CN207938604U - A kind of ultra-thin plug-in type bridge rectifier - Google Patents
A kind of ultra-thin plug-in type bridge rectifier Download PDFInfo
- Publication number
- CN207938604U CN207938604U CN201721182115.2U CN201721182115U CN207938604U CN 207938604 U CN207938604 U CN 207938604U CN 201721182115 U CN201721182115 U CN 201721182115U CN 207938604 U CN207938604 U CN 207938604U
- Authority
- CN
- China
- Prior art keywords
- connection
- fixinig plate
- connection piece
- jumper
- ultra
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 claims abstract description 25
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 238000009413 insulation Methods 0.000 claims description 7
- GVVPGTZRZFNKDS-JXMROGBWSA-N geranyl diphosphate Chemical compound CC(C)=CCC\C(C)=C\CO[P@](O)(=O)OP(O)(O)=O GVVPGTZRZFNKDS-JXMROGBWSA-N 0.000 claims description 6
- 238000009434 installation Methods 0.000 abstract description 10
- 239000004020 conductor Substances 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 43
- 238000010586 diagram Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Rectifiers (AREA)
Abstract
The utility model is related to electronic component technology fields, more particularly to a kind of ultra-thin plug-in type bridge rectifier, the pin of grafting is used for several including packaging body, each pin is connected with connection framework, the package interior is hollow to be equipped with an accommodating chamber for installing connection framework, and the pin is inserted in packaging body side and penetrates accommodating chamber to be connected with connection framework；Jumper connection piece is overlapped between the connection framework respectively, jumper connection piece both ends junction is equipped with fixinig plate, jumper connection piece is overlaid on connection framework by the fixinig plate, the fixinig plate covers jumper connection piece one side and is coated with for playing the connection tin being conductively connected, and fixinig plate is connected by the connection tin with jumper connection piece and connection framework；For the utility model for existing bridge-type reorganizer, the space of bridge conductor can effectively be saved by being connected with jumper connection piece by fixinig plate so that and it is whole thinner, save the installation space of electronic product.
Description
Technical field
The utility model is related to electronic component technology fields, more particularly to a kind of ultra-thin plug-in type bridge rectifier.
Background technology
Bridge rectifier is to make bridge-type connection by four rectification silicon chips, and the north material of external application insulation encapsulates, high-power bridge
Formula rectifier adds the encapsulating of zinc metal-back, enhancing heat dissipation outside insulating layer.
Existing bridge rectifier includes that four rectification chips and four pins, the positive and negative of four rectification chips pass through
Weld tabs Ji Dao connections corresponding with four pins, then make weld tabs melt, so that rectification chip and pin by high temperature
Ji Dao weld together, this structure has some disadvantages：First, which makes the working efficiency of assembly low；
Second, due to the connection structure and technique so that not only yield is low for the product of assembly, but also stability and consistency
Difference can not ensure high-quality；Third, since the yield of product is low, poor quality, thus the defect rate produced is relatively high, causes to produce
The production cost of product is high；4th, the rectification chip of fixed specification can only be encapsulated, if the specification of rectification chip changes,
The specification of pin, specification of weld tabs etc. are required for changing accordingly, and are unable to providing covers for compact rectification chip so that encapsulation spirit
Poor activity；5th, since the positive and negative of four rectification chips passes through weld tabs and the Ji Dao of respective pins connections so that the envelope of product
It is larger to fill thickness, it is difficult to be thinned.
Utility model content
To solve the above problems, the utility model provides one kind for existing bridge-type reorganizer, pass through fixation
Piece is connected with jumper connection piece can effectively save the space of bridge conductor so that and it is whole thinner, save the installation space of electronic product
Ultra-thin plug-in type bridge rectifier.
Technical solution used by the utility model is：A kind of ultra-thin plug-in type bridge rectifier, it is characterised in that：Including
Packaging body is used for the pin of grafting with several, and each pin is connected with connection framework, and the package interior is hollow to be set
There are an accommodating chamber for installing connection framework, the pin to be inserted in packaging body side and penetrate accommodating chamber and connection framework phase
Even；Jumper connection piece is overlapped between the connection framework respectively, jumper connection piece both ends junction is equipped with fixinig plate, the fixinig plate
Jumper connection piece is overlaid on connection framework, the fixinig plate covers jumper connection piece one side and is coated with for playing the connection being conductively connected
Fixinig plate is connected by tin, the connection tin with jumper connection piece and connection framework.
Further improvement of these options is that the fixinig plate and jumper connection piece are copper sheet.
Further improvement of these options is that the copper thickness range is in 0.1~0.45mm.
Further improvement of these options is that the packaging body is insulator.
Further improvement of these options is that the connection framework is equipped with conductive chip.
Further improvement of these options is that the conductive chip is connected with jumper connection piece.
Further improvement of these options is that fixinig plate is connected by the connection tin with jumper connection piece and conductive chip.
Further improvement of these options is that the conductive chip is GPP chip.
The beneficial effects of the utility model are：
1, a kind of ultra-thin plug-in type bridge rectifier, in a first aspect, the pin of grafting is used for several equipped with packaging body,
Packaging insulating effect is played by packaging body, while being easily installed fixation, a mounting hole is equipped at packaging body center, is easily installed
Using the utility model, the utility model is used by pin erecting and welding, it is easy to use；Second aspect, each pin
It is connected with connection framework, connection rectification effect is played by connection framework, rectification effect is good, and the package interior is hollow to be equipped with
One for installing the accommodating chamber of connection framework, and installation connection framework is accommodated by accommodating chamber, and by packaging body by itself and outside
Insulation, improves the safety used, and the pin is inserted in packaging body side and penetrates accommodating chamber to be connected with connection framework, is convenient for company
Rectification is connect, good connecting effect connects convenient for the installation of pin, easy to use；The third aspect is taken respectively between the connection framework
It is connected to jumper connection piece, jumper connection is played by jumper connection piece and plays rectification effect to electric current, rectification effect is good, and jumper connection piece both ends connect
It meets place and is equipped with fixinig plate, jumper connection piece is overlaid on connection framework, jumper connection piece is fixed on connection by fixinig plate by the fixinig plate
Frame, good connecting effect are simple to manufacture；Fourth aspect, the fixinig plate cover jumper connection piece one side and are coated with for playing conduction
The connection tin of connection is connected by connecting tin, and good connecting effect, conductive effect is good, by connecting tin by fixinig plate and jumper connection piece
It is connected with connection framework, for existing bridge-type reorganizer, is connected and can effectively save with jumper connection piece by fixinig plate
The space of bridge conductor so that the utility model is whole thinner, saves the installation space of electronic product.
2, the fixinig plate and jumper connection piece are copper sheet, and copper sheet is in use, in either conductive or service life all
With good using effect, the service life of the utility model is improved, improves conductive effect.
3, the copper thickness range is in 0.1~0.45mm, when copper thickness is less than 0.1mm, on the one hand, selection is compared
Trouble, on the other hand, in use beneficial to small volume, electric conductivity is poor；When thickness is more than 0.45mm, lead to this
Utility model integral thickness is thicker, and cost is also higher；It is preferably 0.2mm through testing copper thickness, can reach optimal makes
With effect, conductive effect is good, and service life is long.
4, the packaging body is insulator, is high-temperature insulation material injection molding, insulation effect is good, and service life is long.
5, the connection framework is equipped with conductive chip, plays conductive rectification effect by conductive chip, conductive effect is good, whole
It is good to flow effect, improves using effect.
6, the conductive chip is connected with jumper connection piece, convenient for conductive rectification, improves rectification efficiency, improves using effect, even
It is good to connect effect.
7, fixinig plate is connected by the connection tin with jumper connection piece and conductive chip, relative to existing bridge-type reorganizer, leads to
The space of bridge conductor can effectively be saved by crossing fixinig plate and being connected with jumper connection piece, be connected with jumper connection piece by conductive chip, can
Conductive rectification effect is effectively played, rectification efficiency is improved, saves installation space.
8, the conductive chip is GPP chip, and by selecting, GPP chip can promote breakdown voltage and surge passes through energy
Power, and there is good high temperature stability performance, it is ensured that product is increased still with preferable in motor rotation blockage current anomaly
Overload current handling capacity.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the connection diagram of the utility model.
Description of drawing identification：Bridge rectifier 100, accommodating chamber 111, pin 120, connection framework 130, is led at packaging body 110
Electrical chip 131, jumper connection piece 140, fixinig plate 150, connection tin 160.
Specific implementation mode
The utility model is further described below in conjunction with attached drawing.
As shown in Fig. 1~Fig. 2, the respectively structural schematic diagram and connection diagram of the utility model.
A kind of ultra-thin plug-in type bridge rectifier 100, including packaging body 110 are used for the pin 120 of grafting, institute with several
It states each pin 120 and is connected with connection framework 130,110 inner hollow of the packaging body is equipped with one for installing connection framework 130
Accommodating chamber 111, the pin 120 is inserted in 110 side of packaging body and penetrates accommodating chamber 111 to be connected with connection framework 130；It is described
Jumper connection piece 140 is overlapped between connection framework 130 respectively, 140 both ends junction of the jumper connection piece is equipped with fixinig plate 150, described
Jumper connection piece 140 is overlaid on connection framework 130 by fixinig plate 150, the fixinig plate 150 cover jumper connection piece 140 coat on one side it is useful
In playing the connection tin 160 being conductively connected, the connection tin 160 is by fixinig plate 150 and 130 phase of jumper connection piece 140 and connection framework
Even.
Packaging body 110 is insulator, is high-temperature insulation material injection molding, insulation effect is good, and service life is long.
Connection framework 130 is equipped with conductive chip 131, and conductive rectification effect, conductive effect are played by conductive chip 131
Good, rectification effect is good, improves using effect.
Conductive chip 131 is connected with jumper connection piece 140, convenient for conductive rectification, improves rectification efficiency, improves using effect, even
It is good to connect effect.
Conductive chip 131 is GPP chip, by selecting GPP chip that can promote breakdown voltage and surge handling capacity, and
With good high temperature stability performance, it is ensured that product is increased still with preferable overload in motor rotation blockage current anomaly
Electric current handling capacity.
Fixinig plate 150 and jumper connection piece 140 are copper sheet, and copper sheet is in use, in either conductive or service life all
With good using effect, the service life of the utility model is improved, improves conductive effect.
Copper thickness range is in 0.1~0.45mm, when copper thickness is less than 0.1mm, on the one hand, and selection is cumbersome,
On the other hand, in use beneficial to small volume, electric conductivity is poor；When thickness is more than 0.45mm, lead to this practicality
Novel integral thickness is thicker, and cost is also higher；It is preferably 0.2mm through testing copper thickness, can reaches optimal using effect
Fruit, conductive effect is good, and service life is long.
Fixinig plate 150 is connected by connection tin 160 with jumper connection piece 140 and conductive chip 131, is arranged relative to existing bridge-type
Device, the space of bridge conductor can effectively be saved by being connected with jumper connection piece 140 by fixinig plate 150, pass through conductive chip 131 and jump
Contact pin 140 is connected, and can effectively play conductive rectification effect, improves rectification efficiency, saves installation space.
In a first aspect, being used for the pin 120 of grafting with several equipped with packaging body 110, encapsulation is played by packaging body 110
Insulation effect, while it being easily installed fixation, it is equipped with a mounting hole at 110 center of packaging body, is easily installed using the utility model,
The utility model is used by 120 erecting and welding of pin, it is easy to use；Second aspect, each pin 120 are connected with connection
Frame 130 plays connection rectification effect by connection framework 130, and rectification effect is good, and 110 inner hollow of the packaging body is equipped with
One accommodating chamber 111 for installing connection framework 130 accommodates installation connection framework 130 by accommodating chamber 111, and passes through encapsulation
Itself and exterior insulation are improved the safety used by body 110, and the pin 120 is inserted in 110 side of packaging body and penetrates accommodating chamber
111 are connected with connection framework 130, and convenient for connection rectification, good connecting effect connects convenient for the installation of pin 120, easy to use；
The third aspect is overlapped with jumper connection piece 140 between the connection framework 130, plays jumper connection by jumper connection piece 140 and play to electricity respectively
The rectification effect of stream, rectification effect is good, and 140 both ends junction of the jumper connection piece is equipped with fixinig plate 150, and the fixinig plate 150 will
Jumper connection piece 140 is overlaid on connection framework 130, and jumper connection piece 140 is fixed on connection framework 130, connection effect by fixinig plate 150
It is good, it is simple to manufacture；Fourth aspect, the fixinig plate 150 cover 140 one side of jumper connection piece and are coated with for playing the company being conductively connected
Tin 160 is connect, is connected by connecting tin 160, good connecting effect, conductive effect is good, by connecting tin 160 by fixinig plate 150 and jump
Contact pin 140 is connected with connection framework 130, for existing bridge-type reorganizer, passes through fixinig plate 150 and jumper connection piece 140
The space of bridge conductor can effectively be saved by being connected so that the utility model is whole thinner, saves the installation space of electronic product.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (8)
1. a kind of ultra-thin plug-in type bridge rectifier, it is characterised in that：The pin of grafting is used for several including packaging body, often
A pin is connected with connection framework, and the package interior is hollow to be equipped with an accommodating chamber for installing connection framework, described to insert
Foot is inserted in packaging body side and penetrates accommodating chamber to be connected with connection framework；Jumper connection piece is overlapped between the connection framework respectively,
Jumper connection piece both ends junction is equipped with fixinig plate, and jumper connection piece is overlaid on connection framework, the fixinig plate pressure by the fixinig plate
It covers jumper connection piece one side to be coated with for playing the connection tin being conductively connected, the connection tin is by fixinig plate and jumper connection piece and connect frame
Frame is connected.
2. a kind of ultra-thin plug-in type bridge rectifier according to claim 1, it is characterised in that：The fixinig plate and jumper connection
Piece is copper sheet.
3. a kind of ultra-thin plug-in type bridge rectifier according to claim 2, it is characterised in that：The copper thickness range
In 0.1~0.45mm.
4. a kind of ultra-thin plug-in type bridge rectifier according to claim 3, it is characterised in that：The packaging body is insulation
Body.
5. a kind of ultra-thin plug-in type bridge rectifier according to claim 4, it is characterised in that：The connection framework is equipped with
Conductive chip.
6. a kind of ultra-thin plug-in type bridge rectifier according to claim 5, it is characterised in that：The conductive chip and jump
Contact pin is connected.
7. a kind of ultra-thin plug-in type bridge rectifier according to claim 6, it is characterised in that：The connection tin will be fixed
Piece is connected with jumper connection piece and conductive chip.
8. a kind of ultra-thin plug-in type bridge rectifier according to claim 7, it is characterised in that：The conductive chip is
GPP chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721182115.2U CN207938604U (en) | 2017-09-15 | 2017-09-15 | A kind of ultra-thin plug-in type bridge rectifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721182115.2U CN207938604U (en) | 2017-09-15 | 2017-09-15 | A kind of ultra-thin plug-in type bridge rectifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207938604U true CN207938604U (en) | 2018-10-02 |
Family
ID=63645257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721182115.2U Expired - Fee Related CN207938604U (en) | 2017-09-15 | 2017-09-15 | A kind of ultra-thin plug-in type bridge rectifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207938604U (en) |
-
2017
- 2017-09-15 CN CN201721182115.2U patent/CN207938604U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181002 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |