CN207939821U - A kind of high speed softpanel structure - Google Patents

Abstract

The utility model discloses a kind of high speed softpanel structures, including：Single side soft board and double surface soft board and the adhesive layer of centre, the adhesive layer are high speed prepreg.The utility model can be used for improving the defect of existing high speed softpanel structure, improve signal transmission performance, heat resistance, processability and the bending performance of high speed soft board.

Description

A kind of high speed softpanel structure

Technical field

The utility model is related to PCB technical fields, and in particular to a kind of high speed softpanel structure.

Background technology

As shown in Figure 1, be the schematic diagram of traditional high speed soft board four-layer structure, including the signal shielding layer 11 on two sides is in Between two layers of high speed signal layer 12 and dielectric layer 13 between the two, the adhesive layer 14 between two layers of high speed signal layer 12 is height The pure glue of speed, such as epoxylite.The softpanel structure of carrying high speed signal can be applied to flexible printed circuit board（Flexible Printed Circuit, FPC）Or rigid-flexible combination PCB（Printed Circuit Board, printed circuit board）In.

Practice finds that above-mentioned high speed softpanel structure has the disadvantage that：The pure glue material of high speed leads to high speed transmission of signals Loss is big；The heat resistance of the pure glue material of high speed is poor, and thermal shock is easy layering plate bursting；Pure glue machinability is poor, and drill desmearing It is big to sting erosion, through-hole difficulty of processing is big, poor reliability；In addition, also having the defect of bending performance difference.

Utility model content

A kind of high speed softpanel structure of the utility model embodiment offer, the defect for improving existing high speed softpanel structure, Improve signal transmission performance, heat resistance, processability and the bending performance of high speed soft board.

The utility model embodiment adopts the following technical scheme that：

A kind of high speed softpanel structure, including：Single side soft board and double surface soft board and the adhesive layer of centre, the adhesive layer are High speed prepreg.

Further, the single side soft board includes the first copper foil layer and first medium layer, and the double surface soft board includes second Copper foil layer and second dielectric layer and third copper foil layer, the adhesive layer are located at the first medium layer and second copper foil layer Between, second copper foil layer is high speed signal layer.

Further, first copper foil layer and second copper foil layer are the signal shielding layer of ground connection.

Further, the first medium layer and the second dielectric layer are copper foil base material FCCL, and thickness is situated between Between 1-4mil.

Further, the thickness of the high speed prepreg is between 1-4mil.

The dielectric constant Dk (@1GHz) of the high speed prepreg is 3.2-3.5, is improved to the variation of 10GHz by 1GHz ＜ 0.15；Fissipation factor Df (@1GHz) is 0.002-0.004, is improved to variation≤0.002 of 10GHz by 1GHz.It enumerates herein Existing volume production high speed PP performance parameters, future, Dk, Df can be further decreased.

As can be seen from the above technical solutions, the utility model embodiment has the following advantages：

It is sandwich 1. the high speed softpanel structure is pressed by single side soft board and double surface soft board through intermediate adhesive layer Structure, including three layers of copper foil, internal layer copper foil layer can be used as high speed signal layer and realize signal high-speed transfer, the outer copper foil on two sides Layer can be grounded as signal shielding layer, and effectively shielding external signal influences；

2. the adhesive layer of the high speed softpanel structure uses the pure glue material in high speed prepreg, with traditional four-layer structure Adhesive layer compare, contribute to reduce high speed transmission of signals loss, improve signal transmission performance；

3. the high speed softpanel structure is using high speed pre-preg materials as adhesive layer, the binding force with other layers is more preferable, Heat resistance is more preferable, and thermal shock is not easy to be layered plate bursting；

4. high speed prepreg is compared with pure glue material, machinability greatly improves, and through-hole drilling is simpler, reliably Property is more preferable；

5. the high speed softpanel structure is three-decker, compared with traditional four-layer structure, product bending performance is more preferable, can Realize three-dimensional assembling；

To sum up, the high speed softpanel structure of the utility model embodiment has the performances such as signal transmission, heat-resisting, bending more excellent, Machinability is more preferable, more reliable and more stable, and the lower advantage of cost.

Description of the drawings

It, below will be to embodiment and description of the prior art in order to illustrate more clearly of the utility model embodiment technical solution Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only the utility model Some embodiments for those of ordinary skill in the art without creative efforts, can also be according to this A little attached drawings obtain other attached drawings.

Fig. 1 is the schematic diagram of traditional high speed soft board four-layer structure；

Fig. 2 is the schematic diagram for the high speed softpanel structure that the utility model embodiment provides.

Specific implementation mode

In order to make those skilled in the art more fully understand the utility model, below in conjunction with the utility model reality The attached drawing in example is applied, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that described Embodiment is only the embodiment of the utility model part, instead of all the embodiments.Based on the reality in the utility model Example is applied, every other embodiment obtained by those of ordinary skill in the art without making creative efforts is all answered When the range for belonging to the utility model protection.

Term " first " in the specification and claims of the utility model and above-mentioned attached drawing, " second ", " third " Etc. being for distinguishing different objects, rather than for describing particular order.In addition, term " comprising " and " having " and they Any deformation, it is intended that cover and non-exclusive include.Such as contain the process of series of steps or unit, method, system, The step of product or equipment are not limited to list or unit, but further include the steps that optionally not listing or unit, Or optionally further include for these processes, method, product or equipment intrinsic other steps or unit.

Below by specific embodiment, it is described in detail respectively.

Referring to FIG. 2, the utility model embodiment provides a kind of high speed softpanel structure, including：Single side soft board 20 and two-sided Soft board 30 and the adhesive layer 40 of centre, the adhesive layer 40 are high speed prepreg, this three layers form one by high-temperature laminating Body structure.Optionally, which also has one or more via holes 50, for realizing the input and output of signal.

Further, the single side soft board 20 may include the first copper foil layer 21 and first medium layer 22, the double surface soft board 30 may include that the second copper foil layer 31 and second dielectric layer 32 and third copper foil layer 33, the adhesive layer 40 are located at described first and are situated between Between matter layer 22 and second copper foil layer 31.In the present embodiment, second copper foil layer 31 is internal layer copper foil layer, can be used as height Fast signals layer realizes the high-speed transfer of signal.First copper foil layer 21 and second copper foil layer 33 are outer copper foil layer, are connect Ground is arranged, and can be used as signal shielding layer, the interference for avoiding external signal.

Wherein, the first medium layer 22 and the second dielectric layer 32 are copper foil base material（Flexible Copper Clad Laminate, FCCL）, preferred thickness is between 1-4mil.FCCL is removed with thin, light and flexible excellent Point is outer, with the FCCL of polyimide base film, also has the characteristics that electrical property, hot property, excellent heat resistance.Its relatively low dielectric is normal Number（Dk）Property so that electric signal is quickly transmitted.Good hot property may make component to be easy to cool down.Higher glass Change temperature（Tg）Component may make well to run at higher temperatures.It is with continuous coiled due to the most products of FCCL Shape form is supplied to user, therefore, using FCCL produce printed circuit board, be conducive to realize FPC automatic continuous production and The successional surface installation of component is carried out on FPC.

The thickness of the high speed prepreg 40, is preferably between 1-4mil.High speed prepreg refer to for realizing The prepreg of the PCB of signal high-speed transfer.The dielectric constant Dk (@1GHz) of the high speed prepreg is 3.2-3.5, by 1GHz is improved to the variation ＜ 0.15 of 10GHz；Fissipation factor Df (@1GHz) is 0.002-0.004, is improved to 10GHz by 1GHz Variation≤0.002.Existing volume production high speed PP performance parameters are enumerated herein, and future, Dk, Df can be further decreased.The present embodiment In, the high speed prepreg of such as Panasonic M6, M7 types can be used.

As described above, the utility model embodiment discloses a kind of sandwich type high speed softpanel structure, by single side soft board and Double surface soft board is pressed through intermediate adhesive layer, including three layers of copper foil layer, two layer medium layer and one layer of adhesive layer.This kind of structure Suitable for products such as high speed soft board, the rigid-flexible combination PCB of high speed.

The utility model structure, it is that signals layer realizes letter that outer copper foil layer ground connection, which is used as signal shielding layer, internal layer copper foil layer, Number high-speed transfer can effectively shield external signal influence.

The utility model structure, interlevel dielectrics layer use the FCCL of thickness 1-4mil, adhesive linkage to use thickness 1-4mil's High speed prepreg, and signals layer is reduced to one layer, bending performance is more preferable, it is ensured that product bending performance, the three-dimensional installation of realization/ The demands such as assembling.

The utility model structure, adhesive layer use high speed prepreg, and prepreg is good with FCCL binding forces, heat resistance Can be good, thermal shock is not easy to be layered plate bursting, and machinability is good, simpler, the better reliability of through-hole drilling, and helps to subtract Few high speed transmission of signals loss, improves signal transmission performance.

To sum up, the high speed softpanel structure of the utility model embodiment, the performances such as signal transmission, heat-resisting, bending are more excellent, and one Aspect meets client's high speed transmission of signals, the demand of three-dimensional assembling, alternative conventional high rate PCB construction；On the other hand, may be used Processability is more preferable, more reliable and more stable, and cost is lower.

In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in some embodiment Part, may refer to the associated description of other embodiments.

Above-described embodiment is only to illustrate the technical solution of the utility model, rather than its limitations；The common skill of this field Art personnel should understand that：It can still modify to the technical solution recorded in the various embodiments described above, or to its middle part Technical characteristic is divided to carry out equivalent replacement；And these modifications or replacements, this practicality that it does not separate the essence of the corresponding technical solution The spirit and scope of novel each embodiment technical solution.

Claims (4)

1. a kind of high speed softpanel structure, which is characterized in that including：

Single side soft board and double surface soft board and the adhesive layer of centre, the adhesive layer are high speed prepreg；

The single side soft board includes the first copper foil layer and first medium layer, and the double surface soft board includes that the second copper foil layer and second are situated between Matter layer and third copper foil layer, the adhesive layer is between the first medium layer and second copper foil layer, and described second Copper foil layer is high speed signal layer.

2. high speed softpanel structure according to claim 1, which is characterized in that

First copper foil layer and second copper foil layer are the signal shielding layer of ground connection.

3. high speed softpanel structure according to claim 1, which is characterized in that

The first medium layer and the second dielectric layer are copper foil base material FCCL, and thickness is between 1-4mil.

4. high speed softpanel structure according to claim 1, which is characterized in that

The thickness of the high speed prepreg is between 1-4mil.