JPS63238535A - Pressure sensor and its manufacture - Google Patents
Pressure sensor and its manufactureInfo
- Publication number
- JPS63238535A JPS63238535A JP7358487A JP7358487A JPS63238535A JP S63238535 A JPS63238535 A JP S63238535A JP 7358487 A JP7358487 A JP 7358487A JP 7358487 A JP7358487 A JP 7358487A JP S63238535 A JPS63238535 A JP S63238535A
- Authority
- JP
- Japan
- Prior art keywords
- main body
- chip
- lead
- pressure sensor
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 10
- 229920001971 elastomer Polymers 0.000 claims abstract description 8
- 239000000806 elastomer Substances 0.000 claims abstract description 8
- 238000000465 moulding Methods 0.000 claims abstract description 6
- 239000004033 plastic Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 2
- 239000002991 molded plastic Substances 0.000 claims 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 abstract description 2
- 230000008878 coupling Effects 0.000 abstract 2
- 238000010168 coupling process Methods 0.000 abstract 2
- 238000005859 coupling reaction Methods 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野］
この発明は、ボタン形をした、拡散型半導体圧力センサ
に関するもので、特に、小型化に留意し、液体、気体の
圧力だけでなく１触圧も計測可能としたものである。Detailed Description of the Invention "Field of Industrial Application" This invention relates to a button-shaped, diffusion-type semiconductor pressure sensor. It is also possible to measure pressure.
［従来の技術とその問題点］
拡散型半導体圧力センサは、シリコンダイヤフラム上に
ゲージ抵抗を形成し、それらをブリッジに接続したもの
で、小型、軽量、高感度という長所がある。[Prior art and its problems] A diffusion type semiconductor pressure sensor has gauge resistors formed on a silicon diaphragm and connected to a bridge, and has the advantages of being small, lightweight, and highly sensitive.
さらに、拡散型半導体圧力センサのうち、第８図のよう
に、本体６０を、リードフレーム６２を用い、プラスチ
ックモールドにしたものがあるが、このタイプは、組立
てなどが多連で処理できるため、量産性にすぐれ、低価
格化が可能である。Furthermore, among the diffusion type semiconductor pressure sensors, as shown in FIG. 8, there is one in which the main body 60 is made of a plastic mold using a lead frame 62, but this type can be assembled in multiple stages. It is suitable for mass production and can be lowered in price.
なお、６４はチップ、６６は台座、６８は圧力導入管を
示す。In addition, 64 is a chip, 66 is a pedestal, and 68 is a pressure introduction pipe.
しかし、従来は、」二足のように、圧力導入管６８を設
けていたため、小型化に限界があると同時に、高粘度の
液体や、触圧を測定することができなかった。However, in the past, the pressure introduction pipe 68 was provided like a pair of legs, so there was a limit to miniaturization and at the same time it was not possible to measure high viscosity liquids or tactile pressure.
［問題点を解決するための手段］
この発明は、上記第８図の圧力導入管６８をなくし、液
体等の流体圧力だけでなく、触圧をも計測可能にすると
同時に、従来のような量産性を保ち、さらに従来にも増
して小型化を可能としたものであり、第１図のように、
（１）本体ｌＯをプラスチックのモールド体により構成
すること、
（２）本体１０の上面１８に凹部２０を形成して、その
底面２２にチップ２８をとりつけ、かつ凹部２０内に樹
脂エラストマ４４を充満させるものであって、さらにリ
ードフレームの連結部に対応した位置に切断孔を有する
ことなどを特徴とする。[Means for Solving the Problems] This invention eliminates the pressure introduction pipe 68 shown in FIG. As shown in FIG. A recess 20 is formed in the recess 20, a chip 28 is attached to the bottom surface 22 of the recess 20, and a resin elastomer 44 is filled in the recess 20, and a cutting hole is provided at a position corresponding to the connecting portion of the lead frame. It is characterized by
［実施例］ 絶対圧力センサの一例を第１図に示す。[Example] An example of an absolute pressure sensor is shown in FIG.
・ＬＪ！：
１０は本体で、たとえばＰＰＳ （ポリフェニレンサル
ファイド）などのプラスチックのモールド品からなり、
全体として、短い円柱形のボタンの形状である。・LJ! : 10 is the main body, which is made of a plastic molded product such as PPS (polyphenylene sulfide).
The overall shape is a short cylindrical button.
