluid pressure sensor housing |
-
2018
- 2018-02-12 CN CN201820256365.4U patent/CN207964153U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112113699A (en) * | 2019-06-21 | 2020-12-22 | 霍尼韦尔国际公司 | Micro-molded fluid pressure sensor housing |
| US11630011B2 (en) | 2019-06-21 | 2023-04-18 | Honeywell International Inc. | Micro-molded fluid pressure sensor housing |
| CN110530427A (en) * | 2019-09-11 | 2019-12-03 | 福建京科科技有限公司 | Motorcycle three-in-one sensor and its assembly method |
| CN110672133A (en) * | 2019-10-09 | 2020-01-10 | 福建京科科技有限公司 | Three-in-one sensor for motorcycle |
| CN110749394A (en) * | 2019-11-21 | 2020-02-04 | 龙微科技无锡有限公司 | High-reliability pressure sensor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Micropressure sensor subassembly Effective date of registration: 20200311 Granted publication date: 20181012 Pledgee: Agricultural Bank of China Limited by Share Ltd Wuxi science and Technology Branch Pledgor: LONGWAY TECHNOLOGY (WUXI) Co.,Ltd. Registration number: Y2020990000167 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220304 Granted publication date: 20181012 Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi science and Technology Branch Pledgor: LONGWAY TECHNOLOGY (WUXI) Co.,Ltd. Registration number: Y2020990000167 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |