CN217009639U - Elastic sheet structure and electronic equipment - Google Patents

Abstract

The present disclosure relates to a spring plate structure, including: a substrate; an elastic contact member located on the first surface of the substrate; the contact area of the elastic contact part moves to the first surface after being pressed; and the fixing parts are distributed on two sides of the elastic contact part and used for fixing the substrate. Through setting up elastic contact part and fixed part in the same one side of base plate, when the shell fragment structure is located the mainboard, the area of mainboard can be taken up to one side at elastic contact part and fixed part place, and the surface opposite with the first surface on the base plate does not have other parts, so need not take the area of mainboard in the both sides of base plate, has just so reduced the area that the shell fragment structure took the mainboard to reserve installation space for other parts, improve the rate of utilization of mainboard.

Description

Elastic sheet structure and electronic equipment

Technical Field

The present disclosure relates to the field of mechanical structures, and in particular, to a spring plate structure and an electronic device.

Background

With the development of electronic devices, various electronic devices play more and more important roles in many application scenes, such as electronic devices such as mobile phones and tablet computers. The electronic equipment comprises a plurality of electronic components, wherein the electronic components need to transmit electric signals, and the electric signals need to be transmitted through a conductive medium. Most electronic devices are provided with a spring structure, and the spring structure is used as a conductive medium of different cut-off or electronic circuits, so that the connection of electric signals can be realized, and the function of transmitting the electric signals, such as grounding, is achieved.

SUMMERY OF THE UTILITY MODEL

The present disclosure provides a spring plate structure and an electronic device.

In a first aspect of the embodiments of the present disclosure, a spring plate structure is provided, which includes: a substrate; an elastic contact member located on the first surface of the substrate; the contact area of the elastic contact part moves to the first surface after being pressed; and the fixing parts are distributed on two sides of the elastic contact part and used for fixing the substrate.

In one embodiment, the fixing member includes: a first connecting plate located on the first surface, the first connecting plate being perpendicular to the substrate; the first fixing pin is connected with the first connecting plate and used for fixing the substrate in a direction parallel to the first connecting plate and the substrate; a second connecting plate located on the first surface, the second connecting plate being parallel to the first connecting plate; and the second fixing pin is connected with the second connecting plate and used for fixing the substrate in a direction parallel to the second connecting plate and the substrate.

In one embodiment, the first connecting plate and the second connecting plate are symmetrically distributed on the substrate with the elastic contact part as a symmetry axis.

In one embodiment, the first connecting plate and/or the second connecting plate are further configured to limit the extent of movement of the resilient contact member towards the first surface after the contact region is subjected to pressure.

In one embodiment, the spring structure comprises: an adsorption surface on the base plate, the first connection plate, or the second connection plate for moving the base plate in a direction parallel to the base plate, the first connection plate, and the second connection plate.

In one embodiment, the suction surface is perpendicular to the base plate, the first connection plate, and the second connection plate.

In one embodiment, the elastic contact member includes: a first elastic member connected to the substrate; the first elastic part is a bent elastic part; a force arm for connecting the first resilient member and the contact region; a second resilient member located between the moment arm and the first surface and connected to the contact region; when the contact area is moved to the first surface by the pressure applied by the target object, the second elastic component is in contact with the first surface, and the first elastic component and the second elastic component provide a rebound force opposite to the pressure.

In one embodiment, the contact region is an arc-shaped structure; when the contact area is not subjected to pressure exerted by a target object, the relative distance between the contact area and the first surface is greater than the relative distance between the moment arm and the first surface, and the relative distance between the contact area and the first surface is greater than the relative distance between the first elastic component and the first surface.

In one embodiment, the first resilient member, the moment arm, the second resilient member and the contact region are integrally formed.

In one embodiment, the base plate, the elastic contact member and the fixing member are integrally formed.

In a second aspect of the embodiments of the present disclosure, an electronic device is provided, including: the main board is provided with a second surface, a mounting position and a fixing hole; in the dome structure of any one of the embodiments, the dome structure is located on the second surface, and a region where the substrate and the elastic contact member in the dome structure are connected is located in the mounting location; wherein the substrate is perpendicular to the main board; and the fixing part in the elastic sheet structure is connected with the fixing hole.

In one embodiment, the motherboard further has a third surface that is opposite the second surface; neither the resilient contact member nor the substrate extends beyond the third surface.

In one embodiment, the first and second fixing pins of the fixing member are fixed in the fixing holes by means of dual in-line packaging.

In one embodiment, the electronic device further comprises: and the frame is perpendicular to the main board, after the frame is contacted with the contact area of the elastic contact component, the frame applies pressure to the contact area, and the contact area moves towards the first surface of the substrate.