本体１０は、直径のやや小さい上部１２と、それよりも
直径の大きい下部１４とからなり、その間に段部１６を
形成する。The main body 10 consists of an upper part 12 with a slightly smaller diameter and a lower part 14 with a larger diameter, with a stepped part 16 formed therebetween.
本体１０の上面１８に、円形の四部２０を設ける。四部
２０の底面２２にさらに四角の四部２４を設け、そこに
台座２６とチップ２８とをとりつける（第２図参照）。The upper surface 18 of the main body 10 is provided with four circular parts 20. A square four part 24 is further provided on the bottom surface 22 of the four part 20, and a pedestal 26 and a chip 28 are attached thereto (see FIG. 2).
３１はリードであり、これは本体ｌＯ内にインサートモ
ールドしである。その内側部分３２は底面２２に露出す
る。外側部分３４は、本体１０の側面の外に出たところ
で直角に曲がって、その部分に設けである溝３６内を下
り、先端３８はさらに内側に曲がっている。31 is a lead, which is insert molded within the main body IO. Its inner portion 32 is exposed on the bottom surface 22. The outer portion 34 bends at a right angle when it exits the side of the body 10 and descends into a groove 36 provided therein, with the tip 38 turning further inward.
本体ｌＯの底面４０から各リード３１に通ずる穴４２を
設ける。この穴４２の役目は後で述べる。A hole 42 is provided that communicates with each lead 31 from the bottom surface 40 of the main body 1O. The role of this hole 42 will be described later.
４４は樹脂エラストマであり、たとえばゲル状のシリコ
ーン樹脂などからなり、その上面４６は、たとえば丸い
山形に盛り上っている。これが、チップ２８への圧力伝
達の短体になる。A resin elastomer 44 is made of, for example, gel-like silicone resin, and its upper surface 46 is raised in the shape of, for example, a round mountain. This becomes a short piece of pressure transmission to the tip 28.
・製造方法： ここで、製法について説明しておく。·Production method: Here, I will explain the manufacturing method.
第２、第３図において、３０はリードフレームであり、
それだけを第４図に示す。これは、たとえば４個のリー
ド３１を連結部３３の部分で連結した形に、金属板を打
抜いたものである。In FIGS. 2 and 3, 30 is a lead frame;
Only that is shown in FIG. This is a metal plate punched out in a shape in which, for example, four leads 31 are connected at a connecting portion 33.
本体ｌＯのモールド時に、このリードフレーム３０をイ
ンサートする。This lead frame 30 is inserted when molding the main body 10.
またそのとき、本体１０の底面４０（本図では底面から
だが、あるいは上面からでもよい）から、この連結部３
３の位置に対応した穴４８や、上記の穴４２も同時に作
る。Also, at that time, this connecting portion 3
A hole 48 corresponding to position 3 and the hole 42 described above are also made at the same time.
モールド後、穴４８を利用して、機械加工、たとえば打
抜きプレス、ドリル加工などにより、上記連結部３３を
破壊して、各リード３１をリードフレーム３０から切り
離す。After molding, each lead 31 is separated from the lead frame 30 by breaking the connecting portion 33 using the hole 48 by machining, such as punching press or drilling.
穴４８は、連結部切断後、樹脂で埋め込むのが好ましい
。The hole 48 is preferably filled with resin after the connecting portion is cut.
それから、必要に応じて、本体ｌＯ外に出ているリード
３１を、」二足のように下に曲げ、さらにその先端を内
側にｄ旧ヂる。Then, if necessary, bend the lead 31 protruding outside the main body 10 downward like two legs, and then fold the tip inward.
このようにすると２先端が取付は基板に対してモ行にな
っているので、半田の接着性が良好となる。In this way, the two tips are attached in a straight line with respect to the board, so that the solder adhesion is good.
なお、ピン穴などに挿入する場合は、先端は曲げないで
、伸ばした状態のままとしておく。When inserting into a pin hole, etc., do not bend the tip; leave it stretched.
その後、チップ２８と一体になった台座２６を凹部２４
内に接着し、チップ２８とリード３１とをリード線で電
気的に接続する。Thereafter, the pedestal 26 integrated with the chip 28 is inserted into the recess 24.
The chip 28 and the leads 31 are electrically connected by lead wires.
最後に、凹部２０内に樹脂エラストマ４４を充満させる
。Finally, the recess 20 is filled with resin elastomer 44.
もっとも、チップ台座装着、リード線取付け、樹脂充填
などを行った後に、連結部破断工程を行ってもよい。However, the connection portion breaking step may be performed after mounting the chip pedestal, attaching the lead wires, filling the resin, and the like.
ソ（７）場合は、特にセンサチップに衝撃を与えないた
めにも、ドリル加工を実施する。In the case of (7), drilling is performed especially to avoid impact on the sensor chip.
・取且Ｕ方払！＝」１
（１）第５図のように１本体ｌＯの段部１６のところに
Ｏリング５０を装着し、対象５２に気密にとりつける。・Payment in U direction! =''1 (1) As shown in Fig. 5, an O-ring 50 is attached to the stepped portion 16 of the main body 1O, and the O-ring 50 is attached to the object 52 airtightly.
（２）第６図のように、本体ｌＯの穴４２にスプリング
ビン５４を挿入して、その先端をリード３１シこ電気的
に接続する。(2) As shown in FIG. 6, the spring pin 54 is inserted into the hole 42 of the main body 10, and its tip is electrically connected to the lead 31.
この場合には、当然に半田付けが不要である。In this case, soldering is naturally unnecessary.
（３）第７図のように、リード３１をプリント基板５６
などにはんだ付け５８する。(3) As shown in FIG. 7, connect the leads 31 to the printed circuit board 56.
etc., soldering 58.
［発明の効果］
（１）圧力導入管をなくし、樹脂エラストマを圧力媒体
としたため、形状が従来のものより、さらに小型化でき
る。[Effects of the Invention] (1) Since the pressure introduction pipe is eliminated and a resin elastomer is used as the pressure medium, the shape can be made more compact than the conventional one.
（２）流体の圧力だけでなく、触圧をも計測可能とした
ため、応用範囲が、きわめて広くなり、たとえば、油圧
◆空気圧システムの制御、ＭＥ用正圧力測定１ロボット
のフィンガー圧の制御などに利用できる。(2) Since it is now possible to measure not only fluid pressure but also tactile pressure, the range of applications is extremely wide, such as control of hydraulic ◆ pneumatic systems, positive pressure measurement for ME1 robot finger pressure control, etc. Available.
（３）本体内に連結部切断孔を設けるので、連結部切断
を外部で行わなくともよいため、リードフレームの切断
が容易になる。(3) Since the connecting portion cutting hole is provided in the main body, the connecting portion does not need to be cut externally, and therefore the lead frame can be easily cut.
第１図は本発明の実施例の縦断立面図、第２図は本体１
０のモールド直後の状態の説明図。
第３図は、第２図のｍ−ｍの断面図。
第４図はリードフレーム３０の説明図。
第５図と第６図と第７図は１本発明圧力センサの取付方
法を示す説明図、
第８図は従来技術の説明図。
ｌＯ二本体 １２：上部
１４：下部 １６二段部
１８：上面 ２０：凹部
２２二底面 ２４：凹部
２６：台座 ２８：チップ
３０：リードフレーム ３１：リード
３２：内側部分 ３３ ＋Ｊ！ｌ！結部３４：外側
部分 ３６：溝
３８：先端 ４０：底面
４２：穴 ４４：樹脂エラストマ４６：」−
面 ４８：穴
５０：０リング ５２二対象
５４ニスプリングピン
５６；プリント基板 ５８：はんだ付け６０：モールド
本体 ６２：リ一ドフレーム６４：チップ ６６
：台座
６８：圧力導入管FIG. 1 is a vertical sectional elevation view of an embodiment of the present invention, and FIG. 2 is a main body 1.
An explanatory diagram of a state immediately after molding of No. 0. FIG. 3 is a sectional view taken along line mm in FIG. 2. FIG. 4 is an explanatory diagram of the lead frame 30. 5, 6, and 7 are explanatory diagrams showing a method of mounting the pressure sensor of the present invention, and FIG. 8 is an explanatory diagram of the prior art. lO2 main body 12: Upper part 14: Lower part 16 Two-step part 18: Top surface 20: Recessed part 22 Two bottom faces 24: Recessed part 26: Pedestal 28: Chip 30: Lead frame 31: Lead 32: Inner part 33 +J! l! Connection part 34: Outer part 36: Groove 38: Tip 40: Bottom surface 42: Hole 44: Resin elastomer 46:''-
Surface 48: Hole 50: 0 Ring 52 Object 54 Spring pin 56; Printed circuit board 58: Soldering 60: Mold body 62: Lead frame 64: Chip 66
:Plinth 68:Pressure introduction pipe
Claims (3)
的に構成するとともに、その中にリード３１をインサー
トモールドし、本体１０の上面１８に凹部２０を形成し
て、その底面２２にチップ２８をとりつけ、かつ凹部２
０内に樹脂エラストマ４４を充満させたことを特徴とす
る、圧力センサ。(1) The main body 10 is integrally constituted by a molded plastic body, the leads 31 are insert-molded therein, a recess 20 is formed in the upper surface 18 of the main body 10, and a chip 28 is attached to the bottom surface 22 of the recess 20, and recess 2
A pressure sensor characterized in that a resin elastomer 44 is filled inside the pressure sensor.
