CN207854162U - A kind of loudspeaker assembly and terminal device - Google Patents
A kind of loudspeaker assembly and terminal device Download PDFInfo
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- CN207854162U CN207854162U CN201820100511.4U CN201820100511U CN207854162U CN 207854162 U CN207854162 U CN 207854162U CN 201820100511 U CN201820100511 U CN 201820100511U CN 207854162 U CN207854162 U CN 207854162U
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- mainboard
- loud speaker
- shell structure
- cathode
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Abstract
A kind of loudspeaker assembly of the embodiment of the present application offer and terminal device, the thickness for reducing terminal device complete machine.In the embodiment of the present application, loud speaker is located at the via regions of mainboard；The first anode on mainboard connects the second anode of loud speaker by the first line in shell structure, the second cathode that the first cathode on mainboard passes through the second connection loud speaker in shell structure, said program not only may insure the connection of loud speaker and mainboard, and since first line and the second circuit are arranged on the inside of first shell structure, it is needed from loud speaker in the prior art and mainboard different up to 0.2 millimeter of flexible PCB connection by individual thickness, first line and the second circuit are less than the thickness of flexible PCB, so, reduce the thickness of terminal device complete machine.
Description
Technical field
The invention relates to construction applications more particularly to a kind of loudspeaker assemblies and terminal device.
Background technology
With the fast development of electronic communication, internet industry, requirement of the user to the frivolous degree of electronic product is increasingly
Height, the especially thickness of mobile phone complete machine.
In the prior art, in order to meet mobile phone sound intermediate frequency sounding demand, the loud speaker needs in mobile phone are connected with mainboard.It is existing
Have in technology, the connection type of loud speaker and mainboard is：It is fixed by the way that the positioning column surveyed in shell structure and gum is arranged
Flexible PCB, the anode on mainboard are connected by the anode of flexible PCB and loud speaker, and the cathode on mainboard passes through flexibility
Circuit board is connected with the cathode of loud speaker.However, the thickness of flexible PCB can reach 0.2 millimeter, this structure results in
The integral thickness of terminal device increases.
To sum up, there is an urgent need for the thickness that a kind of loudspeaker assembly is used to reduce terminal device complete machine.
Utility model content
A kind of loudspeaker assembly of the embodiment of the present application offer and terminal device, the thickness for reducing terminal device complete machine.
The embodiment of the present application provides a kind of loudspeaker assembly, which includes mainboard, and mainboard includes through hole area
Domain, the first anode and the first cathode；Loud speaker, loud speaker are located at the via regions of mainboard；On loud speaker include second anode and
Second cathode；The inside of first shell structure, first shell structure includes first line and the second circuit；First shell structure is covered
It is placed on mainboard and loud speaker, first line is contacted with the first anode and the second anode, the second circuit and the first cathode and the
Two cathode contacts.
Optionally, first line and the second circuit are to take shape in first shell structure by laser direct structuring technique LDS
On.
Optionally, the minimum interval between first line and the second circuit is more than or equal to interval threshold；First line and
The thickness of two circuits is less than thickness threshold value.
Optionally, the material of first line and the second circuit includes：Copper, nickel or gold.
Optionally, any one of the first anode, the second anode, the first cathode and second cathode are：Metal clips, conduction
Sponge or metal bump.
Optionally, the periphery of via regions includes sealing foam, and loud speaker is fixed on by sealing foam in via regions.
Optionally, interval threshold is at least 0.5 millimeter；Ranging from 0.02 millimeter to 0.04 millimeter of thickness threshold value.
Optionally, further include second shell structure；Mainboard is placed between first shell structure and second shell structure.
The embodiment of the present application provides a kind of terminal device, includes the loudspeaker assembly of any of the above-described.
In the embodiment of the present application, loud speaker is located at the via regions of mainboard；The first anode on mainboard passes through shell structure
On first line connection loud speaker the second anode, the first cathode on mainboard passes through the second connection in shell structure
Second cathode of loud speaker, said program not only may insure the connection of loud speaker and mainboard, but also due to first line and
Two circuits are arranged on the inside of first shell structure, are needed through individual thickness with loud speaker in the prior art and mainboard
Difference is connected up to 0.2 millimeter of flexible PCB, first line and the second circuit are less than the thickness of flexible PCB, in this way,
Reduce the thickness of terminal device complete machine.
Description of the drawings
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly introduced, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present application, for this
For the those of ordinary skill in field, without having to pay creative labor, it can also be obtained according to these attached drawings
His attached drawing.
Fig. 1 provides a kind of structural schematic diagram of loudspeaker assembly for the embodiment of the present application；
Fig. 2 provides a kind of structural schematic diagram of mainboard for the embodiment of the present application；
Fig. 3 provides a kind of structural schematic diagram of loudspeaker assembly for the embodiment of the present application.
Specific implementation mode
In order to make the purpose of the application, technical solution and advantageous effect be more clearly understood, below in conjunction with attached drawing and implementation
Example, is further elaborated the application.It should be appreciated that specific embodiment described herein is only used to explain this Shen
Please, it is not used to limit the application.
In the embodiment of the present application, loudspeaker assembly can be adapted for the multiple terminals such as mobile phone, tablet, desktop computer, printer
Equipment.
Fig. 1 shows a kind of structural schematic diagram of the applicable loudspeaker assembly of the embodiment of the present application, as shown in Figure 1, including
Mainboard 101, loud speaker 102 and first shell structure 103.Wherein, mainboard 101 includes via regions, the first anode 1011 and the
One cathode 1012, the second anode 1021 is provided on loud speaker 102 and the second cathode 1022, loud speaker 102 are located at mainboard 101
In via regions.The inside of first shell structure 103, i.e. towards the first shell structure of mainboard 101 and loud speaker 102 in Fig. 1
103 bottoms are provided with first line 1031 and the second circuit 1032.
In a kind of optional embodiment, first shell structure 103 is covered on mainboard 101 and loud speaker 102, and first
Circuit 1031 is contacted with first anode 1011 and second anode 1021, second circuit 1032 and described first negative
Pole 1012 and second cathode 1022 contact.That is first anode 1011 of the connection of first line 1031 and the second anode 1021, the
Two circuits 1032 connect the first cathode 1012 and the second cathode 1022.Between first shell structure 103 and loud speaker 102 no longer
Flexible PCB is set.
In a kind of optional embodiment, first line 1031 as shown in Figure 1 and the second circuit 1032 can be by swashing
Light straight forming technology (Laser Direct Structuring, LDS) takes shape in the first shell structure 103.Laser
Forming technique refers to the movement according to the TRAJECTORY CONTROL laser of conductive pattern using computer, laser throwing is shone molded
In first shell structure 103, activated circuit pattern, circuit pattern, that is, first line 1031 and the second circuit 1032.
In a kind of optional embodiment, the material of first line 1031 and second circuit 1032 includes：Copper, nickel or
Gold.
In order to prevent LDS subsequently change plating during generate overflow plating and caused by line short, a kind of optional embodiment
In, the minimum interval between first line 1031 and the second circuit 1032 is not less than interval threshold, and optionally, the interval threshold is extremely
It is 0.5 millimeter less.
In a kind of optional embodiment, first line 1031 and the second circuit 1032 all have certain thickness, also may be used
To say that first line and the second circuit protrude the numerical value of first shell body structure surface.Optionally, the thickness of first line 1031 and
The thickness of second circuit 1032 can be less than the thickness threshold value, ranging from 0.02 millimeter to 0.04 millimeter of thickness threshold value.Such as
This, the thickness of the thickness of first line 1031 and the second circuit 1032 is far smaller than 0.2 millimeter of flexible PCB.
In a kind of optional embodiment, the first anode 1011, first the 1012, second anode 1021 of cathode and the second cathode
1022 can be any one of following middle material：Metal clips, conductive sponge or metal bump.
Fig. 2 shows a kind of structural schematic diagrams for mainboard that the embodiment of the present application is applicable in, as shown in Fig. 2, mainboard 101 includes
First anode 1011, the first cathode 1021 and via regions 1013, wherein the first positive 1011 and first cathode 1012 is pairs of
Be arranged on mainboard 101, for connect the second positive 1021 and second cathode such as the similar parts of loud speaker 102
1022, such as radiator.
Since loud speaker 102 is the via regions 1013 positioned at mainboard 101, in a kind of optional embodiment, loud speaker
102 surrounding can be provided with engagement site and the periphery of the via regions 1013 of mainboard 101 is fastened togather so that raise one's voice
Device 102 can be fixed in via regions 1013.In another optional embodiment, the surrounding of via regions 1013 can be set
It is equipped with sealing foam, loud speaker 102 can be fixed on by the sealing foam in the via regions 1013.Optionally, close
Envelope foam can be secured at the surrounding of via regions 1013.
In a kind of optional embodiment, which further includes second shell structure, and Fig. 3 shows the application reality
A kind of structural schematic diagram of the applicable loudspeaker assembly of example is applied, as shown in figure 3, including mainboard 101, loud speaker 102, first shell
Structure 103 and second shell structure 104.Wherein, mainboard 101 includes the 1013, first anode 1011 of via regions and the first cathode
1012, it is provided with the second anode 1021 on loud speaker 102 and the second cathode 1022, loud speaker 102 are located at the through hole area of mainboard 101
In domain 1013, the inside of first shell structure 103, i.e. the first shell structure towards mainboard 101101 and loud speaker 102102
103 bottom is provided with first line 1031 and the second circuit 1032, and the second through-hole is also set up in first shell structure 103
1033, second shell structure 104 is provided with third through-hole 1041.
In a kind of mode optionally implemented, the second through-hole 1033 in first shell structure 103 and in second shell
Third through-hole 1041 in structure 104 is symmetrically arranged.The mainboard 101 is placed in the first shell structure 103 and described
Between second shell structure 104.Mainboard 101 and loud speaker 102 can be placed on first shell structure 103 and second shell
Between structure 104, passes through the second through-hole and third through-hole by first shell structure 103 with screw or other fixing devices, raises
Sound device 102, mainboard 101 and second shell mechanism 104 are fixed up.Optionally, the second through-hole 1033 and third through-hole 1041 can
It is a pair of or multipair to have.
The embodiment of the present application provides a kind of terminal setting, including either speaker group in above-mentioned as shown in Figure 1, Figure 2 or Fig. 3
Part repeats no more herein.
In the embodiment of the present application, loud speaker is located at the via regions of mainboard；The first anode on mainboard passes through shell structure
On first line connection loud speaker the second anode, the first cathode on mainboard passes through the second connection in shell structure
Second cathode of loud speaker, said program not only may insure the connection of loud speaker and mainboard, but also due to first line and
Two circuits are arranged on the inside of first shell structure, are needed through individual thickness with loud speaker in the prior art and mainboard
Difference is connected up to 0.2 millimeter of flexible PCB, first line and the second circuit are less than the thickness of flexible PCB, in this way,
Reduce the thickness of terminal device complete machine.
Although the preferred embodiment of the application has been described, created once a person skilled in the art knows basic
Property concept, then additional changes and modifications can be made to these embodiments.So it includes excellent that the following claims are intended to be interpreted as
It selects embodiment and falls into all change and modification of the application range.
Obviously, those skilled in the art can carry out the application essence of the various modification and variations without departing from the application
God and range.In this way, if these modifications and variations of the application belong to the range of the application claim and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
Claims (9)
1. a kind of loudspeaker assembly, which is characterized in that including：
Mainboard, the mainboard include via regions, the first anode and the first cathode；
Loud speaker, the loud speaker are located at the via regions of the mainboard；Include the second anode and the on the loud speaker
Two cathode；
The inside of first shell structure, the first shell structure includes first line and the second circuit；The first shell knot
Structure is covered on the mainboard and the loud speaker, and the first line connects with first anode and second anode
It touches, second circuit and first cathode and second cathode contact.
2. loudspeaker assembly as described in claim 1, which is characterized in that the first line and second circuit are to pass through
Laser direct structuring technique LDS takes shape in the first shell structure.
3. loudspeaker assembly as described in claim 1, which is characterized in that between the first line and second circuit
Minimum interval is more than or equal to interval threshold；The thickness of the first line and second circuit is less than thickness threshold value.
4. loudspeaker assembly as claimed in claim 3, which is characterized in that the interval threshold is at least 0.5 millimeter；The thickness
Spend threshold value ranging from 0.02 millimeter to 0.04 millimeter.
5. such as Claims 1 to 4 any one of them loudspeaker assembly, which is characterized in that the first line and described second
The material of circuit includes：Copper, nickel or gold.
6. such as Claims 1 to 4 any one of them loudspeaker assembly, which is characterized in that first anode, described second are just
Any one of pole, first cathode and described second cathode are：Metal clips, conductive sponge or metal bump.
7. such as Claims 1 to 4 any one of them loudspeaker assembly, which is characterized in that the periphery of the via regions includes
Sealing foam, the loud speaker are fixed on by the sealing foam in the via regions.
8. loudspeaker assembly as claimed in claim 7, which is characterized in that further include second shell structure；
The mainboard is placed between the first shell structure and the second shell structure.
9. a kind of terminal device, which is characterized in that including the loudspeaker assembly described in claim 1 to 8 any claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820100511.4U CN207854162U (en) | 2018-01-19 | 2018-01-19 | A kind of loudspeaker assembly and terminal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820100511.4U CN207854162U (en) | 2018-01-19 | 2018-01-19 | A kind of loudspeaker assembly and terminal device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207854162U true CN207854162U (en) | 2018-09-11 |
Family
ID=63415581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820100511.4U Active CN207854162U (en) | 2018-01-19 | 2018-01-19 | A kind of loudspeaker assembly and terminal device |
Country Status (1)
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| CN (1) | CN207854162U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108055627A (en) * | 2018-01-19 | 2018-05-18 | 西安易朴通讯技术有限公司 | A kind of loudspeaker assembly and terminal device |
-
2018
- 2018-01-19 CN CN201820100511.4U patent/CN207854162U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108055627A (en) * | 2018-01-19 | 2018-05-18 | 西安易朴通讯技术有限公司 | A kind of loudspeaker assembly and terminal device |
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