In one embodiment, the frame further has thereon: the metal contact layer covers the surface of the frame and is used for contacting the contact area; at least two rows of fixing points which are positioned on the metal contact layer and used for fixing the metal contact layer on the frame; each row of the fixed points is perpendicular to the main board, and a moving channel is arranged between two adjacent rows of the fixed points; the moving channel is used for enabling the contact area to move relative to the frame along the moving channel.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

the elastic sheet structure in the embodiment comprises a substrate, an elastic part and a fixing part, wherein the substrate is provided with two surfaces, the elastic contact part is positioned on the first surface of the substrate, namely one surface, and the contact area of the elastic contact part moves to the first surface after being pressed. The fixing parts are also positioned on the first surface of the substrate, the elastic parts and the fixing parts are positioned on the same surface of the substrate, and the fixing parts are distributed on two sides of the elastic contact parts and used for fixing the substrate. The structure reduces the area of the elastic sheet structure occupying the mainboard, thereby reserving installation space for other parts and improving the utilization rate of the mainboard.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.

Fig. 1 is a schematic diagram illustrating a spring structure according to an exemplary embodiment;

fig. 2 is a schematic diagram illustrating another spring structure in accordance with an exemplary embodiment;

FIG. 3 is a schematic diagram illustrating the spring structure of FIG. 2 in contact with a target object in accordance with an exemplary embodiment;

fig. 4 is a schematic structural diagram illustrating a spring structure according to an exemplary embodiment;

FIG. 5 is a schematic diagram illustrating a suction surface positioned on a first connector plate in accordance with an exemplary embodiment;

FIG. 6 is a schematic diagram illustrating a change in state of a resilient contact member in accordance with an exemplary embodiment;

FIG. 7 is a schematic diagram of an electronic device shown in accordance with an exemplary embodiment;

FIG. 8 is a schematic diagram illustrating another perspective of the electronic device shown in FIG. 7 in accordance with an exemplary embodiment;

FIG. 9 is a schematic diagram of another electronic device shown in accordance with an example embodiment;

fig. 10 is a schematic diagram illustrating a dome structure on a motherboard according to an exemplary embodiment;

fig. 11 is a schematic diagram illustrating another spring structure on a motherboard according to an example embodiment;

fig. 12 is a schematic diagram of another dome structure on a motherboard according to an example embodiment;

fig. 13 is a block diagram illustrating a terminal device according to an example embodiment.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the utility model, as detailed in the appended claims.

Referring to fig. 1, a schematic diagram of a spring structure is shown.

In this embodiment, the elastic sheet structure a is located on the motherboard B, the elastic sheet structure a includes an elastic sheet a1 and a fixing part a2, the elastic sheet a1 is connected to the fixing part a2, and the elastic sheet a1 and the fixing part a2 are adjacently disposed in a direction (for example, an X direction) indicated by an arrow X in fig. 1, so that a distance that the elastic sheet structure a occupies the motherboard B in the X direction is longer, for example, greater than 2 mm, and thus an area that the elastic sheet structure a occupies the motherboard B is larger. Under the limited condition of mainboard B area, the installation space of other parts on mainboard B can be reduced when shell fragment A occupies mainboard B's area great. In some scenes, the length of the main board B in the X direction is short, and the length of the main board B in the Y direction is long, so that the arrangement and installation of components in the X direction are affected, and a large space is wasted in the X direction of the main board B, so that the installation of other components is not facilitated, and the utilization rate of the main board B is reduced. The Y direction is a direction parallel to the main board B and perpendicular to the X direction, as indicated by the arrow Y.

Fig. 2 is a schematic view of another spring structure.

In this embodiment, the length that the elastic sheet structure C occupies the motherboard B in the direction indicated by the arrow X (e.g., the X direction) is longer, for example, greater than 1.3 mm, so that the area that the elastic sheet structure a occupies the motherboard B is larger, and under the condition that the area of the motherboard B is limited, the installation space of other components on the motherboard B can be reduced when the area that the elastic sheet structure a occupies the motherboard B is larger. In some scenes, the length of the main board B in the X direction is short, and the length of the main board B in the Y direction is long, so that the arrangement and installation of components in the X direction are affected, and a large space is wasted in the X direction of the main board B, so that the installation of other components is not facilitated, and the utilization rate of the main board B is reduced. The Y direction is a direction parallel to the main board B and perpendicular to the X direction, as indicated by the arrow Y.

In the spring plate structure C shown in fig. 2, after the spring plate C1 contacts with a target object in contact, the target object exerts pressure, and then the spring plate C1 moves in the direction indicated by the arrow X in fig. 3, and the plane formed by the motion track of the spring plate C1 is parallel to the main board B.

Fig. 3 is a schematic diagram of the elastic sheet structure shown in fig. 2 contacting with a target object.

After the spring structure C is mounted on the main board B, the spring C1 contacts the target object M, and for some reason, the spring C1 is separated from the target object M, and the spring C1 is higher than the target object M. In this case, after receiving a pressure in the direction indicated by the arrow Z in fig. 3, since the elastic piece C1 cannot move in the direction indicated by the arrow X in fig. 3, there may be a case where the elastic piece C1 is damaged or other structures in the elastic piece structure C are damaged, resulting in a quality problem of the elastic piece structure C.

Referring to fig. 4, a schematic structural diagram of a spring structure provided in the present technical solution is shown, where the spring structure includes:

a substrate 1, an elastic contact member 2, and a fixing member 3.

An elastic contact member 2 located on the first surface 101 of the substrate 1; the contact area 201 of the resilient contact member 2 moves towards the first surface 101 after being subjected to a pressure.

And fixing parts 3 located on the first surface 101, distributed on both sides of the elastic contact part 2, for fixing the substrate 1.

The substrate 1 may be a flat plate-like metal plate, and the shape of the substrate 1 is not limited, but a preferable shape may be a rectangle, a circle, a polygon, or the like. The substrate 1 has two opposite surfaces, a first surface 101 being shown in fig. 4. Both the resilient contact element 2 and the fixation element 3 are located on this first surface 101. The substrate 1 is used as a basic component of the whole spring structure, and other components are directly or indirectly fixed on the substrate 1 on the basis of the substrate 1 and are directly or indirectly connected with the substrate 1.

The elastic contact member 2 may be a member having elasticity and capable of contacting the target object, and the elastic contact member 2 is used for contacting the target object to achieve a conductive function. The target object may be a bezel of the electronic device. The elastic contact member 2 has therein a contact area 201, and the contact area 201 is an area to be in contact with a target object for contact with the target object. The contact area 201 moves toward the first surface 101 when coming into contact with the target object and receiving pressure applied by the target object. For example, it may be moved in the direction indicated by arrow X in fig. 3 towards the first surface 101.

The structure of the elastic contact member 2 is not limited, and may be the structure shown in fig. 4, or may be a spring plate as shown in fig. 1 and 3. Other structures of the elastic contact member 2 can refer to the subsequent embodiments. The connection method of the elastic contact member 2 and the substrate 1 is not limited, and may be welding or integral molding. At the time of soldering, the bottom edge of the substrate 1 and the elastic contact member 2 are soldered together in the direction indicated by the arrow Z. In the integral molding, the elastic contact member 2 is integrally molded at the bottom edge of the base plate 1 in the direction indicated by the arrow Z.

The fixing parts 3 are located on the first surface 101, and the fixing parts 3 are distributed on both sides of the elastic contact part 2 for fixing the substrate 1. The shape and structure of the fixing member 3 are not limited, and may be, for example, a flat plate, a column, a bar, or the like. The connection method of the fixing member 3 and the substrate 1 is not limited, and may be welding or integral molding. At the time of soldering, the edge of the substrate 1 and the fixing member 3 are soldered together in the direction indicated by the arrow Y. In the integral molding, the fixing member 3 is integrally molded with the edge of the base plate 1 in the direction indicated by the arrow Y.

Through setting up elastic contact part 2 and fixed part 3 in the same one side of base plate 1, when the shell fragment structure is located the mainboard, the area of mainboard can be occupied to one side at elastic contact part 2 and fixed part 3 place, the surface opposite with first surface 101 on the base plate 1 does not have other parts, so need not occupy the area of mainboard in the both sides of base plate 1, the condition that all occupy the mainboard area in the both sides of base plate 1 has been reduced, just so reduced the area that the shell fragment structure occupies the mainboard, thereby leave installation space for other parts, improve the rate of utilization of mainboard.

In one embodiment, referring to fig. 4, the fixing member 3 includes: a first connecting plate 301, a first fixing pin 302, a second connecting plate 303 and a second fixing pin 304.

The first connection plate 301 is located on the first surface 101, and the first connection plate 301 is perpendicular to the substrate 1. The first connection plate 301 is used to connect the substrate 1 and the first fixing pins 302. The first connection plate 301 may have a flat plate structure, such as a rectangular flat plate or a triangular flat plate. The first connection plate 301 is parallel to the direction indicated by the arrow Z shown in fig. 4, and the first connection plate 301 is perpendicular to the substrate 1, i.e., the first connection plate 301 is perpendicular to the direction indicated by the arrow X in fig. 4.

The position where the first connection plate 301 is connected to the substrate 1 may not be limited, and as shown in fig. 4, the substrate 1 may be connected to the substrate 1 at one edge in the direction indicated by the arrow Y, and the connection may be welding, clamping, riveting, or the like.

The first fixing pin 302 is connected with the first connecting plate 301, so that the first fixing pin 302 can be connected with the substrate 1 through the first connecting plate 301, after the first fixing pin 302 is fixed, the substrate 1 can be fixed, and after the substrate 1 is fixed, the elastic contact part 2 is also fixed, thereby fixing the whole spring plate structure.

The first fixing pin 302 may have a rectangular plate-shaped structure, and the length of the first fixing pin 302 in a direction perpendicular to the substrate 1 may be equal to the length of the first connection plate 301 in the direction perpendicular to the substrate 1. The first fixing pins 302 are parallel to the first connection plate 301.

The fixing part 3 is also located in the area towards the first surface 101 of the substrate 1, and after the elastic sheet structure is located on the mainboard, the fixing part also does not occupy the area of the mainboard, which is opposite to the first surface 101, so that the area of the mainboard occupied by the elastic sheet structure can be reduced.

In one embodiment, the first fixing pins 302 may further include a plurality of pillar structures arranged in a direction perpendicular to the substrate 1, i.e., a direction indicated by an arrow X in fig. 4, each of the pillar structures being connected to the first connection plate 301.

A second connection plate 303 is also located at the first surface 1, the second connection plate 303 being parallel to the first connection plate 301. The second connecting plate 303 may be a plate-like structure, and the second connecting plate 302 is located on the opposite side of the substrate 1 from the first connecting plate 301, as shown in fig. 4, the first connecting plate 301 is located on one edge of the substrate 1 in the direction indicated by the arrow Y, and the second connecting plate 302 is located on one edge of the substrate 1 opposite to the direction indicated by the arrow Y. A space for the elastic contact member 2 to move is provided between the first connection plate 301 and the second connection plate 302.

The second fixing pin 304 is connected to the second connection plate 303 for fixing the substrate 1 in a direction parallel to the second connection plate 303 and the substrate 1.

The second fixing pin 304 may have a rectangular plate-shaped structure, and the length of the second fixing pin 304 in the direction perpendicular to the substrate 1 may be equal to the length of the second connection plate 303 in the direction perpendicular to the substrate 1. The second fixing pin 304 is parallel to the second connection plate 303.

In one embodiment, the second fixing pin 304 may further include a plurality of pillar structures arranged in a direction perpendicular to the substrate 1, that is, a direction indicated by an arrow X in fig. 4, each of the pillar structures being connected to the second connection plate 303.

In one embodiment, the movement trajectory of the contact area 201 forms a plane parallel to the first connection portion 301 and perpendicular to the substrate 1.

In another embodiment, referring to fig. 4, the fixing part 3 may further include: a first limiting plate 305 and a second limiting plate 306, wherein the first limiting plate 305 is located between the first connecting plate 301 and the first fixing pin 302, and is connected with the first connecting plate 301 and the first fixing pin 302 respectively. The first restriction plate 305 may be a flat plate perpendicular to the base plate 1 and the first connection plate 301. When the elastic sheet structure is fixed on the carrier, the first limiting plate 305 may limit the distance that the first fixing pin 302 enters the carrier in the direction indicated by the arrow Z, and the first fixing pin 302 does not move toward the inside of the carrier after the first limiting plate 305 contacts the carrier.

Similarly, the second limiting plate 306 is located between the second connecting plate 303 and the second fixing pin 304, and is connected to the second connecting plate 303 and the second fixing pin 304 respectively. The second restriction plate 306 may be a flat plate perpendicular to the base plate 1 and the second connection plate 303. When the spring structure is fixed on the carrier, the second limiting plate 306 may limit the distance that the second fixing pin 304 enters the carrier in the direction indicated by the arrow Z, and the second fixing pin 304 does not move toward the inside of the carrier after the second limiting plate 306 contacts the carrier.

In another embodiment, referring to fig. 4, the first connection plate 301 and the second connection plate 303 are symmetrically distributed on the base plate 1 with the elastic contact member 2 as a symmetry axis.

In another embodiment, the first connection plate 301 and/or the second connection plate 303 also serve to limit the extent of movement of the resilient contact member 2 towards the first surface 101 after the contact area is subjected to pressure. Since the first connecting plate 301 and the second connecting plate 302 are perpendicular to the substrate 1, and the first connecting plate 301 and the second connecting plate 302 have a certain length in a direction perpendicular to the substrate 1, the first connecting plate 301 and/or the second connecting plate 302 may limit the degree of relative movement between the object and the contact area 201 during the movement of the contact area 201 of the elastic contact member 2 to the first surface 101 under the pressure applied by the object after the contact with the object, and after the object is in contact with the first connecting plate 301 and/or the second connecting plate 302, the object and the contact area 201 may not move relatively and the contact area 201 may not approach the first surface 101.

In one embodiment, referring to fig. 4, the spring structure further includes:

a third limiting plate 307 and a fourth limiting plate 308, the third limiting plate 307 is connected with the first connecting plate 301, the first connecting plate 301 is located between the substrate 1 and the third limiting plate 307, and the third limiting plate 307 can be a flat plate parallel to the substrate 1. The fourth limiting plate 308 is connected to the second connecting plate 303, the second connecting plate 303 is located between the substrate 1 and the fourth limiting plate 308, and the fourth limiting plate 308 may be a flat plate parallel to the substrate 1.

The third and fourth stopper plates 307 and 308 may serve to limit the degree of movement of the elastic contact member 2 toward the first surface 101. After the contact area 201 of the elastic contact component 2 contacts with the target object and moves towards the first surface 101 under the pressure exerted by the target object, the third limiting plate 307 and/or the fourth limiting plate 308 limit the degree of relative movement between the target object and the contact area 201, and after the target object contacts with the first connecting plate 301 and/or the second connecting plate 302, the target object and the contact area 201 do not move relatively and the contact area 201 does not approach the first surface 101.

The relative distance between the third limiting plate 307 and the substrate 1 is equal to the relative distance between the fourth limiting plate 308 and the substrate 1, so that the third limiting plate 307 and the fourth limiting plate 308 can simultaneously limit the degree of relative movement between the target object and the contact area 201, and after the target object contacts the first connecting plate 301 and/or the second connecting plate 302, the target object and the contact area 201 are prevented from moving relatively.

In another embodiment, referring to fig. 4, the elastic sheet structure further includes:

and an adsorption surface 4 on the substrate 1, the first connection plate 301, or the second connection plate 303, for moving the substrate 1 in a direction parallel to the substrate, the first connection plate 301, and the second connection plate 303. The adsorption surface 4 is a planar structure connected to the substrate 1, the first connection plate 301 or the second connection plate 303, and the external device can move the elastic sheet structure through the adsorption surface 4.

The suction surface 4 may be a flat plate structure having a certain area, and the suction surface 4 is perpendicular to the base plate 1, the first connection plate 301 and the second connection plate 303 for moving the spring structure. In practical application, after the adsorption surface 4 is adsorbed, the whole elastic sheet structure can be moved by adsorbing the cotton 4. For example, when the spring structure is fixed on the carrier, the first fixing pins 302 and the second fixing pins 304 are inserted into the carrier in a direction parallel to the substrate 1 and the first connecting plate 301 (i.e., in a direction indicated by an arrow Z in fig. 4), so as to fix the spring structure on the carrier. When the elastic sheet structure is separated from the carrier, the whole elastic sheet structure can move in the direction opposite to the direction shown by the arrow Z through the adsorption surface 4, so that the elastic sheet structure is separated from the carrier.

Fig. 4 shows the suction surface 4 on the substrate 1. Referring to fig. 5, a schematic view of the absorption surface 4 on the first connection plate 301 is shown.

In another embodiment, referring to fig. 4, the elastic contact member 2 includes: a contact area 201, a first resilient member 202, a moment arm 203, and a second resilient member 204.

The first elastic member 202 is connected to the substrate 1, and the first elastic member 202 is a bent elastic member, for example, the first elastic member 202 may have an arc-shaped structure. The first elastic members 202 are connected to the bottom (i.e., the edge in the direction indicated by the arrow Z) of the substrate 1 and the arm 203, respectively.

The moment arm 203 is used for connecting the first elastic member 202 and the contact area 201, is located between the first elastic member 202 and the contact area 201, and connects the first elastic member 202 and the contact area 201. The arm 203 may be a bent structure, and after the arm 203 connects the first elastic member 202 and the contact region 201, the contact region 201 protrudes from the third stopper plate 307 and the fourth stopper plate 308 in a direction perpendicular to the substrate 1.

The contact area 201 is an arc-shaped structure, when the contact area 201 is not in contact with the target object and is not subjected to pressure exerted by the target object, the relative distance between the contact area 201 and the first surface 101 is greater than the relative distance between the arm 203 and the first surface 101, and the relative distance between the contact area 201 and the first surface 101 is greater than the relative distance between the first elastic component 202 and the first surface 101.

A second resilient member 204, located between the arm 203 and the first surface 101, is connected to the contact region 201. Referring to fig. 6, a schematic diagram of a state change of the elastic contact member 2 is shown. When the contact area 201 is not released from contact with the target object, the arm is in the state shown by 203A, the contact area is in the state shown by 201A, and the second elastic member is in the state shown by 204A.

After the contact area 201 is contacted with the target object, the contact area 201 is moved toward the first surface 101 by the pressure applied by the target object, the second elastic member 204 is contacted with the first surface 101, and the first elastic member 202 and the second elastic member 204 provide a rebound force opposite to the pressure. At this time, the arm is 203B, the contact area is 201B, and the second elastic member is 204B.

The plane formed by the contact area 201, the moment arm 203 and the moving track of the second elastic component 204 is parallel to the first connection portion 301 and perpendicular to the substrate 1.

In one embodiment, referring to fig. 4, the contact area 201 further has a contact tip 2011 thereon, the contact tip 2011 is located on a surface of the contact area 201, and the contact area 201 is in contact with the target object through the contact tip 2011. The contact 2011 is a gold-plated contact or a copper-foil contact, and the like, and can reduce adverse effects on contact due to oxidation and the like.

In another embodiment, the first resilient member 202, the moment arm 203, the second resilient member 204, and the contact region 201 are integrally formed.

In another embodiment, the base plate 1, the elastic contact member 2, and the fixing member 3 are integrally formed.

In another embodiment, referring to fig. 7, a schematic view of an electronic device is shown, and fig. 8 is a schematic view of the electronic device shown in fig. 7 from another view angle. With reference to fig. 7 and 8, the electronic device includes at least:

the main board 5 has a second surface 501, a mounting location 502 and a fixing hole 503.

In the elastic sheet structure of any of the embodiments, the elastic sheet structure is located on the second surface 501 of the main board 5, and the area where the substrate 1 and the elastic contact component 2 are connected in the elastic sheet structure is located in the mounting position 502. The substrate 1 is perpendicular to the main board 5.

The fixing part 3 of the spring structure is connected to the fixing hole 503, and preferably, the first fixing pin 302 and the second fixing pin 304 are fixed in the fixing hole 503, so as to fix the spring structure on the motherboard 5. The first fixing pin 302 and the second fixing pin 304 are fixed in the fixing hole 503 by a dual in-line package (DIP pin), which is more firmly fixed. The elastic sheet structure is a metal conductive structure, and the substrate 1, the elastic contact part 2 and the fixing part 3 are all metal conductive structures. As indicated by the arrows in fig. 7, after the first fixing pins 302 and the second fixing pins 304 are fixed on the motherboard 5 through the fixing holes 503, the first fixing pins 302 and the second fixing pins 304 may contact with the target circuit on the motherboard 5, thereby communicating the contact region 201 with the target circuit on the motherboard 5, and after the contact region 201 contacts with the target object, communicating the target circuit on the motherboard 5 with the target object.

In this embodiment, the edge of the motherboard 5 has a mounting location 502, and the mounting location 502 is an opening at the edge of the motherboard 5. After the elastic sheet structure is fixed in the fixing hole 503 by the first fixing pin 302 and the second fixing pin 304 of the fixing part 3, the bottom of the substrate 1 may be located in the mounting position 502, the first elastic part 202 of the elastic contact part 2 is located in the mounting position 502, and the connecting portion between the substrate 1 and the first elastic part 202 may also be located in the mounting position 502.

In another embodiment, the main board 5 further has a third surface 504, the third surface 504 is an opposite side of the second surface 501, and the second surface 501 and the third surface 504 are two surfaces of the main board 5. The main board 5 may be a PCB board, such as a main board of an electronic device such as a mobile phone or a tablet computer.

After the spring structure is mounted on the motherboard 5, neither the elastic contact element 2 nor the substrate 1 extends beyond the third surface 504. The bottom of the substrate 1 does not protrude beyond the third surface 504, the first elastic member 202 of the elastic contact member 2 does not protrude beyond the third surface 504, and the connection portion of the substrate 1 and the first elastic member 202 does not protrude beyond the third surface 504. This may reduce the influence on the third Surface 504 of the motherboard 5, and facilitate related operations on the third Surface 504, such as Surface Mount Technology (SMT).

In another embodiment, after the first fixing pins 302 and the second fixing pins 304 are inserted into the fixing holes 503 from the second Surface 501, in another embodiment, the first fixing pins 302 and the second fixing pins 304 do not exceed the third Surface 504, which also reduces the influence on the third Surface 504 of the motherboard 5, and facilitates related operations on the third Surface 504, such as Surface Mount Technology (SMT).

In another embodiment, referring to fig. 9, which is a schematic diagram of another electronic device, the electronic device further includes:

and a frame 6 perpendicular to the main board 5, wherein the contact area 201 of the elastic contact member 2 is in contact with the frame 6 when the main board 5 moves in a direction (a direction indicated by an arrow Z) perpendicular to the main board 5. After the frame 6 is in contact with the contact area 201 of the elastic contact member 2, the frame 6 applies pressure to the contact area 201, and the contact area 201 moves toward the first surface 101 of the substrate 1. For example, the frame 6 applies pressure to the contact area 201 in the direction indicated by the arrow Y, that is, in the direction in which the substrate 1 moves, and the contact area 201 approaches the substrate 1.

In another embodiment, referring to fig. 9, the frame 6 further has:

and the metal contact layer 601 is covered on the surface of the frame 6 close to the main board 5 and the elastic sheet structure and is used for contacting with the contact area 201. The metal contact layer 601 may be a contact layer such as gold plating or copper foil, and may reduce the influence of oxidation on the contact between the contact region 201 and the frame 6, thereby reducing the contact failure between the contact region 201 and the frame 6 and improving the conduction performance between the contact region 201 and the frame 6.

At least two rows of fixing points 602 are located on the metal contact layer 601 for fixing the metal contact layer 601 on the frame 6. Each row of fixing points is perpendicular to the main plate 5, and a moving channel 603 is provided between two adjacent rows of fixing points, and the moving channel 603 is used for moving the contact area 201 along the moving channel 603 relative to the frame 6. This can reduce the damage of the fixed point to the contact area 201 such as friction and scratch.

Since the main board 5 moves in a direction perpendicular to the main board 5 with respect to the rim 6, that is, the main board 5 moves in a direction indicated by an arrow Z in fig. 9 with respect to the rim 6. The contact area 201 is in contact with a moving channel 603 between two rows of fixing points 602, so that the fixing points 602 can fix the metal contact layer 601 to the frame 6 without affecting the movement of the contact area 201 on the metal contact layer 601.

The embodiment can reduce the situation shown in the embodiment corresponding to fig. 3, thereby prolonging the service life of the elastic sheet.

Referring to fig. 10, a schematic diagram of the elastic sheet structure on the motherboard is shown, in which the length of the main board occupied by the elastic sheet structure is reduced in the direction indicated by arrow X, so as to reduce the area of the main board occupied by the elastic sheet structure. Fig. 11 is a schematic diagram of the elastic sheet structure on the main board, and the occupied height is reduced in the direction indicated by the arrow Z, so that the thickness of the electronic device is reduced. Fig. 12 is a schematic view of the elastic sheet structure on the main board.

In a further embodiment of the method according to the utility model,

first fixed pin and the fixed pin of second adopt the DIP foot, compare the flat scheme of pasting and grab the board effect better, and welding strength is better in actual assembly process.

The depth of the DIP plate of the DIP leg and the force arm of the spring plate structure is less than 0.5mm, the DIP leg and the force arm of the spring plate structure can be adapted to a PCB with the thickness more than or equal to 0.5mm, and the spring plate can not exceed the lower surface of the PCB, so that the second SMT manufacture procedure of the lower surface of the PCB can not be influenced.

The adsorption surface 4, such as an SMT pick-up surface, may be located on different structures, referring to fig. 4 and 5, which are bent from the sidewalls or from the bottom, and the connection positions may be designed on both sides.

Referring to fig. 9, the fixed point, e.g., the laser point of the copper foil, is recommended to be laser in the up and down directions on both sides, so that the contact area, e.g., the contact area of the elastic sheet, is not scratched by the rough area of the laser point of the copper foil during the downward sliding process.

Advantage 1 of this embodiment: calculating 0.15mm clearance of PCB hole digging, the distance is 0.9mm, the distance can be shortened by more than 55% on the basis of the prior scheme I, and can be shortened by more than 30% on the basis of the prior scheme II;

advantage 2: in the Z direction, the side connection scheme can be shortened to 1mm, can be shortened by more than 23 percent on the basis of the existing scheme I, and is equal to the height of the existing scheme II;

advantage 3: the side connection scheme is not damaged when being pressed down for assembly, is level with the existing scheme, and has more assemblability than the second existing scheme.

Fig. 13 is a block diagram illustrating a terminal device according to an example embodiment. For example, the terminal device may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, and the like.

Referring to fig. 13, the terminal device may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input/output (I/O) interface 812, a sensor component 814, and a communication component 816.

The processing component 802 generally controls overall operation of the terminal device, such as operations associated with presentation, telephone calls, data communications, camera operations, and recording operations. The processing components 802 may include one or more processors 820 to execute instructions to perform all or a portion of the steps of the methods described above. Further, the processing component 802 can include one or more modules that facilitate interaction between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.

The memory 804 is configured to store various types of data to support operations at the terminal device. Examples of such data include instructions for any application or method operating on the terminal device, contact data, phonebook data, messages, pictures, videos, etc. The memory 804 may be implemented by any type or combination of volatile or non-volatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks.

The power component 806 provides power to various components of the terminal device. The power components 806 may include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power for the terminal device.

The multimedia component 808 includes a screen that provides an output interface between the terminal device and the user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundary of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front facing camera and/or a rear facing camera. When the terminal device is in an operation mode, such as a shooting mode or a video mode, the front camera and/or the rear camera can receive external multimedia data. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a Microphone (MIC) configured to receive external audio signals when the terminal device is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may further be stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.

The I/O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to: a home button, a volume button, a start button, and a lock button.

The sensor component 814 includes one or more sensors for providing various aspects of state assessment for the terminal device. For example, sensor assembly 814 may detect the open/closed status of the terminal device, the relative positioning of components, such as the display and keypad of the terminal device, the change in position of the terminal device or a component of the terminal device, the presence or absence of user contact with the terminal device, the orientation or acceleration/deceleration of the terminal device, and the change in temperature of the terminal device. Sensor assembly 814 may include a proximity sensor configured to detect the presence of a nearby object without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

The communication component 816 is configured to facilitate communication between the terminal device and other devices in a wired or wireless manner. The terminal device may access a wireless network based on a communication standard, such as WiFi, 4G or 5G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, communications component 816 further includes a Near Field Communications (NFC) module to facilitate short-range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, Ultra Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

In an exemplary embodiment, the terminal device may be implemented by one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, micro-controllers, microprocessors or other electronic components for performing the above-described methods.

Other embodiments of the utility model will be apparent to those skilled in the art from consideration of the specification and practice of the utility model disclosed herein. This application is intended to cover any variations, uses, or adaptations of the utility model following, in general, the principles of the utility model and including such departures from the present disclosure as come within known or customary practice within the art to which the utility model pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the utility model being indicated by the following claims.

It will be understood that the utility model is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the utility model is limited only by the appended claims.

Claims (15)

1. A spring structure, comprising:

a substrate;

an elastic contact member located on the first surface of the substrate; the contact area of the elastic contact part moves to the first surface after being pressed;

and the fixing parts are distributed on two sides of the elastic contact part and used for fixing the substrate.

2. A leaf spring structure according to claim 1, wherein the fixing member comprises:

a first connecting plate positioned on the first surface, the first connecting plate being perpendicular to the substrate;

the first fixing pin is connected with the first connecting plate and used for fixing the substrate in a direction parallel to the first connecting plate and the substrate;

a second connecting plate located on the first surface, the second connecting plate being parallel to the first connecting plate;

and the second fixing pin is connected with the second connecting plate and used for fixing the substrate in a direction parallel to the second connecting plate and the substrate.

3. The spring structure according to claim 2, wherein the first connecting plate and the second connecting plate are symmetrically distributed on the substrate with the elastic contact member as a symmetry axis.

4. A leaf spring structure according to claim 2, wherein the first and/or second connecting plate is further adapted to limit the extent of movement of the resilient contact member towards the first surface after the contact area is subjected to pressure.

5. A spring structure according to claim 2, characterized in that it comprises:

an adsorption surface on the base plate, the first connection plate, or the second connection plate for moving the base plate in a direction parallel to the base plate, the first connection plate, and the second connection plate.

6. The spring structure according to claim 5, wherein the suction surface is perpendicular to the base plate, the first connection plate, and the second connection plate.

7. A spring structure according to claim 1, wherein said resilient contact means comprises:

a first elastic member connected to the substrate; the first elastic part is a bent elastic part;

a force arm for connecting the first resilient member and the contact region;

a second resilient member located between the moment arm and the first surface and connected to the contact region;

when the contact area is moved to the first surface by the pressure applied by the target object, the second elastic component is in contact with the first surface, and the first elastic component and the second elastic component provide a rebound force opposite to the pressure.

8. The spring structure of claim 7, wherein the contact region is an arc-shaped structure;

when the contact area is not subjected to pressure exerted by a target object, the relative distance between the contact area and the first surface is greater than the relative distance between the moment arm and the first surface, and the relative distance between the contact area and the first surface is greater than the relative distance between the first elastic component and the first surface.

9. A spring structure according to claim 7, wherein the first resilient member, the force arm, the second resilient member and the contact region are integrally formed.

10. A spring structure according to claim 1, wherein the base plate, the resilient contact member and the fixing member are integrally formed.

11. An electronic device, comprising:

the main board is provided with a second surface, a mounting position and a fixing hole;

the spring structure of any one of claims 1 to 9, said spring structure being located on said second surface and an area of said spring structure where the substrate and the resilient contact member are connected being located within said mounting location; wherein the substrate is perpendicular to the main board;

and the fixing part in the elastic sheet structure is connected with the fixing hole.

12. The electronic device of claim 11, wherein the motherboard further has a third surface that is an opposite side of the second surface;

neither the resilient contact member nor the substrate extends beyond the third surface.

13. The electronic device of claim 11, wherein the first and second fixing pins of the fixing member are fixed in the fixing holes by means of a dual in-line package.

14. The electronic device of claim 11, further comprising:

and the frame is vertical to the main board, after the frame is contacted with the contact area of the elastic contact component, the frame applies pressure to the contact area, and the contact area moves towards the first surface of the substrate.

15. The electronic device of claim 14, wherein the bezel further comprises:

the metal contact layer covers the surface of the frame and is used for contacting the contact area;

at least two rows of fixing points which are positioned on the metal contact layer and used for fixing the metal contact layer on the frame; each row of the fixed points is perpendicular to the main board, and a moving channel is arranged between two adjacent rows of the fixed points; the moving channel is used for enabling the contact area to move relative to the frame along the moving channel.

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