る穴４２を有するものであることを特徴とする、特許請
求の範囲第１項に記載の圧力センサ。(2) The pressure sensor according to claim 1, wherein the main body 10 has a hole 42 that communicates with the lead 31 from the bottom surface 40 of the main body 10.
的に構成するときに、必要数のリード３１を連結部３３
で連結した形状のリードフレーム３０をインサートする
とともに、前記連結部３３に対応した位置に破断用穴４
８を作り、モールド後、この穴４８から前記連結部３３
を破断して、各リード３１間を分離することを特徴とす
る、圧力センサの製造方法。(3) When the main body 10 is integrally constructed from a plastic molded body, the required number of leads 31 are connected to the connecting portion 33.
Insert the lead frame 30 connected to each other, and insert a breaking hole 4 at a position corresponding to the connecting portion
8 and after molding, connect the connecting portion 33 through this hole 48.
A method of manufacturing a pressure sensor, the method comprising: separating each lead 31 by breaking the lead 31.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7358487A JPH067078B2 (en) | 1987-03-27 | 1987-03-27 | Pressure sensor and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7358487A JPH067078B2 (en) | 1987-03-27 | 1987-03-27 | Pressure sensor and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63238535A true JPS63238535A (en) | 1988-10-04 |
| JPH067078B2 JPH067078B2 (en) | 1994-01-26 |
Family
ID=13522501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7358487A Expired - Fee Related JPH067078B2 (en) | 1987-03-27 | 1987-03-27 | Pressure sensor and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH067078B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000513446A (en) * | 1996-06-28 | 2000-10-10 | シーメンス アクチエンゲゼルシヤフト | Pressure sensor component that can be assembled on the mounting surface of a printed wiring board |
| JP2006084337A (en) * | 2004-09-16 | 2006-03-30 | Citizen Miyota Co Ltd | Semiconductor pressure sensor |
| WO2010016439A1 (en) * | 2008-08-05 | 2010-02-11 | アルプス電気株式会社 | Pressure sensor package and method for manufacturing the same |
| JP2014017460A (en) * | 2012-07-11 | 2014-01-30 | Fusheng Industrial Co Ltd | Method for manufacturing lead frame assembly of light-emitting diode |
| JP2015210216A (en) * | 2014-04-28 | 2015-11-24 | 株式会社フジクラ | Semiconductor pressure sensor and manufacturing method of the same |
| JP2016029348A (en) * | 2014-07-25 | 2016-03-03 | 株式会社フジクラ | Semiconductor pressure sensor and manufacturing method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3239680B1 (en) | 2014-12-24 | 2020-01-15 | Fujikura Ltd. | Pressure sensor and pressure sensor module |
-
1987
- 1987-03-27 JP JP7358487A patent/JPH067078B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000513446A (en) * | 1996-06-28 | 2000-10-10 | シーメンス アクチエンゲゼルシヤフト | Pressure sensor component that can be assembled on the mounting surface of a printed wiring board |
| JP2006084337A (en) * | 2004-09-16 | 2006-03-30 | Citizen Miyota Co Ltd | Semiconductor pressure sensor |
| WO2010016439A1 (en) * | 2008-08-05 | 2010-02-11 | アルプス電気株式会社 | Pressure sensor package and method for manufacturing the same |
| JP5039208B2 (en) * | 2008-08-05 | 2012-10-03 | アルプス電気株式会社 | Pressure sensor package and manufacturing method thereof |
| JP2014017460A (en) * | 2012-07-11 | 2014-01-30 | Fusheng Industrial Co Ltd | Method for manufacturing lead frame assembly of light-emitting diode |
| JP2015210216A (en) * | 2014-04-28 | 2015-11-24 | 株式会社フジクラ | Semiconductor pressure sensor and manufacturing method of the same |
| JP2016029348A (en) * | 2014-07-25 | 2016-03-03 | 株式会社フジクラ | Semiconductor pressure sensor and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH067078B2 (en) | 1994-01-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |